Alignment method for use in a semiconductor inspection device

DE102018125608B4Active Publication Date: 2026-03-19MPI CORP
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Filing Date
2018-10-16
Publication Date
2026-03-19

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Abstract

Alignment method for use in a semiconductor inspection device (10), wherein the semiconductor inspection device (10) comprises a stage (11) and a touch control screen (13), wherein the alignment method comprises the following steps: • Displaying an image (191) of a measurement object (19) supported by the object stage (11) on the touch control screen (13), • Detecting a first touch point (231) and a second touch point (232) that result on the touch control screen (13), and defining a first straight line (24) according to the first touch point (231) and the second touch point (232), • Detecting a third touch point (233) and a fourth touch point (234) that appear on the touch control screen (13), and defining a second straight line (25) corresponding to the third touch point (233) and the fourth touch point (234), • Calculating an included angle (θ2) defined by the first straight line (24) and the second straight line (25), and • Rotating the object stage (11) according to the included angle (θ2).
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Citation Information

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