Electronic device for a camera module, method for its manufacture and camera module

A camera module with a transparent substrate and flip-chip image sensor design reduces thickness by eliminating wire bonds and incorporating light-filtering and sealing features, enhancing portability and performance.

DE102024134469A1Pending Publication Date: 2026-05-28PAC TECH PACKAGING TECH
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Patent Information

Application Number
DE102024134469
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-11-22
Publication Date
2026-05-28

AI Technical Summary

Technical Problem

The challenge of reducing the thickness of camera modules in portable devices, such as smartphones and tablets, is hindered by the dimensions of existing camera components.

Method used

A camera module design featuring a transparent substrate with a flip-chip image sensor attached via solder connections, optionally with a translucent element or light-filtering properties, and a sealing section to prevent stray light, allowing for reduced thickness without wire bonding.

Benefits of technology

Enables a significant reduction in camera module thickness while maintaining functionality and protecting the image sensor from environmental factors.

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Abstract

The present disclosure relates to an electronic device (12) for a camera module (1) with a housing (2) in which a light aperture (4) is formed, comprising: a substrate (14) with a first side (18) arranged in the housing (2) such that it faces the light aperture (4), and a second side (20) opposite the first side (18); and an image sensor (16) having a light-sensitive section, configured as a flip chip, and attached to the second side (20). The substrate (14) is transparent, at least in the region of the light-sensitive section of the image sensor (16). The disclosure further relates to a camera module (1) with the electronic device and a method for manufacturing the electronic device (12).
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Citation Information

Patent Citations

  • A packaging method for an image sensor

    CN103337504A

  • Camera module and method for manufacturing it

    KR1020130096901A

  • Camera module

    US20100328525A1

  • Solid-state imaging apparatus

    US20200035731A1

  • Camera assembly, assembly method, and terminal

    US20210075940A1