Vacuum arrangement and method

Abstract

Vacuum arrangement (100a, 400), comprising: • a first dehydration chamber (104) and a second dehydration chamber (106) which are gas-separated from each other; • a substrate transfer chamber (102) for converting a timed substrate transport into a continuous substrate transport to the second dehydration chamber (106); • a first high-vacuum pump (240) of the gas transfer type for pumping out the first dehydration chamber (104); and • a second high-vacuum pump (242) of the gas binding type for pumping out the second dehydration chamber (106); • wherein the first dehydration chamber (104) is arranged between the second dehydration chamber (106) and the substrate transfer chamber (102) with respect to substrate transport.

Description

[0001] The invention relates to a vacuum arrangement and a method.

[0002] In general, a substrate can be treated (processed) in a vacuum, for example, coated, so that its chemical and / or physical properties can be modified. Various coating processes can be used to coat a substrate in a vacuum. For example, a vacuum coating system can be used to deposit one or more layers onto a substrate or multiple substrates using chemical and / or physical vapor deposition.

[0003] To efficiently achieve large-area deposition on a correspondingly large substrate, such as a sheet-shaped one, a processing system can be used. In this system, the substrate is transported through the entire system and its vacuum chambers, for example, by means of rollers. Different vacuum chambers within a vacuum system can be separated from each other by means of chamber walls or baffles, for example, in horizontal continuous coating systems (in-line systems) by means of vertical chamber walls or baffles. Furthermore, the vacuum system can have an airlock chamber at the inlet and / or outlet, allowing a substrate to be introduced into and / or removed from the vacuum system.

[0004] Coating a substrate may require pretreating its surface, for example, by removing water deposits (also known as dehydration, desorption, or drying). Residual water on the substrate surface can negatively impact the quality of the applied coating. This is typically achieved by heating the substrate in a dehydration chamber, causing water to evaporate from its surface (i.e., desorbed). The resulting water vapor (i.e., the desorbed water) is then separated from the substrate.

[0005] A Meissner trap is typically used in a dehydration chamber to capture the desorbed water that leaves the substrate surface during heated processes. A Meissner trap works by depositing the desorbed water onto a cooling surface and converting it into a solid state. This process gradually coats the cooled surface with water ice. Firstly, the water ice thermally insulates the cooled surface, reducing the Meissner trap's efficiency. Secondly, this buildup of ice increasingly clogs and can damage the trap. Therefore, a Meissner trap has a limited lifespan, as it requires regular maintenance, which necessitates opening the vacuum chamber to remove the water ice. This interrupts the operation of the processing plant and thus incurs additional costs.

[0006] According to various embodiments, a vacuum arrangement and a method are provided which reduce the water mass flow towards the Meissner trap, extend its service life, control its service life, improve its resistance to thermal influences (e.g. heating processes in the immediate vicinity) and / or simplify its manufacturability.

[0007] According to various embodiments, it has been found that the Meissner trap is conventionally operated in combination with one or more turbomolecular pumps, i.e., together with the pump, it simultaneously removes the volume to be pumped out (also referred to as the receiver). In this combination, the turbomolecular pump is intended to provide the high vacuum required to minimize the amount of gas introduced into the subsequent coating process. Conversely, the Meissner trap is intended to bind the water remaining in the high vacuum.

[0008] This combination reliably provides a low ultimate pressure with a low water content. In this context, it was observed that the turbomolecular pump pumps little or no water in a high vacuum, meaning the Meissner trap bears the majority of the water removal load. Clearly, the water pumping capacity of the turbomolecular pump decreases significantly with lower pressure.

[0009] In contrast, various embodiments exploit the fact that a turbomolecular pump requires little or no maintenance when pumping more water. To enable the turbomolecular pump to handle a greater water removal load, various embodiments design it to operate in a higher pressure range, which is gas- and pressure-technically separated (also referred to as gas-separated) from the operating point of the Meissner trap at lower pressure.

[0010] According to various embodiments, dehydration (also referred to as desorption) is provided at different pressure stages. A first pressure stage is supplied by a turbomolecular pump, and a second pressure stage by a Meissner trap. The turbomolecular pump operates at an increased pressure, thus pumping out more water. The resulting gaseous mixture is then fed to the Meissner trap, which subsequently binds the remaining water. This reduces the dehydration load on the Meissner trap.

[0011] In this context, it was further recognized that the Meissner trap is conventionally designed to bind as much desorbed water as possible. It became clear that the actual requirements of the subsequent coating process are not considered in the design of the Meissner trap. For example, some coating processes can tolerate more residual water on the substrate surface than others without significant quality losses. This makes it possible to adjust the Meissner trap so that it binds precisely the amount of water required by the subsequent coating process. This reduces the dehydration load on the Meissner trap.

[0012] According to various embodiments, a vacuum arrangement can comprise: a first dehydration chamber (also referred to as a first desorption chamber) and a second dehydration chamber (also referred to as a second desorption chamber), which are gas-separated from each other, and in each of which a heating device is optionally arranged; a substrate transfer chamber for converting a pulsed substrate transport into a continuous substrate transport to the first and / or second dehydration chamber; a first high-vacuum pump of the gas transfer type for pumping out the first dehydration chamber; and a second high-vacuum pump of the gas binding type for pumping out the second dehydration chamber; wherein the first dehydration chamber is arranged between the second dehydration chamber and the substrate transfer chamber with respect to substrate transport.

[0013] They show Fig. 1A a vacuum arrangement according to various embodiments in a schematic side view or cross-sectional view; Fig. 1B a vacuum arrangement according to various embodiments in a schematic diagram. Fig. 2A a first pressure stage according to various embodiments in a schematic side view or cross-sectional view; Fig. 2B a third pressure stage according to various embodiments in a schematic side view or cross-sectional view; Fig. 3 a gas binding pump arrangement according to various embodiments in a schematic perspective view; Fig. 4 a vacuum arrangement according to various embodiments in a schematic side view or cross-sectional view; and Fig. 5 and Fig. 6 each a method according to different embodiments in a schematic flowchart.

[0014] The following detailed description refers to the accompanying drawings, which form part thereof and illustrate specific embodiments in which the invention can be implemented. In this context, directional terminology such as "top," "bottom," "front," "back," "anterior," "rear," etc., is used with reference to the orientation of the described figure(s). Since components of embodiments can be positioned in a number of different orientations, the directional terminology serves only for illustration and is in no way limiting. It is understood that other embodiments may be used and structural or logical modifications may be made without deviating from the scope of protection of the present invention.It is understood that the features of the various exemplary embodiments described herein can be combined with one another, unless specifically stated otherwise. The following detailed description is therefore not to be interpreted in a limiting sense, and the scope of protection of the present invention is defined by the appended claims.

[0015] Within this description, the terms "connected," "connected," and "coupled" are used to describe both direct and indirect connections (e.g., resistive and / or electrically conductive, such as an electrically conductive connection), direct or indirect connections, and direct or indirect couplings. In the figures, identical or similar elements are designated with identical reference numerals where appropriate.

[0016] Depending on the specific embodiment, the term "coupled" or "coupling" can be understood as a connection and / or interaction, e.g., mechanical, hydrostatic, fluid-conducting, thermal, and / or electrical (e.g., direct or indirect). Several elements can, for example, be coupled along an interaction chain, along which the interaction (e.g., a signal) can be transmitted. For instance, two coupled elements can exchange an interaction, e.g., a mechanical, hydrostatic, fluid-conducting, thermal, and / or electrical interaction. Depending on the specific embodiment, "coupled" can also be understood as a mechanical (e.g., physical) coupling, e.g., by means of direct physical contact. A coupling can be configured to transmit a mechanical interaction (e.g., force, torque, etc.).

[0017] In the context of vacuum components (e.g., a pump, a chamber, a pipe, a valve, etc.), the term "coupled" or "coupling" can be understood as a (e.g., fluid-conducting) connection to a common vacuum system. The components of the vacuum system can be configured to exchange gas with each other via this coupling (i.e., interact fluid-conductingly), whereby the coupling can be gas-separated from an external element of the vacuum system (e.g., vacuum-tight).

[0018] Several interconnected vacuum chambers can be part of a common vacuum system in which a vacuum can be generated by means of one or more vacuum pumps connected to the vacuum chambers, whereby the gas flow between interconnected vacuum chamber(s) and / or vacuum pump(s) can be adjusted by means of optionally interposed valves.

[0019] Vacuum pumps are generally used to create a vacuum. They are differentiated by the type of vacuum they create and their operating principle. Depending on their physical principle, vacuum pumps are classified as either gas-transferring vacuum pumps (i.e., gas-transfer type vacuum pumps) or gas-binding vacuum pumps (i.e., gas-binding type vacuum pumps).

[0020] A gas-transferring vacuum pump (also known as a gas transfer vacuum pump) transports gas particles either in a closed working chamber (also known as a positive displacement vacuum pump) or by transferring momentum to the gas particles (e.g., through collisions). Typical examples of gas-transfer pumps include diaphragm pumps, reciprocating vacuum pumps, rotary vane pumps, sliding vane vacuum pumps, rotary lobe pumps, screw vacuum pumps, molecular pumps, turbomolecular pumps, and liquid jet pumps.

[0021] A gas-binding vacuum pump (also known as a gas-binding vacuum pump) achieves its pumping action by binding (e.g., sorbing, also known as sorption) the gas particles to a solid surface, thereby reducing the pressure in the recipient. Gas-binding vacuum pumps (e.g., sorption pumps) include getter pumps, sublimation pumps, condensation pumps (e.g., a cryopump), and adsorption pumps (a sorption pump in which the gas is bound by physical adsorption to the inner surface of a highly porous material).

[0022] According to various embodiments, a vacuum pump can be configured to achieve a low vacuum pressure (for example, a pressure of less than 10). -3mbar). The vacuum pump(s) can optionally be part of a multi-stage vacuum pump arrangement. A first pumping stage (e.g., comprising a rotary vane pump) of the vacuum pump arrangement generates a backing pump and is often referred to as the backing stage, with the subsequent pumping stage of the vacuum pump arrangement being connected to the receiver and providing, for example, a high vacuum. A multi-stage vacuum pump arrangement can, for example, comprise one or more positive displacement vacuum pumps as backing pumps and one or more turbomolecular vacuum pumps (also referred to as turbomolecular pumps) as high vacuum pumps.

[0023] In general (e.g., in backing or high vacuum), a gas transfer vacuum pump can provide a higher nitrogen pumping rate than a gas binder vacuum pump, e.g., more than ten or one hundred times the nitrogen pumping rate. Alternatively or additionally (e.g., in backing or high vacuum), a gas binder vacuum pump can provide a higher water pumping rate than a gas transfer vacuum pump, e.g., more than ten or one hundred times the water pumping rate.

[0024] According to various embodiments, a vacuum pump arrangement (comprising at least one high-vacuum pump) can be configured to create a vacuum (i.e., a pressure less than 0.3 bar) within a vacuum chamber, e.g., a pressure in a range of approximately 10 -2 mbar to approximately 10 -3mbar (in other words, pre-vacuum) or less, e.g., a pressure in the range of approximately 10 -3 mbar to approximately 10 -7 mbar (in other words, high vacuum) or less, e.g., a pressure smaller than high vacuum, e.g., less than approximately 10 -7 to provide mbar (in other words, ultra-high vacuum). The pump rate (i.e., normal volume pumped per unit of time) can be referenced to a specific pressure, e.g., a forevacuum, high vacuum, and / or ultra-high vacuum.

[0025] A condensation pump is a type of pump that utilizes the volume reduction of gases during condensation. The simplest design is the so-called cold trap, in which gases condense (freeze out) through cooling (e.g., with liquid nitrogen). However, the pumping capacity of such a cold trap depends on the vapor pressure of the pumped gas and thus on the type of gas. When cooled with liquid helium, all components of the air freeze out; when cooled with hydrogen, almost all components freeze out (also known as a cryopump). Cooling can also be provided in other ways, for example, by means of a different refrigerant (e.g., in a compression refrigeration machine), such as ammonia, carbon dioxide, or another hydrocarbon, or by means of a Peltier element.

[0026] Complex processes may require more effective gas separation than can be achieved using a chamber wall with a substrate transfer opening. For example, coating substrates with layers of different composition (e.g., different materials) may require different process conditions (e.g., metallic versus reactive / oxide or different reactive gas compositions such as Ar / N2 versus Ar / O2) and thus effective gas separation of the process conditions to reduce the mixing of the differing process conditions (gas separation).

[0027] Gas separation vividly describes a difference in gas pressure and / or gas composition between vacuum-connected areas (e.g., gas-separated areas). The components (e.g., the parts of a gas separation structure) that contribute to gas separation can be designed in such a way that the difference in gas pressure or gas composition between vacuum-connected areas (e.g., gas-separated areas) can be maintained (e.g., kept stable). In other words, gas exchange between vacuum-connected and gas-separated areas can be reduced, for example, the greater the gas separation between the areas.

[0028] For example, the gas separation structure can have one or more apertures, forming, for example, a slit and / or a tunnel (also referred to as a gas separation slit or gas separation tunnel).

[0029] According to various embodiments, a gap can be provided for gas separation (also referred to as a gas separation gap). The gas separation gap can be understood as a gap that impedes gas exchange through it. If the gap is also designed to allow the transport of a substrate, the gas separation gap can also be referred to as a transfer gap.

[0030] According to various embodiments, the gas separation gap (e.g., a transfer gap) can have a gap height (i.e., a distance between the opposing bodies or surfaces between which the gas separation gap is formed) of less than 10 cm (e.g., a gap height of less than 9 cm, 8 cm, 7 cm, 6 cm, 5 cm, 4 cm, 3 cm, 2 cm, or 1 mm), for example, less than 10 mm (millimeters). Alternatively or additionally, the gas separation gap can have a gap width (extent transverse to the gap height and / or transverse to the transport direction) of more than 1 m (meter), for example, more than 2 m. Alternatively or additionally, the gas separation gap can have a ratio (also referred to as the expansion ratio) of gap height to gap width of less than 0.1 (e.g., less than 0.05, 0.02, or 0.01). In contrast, a substrate transfer opening can have a height-to-width ratio greater than 0.1.

[0031] According to various embodiments, a chamber housing can be configured to provide a vacuum or at least a negative pressure within the chamber housing. To illustrate, the chamber housing (e.g., its chamber walls) can be designed to be so robust that it can be evacuated (pumped out), allowing external pressure (e.g., the prevailing atmospheric pressure or a pressure several orders of magnitude greater than the pressure inside the chamber housing) to act on the chamber housing (or its chamber walls) when evacuated, without irreversibly deforming and / or damaging the chamber housing. In other words, the chamber housing can be configured as a vacuum chamber.

[0032] The chamber housing can be a component (a base body) of a vacuum assembly and may contain one or more vacuum chambers, e.g., one or more airlock chambers, one or more buffer chambers, one or more transfer chambers, one or more process chambers (e.g., a coating chamber), and / or one or more gas separation chambers. The specific function or operating mode of the vacuum chamber can be defined by the chamber cover used with the chamber housing in conjunction with the internal components arranged within the chamber housing (e.g., gas baffles, valves, packing material, transport system, etc.).

[0033] Fig. 1A illustrates a vacuum arrangement 100a according to various embodiments in a schematic side view or cross-sectional view. The vacuum arrangement 100a can have several vacuum chambers, of which a first vacuum chamber 102as a substrate transfer chamber 102 (also known as transfer chamber) is set up, a second vacuum chamber 104 as a first dehydration chamber 104 is set up, a third vacuum chamber 106 as a second dehydration chamber 106 is set up and at least one (i.e. one or more than one) fourth vacuum chamber 108 as a coating chamber 108 is set up.

[0034] Of the several vacuum chambers 102 , 104 , 106 , 108 Can any vacuum chamber be part of a pressure stage? 302 , 304 , 306 , 308 as will be described in more detail later.

[0035] Of the several vacuum chambers 102 , 104 , 106 , 108 Any vacuum chamber can be equipped with a vacuum pump arrangement 202be coupled, e.g. fluid-conducting and / or with their pump inlet, of which each vacuum pump arrangement 202 Each vacuum pump arrangement can have one or more high-vacuum pumps. 202 For example, one or more high-vacuum pumps can be used. 240 of gas transfer type (also known as gas transfer pump arrangement) 240 (designated) exhibit, e.g., one or more than one turbomolecular pump.

[0036] At least those with the second dehydration chamber 106 coupled vacuum pump arrangement 202 (also as a third vacuum pump arrangement) 202 (designated) can be one or more than one high-vacuum pump 242 of the gas binding type (also known as gas binding pump arrangement) 242 (designated) have, for example, one or more than one cold trap (e.g., Meissner trap). Alternatively or additionally, the third vacuum pump arrangement can 202 more high vacuum pumps 242exhibiting a gas-binding type than those with the first dehydration chamber 104 , with the first vacuum chamber 102 and / or with at least one fourth vacuum chamber 108 coupled vacuum pump arrangement 202 .

[0037] For example, at least the one with the first dehydration chamber 104 coupled vacuum pump arrangement 202 It must be free of a high-vacuum pump of the gas-binding type. Alternatively or additionally, the first vacuum chamber can be used. 102 and / or at least one fourth vacuum chamber 108 coupled vacuum pump arrangement 202 be free of a high-vacuum pump of the gas-binding type.

[0038] The substrate transfer chamber 102It can be configured to convert a clocked substrate transport into a continuous substrate transport (also referred to as transport type conversion) to at least one coating chamber. This can be achieved, for example, by installing a [missing information - likely a specific type of] in the substrate transfer chamber. 102 two transport devices (e.g., separately controlled and / or driven) are adjacent to each other, between which at least one substrate 102s is transferred. The substrate transfer chamber can be clearly illustrated. 102 Output a continuously transported substrate tape. In general, one or more substrates can be used. 102s in one direction of transport 101t and / or through a transport area 101b are transported along which, after the substrate transfer chamber 102 the first dehydration chamber 104 is arranged after the first dehydration chamber 104 the second dehydration chamber 106is arranged and after the second dehydration chamber 106 the coating chamber 108 is arranged.

[0039] The multiple vacuum chambers can be gas-separated from each other in pairs, at least by means of a substrate transfer gap. 204 (also referred to simply as the transfer gap). The transfer gap 204 can provide a gas-separating connection between two adjacent vacuum chambers, through which multiple substrates can be continuously passed. 102s can be transported. The transfer gap 204 may have a lower gas conductivity and / or cross-sectional area (perpendicular to the direction of transport). 101t) exhibiting a chamber volume between two transfer gaps 204 (e.g. the transport sector) 101b) The provided gas separation can facilitate gas exchange through the transfer gap. 204to impede flow. Gas conductivity can be understood as the reciprocal of flow resistance.

[0040] The or every transfer gap 204 (e.g. between the several vacuum chambers) 102 , 104 , 106 , 108 The transfer chamber can optionally be of the always-open type, e.g., not be closable, e.g., have no substrate transfer flap and / or sealing surface. Alternatively or additionally, the transfer chamber can 102 on the inlet side, i.e., the first dehydration chamber 104 opposite, a substrate transfer opening 214 and a substrate transfer flap 206 exhibit the substrate transfer flap. 206 In an open state, a fluid-conducting connection can pass through the substrate transfer orifice. 214 provide (e.g. release) and in a closed state the substrate transfer opening 214Cover (e.g., with a vacuum seal). The opening and closing can be synchronized with the timed substrate transport.

[0041] The timed substrate transport can be used to treat a substrate 102s a greater temporal fluctuation in its transport speed and / or distance from the subsequent substrate 102s Provided as continuous substrate transport. Clocked substrate transport can be understood, for example, as a substrate 102s is moved and stopped alternately (in time and / or periodically), i.e., its transport speed changes several times between zero and a finite value, and / or that several successively transported substrates 102s They differ in their transport speeds. Continuous substrate transport, for example, can be understood as a substrate being transported continuously. 102sexhibits a transport velocity that is essentially invariant over time and / or that several (e.g., more than 5 or 10) successive substrates 102s exhibit essentially identical transport speeds.

[0042] In timed substrate transport, the interval between several successively transported substrates can be adjusted. 102s fluctuate over time, e.g. by at least the extent of the multiple substrates 102s in the direction of transport (e.g., by more than 1 m). Alternatively or additionally, in continuous substrate transport, the distance between several successively transported substrates can be adjusted. 102s be time-invariant, and e.g. be smaller than approximately 1 m, e.g. 10 cm.

[0043] In the first dehydration chamber 104 can a first heating device 114 be arranged in the second dehydration chamber. 106 Can a second heating device be used? 116be arranged. The first heating device 114 and the second heating device 116 They can be electrically coupled to each other, e.g. electrically optionally in series or parallel to each other and / or in such a way that they can be operated (e.g. controlled) together.

[0044] In the coating chamber 108 can be one or more than one coating device 118 (also referred to as a coating material source) be arranged.

[0045] The or any coating material source 118 According to various embodiments, it can be used to coat at least one substrate. 102s (i.e., exactly one substrate) 102s or multiple substrates 102s) be set up, which, for example, is the transport area 101b in the coating chamber 108(also referred to as the coating area) is transported through it. For example, the coating material source or sources can be set up to provide a gaseous coating material (material vapor) and / or liquid coating material, which is applied, for example, to at least one substrate. 102sto form a layer. A coating material source can include at least one of the following: a sputtering device, a thermal evaporation device (e.g., a laser beam evaporator, an arc evaporator, an electron beam evaporator, and / or a thermal evaporator), a precursor gas source, or a liquid-phase atomizer. A sputtering device can be configured to atomize the coating material using a plasma. A thermal evaporation device can be configured to evaporate the coating material using thermal energy. Depending on the properties of the coating material, sublimation, i.e., a thermal conversion of a liquid state (liquid phase) to a gaseous state, can occur as an alternative or in addition to thermal evaporation (i.e., a thermal conversion of a solid state (solid phase) to a gaseous state).In other words, the thermal evaporation device can also sublimate the coating material. A liquid-phase atomizer can be configured to apply a coating material from the liquid phase, e.g., a dye.

[0046] For example, the coating material may contain or be composed of at least one of the following materials: a metal; a transition metal; an oxide (e.g., a metal oxide or a transition metal oxide); a dielectric; a polymer (e.g., a carbon-based polymer or a silicon-based polymer); an oxynitride; a nitride; a carbide; a ceramic; a metalloid (e.g., carbon); a perovskite; a glass or glass-like material (e.g., a sulfide glass); a semiconductor; a semiconductor oxide; a semi-organic material; and / or an organic material.

[0047] The one connected to the coating chamber 108 coupled vacuum pump arrangement 202It may be set up, at least in one coating chamber. 108 to remove gas so that within the coating chamber 108 A process atmosphere can be provided. The process atmosphere can contain a working gas and optionally a reactive gas, or a gas mixture of several working gases and several optional reactive gases.

[0048] Optionally, the vacuum arrangement can be 100a a control device which is connected to one or more components of the vacuum arrangement 100a It can be coupled to control and / or regulate the operating point in one or more vacuum chambers of the vacuum arrangement. 100ae.g., the temperature (also referred to as process temperature) within it, the pressure (also referred to as internal chamber pressure or total pressure) within it, one or more partial pressures within it, and / or the chemical composition of the atmosphere within it. In other words, the operating point can be set or controlled, e.g., during coating, dehydration, heating, and / or pumping.

[0049] Optionally, the vacuum arrangement can be 100a Each has an additional lock chamber (not shown) on the inlet and / or outlet side, as will be described in more detail later.

[0050] Fig. 1B illustrates a vacuum arrangement, e.g. the vacuum arrangement 100a , according to various embodiments in a schematic diagram 100b , in which the chamber internal pressure 111d above the transport route 111t in the direction of transport 101tis applied. The vacuum arrangement can generally have several pressure levels. 302 , 304 , 306 , 308 have components which are gas-separated from each other (e.g. of the always-open type), and / or of which each pressure stage has: one or more than one vacuum chamber and a vacuum pump arrangement coupled to it.

[0051] One or each pressure level 302 , 304 , 306 , 308 It may, for example, include at least the components contributing to pressure generation (e.g., their entirety), such as vacuum chamber(s), vacuum pump(s), inlet gas separation, outlet gas separation, optional gas supply, etc.

[0052] Gas separation can ensure that each pair of successive pressure stages differs from one another in its atmosphere (e.g., inside its vacuum chamber(s)), for example, in pressure (also referred to as chamber internal pressure or atmospheric pressure) and / or the chemical composition (also referred to as atmospheric composition) of the atmosphere. The vacuum pump arrangement can provide the chamber internal pressure, e.g., as described above.

[0053] Of the several pressure stages, a first pressure stage can be used. 302 or the transport device therein is set up for transferring the transport type. 304 the first dehydration chamber 104 exhibit several pressure levels, including a third pressure level. 306 the second dehydration chamber 106 exhibit several pressure levels, including a fourth pressure level. 308(also referred to as coating stage) set up for substrate coating, e.g. one or more than one coating chamber 108 exhibit. Along the direction of transport 101t The internal chamber pressure can differ between two successive pressure stages, e.g., by at least one order of magnitude (i.e., a factor of at least approximately 10, e.g., at least approximately 100). Up to the third pressure stage 306 Can the pressure be adjusted along the transport direction? 101t sink and then to the coating stage 308 rise again, e.g. to a value greater than the internal pressure of the second dehydration chamber 106 and / or the first dehydration chamber 104 .

[0054] Optionally, the second pressure stage can be 304 be free of a high-vacuum pump of the gas-binding type or at least have fewer high-vacuum pumps of the gas-binding type than the third pressure stage 306.

[0055] The first pressure stage 302 and / or the second pressure stage 304 (e.g., their vacuum pump arrangement and / or heating device) may be configured to provide a dehydration operating point. The dehydration operating point may be defined by at least one dehydration temperature (i.e., the chamber internal temperature at which dehydration occurs) and / or one dehydration pressure (i.e., the chamber internal pressure at which dehydration occurs). The dehydration temperature may, for example, be in a range of approximately 130°C to approximately 320°C, or, for example, in a range of approximately 175°C to approximately 250°C. The dehydration pressure may, for example, be in a range of approximately 10 -2 mbar to approximately 10 -5 mbar, e.g. in a range of approximately 10 -2 mbar to approximately 10 -3 mbar.

[0056] The multiple pressure stages can be provided by means of one or more chamber housings, each containing multiple vacuum chambers. At least one of these vacuum chambers can be part of one of the multiple pressure stages.

[0057] The multiple pressure levels 302 , 304 , 306 , 308 (e.g. their vacuum chambers) can be accessed via a substrate transfer aperture 204 They must be interconnected, for example, to form a common vacuum system. The vacuum system can be essentially airtight to the outside, for example, by means of at least one valve, at least one chamber lid, and / or at least one transfer opening flap.

[0058] Fig. 2A illustrates the first pressure stage 302 according to various embodiments in a schematic side view or cross-sectional view.

[0059] The first pressure stage302 may feature: a lock chamber 302s (e.g. provided by means of a first vacuum chamber) for introducing a substrate 102s into the vacuum arrangement and / or for ejecting a substrate 102s from the vacuum assembly, an optional buffer chamber 312s (e.g. provided by means of a second vacuum chamber) to hold a substrate 102s , the transfer chamber 102 (e.g. provided by means of a third vacuum chamber) to form a substrate ribbon (a continuously transported sequence of substrates) 102s) from several substrates 102s .

[0060] Fig. 2B illustrates the third pressure stage 306 according to various embodiments in a schematic side view or cross-sectional view.

[0061] The third pressure stage 306 Can one or more than one high-vacuum pump 242of the gas binding type (more generally also known as gas binding pump arrangement) 242 (designated) exhibit.

[0062] For example, the third pressure stage can 306 more high vacuum pumps 242 of the gas binding type and / or have a higher gas binding type absorbency than the second pressure stage 304 Alternatively or additionally, the third pressure stage can be used. 306 a larger one using the gas binding pump arrangement 242 Provided pump rate for water exhibits as the second pressure stage 304 .

[0063] The or any high-vacuum pump 242 The gas binding type can have: a gas binding surface 242a , a cooling device 242b and a supply structure 242c , which is the gas binding surface 242a with the cooling device 242b (e.g. fluid-conducting and / or electrical) couples (e.g. couples), e.g. fluid-conducting and / or electrically connects them together.

[0064] In general, the cooling device 242b be set up for the gas binding area 242a to extract thermal energy, e.g., by means of a fluid or electrothermally, and / or to reduce it to a temperature below the freezing point of water and / or below approximately 0°C (e.g., -10°C, -25°C, or -50°C). The freezing point of water can decrease with decreasing pressure. For example, it can decrease at the dehydration operating point of the third pressure stage. 306 be smaller than approximately 0°C, -10°C, -25°C or -50°C.

[0065] The cooling device 242b It can, for example, be configured to generate a temperature difference and / or a heat flow against a temperature gradient. Depending on the design of the high-vacuum pump(s) 242Depending on the type of gas-based cooling device, its cooling device(s) can be based on various cooling principles, e.g. electrothermal (then also referred to as an electrothermal semiconductor converter), heat radiation-based (then also referred to as a radiator) and / or based on a thermodynamic cycle (then also referred to as a heat pump, e.g. a compression heat pump).

[0066] The or any high-vacuum pump 242 The gas-type binding may, for example, have: a heat exchanger 242a , a cooling unit 242b and a fluid connection 242c , which the heat exchanger 242a with the cooling unit 242b Fluid-conducting connection. The heat exchanger 242a It may, for example, have a fluid line (e.g., a pipeline), e.g., in the form of a cooling coil or in another meandering shape. For example, the cooling device 242b to supply the heat exchanger 242aIt should be set up, for example, with a temperature-controlled fluid (e.g., a cooling fluid). Alternatively or additionally, the cooling device can 242b be supplied with electrical energy. For example, the cooling device can be used. 242b a cooling fluid to the heat exchanger 242a supplied and then reabsorbed. Optionally, the cooling device can be... 242b outside the second dehydration chamber 106 be arranged.

[0067] Optionally, the or any high-vacuum pump can 242 of the gas binding type, a shield 242d exhibiting, which are located in the second dehydration chamber 106 is arranged. The shielding 242d can at least a first part of the gas binding area 242a (also referred to as a shielded area) shield, e.g. from the transport area 101b and / or the second heating device 116 Furthermore, the shielding can 242da second part (also referred to as the exposed area) of the gas binding surface 242a uncover, e.g. opposite the transport area 101b and / or the second heating device 116 . Exposure can be achieved, for example, by means of one or more than one opening. 24o be or will be provided.

[0068] The transport area 101b can be used to distinguish between the gas binding pump arrangement 242 and the second heating device 116 be arranged.

[0069] For example, the shielding can 242d a plate (e.g. a sheet or other planar base body) or be formed from one in which one or more than one opening 24o is educated.

[0070] The ratio (also known as suction access area ratio) of the exposed area to the shielded area can, for example, be less than approximately 50% (e.g., 40%, 30%, 20%, 10%, 5%) and / or be adjustable, for example, by means of one or more regulating elements. 314 and / or a control device. The or each regulatory element 314 It can, for example, be planar and, depending on its position and / or orientation, may have at least one opening. 24o the shielding 242d partially cover. For example, this or each regulatory element can 314 have a fin, a lid, a cap, a flap, a hood or something similar.

[0071] The second heating device 116 and / or the first heating device 114 (cf.) Fig. 1A) can be set up to provide the dehydration temperature, e.g. by emitting a corresponding amount of thermal radiation.

[0072] The second heating device 116 and / or the first heating device 114 These can be contactless heating devices, e.g., using a radiant heat source. The second heating device 116 and / or the first heating device 114 can have one or more than one resistive heat radiation source.

[0073] Fig. Figure 3 illustrates a gas binding pump arrangement 242 according to various embodiments in a schematic perspective view.

[0074] The shielding 242d can an enclosure 312 have or another base body surrounding and / or shielding the shield 312 , in which one or more than one opening 24o (e.g., multiple openings) is formed. For example, multiple openings can be formed. 24o in a (e.g. flat) lid 316 of the base body 312be formed. The openings 24o They can, for example, be elongated, e.g. parallel to each other.

[0075] Of the several openings 24o can at least part or each opening be equipped with a regulatory element 314 It may be partially covered and / or sealed. The size of the exposed area can be adjusted, for example, by aligning (e.g., bending) a respective regulator element. 314 be set or will be set. An opening can be illustrated by this. 24o by means of a regulatory element 314 can be opened or closed further. Optionally, the lid can be... 316 the enclosure 312 They will be removed to increase access.

[0076] The lid 316 can be planar. Alternatively or additionally, the regulatory elements can 314 obliquely to the flat lid and / or a cross-section of the opening(s) 24o be arranged.

[0077] Fig. Figure 4 illustrates a vacuum setup 400 according to various embodiments in a schematic side view or cross-sectional view, e.g. set up like the vacuum arrangement 100a .

[0078] The vacuum arrangement 400 Furthermore, a transport device can 101 feature multiple transport rollers 402 exhibits.

[0079] The one with the first dehydration chamber 104 coupled vacuum pump arrangement 202 can a gas transfer pump arrangement 240 exhibiting one or more gas transfer vacuum pumps.

[0080] The one with the second dehydration chamber 106 coupled vacuum pump arrangement 202 can a gas binding pump arrangement 242 which has one or more than one gas-binding vacuum pump. Optionally, it can be equipped with a second dehydration chamber. 106coupled vacuum pump arrangement 202 a gas transfer pump arrangement 240 exhibiting one or more gas transfer vacuum pumps.

[0081] The transfer gap 204 The gas separation surface element (then also referred to as a gas separation wall) can be provided, for example, in or on a housing wall element, such as a bulkhead or chamber wall, and / or by means of another gas separation surface element. For example, the housing wall element can have a substrate transfer opening which is covered and / or narrowed by means of the gas separation surface element (e.g., a slotted sheet) in which the transfer gap is formed.

[0082] According to various embodiments, the shielding is variable and / or controllable. 242d one or more than one Meissner trap 242 provided. The shielding 242dThis allows for a restriction / regulation of their suction access and / or an extension of their service life. Suction access can be used to describe what proportion of the total area of ​​the gas-binding surface is exposed, i.e., what cross-sectional area the gas-binding vacuum pump effectively pumps out.

[0083] According to various embodiments, an adjustable gas separation is achieved. 204 Provided for the targeted differentiation and / or production of areas with higher and lower water vapor partial pressure (H2O partial pressure).

[0084] In areas with high H2O partial pressure, the use of TMP technology for pumping water (providing a high suction capacity p*S for water) is clearly demonstrated, while the Meissner trap pumps water from the area with low H2O partial pressure (significantly extending the service life).

[0085] Instead of the Meissner trap, another gas-binding vacuum pump can also be used.

[0086] Furthermore, the vacuum arrangement 400 have a coating stage (not shown), e.g. to incorporate one or more than one substrate by means of a coating process and / or a coating device 102s to coat. Furthermore, the vacuum arrangement 400 a transport device 101 have the capacity to transport at least one substrate 102s along a transport route in one transport direction 101t through the multiple pressure stages into the coating stage. Furthermore, the vacuum arrangement 400 one or more than one coating device 118 exhibit, e.g., a coating material source. The coating device 118 can, for example, be used to emit at least one coating material in the direction of the transport path. 111p and / or the transport device 101 be set up.

[0087] Fig. 5 illustrates a procedure 500 according to various embodiments in a schematic flowchart, e.g. for operating the vacuum arrangement 100a or 400 .

[0088] The procedure 500 can in 501 Optionally feature: Conversion of a timed substrate transport into a continuous substrate transport.

[0089] The procedure 500 can in 503 exhibit: Transport of at least one substrate 102s between a first dehydration zone and a second dehydration zone, which are gas-separated from each other. The transport 503 may feature: Supply of continuous substrate transport through the first dehydration area (e.g., the interior of the first dehydration chamber) 104 ) through to the second dehydration area (e.g., the interior of the second dehydration chamber) 106 ).

[0090] The procedure 500 can in 505 , 507 exhibit: Dehydration (also known as desorption) of the substrate 102s in the first dehydration zone at a first pressure and the second dehydration zone at a second pressure. Dehydration can occur in 505 This includes: heating the first dehydration zone and initial pumping out of the first dehydration zone using gas transfer (also referred to as initial dehydration). Dehydration can be performed in 507 exhibit: Heating of the second dehydration zone and second pumping of the second dehydration zone by means of gas binding (also referred to as second dehydration).

[0091] The procedure 500 can optionally be in 509 exhibit: Coating in a coating area (which is achieved by means of the coating device) 118is provided) during substrate transport through the coating area (also referred to as the coating process).

[0092] The first dehydration can occur at a higher total pressure (also referred to as chamber pressure) and / or hydrogen partial pressure than the second dehydration, e.g., at least twice the total pressure. Alternatively or additionally, the first dehydration can occur at a lower substrate temperature. 102s take place.

[0093] The substrate transport can include: one or more than one substrate 102s to transport.

[0094] The first dehydration and the second dehydration may exhibit the presence of one or more substrates. 102s at least to remove water (adsorbed water), e.g., by desorbing it from its surface. The first and second dehydration processes can exhibit the effects of the substrate. 102sto pump out the desorbed water.

[0095] Fig. Figure 6 illustrates a procedure 600 according to various embodiments in a schematic flowchart, e.g. for adjusting the vacuum arrangement 100a or 400 .

[0096] The procedure 600 can be found in 601: Dehydrating a first substrate 102s in a first dehydration configuration and subsequent coating of the first substrate 102s The procedure 600 can be found in 603: Changing the first dehydration configuration to a second dehydration configuration. The procedure 600 can be found in 605: Dehydrating a second substrate 102s in the second dehydration configuration and subsequent coating of the second substrate 102s .

[0097] The dehydration configuration can be defined by the following parameters: the dehydration operating point, the gas separation of the two dehydration chambers (or the dehydration areas provided therein), and / or the suction access of the gas binding vacuum pump.

[0098] Changing the dehydration configuration may involve changing one or more parameters of the dehydration configuration.

[0099] Changing the dehydration configuration may involve altering the gas separation of two dehydration areas from each other and / or changing the suction access of a gas binding vacuum pump by which dehydration is performed.

[0100] Changing the dehydration configuration (e.g., the gas separation of the two dehydration zones) can involve altering a transfer gap between the two dehydration zones, for example, changing the expansion ratio of the transfer gap and / or the gap height. Alternatively or additionally, changing the dehydration configuration (e.g., changing the suction access of the gas-absorbing vacuum pump) can involve altering an area ratio (also referred to as the suction access area ratio) between a covered area of ​​the gas-absorbing vacuum pump and an exposed area of ​​the gas-absorbing vacuum pump, for example, by covering or uncovering an opening through which the gas-absorbing vacuum pump pumps (e.g., by using a regulating element). 314 (changes in its orientation and / or position).

[0101] The two pressure levels can be used to determine the second pressure level 304 and the third pressure stage 306exhibit the second pressure stage 304 can provide the first dehydration area (e.g., by means of the first dehydration chamber) 104 ) and the third pressure stage 306 can provide the second dehydration area (e.g., by means of the second dehydration chamber) 106 ) .

[0102] Dehydration 601 , 605 of the first and / or second substrate (or several first or second substrates) can each exhibit: first pumping 505 of the first dehydration zone and / or in the second pressure stage 304 (e.g. in the first dehydration chamber) 104 ) by means of gas transfers and second pumping 507 of the second dehydration zone and / or in the third pressure stage 306 (e.g. in the second dehydration chamber) 106 ) by means of gas binding and heating 505 , 507of the first dehydration area and the second dehydration area.

[0103] The following are various examples that refer to what has been described previously and depicted in the figures.

[0104] Example 1 is a vacuum arrangement 100a , 400 , comprising: at least one coating chamber in which a coating device is arranged, a substrate transfer chamber 102 for converting a timed substrate transport into a continuous substrate transport to at least one coating chamber; a first dehydration chamber 104 and a second dehydration chamber 106 , which are gas-separated from each other and with regard to substrate transport between the substrate transfer chamber 102 and which are arranged in at least one coating chamber, and of which there is one in each dehydration chamber 104 , 106Optionally, a heating device 114 , 116 is arranged; a first high-vacuum pump 240 of the gas transfer type for pumping out the first dehydration chamber 104 ; and a second high-vacuum pump 242 of the gas binding type for pumping out the second dehydration chamber 106 ; wherein the second dehydration chamber 106 regarding substrate transport between the first dehydration chamber 104 and is located in the coating chamber.

[0105] Example 2 is a vacuum arrangement 100a , 400 , comprising: at least one optional coating chamber in which a coating device is arranged, a first dehydration chamber 104 and a second dehydration chamber 106 , which are gas-separated from each other, and of which in each dehydration chamber 104 , 106 Optionally, a heating device 114 , 116is arranged; a substrate transfer chamber 102 to convert a timed substrate transport into a continuous substrate transport to the first dehydration chamber 104 and / or second dehydration chamber 106 there; a first high-vacuum pump 240 of the gas transfer type for pumping out the first dehydration chamber 104 ; and a second high-vacuum pump 242 of the gas binding type for pumping out the second dehydration chamber 106 ; wherein the first dehydration chamber 104 regarding substrate transport between the second dehydration chamber 106 and the substrate transfer chamber 102 is arranged.

[0106] Example 3 is the vacuum arrangement 100a , 400 according to example 1 or 2, wherein the first dehydration chamber 104 and the second dehydration chamber 106 by means of a substrate transfer gap 204are separated from each other by aisles.

[0107] Example 4 is the vacuum arrangement 100a , 400 according to Example 3, wherein the substrate transfer gap 204 has a minimum dimension of less than 10 cm and / or provides a gas separation factor of less than 1 / 10.

[0108] Example 5 is the vacuum arrangement 100a , 400 according to one of examples 1 to 4, wherein the first dehydration chamber 104 and the first high-vacuum pump 240 are part of a first pressure stage, and the second dehydration chamber 106 and the second high-vacuum pump 242 are part of a second pressure stage; wherein the first pressure stage and the second pressure stage are arranged such that, during operation, an internal chamber pressure (also referred to as operating pressure) is maintained in the first dehydration chamber. 104 is larger than in the second dehydration chamber 106; and / or where the first pressure stage has fewer high-vacuum pumps and / or gas-binding suction capacity than the first pressure stage (e.g., no high-vacuum pump or gas-binding suction capacity).

[0109] Example 6 is the vacuum arrangement 100a , 400 according to one of examples 1 to 5, wherein the first high-vacuum pump 240 has a lower pumping rate for water gas than the second high-vacuum pump. 242 ; and / or wherein the first high-vacuum pump 240 has a higher pumping rate for nitrogen than the second high-vacuum pump 242 .

[0110] Example 7 is the vacuum arrangement 100a , 400 according to one of examples 1 to 6, wherein during operation a temperature of the first high-vacuum pump 240 is greater than a temperature of the second high-vacuum pump 242 .

[0111] Example 8 is the vacuum arrangement 100a , 400according to one of examples 1 to 7, wherein the first high-vacuum pump 240 a turbomolecular pump; and / or wherein the second high-vacuum pump 242 has a cold trap.

[0112] Example 9 is the vacuum arrangement 100a , 400 according to one of examples 1 to 8, wherein the second high-vacuum pump 242 has a heat exchanger (e.g. a cooling coil) and / or a heat sink (i.e. an absorber for thermal radiation).

[0113] Example 10 is the vacuum arrangement 100a , 400 according to one of examples 1 to 9, wherein the heating device 114 in the first dehydration chamber 104 and / or in the second dehydration chamber 106 is set up to provide a dehydration operating point.

[0114] Example 11 is the vacuum arrangement 100a , 400 according to one of examples 1 to 10, wherein the heating device 114in the first dehydration chamber 104 and the heating device 116 in the second dehydration chamber 106 provide essentially the same heating power density and / or are electrically coupled in parallel and / or in series with each other.

[0115] Example 12 is the vacuum arrangement 100a , 400 according to one of examples 1 to 11, the vacuum arrangement 100a , 400 furthermore featuring: a shield 242d , which is located in the second dehydration chamber 106 between the second high-vacuum pump 242 and a substrate transport area 101b the second dehydration chamber 106 is arranged, for example the substrate transport area 101b between the second heating device 116 and the second high-vacuum pump 242 is arranged; and / or the vacuum arrangement 100a , 400further comprising: a first heating device 114 , which in the first dehydration chamber 104 is arranged; and / or a second heating device 116 , which is located in the second dehydration chamber 106 is arranged.

[0116] Example 13 is the vacuum arrangement 100a , 400 according to example 12, where the shielding 242d at least one opening 24o features which includes the second high-vacuum pump 242 regarding substrate transport area 101b exposes and / or the second high-vacuum pump 242 fluid-conducting with the substrate transport area 101b connects.

[0117] Example 14 is the vacuum arrangement 100a , 400 according to example 13, where the shielding 242d a planar base body which has at least one opening 24o is penetrated.

[0118] Example 15 is the vacuum arrangement 100a , 400 according to example 13 or 14, wherein an area ratio of the area by means of the at least one opening 24o exposed area of ​​the second high-vacuum pump 242 to a shielded area of ​​the second high-vacuum pump 242 is less than 50%; and / or where the shielding 242d at least one regulatory element 314 has which has at least one opening 24o at least partially covers it.

[0119] Example 16 is the vacuum arrangement 100a , 400 according to Example 14 or 15, wherein the regulatory element 314 a surface element which, for example, is arranged at an angle to the planar base body.

[0120] Example 17 is the vacuum arrangement 100a , 400 according to one of examples 1 to 16, wherein at least one coating chamber is separated from the second dehydration chamber 106gas-separated, e.g. by means of a substrate transfer gap 204 .

[0121] Example 18 is the vacuum arrangement 100a , 400 according to one of examples 1 to 17, wherein the substrate transfer chamber 102 (on the inlet side) it has a pivotally mounted valve flap.

[0122] Example 19 is the vacuum arrangement 100a , 400 according to one of examples 1 to 18, further comprising: a transport arrangement (comprising one or more than one transport device, each of which, for example, has several transport rollers, and / or a transport area) 101b defining), which in the substrate transfer chamber 102 is set up to provide the conversion of a clocked substrate transport into a continuous substrate transport, optionally including the vacuum arrangement 100a , 400furthermore, the coating chamber (in which, for example, a coating device is arranged) has, wherein, for example, the coating chamber is oriented in the direction of substrate transport (also referred to as transport direction) to that of the substrate transfer chamber. 102 The immediately following (e.g., the very first) coating chamber is, for example, the first dehydration chamber. 104 and the second dehydration chamber 106 between the substrate transfer chamber 102 and are arranged in the coating chamber.

[0123] Example 20 is the vacuum arrangement 100a , 400 according to Example 19, wherein the transport arrangement is further configured for substrate transport in a transport direction from the substrate transfer chamber 102 through the first dehydration chamber 104 and the second dehydration chamber 106 through to or into the coating chamber.

[0124] Example 21 is a vacuum arrangement 100a , 400 , featuring: a vacuum chamber 106 , which includes a transport area 101b features; a high-vacuum pump 242 from the gas binding type for pumping out the vacuum chamber 106 ; a transport device (e.g. having several transport rollers and / or a transport area) 101b defining) for substrate transport through the transport area 101b through it; a shield 242d , which is between the high vacuum pump 242 and the transport sector 101b is arranged to shield the high vacuum pump 242 .

[0125] Example 22 is the vacuum arrangement 100a , 400 according to Example 21, where the shielding 242d at least one opening 24o features which the high vacuum pump 242 regarding the transport sector 101b exposes and / or which the high vacuum pump 242with the transport area 101b fluid-conducting connection.

[0126] Example 23 is the vacuum arrangement 100a , 400 according to Example 22, where the shielding 242d a planar base body which has at least one opening 24o is penetrated.

[0127] Example 24 is the vacuum arrangement 100a , 400 according to Example 22 or 23, wherein an area ratio of the means of the at least one opening 24o exposed area of ​​the high vacuum pump 242 to the shielded area of ​​the high vacuum pump 242 is less than 50%; and / or where the shielding 242d at least one regulatory element 314 has which has at least one opening 24o at least partially covers it.

[0128] Example 25 is the vacuum arrangement 100a , 400 according to Example 23 or 24, wherein the regulatory element 314a surface element which, for example, is inclined to the planar base body.

[0129] Example 26 is a procedure 500 , showing: Transfer 501 from a timed substrate transport to a continuous substrate transport; feeding 503 of continuous substrate transport through a first dehydration zone and a second dehydration zone, which are gas-separated from each other, to a coating process; heating 505 , 507 of the first dehydration zone and the second dehydration zone (e.g. by emitting thermal radiation into them and / or by means of a thermal radiation source); first pumping 505 of the first dehydration area by means of gas transfer; and second pumping 507 the second dehydration zone by means of gas binding.

[0130] Example 27 is a procedure 500 , showing: Transfer501 from a timed substrate transport to a continuous substrate transport; feeding 503 of continuous substrate transport through a first dehydration zone to a second dehydration zone, which are gas-separated from each other, and optionally through the second dehydration zone to a coating process; heating 505 , 507 of the first dehydration zone and the second dehydration zone; first pumping 505 of the first dehydration area by means of gas transfer; and second pumping 507 the second dehydration zone by means of gas binding.

[0131] Example 28 is the vacuum arrangement 100a , 400 according to Example 26 or 27, wherein a pressure greater than that provided in the second dehydration area is provided in the first dehydration area.

[0132] Example 29 is the vacuum arrangement 100a , 400according to one of examples 26 to 28, wherein the second pumping through at least one opening 24o in a shield 242d through.

[0133] Example 30 is the vacuum arrangement 100a , 400 according to one of Examples 26 to 29, wherein the heating of the first dehydration zone and the heating of the second dehydration zone are carried out in such a way that dehydration of a substrate transported by means of substrate transport 102s This has been done.

[0134] Example 31 is a process comprising: transporting at least one substrate 102s from a first dehydration zone to a second dehydration zone, which are gas-separated from each other; dehydration of the substrate. 102sin the first dehydration zone at a first pressure and in the second dehydration zone at a second pressure; wherein the first pressure is greater than the second pressure and is provided by means of a gas transfer vacuum pump; and wherein the second pressure is provided by means of a gas binding vacuum pump (e.g. by means of one or more than one Meissner trap and one or more than one turbomolecular pump).

[0135] Example 32 is the vacuum arrangement 100a , 400 , featuring: several gas-separated pressure stages, each of which is a vacuum chamber 106 and a vacuum pump for pumping out the vacuum chamber 106 comprising at least one coating stage, which includes a coating chamber and a coating device therein, and a transport device for transporting a substrate 102sthrough the multiple pressure stages in a transport direction towards the coating chamber, wherein the transport device in a first pressure stage of the multiple pressure stages is configured to convert a pulsed substrate transport into a continuous substrate transport; wherein a second pressure stage and a third pressure stage of the multiple pressure stages optionally each have a heating device 114 , 116 exhibiting, and the second pressure stage is arranged between the first pressure stage and the third pressure stage with respect to the transport direction; wherein the vacuum pump of the second pressure stage is of the high-vacuum gas transfer type and the vacuum pump of the third pressure stage is of the high-vacuum gas binding type; wherein, for example, of the several pressure stages, an additional first pressure stage is provided for lock operation.

[0136] Example 33 is a procedure ( 600 exhibiting: Dehydration 601a first substrate 102s in a first dehydration configuration and subsequent coating of the first substrate 102s ; Change 603 the first dehydration configuration into a second dehydration configuration; dehydration 605 a second substrate 102s in the second dehydration configuration and subsequent coating of the second substrate 102s ; where the changing 603 exhibits a gas separation between two pressure stages (or dehydration areas provided therein) and / or a suction access of a gas binding vacuum pump by means of which dehydration takes place.

Claims

[1] Vacuum arrangement (100a, 400), comprising: • a first dehydration chamber (104) and a second dehydration chamber (106) that are gas-separated from each other; • a substrate transfer chamber (102) for converting a timed substrate transport into a continuous substrate transport to the second dehydration chamber (106); • a first high-vacuum pump (240) of the gas transfer type for pumping out the first dehydration chamber (104); and • a second high-vacuum pump (242) of the gas-binding type for pumping out the second dehydration chamber (106); • wherein the first dehydration chamber (104) is arranged between the second dehydration chamber (106) and the substrate transfer chamber (102) with respect to substrate transport. [2] Vacuum arrangement (100a, 400) according to claim 1, wherein the first dehydration chamber (104) and a second dehydration chamber (106) are gas-separated from each other by means of a substrate transfer gap (204). [3] Vacuum arrangement (100a, 400) according to claim 2, wherein the substrate transfer gap (204) has a minimum extent of less than 10 cm. [4] Vacuum arrangement (100a, 400) according to one of claims 1 to 3, wherein the first high-vacuum pump (240) comprises a turbomolecular pump; and / or wherein the second high-vacuum pump (242) has a cold trap. [5] Vacuum arrangement (100a, 400) according to one of claims 1 to 4, further comprising: a shield (242d) which is arranged in the second dehydration chamber (106) between the second high vacuum pump (242) and a substrate transport area (101b) of the second dehydration chamber (106). [6] Vacuum arrangement (100a, 400) according to claim 5, wherein the shield (242d) has at least one opening (24o) which exposes the second high vacuum pump (242) with respect to the substrate transport area (101b) and / or connects the second high vacuum pump (242) fluidly to the substrate transport area (101b). [7] Vacuum arrangement (100a, 400) according to claim 6, wherein the shield (242d) has a planar base body which is penetrated by the at least one opening (24o). [8] Vacuum arrangement (100a, 400) according to claim 7, wherein the shield (242d) has at least one regulatory element (314) which at least partially covers the at least one opening (24o). [9] Vacuum arrangement (100a, 400) according to any one of claims 1 to 8, further comprising: a first heating device (114) which is arranged in the first dehydration chamber (104); and / or a second heating device (116) which is arranged in the second dehydration chamber (106). [10] Vacuum arrangement (100a, 400) comprising: • a vacuum chamber (106) which has a transport area (101b); • a high vacuum pump (242) of the gas binding type for pumping out the vacuum chamber (106); • a transport device for transporting the substrate through the transport area (101b); • a shield (242d) which is arranged between the high vacuum pump (242) and the transport area (101b) to shield the high vacuum pump (242). [11] Method (500), comprising: • Transporting (503) at least one substrate (102s) from a first dehydration area to a second dehydration area, which are gas-separated from each other; • Dehydrating (505, 507) the substrate (102s) in the first dehydration area at a first pressure and in the second dehydration area at a second pressure; • wherein the first pressure is greater than the second pressure and is provided by means of a gas transfer vacuum pump; and • where the second pressure is provided by means of a gas-binding vacuum pump. [12] Method (600), comprising: • Dehydrating (601) a first substrate (102s) at a first dehydration configuration and subsequent coating of the first substrate (102s) ; • Change (603) the first dehydration configuration to a second dehydration configuration; • Dehydrating (605) a second substrate (102s) at the second dehydration configuration and subsequent coating of the second substrate (102s) ; • wherein the modification (603) includes a gas separation between two pressure stages and / or a suction access of a gas binding vacuum pump by means of which dehydration is carried out.

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