Mounting structure of an electronic component
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- YAZAKI CORP
- Filing Date
- 2018-06-18
- Publication Date
- 2026-07-23
AI Technical Summary
Conventional electronic component mounting structures limit the latitude in arrangement on the substrate and may result in positional deviations between the electronic components and the substrate, as they are typically fixed by pressing from the outer peripheral end, leading to restricted placement and potential misalignment.
A mounting structure that includes a heat sink, substrate, mounting metal connector, and fastener, where the fastening metal connector has a base portion and pressing portions that elastically deform to securely attach electronic components to the substrate, allowing for increased latitude in arrangement and reliable attachment.
The solution enhances the latitude in arranging electronic components on the substrate while ensuring secure attachment, improves assembly efficiency, and facilitates effective heat dissipation by pressing the components closely to the heat sink.
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Abstract
Description
Background of the invention; Field of the invention
[0001] The present invention relates to a fastening structure for electronic components. Description of the related technique
[0002] Traditionally, electronic components such as transistors have been used in switched-mode power supplies, such as DC-DC converters. Since these electronic components generate heat during operation at high temperatures, they are pressed and attached to a heat sink, which serves as a heat dissipation device, using a metal mounting connector.
[0003] For example, the fastening metal connecting piece of international publication WO2008 / 099.554 discloses a technology for clamping a heat sink, a substrate and an electronic component by means of a pair of fastening metal connecting pieces in a state in which a protruding section of the heat sink penetrating the substrate and the electronic component are brought into contact.
[0004] However, in a conventional mounting structure for electronic components, when a mounting metal connector is inserted from the outer circumferential end section of the substrate towards the inner side of the substrate, clamping is achieved by inserting the substrate between the electronic component and the heat sink and pressing them in a direction that brings them closer together. Since the electronic component must be positioned on the side of the outer circumferential end section of the substrate, the margin for maneuver in positioning electronic components with respect to the substrate has been correspondingly small. Furthermore, in the example of WO2008 / 099...554 there was a possibility that the positional deviation between the electronic component and the substrate could occur even though the electronic component and the heat sink were in contact, since the electronic component was not actively pressed against the substrate. Overview of the invention
[0005] The present invention has been made in view of the above-mentioned circumstances, and one purpose of the present invention is to provide a fastening structure for electronic components which is able to improve the flexibility in the arrangement of electronic components with respect to the substrate and to reliably fasten the electronic components to the substrate.
[0006] According to one aspect of the present invention, a mounting structure of an electronic component comprises a heat sink, a substrate on which at least one electronic component is arranged, a mounting metal connector that fastens the at least one electronic component and the substrate to the heat sink, and a fastening element that fastens the mounting metal connector to the heat sink.The heat sink comprises a body section and a mounting section that projects from the body section towards a substrate side and to which the mounting metal connector is attached, the substrate comprising a through-hole that the mounting section penetrates in a state in which the substrate is placed on the body section, and the mounting metal connector comprising a base section that is in contact with the mounting section and is attached to the mounting section by the mounting element, and a press section that extends from an end of the base section, deforms elastically with respect to the base section and presses at least one electronic component towards the substrate side.
[0007] According to a further aspect of the present invention, in the fastening structure of the electronic component, the at least one electronic component includes at least one set of electronic components that connect the through-hole in the substrate, and the press section includes a set of press elements formed on the base section for the respective electronic components.
[0008] According to a further aspect of the present invention, in the fastening structure of the electronic component, a projecting section is formed on one of the surfaces of a surface on the side of the base section of the fastening section and a surface on the side of the fastening section of the base section, and a recessed section, with which the projecting section fits, is formed on the other surface, and the recessed section and the projecting section are formed in at least one set.
[0009] According to a further aspect of the present invention, in the fastening structure of the electronic component, the fastening section has a rotation control form which controls a rotation of the substrate with respect to the fastening section in a state in which the through-hole is penetrated.
[0010] The above and other objectives, features, advantages and the technical and industrial significance of this invention will be better understood by reading the following detailed description of currently preferred embodiments of the invention in conjunction with the accompanying drawings. List of characters Fig. Figure 1 is a perspective view that represents a schematic design of an electronic component unit; Fig. Figure 2 is a perspective exploded view of the electronic component unit; Fig. 3 is a longitudinal section view along the line A - A the in Fig. 1 illustrated electronic component unit; and Fig. Figure 4 is a perspective view of a metal fastener connector seen from below. Detailed description of the preferred embodiment
[0011] In the following, an exemplary embodiment of a fastening structure for electronic components according to the present invention is described in detail on the basis of the accompanying drawings. However, the invention is not intended to be limited by this embodiment. embodiment
[0012] Fig. Figure 1 is a perspective view showing a schematic design of an electronic component unit according to the invention. Fig. Figure 2 is a perspective exploded view of the electronic component unit. Fig. 3 is a longitudinal section view of the Fig. 1 indicated line A - A . Fig. Figure 4 is a perspective view of a metal fastener connector seen from below.
[0013] In the following description, one direction of an arrow is being referred to. XThe respective drawings indicate an extension direction and a depth direction of the electronic component unit. An arrow's direction Y In the respective drawings, one direction is orthogonal to the extension direction and the other is a width direction of the electronic component unit. One direction of an arrow Z In each drawing, a vertical direction is orthogonal to the extension direction and the orthogonal direction, and a direction Z1 is an upward direction, and a direction Z2 is a downward direction.
[0014] An electronic component unit 1 according to the present embodiment as described in Fig. 1 and Fig. Figure 2 illustrates a switched-mode power supply device, which is installed, for example, in a vehicle such as a motor vehicle. The switched-mode power supply device, for example, a DC-DC converter or the like, has the function of converting direct current (DC) into DC with a specific voltage. What components other than the electronic component unit are involved? 1 Regarding the components that form the switched-mode power supply unit, their description is omitted.
[0015] The electronic component unit 1 consists of a heat sink 10 , a substrate 20 , electronic components 30 (four in the examples in Fig. 1 and Fig. 2) Fastening metal connectors 40 (two in the examples), fasteners 50 (two in the examples) and heat dissipation plates 60 (two in the examples).
[0016] The heat sink 10 It is a fixed element on which the substrate rests. 20 and the heat dissipation plates 60 are placed and on which the metal fastening connectors are attached. 40 are attached. The heat sink 10 It serves as a heat dissipation element, supporting the dissipation of heat generated by the electronic components. 30 is generated. The heat sink 10 It consists of a metal material such as aluminum (Al), which has high thermal conductivity and heat dissipation. The heat sink 10 It has a flat, plate-like shape in a plane that includes the depth and width directions. The heat sink 10 includes a body section 11 , fastening sections 12 , which are located on the upper surface (the surface in the upward direction) of the body section 11 to the side of the substrate20 protruding, screw holes 13 and more in-depth sections 14 .
[0017] The fastening section 12 is secured in a state in which a base section 41 of the fastening metal connecting piece described below 40 is brought into contact. The fastening section 12 , as he in Fig. As illustrated in Figure 2, it is designed as a square prism, which is square when viewed from the vertical direction, and is oriented towards the side of the substrate. 20 The fastening sections are designed to protrude. 12 In the present embodiment, they are arranged side by side in the width direction on the body section 11 trained. The fastening section 12 is designed in such a way that in a state in which the substrate 20 and the heat dissipation plates 60 on the upper surface of the body section 11are placed, an upper surface 12a (one surface in the upward direction, one surface on the side of the substrate) 20 ) of the fastening section 12 higher than a top surface 20a (a surface in the upward direction) of the substrate 20 is. In the fastening section 12 are the screw holes 13 and a couple of recessed sections 14 on the upper surface 12a trained. At the screw hole 13 This is a hole for attaching the metal mounting connector. 40 through the fastening element 50 The screw hole 13 In the present embodiment, viewed from the vertical direction, the central section of the upper surface is 12a trained. The pair of indented sections 14 is a section with which protruding sections 44 fit together. The protruding sections44 are based on the basic section described below 41 of the fastening metal connector 40 trained. The in-depth sections 14 In the present embodiment, the screws of a pair are formed diagonally, with the screw hole 13 between them.
[0018] The substrate 20 It is a plate-like element for electrically connecting electronic components. 30 The substrate 20 , as it is in Fig. As illustrated in Figure 1, it has a flat, plate-like shape, with the length of one side being longer than that of the fastening metal connecting piece. 40 and equal to or shorter than the heat sink 10 is. In the substrate 20 is a circuit pattern on the upper surface 20a executed, which is formed on the side facing upwards. In the substrate 20are the electronic components 30 by soldering with the circuit pattern on the upper surface 20a electrically connected. From the outer surfaces of the substrate. 20 At least one section, which is connected to the heat sink, will be used. 10 in contact, subjected to an isolation process. The substrate 20 includes through holes 21 , which are the fastening sections 12 penetrate in a state in which the substrate 20 on the body section 11 is positioned. The through holes 21 In the present embodiment, these correspond to the respective fastening sections. 12 , and the through holes 21 are positioned side by side in the lateral direction on the substrate 20 trained. Each of the through holes 21 is formed in a square prism, which is square when viewed from the vertical direction, and the through hole 21is designed in such a way that it is larger than the corresponding fastening section 12 is, so that the fastening section 12 which can penetrate when viewed from a vertical direction. The through-hole 21 is designed such that the length of one side is shorter than the length of a diagonal line of the fastening section 12 is. The through hole 21 is according to the position of the fastening section 12 trained and is located between electronic components 30 formed, which are adjacent along the depth direction.
[0019] The electronic components 30 They serve as switching elements, used, for example, in a switched-mode power supply device or the like. The electronic components 30 , as they are in Fig. As illustrated in point 1, the through-hole is shown in each case. 21fitting between along the depth direction on the upper surface 20a of the substrate 20 arranged. That is, a set of electronic components 30 is with regard to each through-hole 21 on the substrate 20 attached to each of the electronic components 30 includes a body section 31 and a connecting section 32 Regarding the body section 31 As far as this is concerned, the outer circumference is made of an insulating material. The connection section 32 is achieved by soldering to the substrate 20 electrically connected.
[0020] Each of the metal fastening connectors 40 is a metal connector that holds the corresponding electronic components 30 on the substrate 20 and the heat sink 10 presses and attaches to these, and that through the electronic components 30generated heat to the cooling element 10 conducts. The metal fastening connector 40 It consists of a metal material that exhibits thermal conductivity and heat dissipation and is manufactured, for example, by stamping from a sheet material such as stainless steel and by bending. The fastening metal connector 40 , as it is in Fig. 2 and Fig. As illustrated in section 4, it includes the basic section. 41 , a pair of press sections 42 , a through hole 43 and a pair of projecting sections 44 .
[0021] The basic section 41 It is designed in such a way that, viewed from the vertical direction, it is smaller than the through hole. 21 of the substrate 20 is. The basic section 41 It comes from the lower surface (the surface in the downward direction, the surface on the side of the fastening section). 12 ) with the upper surface12a of the fastening section 12 in contact and is secured by the fastening element 50 on the heat sink 10 attached. The base section 41 includes the through hole 43 and a pair of projecting sections 44 The through hole 43 is a hole that runs vertically through the base section 41 runs, and is a hole through which the fastening element 50 penetrates it. The through-hole 43 corresponds to the screw hole 13 and is in the corresponding screw hole 13 formed facing vertically. The pair of projecting sections 44 is on the lower surface of the base section 41 formed, which the upper surface 12a of the fastening section 12 is facing the pair of projecting sections. 44In the present embodiment, this is achieved by driving it out in the downward direction from the upper surface (the surface in the upward direction) of the base section. 41 trained. Each of the projecting sections 44 fits with the corresponding recessed section 14 of the fastening section 12 in a state together in which the base section 41 on the fastening section 12 is placed.
[0022] The pair of press sections 42 corresponds to a set of electronic components 30 , which in the depth direction with regard to the substrate 20 are arranged, extending from both end sections in the depth direction of the base section. 41 towards the electronic components 30 and has a flat, plate-like shape. The pressing section 42 includes a curved section 42a, which exhibits elastic deformation with respect to the base section 41 enables, and a contact section 42b , which is associated with the body section 31 of the electronic component 30 comes into contact. The curved section 42a connects the base section 41 and the contact section 42b The contact section 42b comes with the upper surface of the body section 12 in a state of contact in which the fastening metal connecting piece 40 on the heat sink 10 is attached. The press section 42 presses in a state in which the fastening metal connecting piece 40 on the heat sink 10 is attached, the electronic component 30 downwards, pressing and securing the electronic component 30 with regard to the substrate 20 and the heat sink 10 .
[0023] The fastening element 50 The metal fastener attaches 40 and the substrate 20 on the heat sink 10 . Regarding the fastening element 50 For example, it is a single screw, and a plurality of screws are arranged according to the respective screw holes. 13 provided. The fastening element 50 penetrates the through hole 43 of the fastening metal connector 40 and is inserted into the screw hole 13 screwed, thus making the metal fastening connector 40 on the heat sink 10 attached.
[0024] The pair of heat-dissipating plates 60 isolates the substrate 20 and the heat sink 10 The heat dissipation plates 60 They consist of an insulating material with high thermal conductivity. The heat dissipation panels 60 , as they are in Fig. 2. As illustrated, the electronic components are 30 turned towards the substrate 20 Insert them vertically between each other. Each of the heat dissipation plates 60 In the present embodiment, they are designed such that they are wider than the area for which the electronic components are intended. 30 , which are arranged along the width direction, are assembled when viewed from the vertical direction. The heat dissipation plates 60 of a pair are arranged in such a way that they form the fastening section 12 insert them along the depth direction between each of the heat dissipation plates. 60 It has a plate-like shape that exhibits elasticity. The heat dissipation plate 60 is attached to the upper surface of the body part by its adhesive properties or an adhesive agent not shown. 11 attached.
[0025] An assembly procedure for the electronic component unit 1 is described. First, the electronic components are described. 30 by soldering to the upper surface 20a of the substrate 20 electrically connected. The electronic components 30 are formed by their interaction with the substrate 20 are electrically connected, mechanically on the substrate 20 held.
[0026] Then the pair of heat dissipation plates 60 to the upper surface of the body section 11 of the heat sink 10 adhered. Then the substrate 20 , that the electronic components 30 holds, on the heat sink 10 placed, with which the heat dissipation plates 60 are combined into a single unit. At this point, each of the fastening sections penetrates 12 of the heat sink 10 the respective through holes 21 of the substrate20 .
[0027] Next, the metal fastening connector is 40 so on the fastening section 12 positioned so that the protruding sections 44 , which are located at the base section 41 are trained, with the in-depth sections 14 fit together, which are attached to the fastening section 12 of the heat sink 10 are formed. The lower surface of the base section 41 and the upper surface 12a of the fastening section 12 are brought into surface contact with each other in a state in which the screw hole 13 and the through hole 43 are oriented in the upward / downward direction. In the metal fastening connector 40 will be, while the projecting sections 44 with the in-depth sections 14 to fit together, the positioning of the base section 41with regard to the fastening section 12 carried out.
[0028] The fastening element then penetrates 50 the through hole 43 of the fastening metal connector 40 and is inserted into the screw hole 13 of the fastening section 12 screwed. When screwing the fastener 50 into the screw hole 13 The metal fastening connector rotates 40 not about the fastening element 50 , which serves as a pivot point, while the projecting sections 44 with the in-depth sections 14 fit together. The substrate 20 It's not about the fasteners 50 , which serve as pivot points, which define the through-hole 21 the respective fastening sections 12 penetrate. The contact section 42b is associated with the body section 31of the electronic component 30 brought into surface contact, and as in Fig. Figure 3 illustrates when the curved section 42a a reaction force in the upward direction against the force for pressing the electronic component 30 As it absorbs pressure in the downward direction, the curved section deforms. 42a elastic in the upward direction with respect to the base section 41 Each of the press sections 42 of a pair deforms essentially uniformly elastically with respect to the base section 41 The press section then closes. 42 of the fastening metal connector 40 the pressing and fastening of the respective electronic components 30 with regard to the substrate 20 and the heat sink 10 away.
[0029] According to the electronic component unit 1In the embodiment described above, the scope for the arrangement of the electronic components decreases. 30 with regard to the substrate 20 to, since the metal fastening connector 40 , which is attached to the fastening section 12 is attached, which the through hole 21 of the substrate 20 penetrates the electronic components 30 on the substrate 20 presses and attaches to it. That is, when the through hole 21 , that the fastening section 12 penetrates the substrate 20 The scope for designing electronic components decreases. 30 with regard to the substrate 20 to, since there is no need to the electronic components 30 on the side of the outer circumferential end section of the substrate 20 to arrange. Since the metal fastening connector 40furthermore the electronic components 30 towards the heat sink 10 and the substrate 20 Pressing downwards, the electronic components 30 reliably attached to the substrate 20 and the heat sink 10 to be attached. Since the press section 42 the electronic component 30 , the substrate 20 and the heat dissipation plate 60 with regard to the heat sink 10 presses and because the above adhere more closely together, the heat generated by the electronic component is reduced 30 is generated, easily to the heat sink 10 guided. If the base section 41 of the fastening metal connector 40 and the fastening section 12 of the heat sink 10 When they come into contact, the heat generated by the electronic component will be transferred. 30 is generated, easily to the heat sink 10Conducted. Accordingly, the heat generated by the electronic component can be dissipated. 30 is generated, can be effectively derived.
[0030] Regarding the metal fastening connector 40 As far as this is concerned, the press sections become deformed. 42 with regard to the basic section 41 uniformly elastic, since the press sections 42 at least one sentence is designed in such a way that it forms the basic section 41 insert between, even if the press sections 42 the reaction force in the upward direction against the force for pressing a set of the electronic component 30 in the downward direction. Accordingly, a set of press sections can 42 a set of electronic components 30 with the even force on the substrate 20 press, and the electronic components 30 can reliably access the substrate 20pressed and attached to this.
[0031] Since the protruding sections 44 or the in-depth sections 14 at the points where they fit together, on the respective surfaces of the lower surface of the base section 41 and the upper surface 12a of the fastening section 12 are trained, the positioning of the fastening metal connecting piece will be 40 with regard to the fastening section 12 when placing the metal fastening connector 40 on the fastening section 12 facilitated. That is to say, since only the recessed sections 14 and the projecting sections 44 Positioning the fasteners at the point where they need to fit together can improve assembly. Furthermore, when screwing in the fastener, 50 in the fastening section 12The assembly capability is improved because of the metal fastening connector. 40 not about the fastening element 50 rotates, which serves as a pivot point, while the projecting sections 44 with the in-depth sections 14 fit together.
[0032] Since the fastening section 12 a rotation control mode with respect to the substrate 20 This makes positioning easier, as the substrate 20 not around the fastening section 12 rotates, which serves as a pivot point when a worker moves the substrate 20 on the heat sink 10 positioned. Accordingly, the ease of assembly can be improved. Since the substrate 20 not around the fastening section 12 rotates, which serves as a pivot point, even after the metal fastening connector is removed. 40 through the fastening element 50at the fastening section 12 Once attached, the electronic components can 30 reliably attached to the substrate 20 to be attached. Modifications to the embodiment
[0033] The electronic component unit 1 The embodiment described above is not limited to the illustrative example. In the embodiment described above, it has been shown that the majority of electronic components 30 on the substrate 20 is arranged and that the fastening metal connecting piece 40 a pair of press sections 42 includes. However, the embodiment is not limited to this. Regarding the fastening section 12 , the electronic component 30 , the press section 42 , the fastening element 50 and the heat dissipation plate 60As far as this is concerned, it only needs to have one or more of them.
[0034] Furthermore, in the embodiment described above, it has been described that two fastening sections 12 are trained. However, only at least one fastening section is needed. 12 or to be more highly trained. In a case where only one fastening section is involved. 12 Once formed, the substrate rotates 20 not around the fastening section 12 , which serves as a pivot point, even if the substrate 20 on the upper surface of the body section 11 is placed because the fastening section 12 a rotation control mode that controls the rotation of the substrate 20 around the fastening section 12 can regulate, which serves as a pivot point. In the embodiment described above, it has been described that the fastening section 12It is designed as a square prism, which appears square when viewed from the vertical direction. However, it could be an elliptical cylinder or a polygonal prism when viewed from the vertical direction, and it simply needs to be able to rotate the substrate. 20 with the fastening section 12 to regulate as a pivot point.
[0035] In the embodiment described above, it has been described that the projecting section 44 of the base section 41 in the downward direction from the upper surface of the base section 41 is driven out. However, the embodiment is not limited to this. For example, the projecting sections can 44 by cutting and lifting part of the base section 41 be trained.
[0036] In the embodiment described above, it has been described that the pressing section 42of the fastening metal connector 40 the curved section 42a and the contact section 42b includes. However, the embodiment is not limited thereto. The press section 42 It simply needs to have a form that, with regard to the base section, 41 It is elastically deformable, and it does not need to have a curved section. 42a exhibit. Although it has been described that the entire contact section 42b with the head section 31 of the electronic component 30 The embodiment is not limited to contact. The pressing section 42 It simply needs to be able to handle the electronic component. 30 on the substrate 20 to press and attach to this, and only at least part of the contact section. 42b must be with the head section 31 be in contact.
[0037] In the embodiment described above, it has been described that the fastening section 12 is designed in a projecting manner such that the upper surface 12a of the fastening section 12 of the heat sink 10 higher than the upper surface 20a of the substrate 20 and the heat dissipation plate 60 is the area of the body 11 are placed. However, the embodiment is not limited to this. The upper surface 12a of the fastening section 12 can be at the same height as or lower than the upper surface 20a of the substrate 20 be trained.
[0038] In the embodiment described above, it has been described that the body section 11 of the heat sink 10 It has a flat, plate-like shape. However, on the lower surface (the downward-facing surface) of the body segment... 11Heat-dissipating fins are formed. By equipping the lower surface of the body section 11 The heat dissipation fins allow for more effective heat dissipation.
[0039] In the embodiment described above, it has been described that the recessed sections 14 on the upper surface 12a of the fastening section 12 are formed and the protruding sections 44 on the lower surface of the base section 41 are formed. The surfaces on which the recessed sections are formed. 14 and the projecting sections 44 However, the opposite can also be true. That is, the protruding sections can be on the upper surface. 12a of the fastening section 12 be formed, and the recessed sections can be located on the lower surface of the base section. 41be formed. One of the recessed section and one of the projecting section can be located on the respective surfaces of the upper surface. 12a of the fastening section 12 and the lower surface of the base section 41 It must be designed so that the protruding section fits with the recessed section. In this case, not only the position of the fastening metal connecting piece can be determined. 40 , but also the orientation of the arrangement can be specifically determined. Accordingly, the mountability of the electronic component unit can be determined. 1 to be improved. In the embodiment described above, it has been described that the recessed section 14 and the projecting section 44 are designed to form a pair. However, the embodiment is not limited to one in which the recessed section 14 and the projecting section 44They form a pair, and only one or more of them need to be trained.
[0040] The mounting structure for electronic components according to the embodiment has the effect of improving the flexibility in the layout of the electronic components on the substrate, since the arrangement of the electronic components on the substrate is not restricted. Furthermore, it has the effect of ensuring that the electronic components can be reliably attached to the substrate, since the mounting metal connector presses the substrate and the electronic components against the heat sink.
[0041] Although the invention has been described with regard to certain embodiments for the purpose of a complete and clear disclosure, the attached claims are not to be limited in this way, but are to be interpreted as embodying all modifications and alternative constructions that a person skilled in the art might conceive which reasonably fall within the basic doctrine set forth herein. QUOTES INCLUDED IN THE DESCRIPTION
[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature
[0000] WO 2008 / 099554 [0003, 0004]
Claims
[1] Mounting structure of an electronic component (30) comprising: a heat sink (10); a substrate (20) on which at least one electronic component (30) is arranged; a metal fastening connector (40) that fastens the at least one electronic component (30) and the substrate (20) to the heat sink (10); and a fastening element (50) that fastens the fastening metal connecting piece (40) to the heat sink (10), wherein the heat sink (10) includes a body section (11) and a mounting section (12) which projects from the body section (11) towards one side of the substrate (20) and to which the mounting metal connecting piece (40) is attached, the substrate (20) includes a through-hole (21) which the fastening section (12) penetrates in a state in which the substrate (20) is placed on the body section (11), and the fastening metal connecting piece (40) includes a base section (41) which is in contact with the fastening section (12) and is attached to the fastening section (12) by the fastening element (50), and a pressing section (42) which extends from an end of the base section (41), deforms elastically with respect to the base section (41) and presses at least one electronic component (30) towards the side of the substrate (20). [2] Mounting structure of the electronic component (30) according to claim 1, wherein which includes at least one electronic component (30) or at least one set of electronic components (30) that connect the through-hole (21) in the substrate (20), and the press section (42) includes a set of press elements which are formed on the base section (41) for the respective electronic components (30). [3] Mounting structure of the electronic component (30) according to claim 1 or 2, wherein a projecting section (44) is formed on one of the surfaces and a recessed section (14) with which the projecting section (44) fits is formed on the other surface, and the recessed section (14) of at least one sentence and the projecting section (44) of at least one sentence are formed. [4] Mounting structure of the electronic component (30) according to one of claims 1 to 3, wherein the mounting section (12) has a rotation control form which controls a rotation of the substrate (20) with respect to the mounting section (12) in a state in which the through hole (21) is penetrated.