Soldering nozzle changing system, soldering system and method for changing soldering nozzles

Abstract

Soldering nozzle changing system (10) for changing soldering nozzles (12) on a soldering system (14), the soldering nozzle changing system (10) comprising: - a nozzle magazine (20) with magazine locations (62) for providing soldering nozzles (12), - a nozzle gripper (22) with a gripping receptacle (68) extending along a nozzle axis (67) for gripping a soldering nozzle (12), - a pivoting drive (24) for pivoting the nozzle gripper (22) about a pivot axis (26) between a receiving position for receiving the soldering nozzle (12) from the nozzle magazine (20) and a transfer position for transferring the soldering nozzle (12) to a soldering pot (16) of the soldering system (14), - a linear drive (28) for displacing the nozzle gripper (22) along a linear axis (30) between a receiving position assigned to the nozzle magazine (20) and a transfer position assigned to the soldering pot (16), and - a magazine drive (32) for rotating the nozzle magazine (20) about a magazine axis (34) so that at least one of the magazine locations (62) can be rotated into a storage location.

Description

[0001] The invention relates to a soldering nozzle changing system for a soldering system, a soldering system and a method for changing a soldering nozzle.

[0002] In the field of contacting electronic components, which are mounted, for example, using through-hole technology (THT) from the top side of a circuit board through a hole in the board, it is common practice to contact the components from the underside of the board. For contacting individual pins or rows of pins by soldering, so-called selective wave soldering has become popular. In this process, a standing wave of liquid solder is positioned precisely beneath a component or pin to be contacted.

[0003] Depending on the component to be soldered, it may be necessary to use solder nozzles with different nozzle openings. These nozzle openings can have different diameters and / or different contours. Furthermore, the solder nozzles are subject to wear during operation, particularly due to unwanted oxidation layers forming on the surface of the solder nozzle, which can lead to unwanted deformation of the solder wave.

[0004] According to the state of the art, it is known to replace worn soldering nozzles manually using the appropriate tools. Due to the liquid solder in the solder pot, such a replacement requires special protective measures and is time-consuming.

[0005] US 2022 / 0016724 A1 discloses a soldering system with a solder pot and a solder nozzle changing device in which several solder nozzles can be stored. When changing the nozzles, a robot moves the solder pot and solder nozzle to the changing device, where the nozzle can be replaced.

[0006] DE 10 2016 121 160 A1 discloses a soldering system with a handling device that enables the placement of the soldering nozzle on the soldering pot and its removal from the soldering pot, thus enabling automated nozzle replacement. DE 10 2020 124 111 A1 discloses an automated soldering nozzle replacement system, wherein a soldering pot is movable together with a nozzle magazine. A gripper can remove the nozzles from the nozzle magazine by moving in the z-direction. The soldering pot is then positioned below the gripper, and the gripper can place the new nozzle on the soldering pot by moving counter to the z-direction. The object of the present invention is to provide a compact soldering nozzle changing system that increases the efficiency of a soldering system while still ensuring reliable operation.

[0007] This object is achieved by a soldering nozzle changing system for changing soldering nozzles on a soldering system, in particular on a selective soldering system, with the features of claim 1. The soldering nozzle changing system comprises a nozzle magazine with magazine locations for providing soldering nozzles, in particular identical or different ones, and a nozzle gripper with a gripping receptacle extending along a nozzle axis for gripping a soldering nozzle. The soldering nozzle can preferably be inserted into the gripping receptacle along the nozzle axis. In the gripped state, the soldering nozzle preferably extends along the nozzle axis.

[0008] The soldering nozzle changing system also has a pivot drive, a linear drive, and a magazine drive. The pivot drive is used to pivot the nozzle gripper about a pivot axis, whereby the nozzle gripper can be pivoted between a receiving position, in which the gripping receptacle is directed towards the nozzle magazine and the nozzle gripper can remove a soldering nozzle from the nozzle magazine, and a transfer position, in which the gripping receptacle is directed, for example, towards a soldering pot of the soldering system and the nozzle gripper can transfer the soldering nozzle to the soldering pot. In the transfer position, the nozzle gripper can also remove a soldering nozzle from the soldering pot. The nozzle gripper is preferably pivoted by 180° by means of the pivot unit in order to pivot the nozzle gripper from the receiving position to the transfer position and vice versa.

[0009] The linear drive is used to move the nozzle gripper along a linear axis, whereby the nozzle gripper can be moved between a receiving position and a transfer position. In the receiving position, the nozzle gripper is arranged on the nozzle magazine so that a soldering nozzle can be inserted into the gripper receptacle. When moving from the receiving position to the transfer position, the nozzle gripper moves away from the nozzle magazine. In the transfer position, and in particular only in the transfer position, the nozzle gripper can be pivoted about the pivot axis. As soon as the nozzle gripper has been pivoted into the transfer position and moved into the transfer position, the gripped soldering nozzle can be picked up by the solder pot.

[0010] The magazine drive rotates the nozzle magazine around a magazine axis, allowing at least one of the magazine positions to rotate in a staging area. It is conceivable that the remaining magazine positions not located in the staging area can be loaded manually or automatically in a loading position.

[0011] The separate design of the drives allows for a particularly simple and compact solder nozzle changing system, which is also efficient due to the simultaneous control of the drives. Furthermore, the rotation of the nozzle magazine ensures that the solder nozzles are safely and reliably delivered to a single location, thus enabling short transport routes to the nozzle gripper and the solder pot. Furthermore, the separate design of the solder pot and the solder nozzle changing system provides greater flexibility.

[0012] It is advantageous if the swivel drive and the magazine drive are designed so that the swivel axis and the magazine axis run parallel to each other. This has the advantage that the nozzle gripper can easily and robustly remove the soldering nozzles from the nozzle magazine.

[0013] It is also advantageous if the swivel drive and / or the magazine drive are designed such that the swivel axis and / or the magazine axis run horizontally. This also has the advantage that the nozzle gripper can transfer the soldering nozzle easily and robustly, for example, to the soldering pot.

[0014] For the purposes of this invention, the term "horizontal" is to be understood as perpendicular to the direction of gravity. For the purposes of this invention, the term "vertical" is to be understood as parallel to the direction of gravity. Gravitational force is of key importance for selective wave soldering, as it significantly influences the formation of the solder wave after it emerges from the solder nozzle.

[0015] It is also advantageous if the linear drive and the swivel drive are designed such that the linear axis runs perpendicular to the swivel axis. It is also advantageous if the linear drive and the magazine drive are designed such that the linear axis runs perpendicular to the magazine axis. This allows the nozzle gripper to move to the nozzle magazine with a simple stroke. Furthermore, pivoting from the pick-up position to the transfer position is sufficient to position the soldering nozzle in the appropriate orientation for picking up by the solder pot.

[0016] Preferably, the nozzle magazine is cylindrical and / or disc-shaped. Consequently, the nozzle magazine is simple and compact.

[0017] An advantageous development provides that the nozzle magazine has a magazine front facing the linear drive and extending perpendicular to the pivot axis, a magazine rear facing away from the linear drive and extending perpendicular to the pivot axis, and a circumferential magazine shell surface arranged between the magazine front and rear and extending parallel to the pivot axis. The magazine locations are arranged on the magazine shell surface. Consequently, despite the flat design, a large number of soldering nozzles can be accommodated in the nozzle magazine. The magazine locations are located in a system plane which preferably runs perpendicular to the pivot axis and / or to the magazine axis and / or, in particular centrally, between the magazine front and rear. The soldering nozzles provided in the magazine locations preferably extend perpendicular to the magazine axis and / or intersect the system plane.The system plane is preferably spanned by the symmetry axes of the magazine locations and / or by the soldering nozzles provided at the magazine locations.

[0018] A centering holder, particularly a cup-shaped one, is provided in the magazine surface at each magazine location for centering the soldering nozzle and / or a magnet, particularly arranged in the centering holder, for holding the soldering nozzle. This allows the soldering nozzles to be easily and precisely positioned at the magazine locations and removed from the magazine locations by the nozzle gripper.

[0019] A further advantageous development provides that the nozzle gripper is arranged such that the nozzle axis, in particular the gripper receptacle, preferably the symmetry axis of the gripper receptacle, i.e., the nozzle axis, is arranged in the system plane both in the pick-up position and in the transfer position. This results in an even easier transfer of the soldering nozzles between the nozzle magazine and the nozzle gripper.

[0020] The soldering nozzle changing system preferably comprises a carrier, with the nozzle magazine and / or the linear drive being arranged on the carrier. It is conceivable for the nozzle magazine to be rotatably mounted in the carrier. It is also conceivable for the linear drive to be movably mounted on the carrier along the linear axis. This ensures that the nozzle magazine and the nozzle gripper are positioned precisely relative to each other with respect to the system plane.

[0021] The carrier is preferably displaceable along a first mounting axis on a system housing of the soldering system. Preferably, the solder nozzle changing system and / or the carrier is telescopic in design and thus displaceable along a second mounting axis. The first mounting axis and the second mounting axis preferably run perpendicular to one another. The second mounting axis preferably runs parallel to the pivot axis and the magazine axis. By displacing the carrier along the first mounting axis and / or the second mounting axis, the solder nozzle changing system and the solder pot can be spatially separated from one another in order to provide the operator with space for servicing and maintaining the solder nozzle changing system and / or the solder pot. The solder nozzle changing system and / or the carrier are displaceable along the first mounting axis and / or the second mounting axis between a working position and a maintenance position.In the working position, the soldering pot can be equipped with the soldering nozzle changing system. In the maintenance position, the soldering nozzle changing system and / or the soldering pot can be serviced and / or maintained or repaired. At least one locking pin can be provided to fix the soldering nozzle changing system and / or the carrier along the first mounting axis and / or the second mounting axis. The soldering nozzle changing system and / or the carrier can preferably be moved manually and / or automatically between the working position and the maintenance position. Furthermore, adjusting screws, in particular in the form of threaded rods, can be provided on the system housing and / or on the soldering nozzle changing system and / or on the carrier in order to adjust the soldering nozzle changing system and / or the carrier along the linear axis and / or the first mounting axis and / or the second mounting axis, in particular to adjust the end positions.This ensures that the soldering nozzle changing system, especially the soldering nozzle, is precisely aligned with the solder pot. Furthermore, adjustment screws on the nozzle magazine and / or nozzle gripper are also conceivable for finely adjusting the end positions along the linear axis and / or around the swivel axis and / or around the magazine axis.

[0022] It is advantageous if the nozzle gripper has gripping jaws that can be moved between an inner position and an outer position. The gripping jaws can be moved preferably perpendicular to the linear axis in the receiving position and / or transfer position. It is advantageous if the nozzle gripper is designed as an inner gripper for gripping the soldering nozzle. Consequently, the soldering nozzle can be secured by moving the gripping jaws to the inner position and released by moving them to the outer position.

[0023] It is further advantageous if the gripping jaws each have a first gripping surface for gripping the soldering nozzle in the inner position and a second gripping surface for gripping a gassing cap arranged on the soldering pot in the outer position. It is further advantageous if the nozzle gripper for gripping the gassing cap is designed as an outer gripper. Accordingly, both the soldering nozzle and the gassing cap can be gripped and handled with a single gripping jaw. The first gripping surface can preferably be prismatic. Furthermore, the second gripping surface can preferably be formed by a shoulder on the gripping jaw.

[0024] A further advantageous development provides that the nozzle gripper has a gripper top side facing the nozzle magazine in the receiving position and a gripper bottom side facing the solder pot in the receiving position and opposite the gripper top side. The nozzle gripper has a locking hook on the gripper bottom side and / or the extension arm for locking the nozzle gripper in the receiving position and / or in the transfer position and / or for directing forces during the receiving and / or transfer of a soldering nozzle. This ensures that the nozzle gripper, in particular the gripper receptacle, is arranged vertically. In addition, the forces acting on the nozzle gripper in the event of a collision can be diverted.

[0025] Furthermore, it is advantageous if a locking lug is provided which faces the nozzle gripper and extends parallel to the linear axis, wherein in the transfer position the locking hook of the nozzle gripper interacts with the locking lug. The locking lug can be arranged fixedly on the nozzle magazine or fixedly on the carrier. It is advantageous if the locking hook has a fork-shaped section at its free end. It is further advantageous if the locking lug has a shaft with a groove and a collar at its free end. In the locked state, the fork-shaped section engages in the groove above the collar of the locking lug. Preferably, the nozzle gripper can only be rotated in a semicircle so that the locking hook can engage in and out of the locking lug. It is conceivable to provide a position measuring system for checking the relative position between the locking hook and the locking lug.The position measuring system is preferably configured to detect the position of the nozzle gripper along the linear axis.

[0026] Alternatively or in addition to the locking hook and / or the locking lug, a sensor system can be provided to detect the position of the nozzle gripper when transferring the soldering nozzle to the solder pot. The sensor system preferably has a sensor, in particular an induction sensor, which interacts with the nozzle gripper, in particular with the underside of the gripper. Should the position of the nozzle gripper deviate in the transfer position, e.g. because the solder pot strikes the nozzle gripper or the solder nozzle and thus slightly displaces the nozzle gripper, the movement of the solder pot is stopped and, if necessary, the solder pot is moved away from the nozzle gripper. In the event of such a collision, the operator can also be notified by the control unit. The sensor system, in particular the sensor, can be arranged on the nozzle magazine or on the carrier.At least one adjusting screw can be provided to adjust the sensor system, in particular the sensor, parallel to the linear axis so that the sensor can reliably detect the position of the nozzle gripper.

[0027] A further advantageous development provides that the soldering nozzle changing system further comprises a control unit for controlling the pivot drive and / or the linear drive and / or the magazine drive. The control unit preferably controls the pivot drive and / or the linear drive such that a provided soldering nozzle can be gripped by the nozzle gripper, moved, and placed in the solder pot. The control unit preferably also controls the magazine drive such that a soldering nozzle provided in a magazine location can be rotated into the provision location. Consequently, the drives can be controlled simultaneously by the control unit, ensuring efficient nozzle changing.

[0028] A further advantageous development of the invention provides that the soldering nozzle changing system has a sensor device for detecting states and nozzle types. The sensor device can be configured to determine whether a soldering nozzle is arranged at the supply and / or magazine location and / or on the nozzle gripper and / or on the soldering pot. The sensor device can additionally or alternatively be configured to detect the nozzle type, the nozzle size and / or the position of the soldering nozzle at the supply and / or magazine location and / or on the nozzle gripper and / or on the soldering pot. The sensor device can additionally or alternatively be configured to determine whether a soldering nozzle on the nozzle magazine and / or on the nozzle gripper and / or on the soldering pot has already been used and / or is worn out. In this way, for example, the quality of the soldering process and / or the wear of the soldering nozzles can be monitored and, if necessary, made available to the control unit.The sensor device is preferably designed as a camera, in particular with image recognition, which detects the nozzle magazine, in particular the magazine locations and / or the provision location, and / or the nozzle gripper and / or the soldering pot, in particular a soldering nozzle provided or mounted on the soldering pot. The sensor device is preferably additionally or alternatively designed as an RFID system, wherein RFID tags, in particular with information on the nozzle type, are arranged on the soldering nozzles, and an RFID reader for reading the RFID tags is arranged on the soldering nozzle changing system. The sensor device is preferably additionally or alternatively designed as a code system, wherein a barcode and / or QR code, in particular with information on the nozzle type, is arranged on each soldering nozzle, and a code reader for reading the codes is arranged on the soldering nozzle changing system.To detect whether a soldering device is located at a magazine location and / or on the nozzle gripper and / or on the solder pot, the sensor device can be designed as a tactile sensor and / or infrared sensor and / or magnetic field sensor. It is advantageous if such a sensor is arranged on the centering holder and / or magnet of each magazine location.

[0029] The information from the sensor device is preferably sent to the control unit, and / or the magazine drive and / or the linear drive and / or the swivel drive and / or the solder pot drive are controlled by the control unit based on this information. It is conceivable that, depending on the magazine location where the soldering nozzle suitable for the next soldering process is located, the magazine drive is controlled in such a way that this magazine location is rotated to the provision location.

[0030] The linear drive is preferably guided on the carrier in a displaceable manner. The pivot drive is preferably arranged on the linear drive, in particular directly. Consequently, the pivot drive can be displaced along the linear axis by means of the linear drive. The pivot drive preferably has a boom, with the nozzle gripper being arranged on the boom. This represents an embodiment for arranging the nozzle gripper vertically below the nozzle magazine. The nozzle gripper is preferably arranged in a pendulum manner on the boom. Consequently, the nozzle gripper can be pivoted by means of the pivot drive, with the nozzle gripper further compensating for tolerances when picking up soldering nozzles from the nozzle magazine and when transferring the soldering nozzle to the solder pot. In addition, the nozzle gripper can be displaced along the linear axis by means of the linear drive.

[0031] The nozzle gripper is preferably arranged on the swivel drive, in particular on the boom, by means of a compensation unit. The compensation unit preferably has a self-aligning bearing and a bearing shaft arranged in the self-aligning bearing in order to compensate for an axial offset and / or a radial offset and / or an angular offset of the nozzle gripper, in particular of the soldering nozzle, relative to the soldering pot, in particular the pot holder. In this way, inaccuracies along the x-axis and / or the y-axis of 1-2 mm and angular errors of up to 5° can preferably be compensated. The nozzle gripper is preferably movably mounted on the boom by means of the self-aligning bearing. The bearing shaft is preferably connected to the nozzle gripper in a movement-proof manner. First elastomer springs are provided to center the self-aligning bearing and / or the nozzle gripper on the swivel drive, in particular on the boom. The first elastomer springs are arranged along a first circular ring around the self-aligning bearing.The first elastomer springs push the self-aligning bearing into a zero position. If there is an offset between the nozzle gripper and the solder pot, a force acts on the self-aligning bearing, which is displaced from the zero position against the force of the first elastomer springs. As soon as the offset no longer exists, the first elastomer springs push the nozzle gripper back to the zero position. By means of the first elastomer springs, in particular, a radial offset and the resetting of the self-aligning bearing can be realized. Furthermore, second elastomer springs are provided between the pivot drive, in particular the boom, and the nozzle gripper. The second elastomer springs are arranged along a second circular ring around the bearing shaft. By means of the second elastomer springs, in particular, a radial offset and an angular offset between the pivot drive, in particular the boom, and the nozzle gripper can be compensated.The first elastomer springs and / or the second elastomer springs may be designed as Sylomer elastomer springs.

[0032] The object underlying the invention is also achieved by a soldering system, in particular a selective soldering system, for soldering components using at least one soldering nozzle, having the features of claim 16. The soldering system has a soldering nozzle changing system as described above. Furthermore, the soldering system has a soldering pot with a pot holder for receiving a soldering nozzle and, in particular, a gassing cap. Furthermore, it is advantageous if the soldering system and / or the soldering nozzle changing system also has a soldering nozzle. Consequently, a soldering system with a compact, efficient, and simple soldering nozzle change is provided.

[0033] To transfer the soldering nozzle to the soldering pot, the soldering pot is preferably designed to be movable along a z-axis running parallel to the linear axis and / or along an xy-plane running perpendicular to the linear axis. Consequently, the soldering nozzle changing system, in particular the nozzle gripper, can provide a soldering nozzle in the transfer position, and the soldering pot moves toward the nozzle gripper and picks up the soldering nozzle. The pot holder preferably has a pot magnet for holding the soldering nozzle. Once the soldering nozzle is held by the pot magnet, the nozzle gripper can be moved to the outer position, thus releasing the soldering nozzle.

[0034] It is advantageous if the support of the soldering nozzle changing system is mounted on a housing of the soldering system. This ensures that the solder pot and the nozzle gripper can be precisely positioned relative to each other, ensuring safe transfer of the soldering nozzle and / or the gassing cap.

[0035] The carrier can be mounted on the system housing so that it can be moved along a first mounting axis. The soldering nozzle changing system can thus be moved manually or automatically above the soldering pot from a working position to a maintenance position using the carrier. The soldering nozzle changing system and / or the carrier is preferably telescopic and can therefore be moved along a second mounting axis. The first mounting axis and the second mounting axis preferably run perpendicular to one another. The first mounting axis preferably runs parallel to the pivot axis. The second mounting axis preferably runs parallel to the magazine axis. By moving the carrier along the first mounting axis and / or the second mounting axis, the soldering nozzle changing system and the soldering pot can be spatially separated from one another in order to provide the operator with space to maintain the soldering nozzle changing system and / or the soldering pot.The soldering nozzle changing system and / or the carrier can be moved along the first assembly axis and / or the second assembly axis between a working position and a maintenance position. In the working position, the soldering pot can be equipped with the soldering nozzle changing system. In the maintenance position, the soldering nozzle changing system and / or the soldering pot can be serviced or repaired. At least one locking pin can be provided to fix the soldering nozzle changing system and / or the carrier along the first assembly axis and / or the second assembly axis. The soldering nozzle changing system and / or the carrier can preferably be moved manually and / or automatically between the working position and the maintenance position.Furthermore, adjusting screws, particularly in the form of threaded rods, can be provided on the system housing and / or on the soldering nozzle changing system and / or on the support to adjust the soldering nozzle changing system and / or the support along the linear axis and / or the first mounting axis and / or the second mounting axis. This ensures that the soldering nozzle changing system, particularly the soldering nozzle, is precisely aligned with the solder pot.

[0036] The object underlying the invention is also achieved by a method for changing a soldering nozzle on a soldering system, in particular a selective soldering system, preferably a previously described soldering system, with the features of claim 19. The method comprises the following steps: a) Providing a soldering nozzle at a magazine location of a nozzle magazine; b) rotating the nozzle magazine so that the soldering nozzle provided at the magazine location is arranged at a staging location; c) moving a nozzle gripper to the staging area; d) Gripping the provided soldering nozzle using the nozzle gripper; e) Moving the nozzle gripper relative to the nozzle magazine along a linear axis from a receiving position to a transfer position; f) pivoting the nozzle gripper about a pivot axis from a receiving position to a transfer position; g) moving the solder pot to the solder nozzle; and h) Transfer the soldering nozzle to the soldering pot.

[0037] Such a procedure ensures that the soldering nozzle can be changed quickly, safely, repeatably and precisely.

[0038] Furthermore, it is advantageous if, for transferring the soldering nozzle to the soldering pot according to step h), the soldering pot first picks up the soldering nozzle, and then the gripping jaws of the nozzle gripper are moved from an inner position to an outer position to release the soldering nozzle. This ensures that the soldering nozzle is only released by the nozzle gripper when the soldering pot securely holds the soldering nozzle.

[0039] It is also advantageous if, in order to transfer the soldering nozzle to the soldering pot according to step h), a soldering wave is first provided on the soldering pot and then the soldering nozzle is heated by means of the soldering wave, in particular by contacting the soldering wave through the soldering nozzle. The heating preferably lasts between 5 and 30 seconds. As a result, the soldering nozzle expands and can in particular only then be mounted in a pot receptacle, in particular on a receiving cone of the pot receptacle. Preliminary heating of the soldering nozzle from room temperature to working temperature may be necessary in order to maintain the tight assembly tolerances on the pot receptacle, in particular on the receiving cone. Preferably, the soldering nozzle is only released by the nozzle gripper once the heated soldering nozzle has been pushed onto the receiving cone. Preferably, after the soldering nozzle has been heated by means of the soldering wave, the soldering wave is first removed in order to mount the soldering nozzle on the soldering pot.As soon as the soldering nozzle is mounted on the solder pot, the soldering wave is rebuilt.

[0040] It is also advantageous to remove the gassing cap from the soldering pot using the nozzle gripper to change the soldering nozzle and / or clean the soldering pot. To do this, the nozzle gripper moves to the transfer position. Furthermore, the gripper jaws of the nozzle gripper are moved to the inner position. The soldering pot then moves to the nozzle gripper, so that the gripper jaws are moved to the outer position for gripping the gassing cap. The gassing cap can now be removed from the soldering pot using the nozzle gripper.

[0041] It is further advantageous if the sensor device, in particular the camera, is configured such that after the soldering nozzle has been placed in the soldering pot, the sensor device, in particular the camera, checks which soldering nozzle is being used and / or whether the soldering nozzle is correctly mounted.

[0042] Further details and advantageous embodiments of the invention can be found in the following description, on the basis of which embodiments of the invention are further described and explained.

[0043] They show: Fig. 1 a perspective view of a soldering nozzle changing system according to the invention; Fig. 2 a side view of the soldering nozzle changing system according to Fig. 1; Fig. 3 a perspective view of a nozzle magazine; Fig. 4 a sectional view of the nozzle magazine according to Fig. 3; Fig. 5 a detailed view of the nozzle magazine according to Fig. 3; Fig. 6 a perspective view of the nozzle gripper in the receiving position and transfer position; Fig. 7 a perspective view of the nozzle gripper in the receiving position and receiving position; Fig. 8 a perspective view of the nozzle gripper with a gripped soldering nozzle in the receiving position and transfer position; Fig. 9 a perspective view of the nozzle gripper with a gripped soldering nozzle in the transfer position and transfer position; Fig. 10 another side view of the nozzle gripper according to Fig. 9 with a gripped soldering nozzle in the transfer position and transfer position; Fig. 11 a perspective view of the nozzle gripper during the transfer of a soldering nozzle to the solder pot; Fig. 12 a sectional view of the nozzle gripper during the transfer of a soldering nozzle to the solder pot according to Fig. 11; Fig. 13 a perspective view of the nozzle gripper with a locking hook; Fig. 14 a perspective view of the nozzle gripper according to Fig. 13, wherein the locking hook is fixed in a locking lug; Fig. 15 a detailed view of the sectional view of the nozzle gripper according to Fig. 12; Fig. 16 a sectional view of the crucible holder with a soldering nozzle; Fig. 17 a perspective view of the nozzle gripper when gripping a gassing cap from the outside; Fig. 18 a perspective view of a gripping jaw of the nozzle gripper; Fig. 19 a perspective view of a soldering nozzle changing system according to the invention in a soldering system according to the invention; Fig. 20 a further perspective view of the soldering nozzle changing system according to the invention in the soldering system according to the invention according to Fig. 19; Fig. 21 a perspective view of the compensation unit between the swivel drive and the nozzle gripper; and Fig. 22 a sectional view of the compensation unit according to Fig. 21.

[0044] In the Fig. 1 and Fig. 2 is a soldering nozzle changing system 10 according to the invention for changing soldering nozzles 12 on a soldering system 14 according to the invention, in particular in the form of a selective soldering system, as in the Fig. 19 and Fig. 20. The soldering system 14 is connected to the soldering pot 16 and the system housing 18 by Fig. 1, Fig. 2, Fig. 19 and Fig. 20 indicated.

[0045] The soldering nozzle changing system 10 has Fig. 2 a nozzle magazine 20 for providing the soldering nozzles 12, a nozzle gripper 22 for gripping the soldering nozzles 12, a pivot drive 24 for pivoting the nozzle gripper 22 about a pivot axis 26, a linear drive 28 for linearly displacing the nozzle gripper 22 along a linear axis 30 and a magazine drive 32 for rotating the nozzle magazine 20 about a magazine axis 34.

[0046] The pivot axis 26 and the magazine axis 34 are preferably aligned parallel to each other and / or horizontally. The linear axis 30 is preferably aligned perpendicular to the pivot axis 26 and / or the magazine axis 34 and / or vertically.

[0047] The soldering nozzle changing system 10 has Fig. 1 and Fig. 2 further comprises a carrier 36. The carrier 36 is according to Fig. 19 and Fig. 20 is mounted displaceably along a first mounting axis 202 by means of a support guide 200 provided on the system housing 18. In the Fig. 19 and Fig. 20, the carrier 36 and thus the soldering nozzle changing system 10 are arranged in a working position. In the working position, the soldering nozzle changing system 10 can change soldering nozzles 12 on the soldering pot 16. The soldering nozzle changing system 10 can be moved along the first mounting axis 202 from the working position to a maintenance position, so that maintenance and / or repairs on the soldering nozzle changing system 10 and / or the soldering pot 16 can be easily performed. The soldering nozzle changing system 10 can be moved manually or automatically along the first mounting axis 202 between the working position and the maintenance position. At least one first locking pin 204 is provided to secure the soldering nozzle changing system 10 in the working position.

[0048] The carrier guide 200 further comprises Fig. 20 preferably has at least one end stop 205, in particular two end stops 205 opposite one another along the first mounting axis 202, for limiting the freedom of movement of the carrier 36 along the first mounting axis 202. The at least one end stop 205 is designed to be finely adjustable.

[0049] Alternatively, the support 36 can be connected to the system housing 18 in a movement-proof manner, in particular screwed or welded.

[0050] The carrier 36 has according to Fig. 1, Fig. 2, Fig. 19 and Fig. 20 further comprises a support tube 206 and a support shaft 208, wherein the support shaft 208 can be arranged telescopically in the support tube 206. By means of the telescopic guide of the support 36, the soldering nozzle changing system 10 can also be displaced along a second mounting axis 210 between the working position and the maintenance position, so that maintenance on the soldering nozzle changing system 10 and / or on the soldering pot 16 can be easily performed. The soldering nozzle changing system 10 can be displaced manually or automatically along the second mounting axis 210 between the working position and the maintenance position. At least one second locking pin 212 is provided to secure the soldering nozzle changing system 10 in the working position.Furthermore, adjusting screws 214 can be provided on the system housing 18 and / or on the soldering nozzle changing system 10 and / or on the carrier 36 in order to adjust the soldering nozzle changing system 10 and / or the carrier 36 along the linear axis 30 and / or the first mounting axis 202 and / or the second mounting axis 210. This ensures that the soldering nozzle changing system 10, in particular the soldering nozzle 12, is precisely aligned with the solder pot 16. The first mounting axis 202 preferably runs parallel to the x-axis X and / or the second mounting axis 210 preferably runs parallel to the y-axis Y.

[0051] The nozzle magazine 20 is rotatably mounted on the support 36, and / or the linear drive 28 or the nozzle gripper 22 is linearly guided. The swivel drive 24 is arranged on the linear drive 28, with the swivel drive 24 having a boom 38 that supports the nozzle gripper 22. Thus, the nozzle gripper 22 can also be displaced by a linear displacement of the swivel drive 24.

[0052] The carrier 36 has a first carrier section 40, on which the nozzle magazine 20 and the magazine drive 32 are arranged. The nozzle magazine 20 is arranged on a magazine shaft 42 of the magazine drive 32, with the magazine shaft 42 extending through the first carrier section 40.

[0053] Furthermore, the carrier 36 has a second carrier section 44 spaced apart from the first carrier section 40, which are connected to one another by means of carrier rods 46. The carrier rods 46 can be formed, at least in sections, by the carrier shaft 208. The first carrier section 40 and the second carrier section 44 frame the nozzle magazine 20 along the magazine axis 34. The first carrier section 40 and / or the second carrier section 44 preferably run parallel to the linear axis 30 and / or vertically.

[0054] The linear drive 28 is arranged on the second support section 44. The linear drive 28 has a linear guide 48, a linear cylinder 50 guided in the linear guide 48, and a linear slide 52 arranged on the linear cylinder 50. The linear guide 48 is preferably arranged in a motion-rigid manner on the support 36, in particular on the second support section 44. The pivot drive 24 is arranged on the linear slide 52. The linear slide 52 is preferably cantilevered in sections so that the nozzle gripper 22 is arranged below the nozzle magazine 20. The pivot drive 24 has a pivot shaft 54, which is connected in a rotationally fixed manner to the boom 38. The nozzle gripper 22 is according to Fig. 21 and Fig. 22 is preferably arranged by means of a compensation unit 400 on the swivel drive 24, in particular on the boom 38, in order to be able to compensate for tolerances on the nozzle magazine 20 or on the solder pot 16.

[0055] The compensation unit 400 has according to Fig. 21 and Fig. 22 preferably has a self-aligning bearing 402 and a bearing shaft 404 arranged in the self-aligning bearing 402 in order to compensate for an axial offset and / or a radial offset and / or an angular offset of the nozzle gripper 22, in particular of the soldering nozzle 12, relative to the soldering pot 16, in particular of the pot holder 74. The nozzle gripper 22 is movably mounted on the boom 38 by means of the self-aligning bearing 402. The bearing shaft 404 is connected to the nozzle gripper 22 in a movement-proof manner. First elastomer springs 406 are provided for centering the self-aligning bearing 402 and / or the nozzle gripper 22 on the pivot drive 24, in particular on the boom 38. The first elastomer springs 406 are arranged along a first circular ring around the self-aligning bearing 402. The first elastomer springs 406 push the self-aligning bearing 402 into a zero position.Should there be an offset between the nozzle gripper 22 and the solder pot 16, a force acts on the self-aligning bearing 402, which is displaced from the zero position against the force of the first elastomer springs 406. As soon as the offset no longer exists, the first elastomer springs 406 push the nozzle gripper 22 back to the zero position. By means of the first elastomer springs 406, in particular, a radial offset and the resetting of the self-aligning bearing 402 can be realized. Furthermore, second elastomer springs 408 are provided between the pivot drive 24, in particular the boom 38, and the nozzle gripper 22. The second elastomer springs 408 are arranged along a second circular ring around the bearing shaft 404. By means of the second elastomer springs 408, in particular a radial offset and an angular offset between the swivel drive 24, in particular the boom 38, and the nozzle gripper 22 can be compensated.The first elastomer springs 406 and / or the second elastomer springs 408 may be formed as Sylomer elastomer springs.

[0056] After the Fig. 1 to 5, the nozzle magazine 20 has a magazine front side 56 facing the first support section 40 and a magazine rear side 58 facing the second support section 44, as well as a magazine casing surface 60 extending parallel to the pivot axis 26 and arranged between the magazine front side 56 and the magazine rear side 58. 16 magazine locations 62 are provided in the magazine casing side 60. Each magazine location 62 has, according to Fig. 4 and Fig. 5, a cup-shaped centering holder 64 for receiving and centering the soldering nozzle 12 and a magnet 66 arranged in the centering holder 64 for holding the soldering nozzle 12. Accordingly, the soldering nozzles 12 can be easily and precisely positioned at the magazine locations 62 and removed from the magazine locations 62 by the nozzle gripper 22. The centering holder 64 can preferably be screwed to the nozzle magazine 20. The magnet 66 is preferably designed as a circular ring.

[0057] In the Fig. 6 to 8 disclose how a soldering nozzle 12 can be removed from the nozzle magazine 20 by means of the nozzle gripper 22. In the initial position, the nozzle gripper 22 is located according to Fig. 6 in a lower transfer position and a receiving position. In the transfer position, the nozzle gripper 22 is extended to its maximum stroke by means of the linear drive 28 and is at the greatest distance from the nozzle magazine 20. In the receiving position, the nozzle gripper 22 is pivoted such that a gripping receptacle 68 of the nozzle gripper 22, which extends along a nozzle axis 67, is directed toward the nozzle magazine 20, i.e., upwards, for gripping the soldering nozzle 12. In addition, a soldering nozzle 12 provided at a magazine location 62 is arranged at a supply location 70 directed toward the nozzle gripper 22, i.e., downwards. This soldering nozzle 12 is subsequently gripped by the nozzle gripper 22. When the nozzle gripper 22 grips the soldering nozzle 12, the soldering nozzle 12 extends parallel to the nozzle axis 67.

[0058] For this purpose, the nozzle gripper 22 is Fig. 7 is displaced from the lower transfer position into the upper receiving position by means of the linear drive 28 along the linear axis 30. In the receiving position, the soldering nozzle 12 is inserted into the gripping receptacle 68 and can be gripped from an outer position to an inner position by moving gripping jaws 72 of the nozzle gripper 22. The nozzle gripper 22 is preferably designed as

[0059] By moving the nozzle gripper 22 by means of the linear drive 28 from the receiving position to the transfer position, Fig. 8, the soldering nozzle 12 is removed from the nozzle magazine 20. During removal, the nozzle gripper 22 acts against the magnetic force of the magnet 66. The soldering nozzles 12 are arranged on the nozzle magazine 20 such that the tip of the soldering nozzle 12 is directed toward the nozzle gripper 22 and is thus picked up by the gripper receptacle 68.

[0060] According to Fig. 9, the nozzle gripper 22 is then pivoted about the pivot axis 26 from the receiving position to the transfer position by means of the pivot drive 24. In the receiving position, the gripper receptacle 68 is directed upwards, and in the transfer position, the gripper receptacle 68 is rotated 180° and directed downwards. As soon as the nozzle gripper 22 is in the transfer position, the soldering nozzle 12 can be transferred to the solder pot 16.

[0061] Advantageously, the solder pot 16 is displaceable along the x-axis X, the y-axis Y and the z-axis Z, wherein the y-axis Y runs parallel to the pivot axis 26, wherein the x-axis X runs perpendicular to the y-axis Y and to the linear axis 30, and wherein the z-axis Z runs parallel to the linear axis 30.

[0062] To accommodate the soldering nozzle 12, the soldering pot 16 is Fig. 11 and Fig. 12 to the nozzle gripper 22, in particular along the z-axis Z. The soldering nozzle 12 is held by a crucible holder 74. Preferably, the crucible holder 74 is constructed corresponding to the magazine locations 62, wherein at least one magnet 66 is provided for holding the soldering nozzle 12. As soon as the soldering nozzle 12 is held in the crucible holder 74 by the magnet 66, the nozzle gripper 22 can be released and the soldering pot 16 together with the soldering nozzle can be moved into the soldering position (not shown). Due to the arrangement of the soldering nozzles 12 on the nozzle magazine 20, apart from pivoting the nozzle gripper 22, no further alignment of the soldering nozzle 12 is required in order to transfer it to the soldering pot 16.

[0063] To ensure the precise position of the soldering nozzle 12 or the nozzle gripper 22 when transferring the soldering nozzle 12, Fig. 13 and Fig. 14 on the nozzle gripper 22 or on the boom 38 coupled to the nozzle gripper 22, a locking hook 76 is arranged. The nozzle gripper 22 has a in the receiving position according to Fig. 6 has a gripper top side 78 facing the nozzle magazine 20 and a gripper bottom side 80 facing away from the nozzle magazine 20. The gripper receptacle 68 is preferably arranged on the gripper top side 78 and / or the locking hook 76 is arranged on the gripper bottom side 80.

[0064] A locking lug 82 is provided on the nozzle magazine 20 and / or on the carrier 38, in particular the first carrier section 40, which interacts with the locking hook 76 when the nozzle gripper 22 is arranged in the transfer position and transfer orientation. This ensures that the nozzle gripper 22 is aligned horizontally. Furthermore, forces generated by the action of the nozzle gripper 22 against the magnetic force of the magnet 66 can be diverted into the carrier 38 and / or the system housing 18.

[0065] According to Fig. 13 and Fig. 14, the locking hook 76 has a fork-shaped portion 86 at its free end 84. It is further advantageous if the locking lug 82 has a shaft 88 with a groove 90 and a collar 94 at its free end 92. In the locked state, the fork-shaped portion 86 engages in the groove 90 above the collar 94 of the locking lug 82. Preferably, the nozzle gripper 22 is only rotatable in a semicircle, so that the locking hook 76 can engage in the locking lug 82 and can be moved out of the locking lug 82.

[0066] Alternatively or in addition to the locking hook 76 and / or the locking lug 82, Fig. 9 to 12, a sensor system 600 is provided for detecting the position of the nozzle gripper 22 during the transfer of the soldering nozzle 12 to the soldering pot 16. The sensor system 600 preferably has a sensor 602, in particular an induction sensor, which interacts with the nozzle gripper 22, in particular with a signal generator 603 arranged on the gripper underside 80. Should the position of the nozzle gripper 22 deviate in the transfer position, e.g. because the soldering pot 16 strikes the nozzle gripper 22 or the soldering nozzle 16 and thus slightly displaces the nozzle gripper 22, the movement of the soldering pot 16 is stopped and, if necessary, the soldering pot 16 is displaced away from the nozzle gripper 22. In the event of such a collision, the operator can also be notified by the control unit 110. The sensor system 600, in particular the sensor 602, can be arranged on the nozzle magazine 20 or on the carrier 36.At least one adjusting screw 604 can be provided to adjust the sensor system 600, in particular the sensor 602, parallel to the linear axis 30, so that the sensor 602 can reliably detect the position of the nozzle gripper 22.

[0067] Furthermore, according to Fig. 15 and Fig. 16, a nozzle base 96 is provided for centering the soldering nozzles 12 on the soldering pot 16, which nozzle base has a joining bevel 98 facing the soldering nozzle 12. Furthermore, a joining bevel 98 is preferably also provided on the underside of the soldering nozzle 12. The joining bevels 98 allow easy mounting of the soldering nozzle 12 on the soldering pot 16, even if the soldering nozzle 12 is not optimally aligned with the soldering pot 16.

[0068] The nozzle gripper 22 is according to Fig. 11 and Fig. 17 is preferably designed as a centric gripper, wherein three gripping jaws 72 are provided. The gripping jaws 72 can be displaced between an inner position and an outer position. In the inner position, a soldering nozzle 12 can be secured in the nozzle gripper 22. In the outer position, a soldering nozzle 12 can be released. For contacting the soldering nozzle 12, each gripping jaw 72 has a first gripping surface 100 facing the gripping receptacle 68. Furthermore, the gripping jaws 72 can be displaced according to Fig. 18 have a second gripping surface 102 facing away from the gripping receptacle 68 in order to grip, remove, or replace a gassing cap 104 required on the soldering pot 16 in an external position. The second gripping surface 102 is preferably provided on a shoulder 106 of the gripping jaws 72.

[0069] Due to the vertical arrangement of the nozzle magazine 20 and the nozzle gripper 22, the soldering nozzle changing system 10 is particularly compact. The symmetry axes of the magazine positions 62 and the symmetry axis of the gripper holder 68, i.e. the nozzle axis 67, are located according to Fig. 2 in a system plane 108, which is arranged vertically and / or runs parallel to the linear axis 30. This enables a particularly simple, fast, and positionally accurate transfer between the nozzle magazine 20, the nozzle gripper 22, and the solder pot 16.

[0070] Furthermore, according to Fig. 1 and Fig. 2, a control unit 110 is provided, which controls the swivel drive 24, the linear drive 28, the nozzle gripper 22, and the magazine drive 32. The control unit 110 controls the magazine drive 32 such that a soldering nozzle 12 provided in a magazine location 62 is moved to the provision location 70. Furthermore, the control unit 110 controls the nozzle gripper 22, the swivel drive 24, and the linear drive 28 such that a soldering nozzle 12 can be removed from the nozzle magazine 20 by means of the nozzle gripper 22 and transferred to the solder pot 16.

[0071] In addition, according to Fig.2, a sensor device 112 is provided, which detects whether and at which magazine location 62 a soldering nozzle 12 is arranged. Furthermore, the sensor device 112 detects whether a soldering nozzle 12 is arranged on the nozzle gripper 22 or on the soldering pot 16. Furthermore, coding (not shown) in the form of barcodes or RFID chips can be provided on the soldering nozzles 12, which contain information about the nozzle type of the soldering nozzle. In this case, the sensor device 112 can additionally have a reader for reading the information. The control unit 110 can be configured such that it controls the drives depending on the information from the sensor device 112. For example, a suitable nozzle type can be provided for a specific soldering task.

Claims

[1] Soldering nozzle changing system (10) for changing soldering nozzles (12) on a soldering system (14), the soldering nozzle changing system (10) comprising: - a nozzle magazine (20) with magazine locations (62) for providing soldering nozzles (12), - a nozzle gripper (22) with a gripping receptacle (68) extending along a nozzle axis (67) for gripping a soldering nozzle (12), - a pivoting drive (24) for pivoting the nozzle gripper (22) about a pivot axis (26) between a receiving position for receiving the soldering nozzle (12) from the nozzle magazine (20) and a transfer position for transferring the soldering nozzle (12) to a soldering pot (16) of the soldering system (14), - a linear drive (28) for displacing the nozzle gripper (22) along a linear axis (30) between a receiving position assigned to the nozzle magazine (20) and a transfer position assigned to the soldering pot (16), and - a magazine drive (32) for rotating the nozzle magazine (20) about a magazine axis (34) so that at least one of the magazine locations (62) can be rotated into a storage location. [2] Soldering nozzle changing system (10) according to claim 1, wherein the pivot drive (24) and the magazine drive (32) are designed such that the pivot axis (26) and the magazine axis (34) run parallel to each other. [3] Soldering nozzle changing system (10) according to claim 1 or 2, wherein the pivot drive (24) and / or the magazine drive (32) are designed such that the pivot axis (26) and / or the magazine axis (34) extend horizontally. [4] Soldering nozzle changing system (10) according to one of the preceding claims, wherein the linear drive (28) and the pivoting drive (24) and / or the magazine drive (32) are designed such that the linear axis (30) runs perpendicular to the pivoting axis (26) and / or to the magazine axis (34). [5] Soldering nozzle changing system (10) according to one of the preceding claims, wherein the nozzle magazine (20) is cylindrical and / or disc-shaped. [6] Soldering nozzle changing system (10) according to one of the preceding claims, wherein the nozzle magazine (20) has a circumferential magazine surface (60), and wherein the magazine locations (62) are arranged on the magazine surface (60) along a system plane (108). [7] Soldering nozzle changing system (10) according to one of the preceding claims, wherein a centering holder (64) for centering the soldering nozzle (12) and / or a magnet (66) for holding the soldering nozzle (12) is provided at each of the magazine locations (62). [8] Soldering nozzle changing system (10) according to claim 6 or 7, characterized in that the nozzle gripper (22) is arranged such that the nozzle axis (67) is arranged in the system plane (108) in the receiving position and in the transfer position. [9] Soldering nozzle changing system (10) according to one of the preceding claims, further comprising a carrier (36), wherein the nozzle magazine (20) and the linear drive (28) are arranged on the carrier (36). [10] Soldering nozzle changing system (10) according to one of the preceding claims, wherein the nozzle gripper (22) has gripping jaws (72) which can be displaced between an inner position and an outer position. [11] Soldering nozzle changing system (10) according to claim 10, wherein the gripping jaws (72) each have a first gripping surface (100) for gripping the soldering nozzle (12) in the inner position and a second gripping surface (102) for gripping a gassing cap (104) in the outer position. [12] Soldering nozzle changing system (10) according to one of the preceding claims, wherein the nozzle gripper (22) has a gripper top side (78) facing the nozzle magazine (20) in the receiving position and a gripper bottom side (80) facing the soldering pot (16) in the receiving position, and wherein the nozzle gripper (22) has a latching hook (76) on the gripper bottom side (80) for locking the nozzle gripper (22) in the receiving position and / or in the transfer position and / or for directing forces when receiving and / or taking over a soldering nozzle (12). [13] Soldering nozzle changing system (10) according to claim 12, further comprising a locking lug (82), wherein in the transfer position the locking hook (76) of the nozzle gripper (22) cooperates with the locking lug (82). [14] Soldering nozzle changing system (10) according to one of the preceding claims, wherein the soldering nozzle changing system (10) further comprises a control unit (110) for controlling the pivot drive (24) and / or the linear drive (28) and / or the magazine drive (32), wherein the control unit (110) controls the pivot drive (24) and / or the linear drive (28) and / or the magazine drive (32) in such a way that a soldering nozzle (12) provided in a magazine location (62) can be rotated to the provision location (70) and / or that a provided soldering nozzle (12) can be gripped, displaced and deposited in the solder pot (16) by means of the nozzle gripper (22). [15] Soldering nozzle changing system (10) according to one of the preceding claims, further comprising a sensor device (112) for detecting whether a soldering nozzle (12) is arranged at a magazine location (62) and / or at the provision location (70) and / or at the nozzle gripper (22) and / or at the soldering pot (16) and / or for detecting a nozzle type of the soldering nozzle (12) at the magazine location (62) and / or at the provision location (70) and / or at the nozzle gripper (22) and / or at the soldering pot (16). [16] Soldering system (14) for soldering components by means of at least one soldering nozzle (12), with a soldering nozzle changing system (10) according to one of claims 1 to 15 and with a soldering pot (16), wherein a pot holder (74) for receiving a soldering nozzle (12) and in particular a gassing cap (104) is provided on the soldering pot (16). [17] Soldering system (14) according to claim 16, wherein the soldering pot (16) is movable along a z-axis running parallel to the linear axis (30) and / or along an xy-plane running perpendicular to the linear axis (30). [18] Soldering system (14) according to claim 16 or 17, further comprising a system housing (18), wherein the carrier (36) is arranged on the system housing (18). [19] Soldering system (14) according to claim 18, wherein the soldering nozzle changing system (10) is displaceable along a first mounting axis (202) between a working position for operating the soldering nozzle changing system (10) and a maintenance position for servicing the soldering nozzle changing system (10) and / or the solder pot (16). [20] Method for changing a soldering nozzle (12) on a soldering system (14) according to one of claims 16 to 18, comprising the following steps: a) providing a soldering nozzle (12) at a magazine location (62) of a nozzle magazine (20); b) rotating the nozzle magazine (20) so that the soldering nozzle (12) provided at the magazine location (62) is arranged at a provision location (70); c) moving a nozzle gripper (22) to the staging area (70); d) gripping the provided soldering nozzle (12) by means of the nozzle gripper (22); e) displacing the nozzle gripper (22) relative to the nozzle magazine (20) along a linear axis (30) from a receiving position to a transfer position; f) pivoting the nozzle gripper (22) about a pivot axis (26) from a receiving position to a transfer position; g) moving the solder pot (16) to the solder nozzle (12); and h) Transfer the soldering nozzle (12) to the soldering pot (16). [21] Method according to claim 19, wherein, in order to transfer the soldering nozzle (12) to the soldering pot (16) according to step h), the soldering pot (16) first receives the soldering nozzle (12) and then the gripping jaws (72) of the nozzle gripper (22) are displaced from an inner position to an outer position in order to release the soldering nozzle (12).

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