Sensor device, manufacturing process for a sensor device and method for operating a sensor device

DE102025100541A1Undetermined Publication Date: 2026-07-09ROBERT BOSCH GMBH
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Patent Information

Application Number
DE102025100541
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-01-09
Publication Date
2026-07-09

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Abstract

The present invention relates to a sensor device comprising at least one first substrate (20) with a first substrate surface (20a), a sensor element layer (22) with at least one sensitive element arranged in the sensor element layer (22), wherein the sensor element layer (22) covers the first substrate surface (20a) and / or at least one intermediate layer (24) at least partially covering the first substrate surface (20a), and at least one capacitor arrangement (30), wherein the at least one capacitor arrangement (30) is formed in the first substrate (20) and / or in a second substrate (32), which is electrically connected to the first substrate (20) via at least one bond connection (34). The present invention also relates to a manufacturing method for a sensor device. Furthermore, the present invention relates to a method for operating a sensor device.
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Citation Information

Patent Citations

  • MAGNETIC FIELD SENSOR PACKAGE WITH INTEGRATED PASSIVE COMPONENT

    DE102019110570A1

  • Three dimensional integrated deep trench decoupling capacitors

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  • High aspect ratio etch without upper widening

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