LIGHT EMISSIONING DEVICE

Abstract

Light-emitting device (100) comprising: a light-emitting element (1) configured to emit first light; a first wavelength conversion component (10) arranged on the light-emitting element (1) having a lower surface (12) connected to the light-emitting element (1), an upper surface (11) opposite the lower surface (12), and a lateral surface (13) adjoining the upper surface (11), wherein the first wavelength conversion component (10) is configured to emit second light when excited by the first light;a second wavelength conversion component (20) covering the lateral surface (13) of the first wavelength conversion component (10) without covering the upper surface (11) of the first wavelength conversion component (10), wherein the second wavelength conversion component (20) has an inclined surface (22) extending outwards from the lateral surface (13) of the first wavelength conversion component (10), wherein the second wavelength conversion component (20) is configured to emit third light when excited by the first light and / or the second light; and a first light-reflecting component (30) covering the inclined surface (22) and having an upper surface that is part of an upper surface of the light-emitting device (100), wherein the lower surface (12) of the first wavelength conversion component (10) completely covers an upper surface (2) of the light-emitting element (1).

Description

BACKGROUND The present disclosure relates to a light-emitting device. In recent years, there has been increasing demand for a light-emitting device configured to emit light with a chromaticity within a desired range, specifically from white light-emitting devices. For example, Japanese patent publication JP 2018-082 027 A discloses a light-emitting device in which the color temperature of the emitted light is adjusted by the phosphor layer covering the lateral surfaces of the light-emitting element. Document US 2018 / 0029523A1 describes a light-emitting device comprising a light-emitting component, a first translucent element, a second translucent element, and a light-reflecting element. Document US 2021 / 0317958A1 describes a light-emitting device and a light-emitting module in which a plurality of light-emitting surfaces are arranged precisely and at high density. Document US 2020 / 0309346A1 describes a light-emitting device comprising a light-emitting element, a wavelength conversion component arranged on the light-emitting element and containing a first fluorescent material, and a cover component that covers the sides of the wavelength conversion component and surrounds the light-emitting element. OVERVIEW However, the light-emitting device disclosed in Japanese patent publication JP 2018-082 027 A still leaves room for improvements regarding light extraction efficiency. The purpose of the present disclosure is to increase the light extraction efficiency of a light-emitting device capable of emitting light with a chromaticity within a desired range. The invention is defined in the independent claims. Dependent claims define embodiments thereof. According to one embodiment of the present disclosure, a light-emitting device comprises a light-emitting element that emits first light, a first wavelength conversion component arranged on the light-emitting element and having a lower surface connected to the light-emitting element, an upper surface opposite the lower surface, and a lateral surface connected to the upper surface, wherein the first wavelength conversion component emits second light when excited by the first light, and a second wavelength conversion component covering the lateral surface of the first wavelength conversion component, except for the upper surface of the first wavelength conversion component, and having an inclined surface.extending from the lateral surface of the first wavelength conversion component to the outside, wherein the second wavelength conversion component emits third light when excited by the first light and / or the second light, and a first light-reflecting component covering the inclined surface. According to one embodiment of the present disclosure, the light extraction efficiency of a light-emitting device configured to emit light with a chromaticity within a desired range can be increased. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic top view of a light-emitting device according to a first embodiment of the present disclosure. Fig. 2 is a schematic cross-sectional view of the light-emitting device along a line II-II in Fig. 1. Fig. 3 is a schematic cross-sectional view of the light-emitting device along a line III-III in Fig. 1. Fig. 4 is a schematic diagram showing the propagation of light in the light-emitting device shown in Fig. 1. Fig. 5A is a schematic cross-sectional view showing a step in a method for manufacturing a light-emitting device according to the first embodiment. Fig. 5B is a schematic top view showing a step in the method for manufacturing a light-emitting device according to the first embodiment.Figure 5C is a schematic cross-sectional view showing a step in the process for manufacturing a light-emitting device according to the first embodiment. Figure 5D is a schematic cross-sectional view showing a step in the process for manufacturing a light-emitting device according to the first embodiment. Figure 5E is a schematic cross-sectional view showing a step in the process for manufacturing a light-emitting device according to the first embodiment. Figure 5F is a schematic cross-sectional view showing a step in the process for manufacturing a light-emitting device according to the first embodiment. Figure 5G is a schematic cross-sectional view showing a step in the process for manufacturing a light-emitting device according to the first embodiment.Figure 5H is a schematic cross-sectional view showing a step in the process for manufacturing a light-emitting device according to embodiment 1. Figure 6 is a schematic cross-sectional view of a light-emitting device according to a second embodiment of the present disclosure. Figure 7 is a schematic cross-sectional view of a light-emitting device according to an embodiment of the present disclosure. Figure 8 is a schematic cross-sectional view of a light-emitting device according to a third embodiment of the present disclosure. Figure 9 is a chromaticity coordinate map showing the chromaticity of the light emitted by a light-emitting device in one example and the chromaticity of the light emitted by a light-emitting device in a comparison example. DETAILED DESCRIPTION Certain embodiments and examples for implementing the present invention will be explained below with reference to the accompanying drawings. The light-emitting devices described below are provided to give form to the technical ideas of the invention as disclosed herein and do not limit the invention unless specifically stated. In the drawings, identical reference numerals denote components with the same functions. For ease of understanding, the feature descriptions are distributed across the embodiments and examples, but the component elements described in different embodiments and examples may be interchangeable or partially combined. Explanations of common features already described in previously appearing embodiments or examples may be omitted in subsequent embodiments or examples, where the explanation focuses solely on the differences. Similar effects, particularly those attributable to similar features, will not be mentioned every time an embodiment or example is discussed. The sizes of and positional relationships between the components shown in each drawing may be exaggerated for clarity. In this description, the lower part of a light-emitting device refers to a side where the substrate 50 is located, and the upper part of the light-emitting device refers to a side opposite the lower part. Furthermore, in this description, the inner side of a light-emitting device refers to a central side of the light-emitting device, and the outer side of the light-emitting device refers to an outer surface side of the light-emitting device. DETAILED DESCRIPTION 1. Design As shown in Figs. 1, 2 to 3, a light-emitting device 100 according to a first embodiment comprises a light-emitting element 1 that emits first light, a first wavelength conversion element 10 arranged on the light-emitting element 1 and having a lower surface 12 connected to the light-emitting element 1, an upper surface 11 opposite the lower surface 12, and lateral surfaces 13 connected to the upper surface 11, wherein the first wavelength conversion element emits second light when excited by the first light, a second wavelength conversion element 20 that covers the lateral surfaces 13 of the first wavelength conversion element 10 without covering the upper surface 11 of the first wavelength conversion element 10, and has an inclined surface 22 extending from the lateral surfaces 13 to the outside. extendand a first light-reflecting component 30 that covers the inclined surfaces 22. The second wavelength conversion component 20 emits third light when excited by the first light and / or the second light. Furthermore, the light-emitting device 100 can comprise a substrate 50 for mounting the light-emitting element 1, and a second light-reflecting component 40, which is arranged between the lateral surfaces 3 of the light-emitting element 1 and the second wavelength conversion component 20. A first projection 91 and a second projection 91, which hold the first light-reflecting component 30 and partially cover the lateral surfaces of the first light-reflecting component 30, as well as a protective device 80, can be arranged on the substrate 50. substrate A substrate 50 is a component on which a light-emitting element 1 is mounted, and it includes wiring 56 for supplying power to the light-emitting element 1 from the outside. As shown in Fig. 1, Fig. 2 to Fig. 3, the substrate 50 comprises wiring 56 and a base 55. The wiring 56 is arranged at least on the upper surface of the base 55. For example, a base 55 has a rectangular cuboid shape and comprises four lateral surfaces connected to the upper surface on which a light-emitting element is mounted. The four lateral surfaces are a first lateral surface 51 and a second lateral surface 52, which are opposite to each other, a third lateral surface 53 and a fourth lateral surface 54, which are opposite to each other and connect the first lateral surface 51 and the second lateral surface 52. For the base 55, a material is preferably used that hardly transmits the light from the light-emitting element or the external light. Examples include ceramics such as aluminum oxide, aluminum nitride, and silicon nitride; resins such as phenolic resins, epoxy resins, polyimide resins, BT resins, and polyphthalamide resins; semiconductors such as silicon; and metals such as copper and aluminum, which can be used individually or as a composite material. Examples of materials for the wiring 56 include metals such as iron, copper, nickel, aluminum, gold, silver, platinum, titanium, tungsten, and palladium, as well as alloys containing at least one of these. The light-emitting device 100 can have a structure in which the light-emitting element 1 is mounted at the bottom of a recess provided on the upper surface of the substrate 50. The light-emitting device 100 can also have a structure without a substrate 50. For example, the light-emitting device can have a structure equipped with metal components as the electrodes of the light-emitting device, which are exposed by the cover component, such as the second wavelength conversion component 20, that covers the light-emitting element 1. The wiring 56 is electrically connected to the electrodes 6 of the light-emitting element 1. The wiring 56 and the electrodes 6 can be connected, for example, by means of conductive connecting elements 70. Examples of connecting elements 70 include eutectic solder, conductive paste, protrusions, and the like. The wiring 56 comprises an anode-side wiring 56 and a cathode-side wiring 56. As shown in Fig. 1 and Fig. 3, a region of the anode-side wiring 56 and a region of the cathode-side wiring 56 are exposed on the surface of the light-emitting device 100 to function as the external electrodes of the light-emitting device 100. Light-emitting element A light-emitting element 1 emits first light. As shown in Fig. 2 and Fig. 3, the light-emitting element 1 comprises a semiconductor stack structure 5 and electrodes 6. The light-emitting element 1 can comprise a support substrate 7 that supports the semiconductor stack structure 5. For example, a semiconductor stack structure 5 comprises a first semiconductor layer, a second semiconductor layer, and a light-emitting layer located between the first semiconductor layer and the second semiconductor layer. Various semiconductors can be used for the semiconductor stack structure 5, including Group III-V compound semiconductors, Group II-VI compound semiconductors, and the like. Specific examples include nitride-based semiconductor materials such as InXAlYGa1-X-YN (0≤X, 0≤Y, 0≤X + Y≤1) and InN, AlN, GaN, InGaN, AlGaN, InGaAlN, or the like. With regard to the thickness of each layer and the layer structure, any of those known in the prior art can be used. The semiconductor stack structure 5 emits first light from the light-emitting layer. The peak wavelength of the first light is, for example, in the range of 260 nm to 630 nm. The first light is, for example, blue light. A light-emitting element 1 can have a single semiconductor stack structure 5 on a single support substrate, or a plurality of semiconductor stack structures 5 on a single support substrate. A semiconductor stack structure 5 can have a single light-emitting layer or a plurality of light-emitting layers. The structure of a semiconductor stack structure 5 with a plurality of light-emitting layers can be one in which a plurality of light-emitting layers are inserted between a single first semiconductor layer and a single second semiconductor layer, or one in which a structure containing a first semiconductor layer, a light-emitting layer, and a second semiconductor layer stacked in that order is repeated several times. A light-emitting element 1 comprises electrodes 6 on the semiconductor stack structure 5. The electrodes 6 include a first electrode, connected to the first semiconductor layer, and a second electrode, connected to the second semiconductor layer. The first electrode and the second electrode can be located on different surfaces or on the same surface of the semiconductor stack structure 5. In a light-emitting device 100, the shape of the light-emitting element 1, when viewed from above, is, for example, a square or rectangle. The light-emitting element 1 can also have a different polygonal shape when viewed from above, such as a triangle, hexagon, or the like. First wavelength conversion component As shown in Figs. 2 and 3, a first wavelength conversion component 10 is arranged on the light-emitting element 1. The first wavelength conversion component 10 comprises a lower surface 12 connected to the light-emitting element 1, an upper surface 11 opposite the lower surface 12, and lateral surfaces 13 connected to the upper surface 11. The lower surface 12 of the first wavelength conversion component 10 is connected to the upper surface 2 of the light-emitting element 1. The first wavelength conversion component 10 is excited by the first light emitted by the light-emitting element 1 to emit second light. The first wavelength conversion component 10 is, for example, a layered component. The upper surface 11 and the lower surface 12 are flat surfaces that are parallel to each other, and the upper surface 11 is rectangular, as shown in Fig. 1. The lower surface 12 completely covers the upper surface 2 of the light-emitting element 1, as shown in Fig. 2 and Fig. 3. The lateral surfaces 13 comprise a plurality of lateral surfaces. Specifically, there are four lateral surfaces, each connected to the sides of the quadrilateral upper surface 11. All four lateral surfaces are flat surfaces orthogonal to the upper surface 11. The shape of the first wavelength conversion component 10 described above is only an example. In the first wavelength conversion component 10, for instance, the upper surface 11 and the lower surface 12 can be flat surfaces with areas of the same size. Alternatively, one of the upper surface 11 and the lower surface 12 can encompass the other in a top view. In this case, a structure may exist in which a step exists between the upper surface and the lower surface 12, or the lateral surfaces may comprise inclined surfaces extending from the upper surface to the lower surface. The first wavelength conversion component 10 can be connected to the upper surface 2 of the light-emitting element 1 by means of a translucent connecting material. Alternatively, the first wavelength conversion component 10 and the light-emitting element 1 can be directly connected to each other without any connecting material. The upper surface 11 of the first wavelength conversion component 10 is exposed by the first light-reflecting component 30 (described later) to form part of the upper surface of the light-emitting device 100. In this case, the upper surface 11 of the first wavelength conversion component 10 serves as the emission surface of the light-emitting device 100. The first wavelength conversion component 10 contains a phosphor that is excited by the first light emitted by the light-emitting element 1 to emit a second light. The second light has a longer peak wavelength than the peak wavelength of the first light. The peak wavelength of the second light is, for example, in the range of 520 nm to 560 nm. The second light is, for example, yellow-green to yellow light. Examples of the first wavelength conversion component 10 include a sintered body made of a phosphor, and one made of a resin or an inorganic material, such as glass or ceramic, containing phosphor powder. Alternatively, the first wavelength conversion component 10 may be one in which a layer containing a phosphor is applied to the surface of a molded body made of a resin, glass, ceramic, or the like. Furthermore, the first wavelength conversion component 10 may include a filler, such as a diffuser, or the like, to the extent that such a filler does not block light. Examples of diffusers that may be used include titanium oxide, silicon oxide, aluminum oxide, zinc oxide, or the like.In the case of using a resin as a binder for the phosphor and / or the diffuser, for example epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylic resins, fluorinated resins or the like can be used as the resin. The first wavelength conversion component has light transmittance, and the transmittance is preferably 50% or higher, more preferably 70% or higher, based on the first light from the light-emitting element 1, and the wavelength-converted second light and third light. The phosphor to be included in the first wavelength conversion component 10 can be one that can be excited by the first light emitted by the light-emitting element 1. Examples of phosphors that emit green light include phosphors based on yttrium aluminum garnet (for example, Y3(Al,Ga)5O12:Ce), phosphors based on lutetium aluminum garnet (for example, Lu3(Al,Ga)5O12:Ce), phosphors based on terbium aluminum garnet (for example, Tb3(Al,Ga)5O12:Ce), phosphors based on silicate (for example, (Ba,Sr)2SiO4:Eu), phosphors based on chlorosilicate (for example, Ca8Mg(SiO4)4C12:Eu), and phosphors based on β-SiAlON (for example, Si6-zAlzOzN8-z:Eu (0 <z<4,2)), und Leuchtstoffe auf Basis von SGS (z. Beispiel SrGa2S4:Eu). Examples of phosphors that emit yellow light, including phosphors based on α-SiAION (for example, Mz(Si, Al)12(O, N)16:Eu (0 <z≤2, „M“ ist Li, Mg, Ca, Y, und Lanthanidelemente unter Ausschluss von La und Ce). Zudem emittieren einige von den oben aufgeführten Leuchtstoffen, die grünes Licht emittieren, gelbes Licht. Ferner können beispielsweise die Peakemissionswellenlängen von Yttrium-Aluminium-Granat-Leuchtstoffen zu längeren Wellenlängen verschoben werden, indem man einen Teil von Y durch Gd ersetzt, um gelbes Licht zu emittieren. Außerdem können einige von diesen Wellenlängenumwandlungssubstanzen oranges Licht emittieren. Examples of phosphors that emit red light include phosphors based on nitrogen-containing calcium aluminum silicate (CASN or SCASN) (for example, (Sr,Ca)AlSiN3:Eu) and phosphors based on BSESN (for example, (Ba,Sr,Ca)2Si5N8:Eu). Further examples include manganese-activated fluoride phosphors (represented by the general formula (I), A2[M1-aMnaF6] (in the general formula (I), "A" is at least one selected from the group consisting of K, Li, Na, Rb, Cs, and NH4; "M" is at least one selected from the group consisting of elements of group 4 and elements of group 14; and "a" satisfies 0). <a<0,2)). Beispiele der manganaktivierten Fluoridleuchtstoffe umfassen Leuchtstoffe auf Basis von KSF (zum Beispiel K2SiF6:Mn), Leuchtstoffe auf Basis von KSAF (zum Beispiel K2Si0,99Al0,01F5,99:Mn) und Leuchtstoffe auf Basis von MGF (zum Beispiel (3,5MgO·0,5MgF2·GeO2:Mn). Phosphors based on KSAF can have a composition represented by the following formula (I): M2[SipAlaMnrFs] (I) In formula (I), “M” represents an alkali metal and can include at least K. Mn can be tetravalent Mn ions. p, q, r, and s can satisfy the following: 0.9 ≤ p + q + r ≤ 1.1, 0 < q ≤ 0.1, 0 < r ≤ 0.2, and 5.9 ≤ s ≤ 6.1, preferably 0.95 ≤ p + q + r ≤ 1.05 or 0.97 ≤ p + q + r ≤ 1.03, 0 < q ≤ 0.03, 0.002 ≤ q ≤ 0.02 or 0.003 ≤ q ≤ 0.015, 0.005 ≤ r ≤ 0.15, 0.01 ≤ r ≤ 0.12 or 0.015 ≤ r ≤ 0.1, 5.92 ≤ s ≤ 6.05 or 5.95 ≤ s ≤ 6.025. Examples of such compositions include those represented by K2[Si0.946Al0.005Mn0.049F5.995], K2[Si0.942Al0.008Mn0.050F5.992] and K2[Si0.939Al0.014Mn0.047F5.986]. Such KSAF-based phosphors can emit highly luminous red light with a peak emission wavelength that has a narrow full width at half the maximum. Of these, phosphors based on yttrium aluminum garnet (for example, Y3(Al,Ga)5O12:Ce), in which part of the Y is replaced by Gd, are preferably used for the phosphor that is to be contained in the first wavelength conversion element and emits yellow light. This enables the light-emitting device 100 to emit white light, which is a mixture of blue light as the first light and yellow light as the second light, as the light emitted by the first wavelength conversion component. Second wavelength conversion component A second wavelength conversion component 20 exposes the upper surface 11 of the first wavelength conversion component 10, while covering the lateral surfaces 13 of the first wavelength conversion component 10. The second wavelength conversion component 20 has inclined surfaces extending outwards from the lateral surfaces 13 of the first wavelength conversion component 10 (hereinafter referred to as the first inclined surfaces 22). The second wavelength conversion component 20 is excited by the first light and / or the second light to emit third light. The second wavelength conversion component 20 is excited by at least one of the first light emitted by the light-emitting element 1 and the second light emitted by the first wavelength conversion component 10 to emit a third light. The third light has a longer peak wavelength than the peak wavelength of the first light. Specifically, the third light has a longer peak wavelength than both the peak wavelength of the first light and the peak wavelength of the second. The peak wavelength of the third light is, for example, 600 nm to 660 nm. The third light is, for example, orange to red light. As shown in Fig. 2 and Fig. 3, the second wavelength conversion component 20 has first surfaces 21 in contact with the lateral surfaces of the first wavelength conversion component 10, and first inclined surfaces 22 extending from the upper edges of the first surfaces 21 to the outside. The second wavelength conversion component 20 may further comprise second inclined surfaces 23 extending from the lower edges of the first surfaces 21 to the outside. In the case where the first wavelength conversion component 10 comprises a plurality of lateral surfaces, the second wavelength conversion component 20 continuously covers the plurality of lateral surfaces of the first wavelength conversion component 10. In the light-emitting device 100, the second wavelength conversion component 20 preferably continuously covers the four lateral surfaces of the first wavelength conversion component 10, and further preferably completely covers the lateral surfaces 13 of the first wavelength conversion component 10. In the case where the light-emitting device 100 comprises the second light-reflecting component 40 described below, the second wavelength conversion component 20 can cover at least a portion of the upper region of each lateral surface 3 of the light-emitting element 1 that is exposed by the second light-reflecting component 40.In the case where the light-emitting device 100 does not contain the second light-reflecting component 40 described below, the second wavelength conversion component 20 preferably extends from the lateral surfaces of the first wavelength conversion component 10 to the lateral surfaces 3 of the light-emitting element 1 in order to completely cover the lateral surfaces of the light-emitting element 1. The first inclined surfaces 22 are connected to the first surfaces 21. The upper edges of the first inclined surface 22 are in contact with the lateral surfaces of the first wavelength conversion component 10, and the lower edges are, for example, in contact with the upper surface of the substrate 50. The second inclined surfaces 23 are positioned inwards from the first inclined surfaces 22 and contact the upper edges with the lateral surfaces of the first wavelength conversion component 10 or the lateral surfaces of the light-emitting element 1, and the lower edges, for example, with the upper surface of the substrate 50. The first inclined surfaces 22 and the second inclined surfaces 23 can be flat or curved surfaces. As shown particularly in Figs. 2 and 3, the first inclined surfaces 22 are preferably curved surfaces such that their cross-sectional shapes are curved lines projecting from the outside to the inside of the light-emitting device. In this example, the first inclined surfaces 22 are curved surfaces where the curved lines project in cross-section in the direction of the light-emitting element 1. With such a shape, the second wavelength conversion element 20 can reflect the incident light to allow the reflected light to propagate towards the first wavelength conversion element 10.In other words, such a structure allows a larger amount of light to be guided towards the first wavelength conversion component 10, thereby increasing the light extraction efficiency of the light-emitting device 100. The first inclined surfaces 22 are preferably completely covered by the (later described) first light-reflecting component 30. The light-reflecting function of the first light-reflecting component 30 can direct a greater amount of light towards the first wavelength conversion component 10, thereby increasing the light extraction efficiency of the light-emitting device 100. The upper edges of the first inclined surfaces 22 can meet the upper edges of the lateral surfaces 13 of the first wavelength conversion component 10 (i.e., the outer edges of the upper surface 11 of the first wavelength conversion component 10), or meet the lateral surfaces 13 of the first wavelength conversion component 10 at positions lower than the upper edges. In the case where the upper edges of the first inclined surfaces 22 meet the upper edges of the lateral surfaces 13 of the first wavelength conversion element 10 (i.e., the second wavelength conversion element 20 is part of the upper surface of the light-emitting device 100), the thickness of the second conversion element 20, which is exposed on the upper surface of the light-emitting device 100, is preferably small. For example, the thickness is preferably 10 µm or less. This can reduce the amount of light that exits the second wavelength conversion element 20 without passing through the first wavelength conversion element 10, thereby reducing the unevenness in the emission color in the light-emitting device 100. In the case where the upper edges of the first inclined surfaces 22 meet the lateral surfaces 13 of the first wavelength conversion component 10 at lower positions than the upper edges of the lateral surfaces 13 (i.e., as in the case of the light-emitting device 100A shown in Fig. 7, where the second wavelength conversion component 20A exposes the upper regions 13A of the lateral surfaces 13 of the first wavelength conversion component 10), the upper regions 13A of the lateral surfaces 13 of the first wavelength conversion component 10, exposed by the second wavelength conversion component 20A in the light-emitting device 100A, are preferably covered by the first light-reflecting component 30.With this structure, light emitted by the second wavelength conversion component 20 is less visible externally through the first light-reflecting component 30, so that the unevenness in the emission color of the light-emitting device 100 can be reduced. An example of the second wavelength conversion component 20 is a resin containing a light-reflecting substance and a phosphor. Specifically, a resin-based material containing a light-reflecting substance and a phosphor can be used. By containing a light-reflecting substance, the second wavelength conversion component 20 can efficiently reflect the first light and the second light. By containing a phosphor, the second wavelength conversion component 20 can further convert the passing light that is not reflected by the light-reflecting substance into third light, which is to be reflected by the first inclined surfaces 22 and / or the second inclined surfaces 23 to propagate towards the first wavelength conversion component.The presence of the third light in the light emitted from the light-emitting device 100 makes it possible to adjust the chromaticity of the light emitted by the light-emitting device 100. Suitable materials for the light-reflecting substance to be contained in the second wavelength conversion component 20 include titanium oxide, aluminum oxide, silicon oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, glass filler or the like. The resin for the base material can be a resin similar to one of those listed as examples with reference to the first wavelength conversion component 10. The phosphor to be contained in the second wavelength conversion component 20 can be one that can be excited by the first light emitted by the light-emitting element 1 and / or the second light emitted by the first wavelength conversion component 10. The phosphor can be similar to any of those listed above as examples. Of these, a BSESN phosphor (e.g. (Ba,Sr,Ca)2Si5N8:Eu) can be suitablely used as a phosphor emitting orange light, which is to be contained in the second wavelength conversion component 20. If the second wavelength conversion component 20 contains such a phosphor that emits orange light, the chromaticity of the white light resulting from the mixture of blue light and yellow light emitted by the light-emitting device 100 can be shifted towards orange. The same phosphor as that contained in the first wavelength conversion component 10 can be used as the phosphor contained in the second wavelength conversion component 20. In this case as well, the chromaticity of the light emitted by the light-emitting device 100 can be adjusted. First light-reflecting component A first light-reflecting component 30 covers the first inclined surfaces 22 of the second wavelength conversion component 20. The first light-reflecting component 30 exposes the upper surface 11 of the first wavelength conversion component 10. The first light-reflecting component 30 is preferably arranged continuously with the upper surface 11 of the first wavelength conversion component 10 in the upper surface of the light-emitting device 100. The upper surface of the first light-reflecting component 30 is part of the upper surface of the light-emitting device 100. As shown in Fig. 1, the outline of the first light-reflecting component 30, viewed from above, is, for example, substantially rectangular, and the first light-reflecting component 30 comprises, for example, four lateral surfaces connected to the top surface. Two opposite lateral surfaces 33 and 34 of the first light-reflecting component 30 are parts of the lateral surfaces of the light-emitting device 100. As shown in Fig. 2, the lateral surface 33 of the two lateral surfaces 33 and 34 is substantially coplanar with the third lateral surface 53 of the substrate 50. The lateral surface 34 of the two lateral surfaces 33 and 34 is substantially coplanar with the fourth lateral surface 54 of the substrate 50. The other opposite lateral surfaces 31 and 32 of the first light-reflecting component 30 are, as shown in Fig.3 shown, covered by the projections (the first projection 91 or the second projection 92). The light-emitting device 100 need not include a first projection 91, and in this case the first light-reflecting component 30 has a lateral surface that is substantially coplanar with the first lateral surface 51 of the substrate 50. For the first light-reflecting component 30, for example, a resin containing a light-reflecting substance can be used. The light-reflecting substance can be similar to any of those listed as examples with reference to the second wavelength conversion component 20. The resin can be similar to any of those listed with reference to the first wavelength conversion component 10. The first light-reflecting component 30 can contain a light-absorbing substance, such as carbon black, graphite, or the like. The first light-reflecting component 30 preferably has a reflectivity of 60% or higher, more preferably 80% or higher, based on the light emitted by the light-emitting element 1. Second light-reflecting component A light-emitting device 100 can include a second light-reflecting component 40, which is arranged between the lateral surfaces of the light-emitting element 1 and the second wavelength conversion component 20. The second light-reflecting component 40 preferably covers the lateral surfaces 3 of the light-emitting element 1. This allows the second light-reflecting component to reflect the light emanating from the lateral surfaces 3 of the light-emitting element 1 and propagate towards the light-emitting element 1. In the case where the light-emitting element 1 is mounted on a substrate 50, the second light-reflecting component 40 preferably fills the space between the lower surface 4 of the light-emitting element 1 and the upper surface of the substrate 50, covering the lateral surfaces of the electrodes 6 of the light-emitting element 1.This allows the second light-reflecting component to reflect downward-facing light from the light-emitting element 1 and propagate towards the light-emitting element 1. If the lateral surfaces of the light-emitting element 1 are covered by a translucent connecting material, as in the case where the light-emitting element 1 and the first wavelength conversion component 10 are connected by means of a translucent connecting material, the second light-reflecting component 40 can cover the lateral surfaces 3 of the light-emitting element 1 with the translucent material. The second light-reflecting component 40 is preferably mounted such that ridges are formed on the lateral surfaces 3 of the light-emitting element 1. This allows the second wavelength conversion component 20, which covers the second light-reflecting component 40, to have second inclined surfaces 23 in contact with the second light-reflecting component 40. The second inclined surfaces 23 are preferably curved surfaces such that their cross-sectional shapes are curved lines projecting from the outside to the inside of the light-emitting device. This enables a greater proportion of the light emerging from the lateral surfaces of the light-emitting element 1 to be reflected back towards the light-emitting element 1.The light incident on the second wavelength conversion component 20, without being reflected by the second inclined surface 23, is reflected by the first inclined surfaces 22 and directed towards the first wavelength conversion component 10 to become part of the light emitted by the light-emitting device 100. This can increase the light extraction efficiency of the light-emitting device 100. For the second light-reflecting component 40, materials can be selected from the same materials used to form the first light-reflecting component 30. The materials used to form the first light-reflecting component 30 and the materials used to form the second light-reflecting component 40 can be the same or different. Protrusions As shown in Fig. 3, a light-emitting device can include 100 projections that hold the first light-reflecting component. The projections comprise a first projection 91, which covers one lateral surface of the first light-reflecting component 30, and a second projection 92, which covers the opposite lateral surface of the first light-reflecting component. The first projection 91 is located on the upper surface of the substrate 50 along the outer edge on the side of the first lateral surface 51. The second projection 92 is located on the upper surface of the substrate 50 on the side of the second lateral surface 52.In the region between the first projection 91 and the second projection 92, a light-emitting element 1, a first wavelength conversion component 10, a second light-reflecting component 40, a second wavelength conversion component 20, a first light-reflecting component 30, and a protective device 80 are arranged. The regions where the first projection 91 and the second projection 92 are arranged, and the region between the first projection 91 and the second projection 92, are hereinafter collectively referred to as the assembly region R1. The wiring 56 is partially exposed in the region of the substrate 50 outwards from the second projection 92 on the side of the second lateral surface 52. This region is hereinafter referred to as the external connection region R2. For the first projection 91 and the second projection 92, a resin can be used, for example. Any of the resins described above can be used. The resin used to form the projections can be a translucent resin, a white resin containing a light-reflecting substance, or a gray or black resin containing a light-absorbing substance. Protective device A light-emitting device 100 can further include a protective device 80. The protective device 80 is connected to the wiring 56 of the substrate 50 by means of a connecting component, such as a protrusion. The surfaces of the protective device 80 are covered by one or more components consisting of the first light-reflecting component 30, the second wavelength conversion component 20, and the second light-reflecting component 40. The protective device 80 is, for example, a Zener diode. Light propagation The propagation of light in a light-emitting device 100 will be explained with reference to Fig. 4. The first light emitted from the upper surface 2 of the light-emitting element 1 (e.g., arrow A1) strikes the first wavelength conversion component 10. A portion of the first light emitted from the lateral surfaces 3 and the lower surface 4 (e.g., arrow A2) is reflected by the lateral surfaces 3 and the lower surface 4 to exit the upper surface 2 of the light-emitting element 1 (e.g., arrow A3) and strike the first wavelength conversion component 10. A portion of the light incident on the first wavelength conversion component 10 (e.g., arrow B5) exits the upper surface of the first wavelength conversion component 10 (e.g., arrow C1). Part of the light exiting the lateral surfaces 13 of the first wavelength conversion component 10 (e.g., arrow B1) is reflected by the first surfaces 21 and / or the second wavelength conversion component 20 (e.g., arrow B4) to exit the upper surface of the first wavelength conversion component 10 (e.g., arrow C4). Another part is incident on the second wavelength conversion component 20 (e.g., D1). Part of the first light and / or the second light incident on the second wavelength conversion component 20 is converted into third light within the second wavelength conversion component 20. Another part of the first light and / or the second light incident on the second wavelength conversion component 20 exits the second wavelength conversion component without having been converted into third light. In this way, the light exiting the second wavelength conversion component 20 can contain the first light, the second light, and the third light. A portion of the light exiting the second wavelength conversion component 20 (e.g., arrow D1) is reflected by the first inclined surfaces 22 and / or the first light-reflecting component 30. A portion of the light reflected by the first inclined surfaces 22 and / or the first light-reflecting component 30 (e.g., arrow D2) passes through the first surfaces 21 to enter the first wavelength conversion component 10 (e.g., arrow B2) before exiting the top surface of the first wavelength conversion component 10 (e.g., arrow C2). In this way, the light exiting the top surface of the first wavelength conversion component 10 can contain the first light, the second light, and the third light. The light exiting the top surface of the first wavelength conversion component 10 constitutes the light emitted by the light-emitting device 100. The light, composed as above and emitted by the light-emitting device 100, forms the light that passes through the components as described above. In this way, the light-emitting device 100 can emit light that is a mixture of the first, second, and third light. In the case where the first light is blue light, the second light contains yellow-green to yellow light, and the third light contains orange to red light, in particular, adjusting the type and amount of phosphor contained in the second wavelength conversion component in the light-emitting device 100 allows the chromaticity of the white light, composed of the first and second light, to be shifted towards red.In other words, the light-emitting device 100, which is equipped with a second wavelength conversion component 20, allows the adjustment of the chromaticity of the light emitted by the light-emitting device 100. Furthermore, the light emitted by the light-emitting device 100 can be essentially free of the first light. In the case of obtaining a light-emitting device that emits orange to red light, for example, by using a blue light-emitting element, essentially all the light emitted by the light-emitting device 100 can be composed of the second and third light. Equipping the light-emitting device with a second wavelength conversion component can also adjust the chromaticity of the light emitted by the light-emitting device in this case. Furthermore, the leakage of the first light from the lateral surfaces of the light-emitting device can be reduced by means of the first light-reflecting component. In the case of equipping a light-emitting device 100 with a second light-reflecting component, a portion of the light emitted from the lateral surfaces 3 and the lower surface 4 of the light-emitting element 1, which is transmitted through the second light-reflecting component 40 without being reflected by the lateral surfaces 3 and the lower surface 4 of the light-emitting element 1 or the second light-reflecting component 40 (e.g., arrow E1), falls onto the second wavelength conversion component 20 (e.g., arrow D3). A portion of the light incident on the second wavelength conversion component 20 is converted into third-order light within the second wavelength conversion component 20. As described above, the light exiting the second wavelength conversion component 20 contains the first light incident on the second wavelength conversion component 20 via the second light-reflecting component 40, and the third light associated with the first light. A portion of the light passing through the second wavelength conversion component 20 (e.g., arrow D3) is reflected by the first inclined surfaces 22 and / or the first light-reflecting component 30 (e.g., arrow D4) before entering the first wavelength conversion component 10 through the first surfaces 21 (e.g., arrow B3) and exiting from the upper surface of the first wavelength conversion component 10 (e.g., arrow C3). Accordingly, the light incident on the second wavelength conversion component 20 via the second light-reflecting component 40 can also be a portion of the light emitted by the light-emitting device 100.In other words, the light-emitting device 100 with the above design can emit the light corresponding to the first light that has passed through the second light-reflecting component 40. This can ultimately increase the light extraction efficiency of the light-emitting device 100. The arrows shown in Fig. 4 are a schematic representation provided to illustrate the propagation of light in a simplified manner. The actual propagation of light changes as it passes through each component or intermediate components, depending on the refractive index differences and the scattering effect of the materials contained within the components. The amount of the third light contained in the light emitted from the emission surface can be adjusted by appropriately modifying the shapes of the first inclined surfaces 22 and the second inclined surfaces 23, the volume of the second wavelength conversion component 20, and the amount of phosphor contained therein. In other words, the color of the light emitted by the light-emitting device 100 can be appropriately adjusted. 2. Manufacturing process A method for manufacturing a light-emitting device 100 comprises: (1) a step of preparing a collective substrate; (2) a step of providing protrusions; (3) a step of providing light-emitting elements; (4) a step of providing first wavelength-conversion components; (5) a step of providing protective devices; (6) a step of providing second light-reflecting components; (7) a step of providing second wavelength-conversion components; (8) a step of providing first light-reflecting components; and (9) a step of separating the block substrate into individual devices. Each step will be explained below with reference to Figures 5A to 5H. (1) Step of preparing a collective substrate In one step of preparing a collective substrate, as shown in Fig. 5A, a collective substrate 50A is prepared, comprising a plurality of substrate 50 regions. The substrates 50, as shown in Fig. 5B, are arranged, for example, in a matrix. The collective substrate 50A comprises a wiring 56 with a predetermined pattern layout for each region of a light-emitting device 100. The dashed lines in Fig. 5A and Fig. 5B are imaginary lines provided to make the boundaries of the substrates 50 for the light-emitting devices 100 to be manufactured more easily understood. In Fig. 5B, the wiring 56 is represented using a simplified form to make the drawing easier to understand. The wiring 56 can be installed by a known method, for example, plating, vapor deposition, sputtering, or the like. The collective substrate 50A can be prepared by procurement or transfer from one that is already equipped with wiring 56. (2) Step of providing advantages In one step of protrusion provision, frame-shaped protrusions 90A are provided on the upper surface of the block substrate 50A. As shown in Fig. 5B, each protrusion 90A collectively encloses the mounting regions R1 of a plurality of light-emitting devices 100 to be manufactured, such that the mounting regions R1 and the external connection regions R2 of the light-emitting device 100 are separated. Providing the protrusions 90A in this way can facilitate the provision of second light-reflecting components 40, second wavelength conversion components 20, and first light-reflecting components 30 in subsequent steps only in the areas surrounded by the protrusions 90A. (3) Step of providing light-emitting elements In one step of providing light-emitting elements, as shown in FIG. 5C, light-emitting elements 1 are provided on the wiring 56, surrounded by the projections 90A. The light-emitting elements 1 are provided, for example, by means of protrusions. (4) Step of providing initial wavelength conversion components In one step of providing first wavelength conversion components, as shown in Fig. 5D, first wavelength conversion components 10 are provided on the upper surfaces 2 of the light-emitting elements 1. The first wavelength conversion components 10 are bonded to the light-emitting elements 1, for example, using a translucent adhesive. The step of providing initial wavelength conversion components can be performed before the step of providing light-emitting elements. In this case, in the step of providing light-emitting elements, light-emitting elements 1 are provided on the wiring 56, which already have initial wavelength conversion components on them. (5) Step of providing protective devices In one step of providing protective devices, as shown in Fig. 5E, protective devices 80 are provided on the wiring 56, surrounded by the projections 90A. The protective devices 80 are provided, for example, by means of protrusions. (6) Step of providing second light-reflecting components In a step of providing second light-reflecting components, as shown in Fig. 5F, second light-reflecting components 40 are provided in the areas surrounded by the projections 90A such that the lateral surfaces 3 of the light-emitting elements 1 are covered. In particular, an uncured material for the second light-reflecting components 40 is provided by potting or spraying around the protective devices 80. The uncured material for the second light-reflecting components 40 creeps upward by means of surface tension onto the lateral surfaces 3 of the light-emitting elements 1 to cover the lateral surfaces 3 of the light-emitting elements 1.This gives the second light-reflecting components 40 a shape that widens towards the collective substrate 50A, and first curved surfaces 41 that move away from the light-emitting elements 1 as they approach the collective substrate 50A. The first curved surfaces 41 are designed to project towards the light-emitting elements 1. (7) Step of providing second wavelength conversion components In a step of providing second wavelength conversion components, as shown in Fig. 5G, second wavelength conversion components 20 are provided in the areas surrounded by the projections 90A, such that the lateral surfaces 13 of the first wavelength conversion components 10 are covered. Specifically, an uncured material for the second wavelength conversion components 20 is provided on the first curved surfaces 41 of the second light-reflecting components 40 by potting or spraying. The uncured material for the second wavelength conversion components 20 creeps upward by means of surface tension onto the lateral surfaces 13 of the first wavelength conversion components 10 to cover the lateral surfaces of the first wavelength conversion components 10.This can form second wavelength conversion components 20, each having a first inclined surface 22 that recedes from the lateral surfaces 13 of the first wavelength conversion components 10 as it approaches the upper surface of the collective substrate 50A. In the light-emitting devices 100, the first inclined surfaces 22 are positioned lower than the upper surfaces 11 of the first wavelength conversion components 10 and are curved to project inwards (i.e., towards the first wavelength conversion components 10 and the light-emitting elements 1). The second wavelength conversion components 20 further cover the first curved surfaces 41 of the second light-reflecting components 40. This provides the second wavelength conversion components 20 with second inclined surfaces 23 along the first curved surfaces 41 at the interfaces with the second light-reflecting components 40. (8) Step of providing initial light-reflecting components In a step of providing first light-reflecting components, as shown in Fig. 5H, first light-reflecting components 30 are provided in the areas surrounded by the projections 90A. Specifically, an uncured material for the first light-reflecting components 30 is provided on the first inclined surfaces 22 of the second wavelength conversion components 20 by potting or spraying, allowing it to flatten under its own weight. At this stage, the amount of material supplied is preferably adjusted such that the surfaces of the first light-reflecting components 30 are aligned with the upper surfaces 11 of the first wavelength conversion components 10, i.e., the surfaces of both are essentially coplanar.Subsequently, the first light-reflecting components 30, the second wavelength conversion components 20, and the second light-reflecting components 40 are cured, for example by heating. (9) Step of separating the block substrate into individual devices In one step of separating the block into individual devices, it is cut at the cutting position CL, which is shown as an example in Fig. 5H, to obtain light-emitting devices 100. For example, a blade is used for cutting. By following the manufacturing process described above, a light-emitting device 100 can be produced, comprising a first light-reflecting component 30, a second wavelength conversion element 20, and a second light-reflecting component 40. Furthermore, the first light-reflecting components 30, the second wavelength conversion element 20, and the second light-reflecting components 40 are preferably cured sequentially by heating or the like as they flow into their respective shapes. In this way, desired interface shapes between the components can be easily achieved. However, the first light-reflecting components 30, the second wavelength conversion element 20, and the second light-reflecting components 40 can also be cured simultaneously.For example, the material for the second light-reflecting components 40 can be applied and partially cured after the second light-reflecting components 40 have achieved their desired shapes. Then, the material for the second wavelength-conversion components 20 can be applied and partially cured after the second wavelength-conversion components 20 have achieved their desired shapes. After the material for the first light-reflecting components 30 has been applied, the first light-reflecting components 30, the second wavelength-conversion components 20, and the second light-reflecting components 40 can be fully cured simultaneously. Each material can be cured and shaped under suitable conditions. The materials are selected so that the curing conditions for one component do not adversely affect the other components.The same base material or different base materials can be used for the components. 3. Second embodiment A light-emitting device 200 according to a second embodiment of the present disclosure will be explained with reference to Fig. 6. The light-emitting device 200 differs from a light-emitting device 100 according to the first embodiment in that the second wavelength conversion component 220 covers the lateral surfaces 3 of the light-emitting element 1. The second wavelength conversion component 220 covers both the lateral surfaces of the first wavelength conversion component 10 and the lateral surfaces 3 of the light-emitting element 1. If the light-emitting element 1 has a plurality of lateral surfaces, for example, four lateral surfaces, the second wavelength conversion component 220 completely covers the lateral surfaces of the light-emitting element 1. The second wavelength conversion component 220 can completely cover the lateral surfaces 3 of the light-emitting element 1. Alternatively, it can cover the lateral surfaces 3 of the light-emitting element 1 in such a way that, for example, the lower regions of the lateral surfaces are exposed by the second wavelength conversion component 220.In this case, the areas of the lateral surfaces 3 that are exposed by the second wavelength conversion component 220 are covered by the second light-reflecting component 40. In a light-emitting device 200 with the above construction, a portion of the first light emitted from the lateral surfaces 3 of the light-emitting element 1 is converted into third light by the second wavelength conversion component 220. A portion of the first light incident on the second wavelength conversion component 220 and the third light, which has undergone wavelength conversion, is reflected by the first inclined surfaces 22 and / or the second inclined surfaces 23 to incident on the first wavelength conversion component 10 before exiting from the upper surface of the first wavelength conversion component 10. This enables the light-emitting device 200 to emit white light with a predetermined chromaticity. Furthermore, the light-emitting device 200 can convert the wavelength of a larger portion of the first light from the light-emitting element 1 into third light, and can thus increase the percentage of third light in the light emitted by the light-emitting device 200. 4. Third embodiment A light-emitting device 100B according to a third embodiment of the present disclosure will be explained with reference to Fig. 8. The light-emitting device 100B differs from a light-emitting device 100 according to the first embodiment in that the first wavelength conversion component 10B is designed differently. The first wavelength conversion component 10, described with reference to the embodiment described above, was a layered component in which the upper surface 11 and the lower surface 12 had the same shape and size, but the shape is not limited to this. As in the case of the light-emitting device 100B shown in Fig. 8, the first wavelength conversion component can have an upper surface 11B and a lower surface 12B with rectangular shapes of different sizes. In the case where the upper surface 11B and the lower surface 12B have different sizes, the lateral surfaces 13B of the first wavelength conversion component 10B include, for example, first lateral surfaces 14 that meet the upper surface 11B and second lateral surfaces 15 that meet the lower surface 12B. The first lateral surfaces 14 comprise a plurality of lateral surfaces. Specifically, the first lateral surfaces 14 comprise four surfaces, each connected to a side of the quadrilateral upper surface 11B. The four surfaces are, for example, flat surfaces orthogonal to the upper surface 11B. The second lateral surfaces 15 comprise a plurality of lateral surfaces. Specifically, the second lateral surfaces 15 comprise four third lateral surfaces 16, each connected to a side of the quadrilateral lower surface 12B, and four fourth lateral surfaces 17, each connected to a third lateral surface 16. The four third lateral surfaces 16 are, for example, flat surfaces that meet the lower surface 12B orthogonally. The four fourth lateral surfaces 17 each connect a third lateral surface 16 to a first lateral surface 14. The fourth lateral surfaces 17 are, for example, flat surfaces parallel to the upper surface 11B and the lower surface 12B. The first wavelength conversion component 10 with the above construction can reduce the light extraction surface area, thereby making the light-emitting device 100B a device with higher luminance. Furthermore, in the lateral surfaces 13B of the first wavelength conversion component 10B with the above configuration, the first lateral surfaces 14 and the second lateral surfaces 15 can be completely covered by the second wavelength conversion component 20. The upper regions of the first lateral surfaces 14, or regions of the first lateral surfaces 14 and the second lateral surfaces 15, can be exposed by the second wavelength conversion component 20. 5. Examples A light-emitting device according to the first embodiment was produced as an example. A GaN-based light-emitting semiconductor element was used as the light-emitting element, which emitted light with a peak emission wavelength of 450 nm. The first wavelength conversion component used was a layered sintered body containing a phosphor based on yttrium aluminum garnet. This first wavelength conversion component emitted secondary light with a peak emission wavelength in the range of 520 nm to 560 nm. For the second wavelength conversion component, a silicone resin was used containing titanium oxide as a light-reflecting substance and a BSESN phosphor as a phosphor. The titanium oxide content of the second wavelength conversion component was 60 parts by mass per 100 parts by mass of the silicone resin. The phosphor content of the second wavelength conversion component was 10 parts by mass per 100 parts by mass of the silicone resin. The second wavelength conversion component emitted third light with a peak emission wavelength in the range of 600 nm to 620 nm. For the first light-reflecting component, a silicone resin containing titanium oxide as a light-reflecting agent was used. The titanium oxide content of the first light-reflecting component was 60 parts by mass per 100 parts by mass of the silicone resin. For the second light-reflecting component, a silicone resin containing titanium oxide as a light-reflecting agent was used. The titanium oxide content of the second light-reflecting component was 60 parts by mass per 100 parts by mass of the silicone resin. As a light-emitting device in a comparative example 1, a light-emitting device similar to that in the example was manufactured, except that it did not contain a second wavelength conversion component. By using an optical measurement system combining a multichannel spectrometer and an integrating sphere, the x and y chromaticity coordinates of the light emitted by the light-emitting devices in Example 1 and Comparison Example 1 were obtained in the CIE 1931 color space. Fig. 9 is a chromaticity coordinate chart showing the chromaticity of the light emitted by the light-emitting device in Example 1 and the chromaticity of the light emitted by the light-emitting device in Comparison Example 1. In Fig. 9, plot P1 represents the total chromaticity of the light emitted by the light-emitting device in Example 1. In Fig. 9, plot P2 represents the chromaticity of the light emerging from the emission surface in Example 1.Figure 9 represents the chromaticity of the total light emitted by the light-emitting device in the comparison example. In Figure 9, the chromaticity of the light emitted from the emission surface in the comparison example is represented by the Q1 plot. As a result of comparing the chromaticity of the light emitted by the light-emitting device in the example and the chromaticity of the light emitted by the light-emitting device in the comparison example, based on the chart described above, it was found that the chromaticity of the light emitted by the light-emitting device in the example was closer to red than the light emitted by the light-emitting device in the comparison example. In other words, the light-emitting device in the example, which included a second wavelength conversion component, allowed for adjustment of the chromaticity of the light emitted by the light-emitting device. A light-emitting device according to any embodiment of the present disclosure can be used as a light-emitting device in a wide range of applications. For example, it can suitably be used as an automotive headlight. Certain embodiments of the present invention have been described above. However, changes can be made to the details of the elements described above, which allow for various modifications to the combinations or sequences of the elements without deviating from the scope of protection of the claims or the spirit of the invention.

Claims

Light-emitting device (100) comprising: a light-emitting element (1) configured to emit first light; a first wavelength conversion component (10) arranged on the light-emitting element (1) having a lower surface (12) connected to the light-emitting element (1), an upper surface (11) opposite the lower surface (12), and a lateral surface (13) adjoining the upper surface (11), wherein the first wavelength conversion component (10) is configured to emit second light when excited by the first light;a second wavelength conversion component (20) covering the lateral surface (13) of the first wavelength conversion component (10) without covering the upper surface (11) of the first wavelength conversion component (10), wherein the second wavelength conversion component (20) has an inclined surface (22) extending outwards from the lateral surface (13) of the first wavelength conversion component (10), wherein the second wavelength conversion component (20) is configured to emit third light when excited by the first light and / or the second light; and a first light-reflecting component (30) covering the inclined surface (22) and having an upper surface that is part of an upper surface of the light-emitting device (100), wherein the lower surface (12) of the first wavelength conversion component (10) completely covers an upper surface (2) of the light-emitting element (1). Light-emitting device (100) comprising: a light-emitting element (1) configured to emit first light; a first wavelength conversion component (10) arranged on the light-emitting element (1) having a lower surface (12) connected to the light-emitting element (1), an upper surface (11) opposite the lower surface (12), and a lateral surface (13) adjoining the upper surface (11), wherein the first wavelength conversion component (10) is configured to emit second light when excited by the first light;a second wavelength conversion component (20) covering the lateral surface (13) of the first wavelength conversion component (10) without covering the upper surface (11) of the first wavelength conversion component (10), wherein the second wavelength conversion component (20) has an inclined surface (22) extending outwards from the lateral surface (13) of the first wavelength conversion component (10), wherein the second wavelength conversion component (20) is configured to emit third light when excited by the first light and / or the second light; and a first light-reflecting component (30) covering the inclined surface (22); and a second light-reflecting component (40) arranged between a lateral surface (3) of the light-emitting element (1) and the second wavelength conversion component (20). Light-emitting device (100) according to claim 2, wherein: the second light-reflecting component (40) covers the lateral surface (3) of the light-emitting element (1). Light-emitting device (100) according to one of claims 1 to 3, wherein: the first wavelength conversion component (10) comprises a plurality of lateral surfaces (13), and the second wavelength conversion component (20) completely covers the lateral surfaces (13) of the first wavelength conversion component (10). Light-emitting device (100) according to one of claims 1 to 4, wherein: the upper surface (11) of the first wavelength conversion component (10) is an emission surface of the light-emitting device (100). Light-emitting device (100) according to one of claims 1 to 5, wherein: the upper region of the lateral surface (13) of the first wavelength conversion component (10) is exposed by the second wavelength conversion component (20), and the first light-reflecting component (30) covers the region of the lateral surface (13) of the first wavelength conversion component (10) that is exposed by the second wavelength conversion component (20). Light-emitting device (100) according to one of claims 1 to 6, wherein: the lateral surface (13) of the first wavelength conversion component (10) has a first lateral surface that meets the upper surface and a second lateral surface that meets the lower surface, and the second wavelength conversion component (20) completely covers the first lateral surface and the second lateral surface of the first wavelength conversion component (10). Light-emitting device (100) according to one of claims 1 to 7, wherein: the second light has a longer peak wavelength than the peak wavelength of the first light, and the third light has a longer peak wavelength than the peak wavelength of the second light. Light-emitting device (100) according to one of claims 1 to 8, wherein: the first light is blue light, the second light is yellow light, and the third light is red light. Light-emitting device (100) according to one of claims 1 to 9, wherein: the first wavelength conversion component (10) contains a phosphor which emits second light when excited by the first light. Light-emitting device (100) according to one of claims 1 to 10, wherein: the second wavelength conversion component (20) comprises a resin containing a light-reflecting substance and a phosphor. Light-emitting device (100) according to claim 11, wherein: the second wavelength conversion component (20) comprises a silicone resin containing titanium oxide and a BSESN phosphor. Light-emitting device (100) according to one of claims 1 to 12, wherein: the first light-reflecting component (30) comprises a resin containing a light-reflecting substance. Light-emitting device (100) according to one of claims 1 to 13, wherein: the light-emitting element (1) comprises a semiconductor layer based on gallium nitride, the first wavelength conversion component (10) contains a phosphor based on yttrium aluminum garnet, and the second wavelength conversion component (20) contains a BSESN phosphor. Light-emitting device (100) according to one of claims 1 to 14, wherein: the light-emitting element (1) comprises positive and negative electrodes (6), a wiring substrate electrically connected to the electrodes (6), and a frame component arranged on the wiring substrate and covering at least one area of ​​a lateral surface of the first light-reflecting component (30).

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