WAFER PROCESSING METHODS
The use of a polyolefin film for bonding and separating device chips in the wafer processing method prevents adhesive layer adhesion, ensuring high-quality chip production by thermo-compression bonding and laser division.
DE102020207070B4Active Publication Date: 2025-10-23DISCO CORP
Patent Information
- Application Number
- DE102020207070
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2019-06-07
- Filing Date
- 2020-06-05
- Publication Date
- 2025-10-23
- Estimated Expiration
- 2040-06-05
AI Technical Summary
Technical Problem
The adhesion of the adhesive layer to the back or front side of device chips during the wafer division process degrades the quality of the chips.
Method used
A wafer processing method that uses a polyolefin film instead of an adhesive tape for bonding the wafer and ring frame, forming a frame unit through thermo-compression bonding, and applying a laser beam along division lines to form modified layers for division, followed by expanding the polyolefin film to separate individual device chips.
Benefits of technology
Prevents adhesive layer adhesion to the device chips, maintaining their quality by using a polyolefin film that does not have an adhesive layer, thus avoiding quality degradation.
✦ Generated by Eureka AI based on patent content.
Smart Images
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Abstract
Wafer processing method for dividing a wafer (1) along multiple division lines (3) to obtain multiple individual component chips (1c), wherein the division lines (3) are formed on a front face (1a) of the wafer (1) such that they define multiple separate areas in which multiple components (5) are individually formed, wherein the wafer processing method comprises: a ring frame preparation step of preparing a ring frame (7) which has an inner opening (7a) for receiving the wafer (1); a polyolefin film provisioning step of positioning the wafer (1) in the inner opening (7a) of the ring frame (7) and providing a polyolefin film (9) on a back or front (1a) of the wafer (1) and on a back of the ring frame (7), wherein no adhesive layer is arranged between the polyolefin film (9) and the wafer (1); a joining step of heating the polyolefin film (9) during the application of a pressure to the polyolefin film (9) after performing the polyolefin film provisioning step, whereby the wafer (1) and the ring frame (7) are joined by thermocompression joining over the polyolefin film (9) to form a frame unit in a state in which the wafer (1) and the front (1a) of the ring frame (7) are exposed; a division step of positioning a focal point of a laser beam within the wafer (1), wherein the laser beam has a transmission wavelength for the wafer (1), and of applying the laser beam to the wafer (1) along each division line (3), thereby forming a modified layer in the wafer (1) along each division line (3) to divide the wafer (1) into the individual component chips (1c), after performing the interconnection step; and a pickup step of cooling the polyolefin film (9) in each of the several separate areas corresponding to a respective component chip, pushing up each component chip (1c) through the polyolefin film (9) and then picking up each component chip (1c) from the polyolefin film (9) after performing the division step.
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Citation Information
Patent Citations
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