WAFER HOLDER, PROCESS CHAMBER AND METHOD FOR MAKING A SEMICONDUCTOR DEVICE

Abstract

A wafer holder comprises: at least one pocket configured to receive a wafer, wherein the at least one pocket is arranged in a first side of the wafer holder, the at least one pocket forming a recess in the first side of the wafer holder, the recess having at least a first recess depth, and at least one first recess arranged either in a bottom of the pocket or in a second side of the wafer holder, the second side being opposite the first side of the wafer holder such that the at least one first recess in the second side is arranged vertically below the pocket, the at least one first recess being arranged along a first part of a first circle when viewed from above the first side or from above the second side, the first circle being arranged along a lateral edge of the pocket, and wherein a first thickness of the wafer holdermeasured between the bottom of the at least one first depression and the respective first and second sides opposite the bottom of the at least one first depression, compared to a second thickness of the wafer holder, measured between the bottom of the pocket and the second side.

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