THERMAL INSULATION COMPONENT

Abstract

Thermal insulation component including: a matrix comprising a thermal insulation material with a thermal conductivity of less than or equal to 5 W / mK; a crosslinking precursor embedded in the matrix, wherein the crosslinking precursor comprises at least one functional acrylate group or one functional methacrylate group; and a crosslinking initiator embedded in the matrix, wherein the crosslinking initiator is configured to decompose in order to initiate the crosslinking of the crosslinking precursor at a temperature greater than or equal to 50°C, where the thermal insulation material does not chemically react with the crosslinking precursor or the crosslinking initiator, wherein the thermal insulation material comprises fiberglass, mineral wool, cellulose, polyurethane, polystyrene, polypropylene, silicone rubber or any combination thereof, wherein the crosslinking precursor comprises a linear molecule selected from the group consisting of: a polydimethylsiloxane (PDMS) with a terminal methacryloxypropyl group; a PDMS with a terminal acryloxypropyl group; a poly(ethylene glycol) diacrylate; a poly(ethylene glycol) dimethacrylate; 1,10-decanediol diacrylate; 1,10-decanediol dimethacrylate; ethoxylated bisphenol A diacrylate; ethoxylated bisphenol A dimethacrylate; a urethane acrylate; a urethane methacrylate; an epoxy acrylate; an epoxy methacrylate; or any combination thereof, or wherein the crosslinking precursor comprises a branched monomer selected from the group consisting of: an ethoxylated trimethylolpropane triacrylate; trimethylolpropane trimethacrylate; an alkyloyl-modified dipentaerythritol triacrylate; an ethoxylated glycerol triacrylate; an ethoxylated pentaerythritol tetraacrylate; or any combination thereof, or wherein the crosslinking precursor comprises a branched oligomer selected from the group consisting of: an ethoxylated trimethylolpropane triacrylate; an ethoxylated glycerol triacrylate; an ethoxylated pentaerythritol tetraacrylate; or any combination thereof.

Description

INTRODUCTION

[0001] This section contains background information related to the present disclosure that is not necessarily prior art.

[0002] The present disclosure relates to thermal insulation components for electronic assemblies

[0003] Vehicles contain various types of electronic components. Electronic components typically generate heat under normal operating conditions. However, it is desirable that electronic components be kept within specified temperature ranges for optimal performance and to maximize component life. Electronic components can be kept within a specified temperature range through the use of cooling systems and / or thermal insulation.

[0004] DE 10 2004 053 374 A1 discloses rigid polyurethane foams, wherein the rigid polyurethane foam contains a compound comprising two end-functional acrylate groups. EP 1 882 715 A1 discloses a crosslinked polyolefin resin foam comprising a polyolefin resin, namely a polypropylene-polyethylene-based resin. SUMMARY

[0005] This section contains a general summary of the disclosure and is not a comprehensive disclosure of its full scope or all of its features.

[0006] The present disclosure provides a thermal insulation component in various aspects. The thermal insulation component comprises a matrix, a crosslinking precursor, and a crosslinking initiator. The matrix comprises a thermal insulation material having a thermal conductivity of less than or equal to 5 W / mK. The crosslinking precursor is embedded in the matrix. The crosslinking precursor comprises at least one acrylate functional group or one methacrylate functional group. The crosslinking initiator is embedded in the matrix. The crosslinking initiator is configured to decompose to initiate crosslinking of the crosslinking precursor at a temperature greater than or equal to 50°C. The thermal insulation material does not chemically react with the crosslinking precursor or the crosslinking initiator. The thermal insulation material comprises glass fiber, mineral wool, cellulose, polyurethane, polystyrene, polypropylene, silicone rubber, or any combination thereof.There are three alternatives regarding the crosslinking precursor. The first alternative comprises, as a crosslinking precursor, a linear molecule selected from the group consisting of: a methacryloxypropyl-terminated polydimethylsiloxane (PDMS), an acryloxypropyl-terminated PDMS, a poly(ethylene glycol) diacrylate, a poly(ethylene glycol) dimethacrylate, 1,10-decanediol diacrylate, 1,10-decanediol dimethacrylate, ethoxylated bisphenol A diacrylate, ethoxylated bisphenol A dimethacrylate, a urethane acrylate, a urethane methacrylate, an epoxy acrylate, an epoxy methacrylate, or any combination thereof.The second alternative comprises, as a crosslinking precursor, a branched monomer selected from the group consisting of: an ethoxylated trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, an alkyloyl-modified dipentaerythritol triacrylate, an ethoxylated glycerol triacrylate, an ethoxylated pentaerythritol tetraacrylate, or any combination thereof. The third alternative comprises, as a crosslinking precursor, a branched oligomer selected from the group consisting of: an ethoxylated trimethylolpropane triacrylate, an ethoxylated glycerol triacrylate, an ethoxylated pentaerythritol tetraacrylate, or any combination thereof.

[0007] In one aspect, the crosslinking initiator comprises an azo initiator selected from the group consisting of: 2,2'-azobis(isobutyronitrile), 4,4'-azobis(4-cyanovaleric acid), 2,2'-azobis[2-methyl-N-(2-hydroxyethyl)propionamide], 4-azobis(4-cyanovaleric acid) polymer with alpha,omega-bis(3-aminopropyl)polydimethylsiloxane, or any combination thereof.

[0008] In one aspect, the crosslinking initiator is a peroxidic initiator selected from the group consisting of: tert-butyl peroxide, dicumyl peroxide, 2,4-pentanedione peroxide, or any combination thereof.

[0009] In one aspect, the crosslinking precursor comprises a poly(ethylene glycol) diacrylate having a number average molecular weight of greater than or equal to about 3 to less than or equal to about 1,000 and the crosslinking initiator comprises 2,2'-azobis(isobutyronitrile).

[0010] In one aspect, the crosslinking initiator has a ten-hour half-life temperature of greater than or equal to about 50°C to less than or equal to about 120°C.

[0011] In one aspect, the crosslinking precursor is present in an amount of greater than or equal to about 5 wt% to less than or equal to about 50 wt% of the thermal insulation material.

[0012] In one aspect, the crosslinking initiator is present in an amount of greater than or equal to about 0.5 wt% to less than or equal to about 5 wt% of the crosslinking precursor.

[0013] Also not described in the invention is an electronic assembly comprising an electronic component and a thermal insulation component. The thermal insulation component is in thermal communication with the electronic component. The thermal insulation component comprises a matrix, a crosslinking precursor, and a crosslinking initiator. The matrix comprises a thermal insulation material with a thermal conductivity of less than or equal to approximately 5 W / mK. The crosslinking precursor is embedded in the matrix. The crosslinking precursor comprises at least one acrylate functional group or one methacrylate functional group. The crosslinking initiator is embedded in the matrix. The crosslinking initiator is configured to decompose to initiate crosslinking of the crosslinking precursor.

[0014] In one aspect, the thermal insulation component has a thickness of greater than or equal to about 1 mm to less than or equal to about 1 cm.

[0015] In one aspect, the electronic component comprises an electrochemical cell. The thermal insulation material comprises polyurethane. The crosslinking precursor comprises a poly(ethylene glycol) diacrylate having a number-average molecular weight of greater than or equal to about 3 to less than or equal to about 1,000. The initiator comprises 2,2'-azobis(isobutyronitrile).

[0016] The invention also describes a method for producing a thermal insulation component. The method comprises embedding a crosslinking precursor and a crosslinking initiator in a matrix comprising a thermally insulating material. The method further comprises, during embedding, maintaining the crosslinking initiator at a temperature less than or equal to a ten-hour half-life temperature of the crosslinking initiator.

[0017] In one aspect, the method further comprises forming the matrix.

[0018] In one aspect, formation occurs simultaneously with embedding.

[0019] In one aspect, the method further comprises, prior to embedding, forming a solution by dissolving the crosslinking precursor and the crosslinking initiator in a solvent. The method further comprises, after embedding, removing the solvent from the matrix.

[0020] In one aspect, embedding comprises absorbing the solution into the matrix.

[0021] In one aspect, the ten-hour half-life temperature is greater than or equal to about 50°C to less than or equal to about 120°C.

[0022] Further areas of applicability will become apparent from the description provided herein. The description and specific examples in this summary are for illustrative purposes only and are not intended to limit the scope of the present disclosure. DRAWINGS

[0023] The drawings described herein are for illustrating selected embodiments only and not all possible implementations and are not intended to limit the scope of the present disclosure. Fig. 1A-1C relate to an electronic assembly including a thermal insulation component according to various aspects of the present disclosure; Fig. 1A is a schematic view of the electronic assembly with the thermal insulation component in a first state; Fig. Figure 1B is a schematic view of the electronics assembly during a heat-generating event; Fig. 1C is a schematic view of the electronic assembly with the thermal insulation component in a second state; Fig. 2 is a schematic view of another electronic assembly according to various aspects of the present disclosure; Fig. 3 is a sectional view of yet another electronic assembly according to various aspects of the present disclosure; and Fig. 4 is a flow diagram illustrating a method of manufacturing a thermal insulation component according to various aspects of the present disclosure.

[0024] Corresponding reference numerals indicate corresponding parts in the several views of the drawings. DETAILED DESCRIPTION

[0025] Embodiments are provided so that this disclosure will be thorough and will convey the full scope to those skilled in the art. Numerous specific details are set forth, such as examples of specific compositions, components, devices, and methods, providing a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that embodiments may be embodied in many different forms, and that neither should be construed to limit the scope of the disclosure. In some embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.

[0026] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprise," "comprising," "including," and "having" are inclusive and therefore specify the presence of stated features, elements, compositions, steps, integers, acts, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, acts, elements, components, and / or groups thereof.Although the open term "comprising" is intended to be a non-limiting term used to describe and claim various embodiments set forth herein, in certain aspects, the term may alternatively be understood as a more limiting and restrictive term, such as "consisting of" or "consisting essentially of." Therefore, for any given embodiment recognizing compositions, materials, components, elements, features, integers, acts, and / or method steps, the present disclosure expressly includes embodiments consisting of, or consisting essentially of, such recognizing compositions, materials, components, elements, features, integers, acts, and / or method steps.In the case of "consisting of", the alternative embodiment excludes any additional compositions, materials, components, elements, features, integers, operations and / or process steps, whereas in the case of "consisting essentially of", any additional compositions, materials, components, elements, features, integers, operations and / or process steps that significantly affect the basic and novel properties are excluded from such embodiment, but any compositions, materials, components, elements, features, integers, operations and / or process steps that do not significantly affect the basic and novel properties may be included in the embodiment.

[0027] Any procedure steps, processes, and operations described herein should not be construed as necessarily being performed in the particular order explained or illustrated unless expressly identified as such. It is understood that additional or alternative steps may be used unless otherwise specified.

[0028] When a component, element, or layer is described as being "on" or "engaging with" another element or layer, or as being "connected" or "coupled" to it, it may be directly on or directly engaging with another component, element, or layer, or it may be directly connected or directly coupled to it, or there may be intervening elements or layers. On the other hand, when an element is described as being "directly on" or "directly engaging with" another element or layer, or as being "directly connected" or "directly coupled" to it, there may be no intervening elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar way (e.g.(e.g., "between" versus "directly between," "adjacent" or "contiguous" versus "directly adjacent" or "directly adjacent," etc.). As used herein, the term "and / or" includes all combinations of one or more of the related listed items.

[0029] Although the terms first, second, third, etc. are used herein to describe various steps, elements, components, regions, layers, and / or sections, these steps, elements, components, regions, layers, and / or sections are not intended to be limiting unless otherwise specified. These terms may only be used to distinguish one step, element, component, region, layer, or section from another step, element, component, region, layer, or section. Terms such as "first," "second," and other numerical terms, when used herein, do not imply a sequence or order unless the context clearly indicates otherwise.Thus, a first step, a first element, a first component, a first region, a first layer, or a first section discussed below could be referred to as a second step, second element, second component, second region, second layer, or second section without departing from the teachings of the embodiments.

[0030] Spatially or temporally relative terms such as "before," "after," "inner," "outer," "below," "under," "lower," "above," "upper," and the like may be used herein for convenience to describe the relationship of one element or feature to one or more other elements or features, as illustrated in the figures. Spatially or temporally relative terms may be intended to encompass different orientations of the device or system in use or operation, in addition to the orientation depicted in the figures.

[0031] Throughout this disclosure, numerical values ​​represent approximate measures or limits for ranges to include minor deviations from the stated values ​​and embodiments that approximately have the stated value, as well as values ​​that exactly have the stated value. Other than in the working examples at the end of the detailed description, all numerical values ​​of parameters (e.g., quantities or conditions) in this specification, including the appended claims, are to be understood as being modified in all cases by the term "approximately," regardless of whether "approximately" actually appears before the numerical value or not. "Approximately" means that the stated numerical value allows for slight imprecision (with some approximation to the accuracy of the value, approximately or fairly close to the value, almost).If the imprecision implied by "approximately" is not otherwise understood in the art to have this ordinary meaning, then "approximately," as used herein, means at least deviations that may result from ordinary methods of measuring and using such parameters. For example, "approximately" may include a deviation of less than or equal to 5%, optionally less than or equal to 4%, optionally less than or equal to 3%, optionally less than or equal to 2%, optionally less than or equal to 1%, optionally less than or equal to 0.5%, and in certain aspects, optionally less than or equal to 0.1%.

[0032] In addition, the disclosure of ranges includes the disclosure of all values ​​and further subdivided ranges within the entire range, including the endpoints and subranges specified for the ranges.

[0033] Embodiments will now be described in more detail with reference to the accompanying drawings.

[0034] As explained above, electronic components can generate heat during normal operation. Under extenuating circumstances, electronic components may experience heat-generating events that cause the component's temperature to rise significantly above its normal operating temperature, potentially heating nearby components. This significant temperature rise may result in reduced performance and / or reduced component life.

[0035] In various aspects, the present disclosure provides a thermal insulation component for an electronic assembly. The thermal insulation component provides thermal insulation under normal operating conditions as well as on-demand insulation and physical protection in response to a heat-generating event. The present disclosure also provides, in various aspects, methods for manufacturing thermal insulation components, which are described in detail below (see the discussion of Fig. 4).

[0036] The thermal insulation component according to the various aspects of the present disclosure, which can be in thermal contact with at least one electronic component, comprises a matrix of thermal insulation material with a crosslinking precursor and a crosslinking initiator dispersed therein. Under normal operating conditions (e.g., at normal operating temperatures), the crosslinking precursor remains uncrosslinked and the thermal insulation material has a first hardness. Upon exceeding a predetermined temperature, the initiator decomposes in an endothermic process to initiate crosslinking of the precursor. After crosslinking, the thermal insulation material has a second hardness that is greater than the first hardness. The second hardness can provide additional pressure tolerance, which can facilitate improved physical insulation compared to the thermal insulation component in the first state.

[0037] With reference to Fig. 1A, an electronic assembly 10 is provided according to various aspects of the present disclosure. The electronic assembly 10 includes a first electronic component 12, a second electronic component 14 (collectively referred to as "the electronic components 12, 14"), and a thermal insulation component 16 disposed between the electronic components 12, 14. The thermal insulation component 16 is in thermal communication with the electronic components 12, 14. In certain aspects, an electronic assembly may include a single electronic component in thermal communication with a thermal insulation component (see, e.g., the electronic assembly 210 of Fig. 3). The first and second electronic components 12, 14 may each include a first and a second electrical terminal 18, 20.

[0038] The electronic components 12, 14 can be any powered components that generate heat during normal operation and / or can be subject to significant temperature changes during a heat-generating event. For example, the electronic components 12, 14 can be independently selected from an electrochemical cell (e.g., a battery), a resistor, a capacitor, an inductor, a processor, an engine control unit, a high-performance electronic module (e.g., a metal-oxide-semiconductor field-effect transistor (MOSFET), an insulated-gate bipolar transistor (IGBT)), an engine component, a portion of an engine component, an internal combustion engine, or a portion of an internal combustion engine. In certain aspects, the electronic components 12, 14 can both be electrochemical cells. If the electronic components 12, 14 are electrochemical cells, the heat-generating event can, for example,a potential internal short circuit. Other heat-generating events can include, for example, ambient temperature changes, including unexpected temperature fluctuations in adjacent components.

[0039] In certain aspects, the thermal insulation component 16 may be in the form of a cushion, as shown in the Fig. 1A-1C. Accordingly, the thermal insulation component 16 may act as a physical or physical and thermal barrier without completely surrounding the first electronic component 12 and / or the second electronic component 14. In various alternative aspects, a thermal insulation component may be in the form of a housing that at least partially surrounds an electronic component (see, for example, thermal insulation component 216 of Fig. 3). The thermal insulation component 16 may be in direct contact or indirect contact with the first and second electronic components 12, 14.

[0040] The thermal insulation component 16 provides thermal insulation between the electronic components 12, 14 during normal operation of the electronic components 12, 14. In addition, the thermal insulation component 16 is configured to provide on-demand thermal insulation and physical protection in response to a heat-generating event. The thermal insulation component 16 includes a matrix 30, a crosslinking precursor 32, and a crosslinking initiator 34. The precursor 32 and the initiator 34 may be dispersed and embedded in the matrix 30. The precursor 32 and the initiator 34 may be in the form of solid particles. In certain aspects, the particles may have an average particle size of greater than or equal to about 10 nm to less than or equal to about 1 µm (e.g.,from greater than or equal to about 10 nm to less than or equal to about 100 nm, from greater than or equal to about 100 nm to less than or equal to about 250 nm, from greater than or equal to about 250 nm to less than or equal to about 500 nm, or from greater than or equal to about 500 nm to less than or equal to about 1 µm).

[0041] In certain aspects, the matrix 30 may be porous. For example, the matrix 30 may have a porosity of greater than or equal to about 1% to less than or equal to about 90%, or optionally, greater than or equal to about 30% to less than or equal to about 60%. Pore sizes may range from greater than or equal to about 10 µm to less than or equal to 1 mm, or optionally, greater than or equal to about 100 µm to less than or equal to about 500 µm. In certain aspects, the matrix 30 may, for example, be substantially non-porous.

[0042] Precursor 32 and initiator 34 are dispersed and embedded in matrix 30. In certain aspects, precursor 32 and initiator 34 may be disposed within pores of the matrix. Additionally or alternatively, precursor 32 and initiator 34 may be partially or completely encapsulated by matrix 30. In certain aspects, e.g., when matrix 30 contains interconnected pores (e.g., an open cell format), precursor 32 and initiator 34 may be encased on the interior surfaces of matrix 30.

[0043] The thermal insulation component 16 may comprise the precursor 32 in an amount of greater than or equal to about 5 wt.% to less than or equal to about 50 wt.% of a matrix material (e.g., a thermal insulation material), or optionally greater than or equal to about 10% to less than or equal to about 20%. The thermal insulation component 16 may contain the initiator 34 in an amount of greater than or equal to about 0.5 wt.% to less than or equal to about 5 wt.% of the precursor 32, or optionally greater than or equal to about 1% to less than or equal to about 3%. In certain aspects, the thermal insulation component 16 may consist essentially of the matrix material (e.g., a thermal insulation material), the precursor 32, and the initiator 34.

[0044] Fig. 1A illustrates the electronic assembly 10 under normal operating conditions according to various aspects of the present disclosure. The normal operating conditions may include a first temperature. The operating temperature may be any temperature less than the decomposition temperature of the initiator (e.g., less than or equal to a ten-hour half-life temperature of the initiator). In some examples, a normal operating temperature of the first electronic component 12 is greater than or equal to about 0°C to less than or equal to about 50°C. At the operating temperature, the precursor 32 and the initiator 34 remain unreactive, such that the thermal barrier component 16 is in a first state. In the initial state, the thermal barrier component 16 has a first hardness.

[0045] Fig. 1B illustrates the electronic assembly 10 during a heat-generating event 40 in the first electronic component 12 according to various aspects of the present disclosure. The precursor 32 is configured to crosslink in the presence of the initiator 34 under certain temperature conditions. Preferably, the initiator 34 can decompose (e.g., forming free radicals) and initiate crosslinking of the precursor (e.g., free radical polymerization) at a second or event temperature. The minimum event temperature depends on the particular initiator. In some examples, the event temperature is greater than or equal to about 50°C, greater than or equal to about 60°C, optionally greater than or equal to about 70°C, optionally greater than or equal to about 80°C, optionally greater than or equal to about 90°C, optionally greater than or equal to about 100°C, or optionally greater than or equal to about 110°C.The decomposition process is endothermic and therefore consumes all or part of the heat from the heat-generating event 40.

[0046] Fig. 1C shows the electronic assembly 10 after the heat-generating event 40 ( Fig. 1B). At least part of the precursor 32 and the initiator 34 ( Fig. 1A) are consumed to form a crosslinked polymer 50, so that the thermal insulation component 16 is in a second or final state. The change from the initial state ( Fig. 1A) into the second state ( Fig. 1C) is irreversible. The precursor 32 and the initiator 34 may be substantially completely consumed to form the crosslinked polymer 50 during or after the heat-generating event 40. However, in certain aspects, the thermal insulation component 16 in the second state may contain excess precursor 32 and / or excess initiator 34. In the final state, the thermal insulation component 16 has a second hardness that is greater than the first hardness. The increased hardness provides additional physical protection for adjacent components, such as the second electronic component 14, by enhancing the mechanical properties of the thermal insulation component 16 such that it acts as a physical barrier in addition to thermal insulation.

[0047] Precursor 32 is a molecule comprising at least one acrylate functional group or one methacrylate functional group. In one example, precursor 32 comprises two or more acrylate functional groups. In another example, precursor 32 comprises two or more methacrylate functional groups. Precursor molecule 32 can be a monomer, an oligomer, or a polymer. Precursor 32 can be a linear molecule or a branched molecule.

[0048] In certain aspects, linear precursors can be monomers, oligomers, or polymers. Linear precursors can include, for example, a methacryloxypropyl-terminated polydimethylsiloxane (PDMS) (CAS No. 58130-03-3); an acryloxypropyl-terminated PDMS (CAS No. 128754-61-0); a poly(ethylene glycol) diacrylate (CAS No. 26570-48-9); a poly(ethylene glycol) dimethacrylate (CAS No. 25852-47-5); 1,10-decanediol diacrylate (CAS No. 13048-34-5); 1,10-decanediol dimethacrylate (CAS No. 6701-13-9); ethoxylated bisphenol A diacrylate (CAS No. 64401-02-1); ethoxylated bisphenol A dimethacrylate (CAS No. 41637-38-1); a urethane acrylate (e.g. 2-[[(Butylamino)carbonyl]oxy]ethyl acrylate, CAS No. 63225-53-6); a urethane methacrylate (e.g. 2-[2-(3-Prop-1-en-2-ylphenyl)propan-2-ylcarbamoyloxy]ethyl methacrylate, CAS No. 126710-08-5); an epoxy acrylate (e.g. bisphenol A glycerol (1 glycerol / phenol) diacrylate, CAS No. 4687-94-9); an epoxy methacrylate (e.g.Bisphenol A ethoxylate dimethacrylate, CAS No. 41637-38-1); or any combination thereof. The methacryloxypropyl-terminated PDMS may have a weight-average molecular weight (M W ) of greater than or equal to about 1,000 to less than or equal to about 10,000. The acryloxypropyl-terminated PDMS may have a weight-average molecular weight (M W ) of greater than or equal to about 1,000 to less than or equal to about 10,000. The poly(ethylene glycol) diacrylate may have a number average molecular weight (M N ) of greater than or equal to about 3 to less than or equal to about 1000. The poly(ethylene glycol) dimethacrylate may have a number average molecular weight (M N) of greater than or equal to 3 to less than or equal to 1,000. The ethoxylated bisphenol A diacrylate may have greater than or equal to 4 to less than or equal to 30 ethylene oxide (EO) units. The ethoxylated bisphenol A dimethacrylate may have greater than or equal to 4 to less than or equal to 30 ethylene oxide (EO) units. The urethane acrylate may have a weight average molecular weight (M W ) of greater than or equal to about 200 to less than or equal to about 10,000. The urethane methacrylate may have a weight average molecular weight (M W ) of greater than or equal to about 200 to less than or equal to about 10,000. The epoxy acrylate may have a weight average molecular weight (M W ) of greater than or equal to about 200 to less than or equal to about 10,000. The epoxy methacrylate may have a weight average molecular weight (M W) of greater than or equal to approximately 200 to less than or equal to approximately 10,000.

[0049] In certain aspects, a branched precursor can be a branched monomer or a branched oligomer. Branched precursors can include an ethoxylated trimethylolpropane triacrylate (CAS No. 28961-43-5); trimethylolpropane trimethacrylate (CAS No. 3290-92-4); an alkyloyl-modified dipentaerythritol triacrylate (CAS No. 83045-0-1); an ethoxylated glycerol triacrylate (CAS No. 144086-03-3); an ethoxylated pentaerythritol tetraacrylate (CAS No. 51728-26-8); or any combination thereof. The ethoxylated trimethylolpropane triacrylate can be a monomer or an oligomer and can have greater than or equal to 3 to less than or equal to 30 EO units. The ethoxylated glycerol triacrylate may be a monomer or an oligomer and may have more than or equal to 3 and less than or equal to 30 EO units.The ethoxylated pentaerythritol tetraacrylate may be a monomer or an oligomer and may have more than or equal to 3 and less than or equal to 30 EO units.

[0050] The initiator 34 is configured to decompose at the event temperature. The initiator 34 can decompose in an endothermic reaction to generate free radicals that polymerize with the precursor 32 to form the crosslinked polymer 50. The initiator can have a ten-hour lifetime temperature of greater than or equal to about 50°C to less than or equal to about 120°C, or optionally, greater than or equal to about 70°C to less than or equal to about 100°C.

[0051] In certain aspects, the initiator is an azo radical polymerization initiator or a peroxide radical polymerization initiator. Azo polymerization initiators may include, for example, azo nitrile initiators, azo amide initiators, or macro azo initiators. Azo nitrile polymerization initiators may include, for example, 2,2'-azobis(isobutyronitrile) (AIBN) (CAS No. 78-67-1) or 4,4'-azobis(4-cyanovaleric acid) (CAS No. 2638-94-0). An azo amide initiator may include, for example, 2,2'-azobis[2-methyl-N-(2-hydroxyethyl)propionamide] (CAS No. 61551-69-7). A macro-azo initiator can, for example, comprise 4-azobis(4-cyanovaleric acid) polymer with alpha,omega-bis(3-aminopropyl)polydimethylsiloxane (CAS No. 158947-07-0). Peroxidic initiators can, for example, comprise tert-butyl peroxide (CAS No. 110-05-4), dicumyl peroxide (CAS No. 80-43-3), or 2,4-pentanedione peroxide (CAS No. 37187-22-7).

[0052] The matrix 30 comprises a thermal insulation material. The thermal insulation material may have a thermal conductivity of less than or equal to approximately 5 W / mK. The thermal insulation material does not chemically react with the precursor 32 or the initiator 30. The thermal insulation material may comprise, for example, a polymer, a natural material, a fibrous material, or any combination thereof. Polymers may comprise, for example, polyurethane (e.g., polyurethane foam), polystyrene, polypropylene, silicone rubber, any copolymer thereof (e.g., polyurethane-polypropylene copolymer), or a combination thereof. Natural materials may comprise, for example, cellulose. Fiber materials may comprise, for example, fiberglass or mineral wool. In certain aspects, the thermal insulation material comprises, for example, polyurethane, polystyrene, polypropylene, silicone rubber, polyurethane-polypropylene copolymer, cellulose, fiberglass, mineral wool, or any combination thereof.In one example, the thermal insulation material comprises polyurethane foam.

[0053] The thermal insulation component 16 may optionally include other non-reactive components. For example, non-reactive components may be dispersed and embedded in the matrix 30 or form a coating on the matrix 30. In certain aspects, the thermal insulation material further includes an additive to modify its physical properties, such as silicon dioxide (SiO2), aluminum oxide (Al2O3), titanium oxide (TiO2), or any combination thereof. In one example, silica nanopowder is added to selectively provide mechanical strength and flexibility to the thermal insulation component 16.

[0054] As in Fig. 1A, the thermal insulation component 16 may define a thickness 60 in a direction substantially perpendicular to an outer surface 62 of the first electronic component 12. The thickness 60 may be selected depending on the desired packaging and performance characteristics of the electronic assembly 10. The thickness 60 may be substantially uniform, as shown. In certain alternative variations, a thickness may be non-uniform. In certain aspects, the thickness 60 may be from greater than or equal to about 1 mm to less than or equal to about 1 cm (e.g., from greater than or equal to about 1 mm to less than or equal to about 200 mm, from greater than or equal to about 200 mm to less than or equal to about 500 mm, or from greater than or equal to about 500 mm to less than or equal to about 1 cm).

[0055] In various aspects, an electronic assembly may include one or more electronic components and one or more thermal insulation components. Furthermore, electronic assemblies may have different arrangements, with the thermal insulation component remaining in thermal communication with the electronic component. With reference to Fig. 2, a further electronic assembly 110 is provided according to various aspects of the present disclosure. The electronic assembly 110 includes a plurality of electronic components 112 and a plurality of thermal insulation components 116, each disposed between the electronic components 112. The electronic components 112 can be connected to the electronic components 12, 14 of the Fig. 1A-1C. The thermal insulation component 116 may be similar to the thermal insulation component 16 of the Fig. 1A. With reference to Fig. 3, a further electronic assembly 210 is provided according to various aspects of the present disclosure. The electronic assembly 210 includes an electronic component 212 and a thermal insulation component 216. The electronic component 212 can be connected to the first electronic component 12 of the Fig. 1A. Except as described below, the thermal insulation component 216 may be similar to the thermal insulation component 16 of the Fig. 1A similar.

[0056] The thermal insulation component 216 is disposed around an outer surface 218 of the electronic component 212. In certain aspects, the thermal insulation component 216 may extend substantially around the entire outer surface 218 to define a housing. The thermal insulation component 216 defines a thickness 220 substantially perpendicular to the outer surface 218. The thickness 220 may be uniform, as shown. In certain alternative aspects, the thickness 220 may be non-uniform. For example, the thickness 220 may be thicker in areas adjacent to other electronic components in an assembly and thinner in the remaining areas.

[0057] In various aspects, the present disclosure provides a method of manufacturing a thermal insulation component. With reference to Fig.4, the process generally comprises providing a crosslinking precursor and a crosslinking initiator at 310, providing a matrix at 320, and embedding the precursor and initiator in the matrix at 330. The initiator is maintained at a temperature less than a ten-hour half-life temperature of the initiator to prevent premature rapid decomposition of the initiator and crosslinking of the precursor.

[0058] At 310, the method includes providing the crosslinking precursor and the crosslinking initiator. The precursor and the initiator can be provided as solids or liquids. If the precursor and / or the initiator is / are provided as a solid, it / they can be embedded into the matrix as solids prior to embedding or dissolved in a solvent to form a solution. Suitable solvents can include, for example, dimethylformamide (DMF), dimethyl sulfoxide (DMSO), N-methyl-2-pyrrolidone (NMP), or a combination thereof.

[0059] At 320, the method comprises providing the matrix. Providing the matrix may comprise forming the matrix, e.g., when the matrix comprises a foam. At 330, the method comprises embedding the precursor and the initiator in the matrix. Embedding may occur sequentially (i.e., after providing the matrix) or simultaneously with providing the matrix (i.e., forming the matrix). In an example of a sequential method, a solution of the precursor and the initiator in the solvent is prepared, then a porous matrix (e.g., glass fiber or cellulose) is provided, then the solution is absorbed into the porous matrix, and then the solvent is removed (e.g., by evaporation with or without heat). In an example of a concurrent method, powder precursor and initiator are provided, the precursor and the initiator are mixed with a polymer foam precursor (e.g., a polyurethane precursor), and then foam (e.g.,A foam pad is produced, with the crosslinking precursor and initiator dispersed and embedded in the foam. The foam can be formed by heating the admixture to a temperature below the ten-hour half-life temperature of the initiator and pouring it into a metal mold for cooling. In certain aspects, pores can be formed, for example, by pore-forming reagents or inert gas bubbles prior to cooling.

[0060] The foregoing description of the embodiments is for purposes of illustration and description. It is not intended to be exhaustive or limiting of the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but are interchangeable and may be used in a selected embodiment, even if not specifically shown or described. They may also be modified in many ways. Such modifications are not to be regarded as a departure from the disclosure, and all such changes are intended to be included within the scope of the disclosure.

Claims

[1] Thermal insulation component comprising: a matrix comprising a thermal insulation material having a thermal conductivity of less than or equal to 5 W / mK; a crosslinking precursor embedded in the matrix, wherein the crosslinking precursor comprises at least one acrylate functional group or one methacrylate functional group; and a crosslinking initiator embedded in the matrix, wherein the crosslinking initiator is configured to decompose to initiate crosslinking of the crosslinking precursor at a temperature greater than or equal to 50°C, wherein the thermal insulation material does not react chemically with the crosslinking precursor or the crosslinking initiator, wherein the thermal insulation material comprises glass fibre, mineral wool, cellulose, polyurethane, polystyrene, polypropylene, silicone rubber or any combination thereof, wherein the crosslinking precursor comprises a linear molecule selected from the group consisting of: a methacryloxypropyl-terminated polydimethylsiloxane (PDMS); an acryloxypropyl-terminated PDMS; a poly(ethylene glycol) diacrylate; a poly(ethylene glycol) dimethacrylate; 1,10-decanediol diacrylate; 1,10-decanediol dimethacrylate; ethoxylated bisphenol A diacrylate; ethoxylated bisphenol A dimethacrylate; a urethane acrylate; a urethane methacrylate; an epoxy acrylate; an epoxy methacrylate; or any combination thereof, or wherein the crosslinking precursor comprises a branched monomer selected from the group consisting of: an ethoxylated trimethylolpropane triacrylate; trimethylolpropane trimethacrylate; an alkyloyl-modified dipentaerythritol triacrylate; an ethoxylated glycerol triacrylate; an ethoxylated pentaerythritol tetraacrylate; or any combination thereof, or wherein the crosslinking precursor comprises a branched oligomer selected from the group consisting of: an ethoxylated trimethylolpropane triacrylate; an ethoxylated glycerol triacrylate; an ethoxylated pentaerythritol tetraacrylate; or any combination thereof. [2] Thermal insulation component according to claim 1, wherein the crosslinking initiator comprises an azo initiator selected from the group consisting of: 2,2'-Azobis(isobutyronitrile); 4,4'-Azobis(4-cyanovaleric acid); 2,2'-Azobis[2-methyl-N-(2-hydroxyethyl)propionamide]; 4-Azobis(4-cyanovaleric acid) polymer with alpha,omega-bis(3-aminopropyl)polydimethylsiloxane; or any combination thereof. [3] Thermal insulation component according to claim 1, wherein the crosslinking initiator is a peroxidic initiator selected from the group consisting of: tert-butyl peroxide; dicumyl peroxide; 2,4-pentanedione peroxide; or any combination thereof. [4] The thermal insulation component of claim 1, wherein the crosslinking precursor comprises a poly(ethylene glycol) diacrylate having a number average molecular weight of greater than or equal to 3 to less than or equal to 1000 and the crosslinking initiator comprises 2,2'-azobis(isobutyronitrile). [5] Thermal insulation component according to claim 1, wherein the crosslinking initiator has a ten-hour half-life temperature of greater than or equal to 50°C to less than or equal to 120°C. [6] Thermal insulation component according to claim 1, wherein the crosslinking precursor is present in an amount of greater than or equal to 5 wt% to less than or equal to 50 wt% of the thermal insulation material. [7] Thermal insulation component according to claim 1, wherein the crosslinking initiator is present in an amount of greater than or equal to 0.5 wt.% to less than or equal to 5 wt.% of the crosslinking precursor.

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