Cooling device, cooling system and immersion cooling system

Abstract

Cooling device for cooling a discrete semiconductor package, comprising a housing, wherein the housing includes a heat exchange surface configured to match a corresponding heat-emitting surface of the semiconductor package, and wherein the housing surrounds a liquid chamber and includes distribution elements arranged to form a fluid channel for a cooling fluid through the liquid chamber between an inlet section and an outlet section, wherein the fluid channel is configured to direct a flow of the cooling fluid within the housing along the heat exchange surface.

Description

TECHNICAL AREA The present disclosure relates to a cooling device, a cooling system, and an immersion cooling system for cooling a discrete semiconductor package. A housing of the cooling device surrounds a liquid chamber and includes distribution elements arranged to form a fluid channel for a cooling liquid through the liquid chamber between an inlet section and an outlet section. The cooling system comprises a cooling device and a semiconductor package. The immersion cooling system comprises the cooling device, a semiconductor package, and an immersion bath into which the semiconductor package is immersed. BACKGROUND To achieve high power densities in high-performance applications, especially chargers and battery storage systems, the market is moving towards liquid cooling. Furthermore, power requirements are still increasing. A minimum number of components is particularly desirable for systems with high reliability demands. In addition, heat sinks for liquid cooling must be specially modified. This can be seen in transformers that can operate maintenance-free for up to 30 years using hermetically sealed immersion cooling. This disclosure addresses two shortcomings of the existing liquid cooling technology. Currently, there is no reasonable compromise between ease of manufacturing / implementation for our customers and excellent performance. Background information on this disclosure can be found in publications DE 60 2005 006 310 T2, DE 10 2020 129 883 A1, US 2014 / 0 268 571 A1, DE 10 2011 100 543 A1, and US 2024 / 0 251 523 A1. One aim of the present revelation is to at least mitigate these shortcomings. SUMMARY A first aspect of the disclosure relates to a cooling device for cooling a discrete semiconductor package, the device comprising: a housing, the housing comprising a heat exchange surface configured to match a corresponding heat-emitting surface of the semiconductor package, and the housing surrounding a liquid chamber and comprising distribution elements arranged to form a fluid channel for a cooling fluid through the liquid chamber between an inlet section and an outlet section, the fluid channel being configured to direct a flow of the cooling fluid within the housing along the heat exchange surface, the housing comprising an opening that allows a thermal connection between the heat-emitting surface of the semiconductor package and the fluid channel;wherein the opening is arranged at the heat exchange surface, and wherein a pressure-resistant elastic element is arranged inside the opening, forming the heat exchange surface. A second aspect of the disclosure relates to a cooling device for cooling a discrete semiconductor package, the device comprising: a housing, wherein the housing includes a heat exchange surface configured to match a corresponding heat-emitting surface of the semiconductor package, and wherein the housing surrounds a liquid chamber and includes distribution elements arranged to form a fluid channel for a cooling liquid through the liquid chamber between an inlet section and an outlet section, the fluid channel being configured to direct a flow of the cooling liquid within the housing along the heat exchange surface;wherein the opening comprises a frame-like recess on a circumferential surface of the opening, the recess being formed by a step to an inside of the housing, and being configured to receive and fit the semiconductor housing; and wherein a seal is arranged on the step. A third aspect of the present disclosure relates to a cooling device for cooling a discrete semiconductor package, the device comprising: a housing, wherein the housing includes a heat exchange surface configured to match a corresponding heat-emitting surface of the semiconductor package, and wherein the housing surrounds a liquid chamber and includes distribution elements arranged to form a fluid channel for a cooling liquid through the liquid chamber between an inlet section and an outlet section, the fluid channel being configured to direct a flow of the cooling liquid within the housing along the heat exchange surface; wherein the outlet section is arranged on a side wall of the housing opposite the heat exchange surface, and wherein the outlet section comprises a plurality of openings. The housing of the cooling device can be any environment or enclosure. The housing includes side walls, with at least one of the side walls forming or being replaced by a heat exchange surface, that is, a section of the housing configured to conduct heat from an inside of the housing to an outside of the housing and vice versa. The interior of the housing can form the fluid chamber. The fluid chamber can be a section configured to allow a fluid to be contained within the housing. The fluid chamber can include distribution elements, that is, elements that divide this fluid chamber into separate sections. The separate sections can be communicatively coupled or connected to each other to form a fluid channel or fluid channel through the fluid chamber. The fluid channel can consist of sequentially arranged sections of the fluid chamber that connect an inlet section to an outlet section to allow a flow of coolant through the fluid chamber. The coolant can be an electrically insulating liquid. The coolant can be any liquid suitable for heat transfer. The housing of the cooling device may comprise or be made of an electrically insulating material. The housing of the cooling device may also comprise a plastic material, such as a thermoplastic or thermosetting material. The fluid channel is designed to direct the fluid flow through the fluid chamber and past the heat exchange surface. The coolant, coming from the inlet section, absorbs heat from the heat exchange surface and carries it away from the heat exchange surface and thus away from the heat source. According to the disclosure, a modular cooling solution is provided for cooling discrete devices. The cooling device ensures creepage / clearance compliance while enabling easy integration at the customer's site. The discrete device, i.e., the semiconductor package, can be directly coupled to the fluid channel. Electrical isolation can be achieved via the coolant or an insulated back side of the discrete device. According to the disclosure, a semiconductor body and a cooling device housing are combined and can be cascaded into multi-part assemblies without increasing the connection effort for conducting coolant while it is covered internally, while ensuring electrical insulation. One effect of the first aspect of the revelation may be simple manufacturing and reduced assembly complexity, which ensures reliable sealing while keeping design effort low, as cooling devices are adapted to common packages of discrete power electronic devices. In particular, the heat-emitting surface is in thermal contact with the fluid channel, especially where the heat exchange surface or the corresponding heat-emitting surface forms a side wall of the housing. That is, the heat-emitting surface can be the heat exchange surface. In one embodiment, the housing includes an opening, the opening providing a thermal connection between the heat-emitting surface of the semiconductor housing and the fluid channel. The opening can be a recess or a window-like section. The semiconductor housing can fit precisely into the opening, such that one contact side of the semiconductor housing can be at least partially located within the housing. In particular, the opening is located at the heat exchange surface. A pressure-resistant elastic element can be arranged within the opening, forming the heat exchange surface. In particular, the pressure-resistant elastic element is a silicone or latex film. The pressure-resistant element can be stretched within the opening, thus forming a stretched plane. The pressure-resistant element can therefore form the heat exchange surface of the housing. The pressure-resistant element can also be electrically insulating. Due to its elasticity, the element can be pressed against a heat-emitting surface, such as the semiconductor package, by the pressure of the coolant within the liquid chamber. This creates a tight thermal connection between the pressure-resistant element, and thus the coolant, and the heat-emitting surface. The electrical insulation allows the pressure-resistant element to insulate the coolant from the heat-emitting surface of, for example, the semiconductor package, thus enabling the use of a non-insulating coolant, such as water or a water-glycol mixture. In one embodiment, the distribution elements are arranged to form a U-shaped fluid channel, wherein the flow direction of the coolant through the inlet section is essentially parallel to the flow direction of the coolant through the outlet section. In this embodiment, the fluid channel forms a flow reverser, meaning that the flow of coolant at the inlet section is essentially in the opposite direction to the flow of coolant at the outlet section. In one embodiment, the housing includes a mounting section configured to attach the semiconductor package to the housing, wherein the mounting section includes a threaded hole to receive a screw. The mounting section may be a projection and may be an integral part of the housing. The mounting section may project vertically toward the heat exchange surface. A distal end of the mounting section may be in contact with the heat exchange surface and may have an additional seal, in particular an O-ring, at its end face. The mounting section may include a fastening element, in particular a thread, to receive a screw. According to another embodiment, the housing may include a receiving part for a clamping mechanism configured to attach the semiconductor package to the housing. However, other fastening elements are also provided. In one embodiment, the housing comprises at least two openings. Since each opening is configured to receive a rear face of a semiconductor package, a plurality of semiconductor packages connected to the fluid channel of a cooling device can be cooled. If a device comprises more than one heat exchange surface, a plurality of semiconductor packages on the same device can be connected to the same or a different fluid channel. In this way, a plurality of semiconductor packages can be connected to a cooling device cascaded along a flow direction of the coolant through the fluid channel. In one embodiment, the opening includes a frame-like recess on a circumferential surface of the opening, the frame-like recess being configured to receive and mate with the semiconductor package. The frame-like recess can be formed by a step to an inner surface of the package, configured to receive a corresponding circumferential section of the semiconductor package. The recess allows a semiconductor package to be held within the opening in an assembled state. In particular, the recess includes a seal, especially an O-ring or an adhesive, to create a liquid-tight connection between the housing and the semiconductor package. The body of the semiconductor package and the housing are matched to ensure a reliable seal, while the molded body and / or a conductor frame of the discrete device itself act as part of the housing. In another embodiment, the fluid channel is not liquid-tight, but a gap is provided between the housing and the semiconductor housing to allow a leakage flow of the coolant through the opening. In this embodiment, the semiconductor package and the housing are attached to each other, but not in a leak-proof manner. Being non-liquid-tight or non-leak-proof means that leakage flows are permitted through the opening. A certain amount of coolant introduced into the housing via the inlet section cannot exit the housing through an outlet section, but instead through the opening and past the semiconductor package. As a result, heated coolant that has absorbed heat from the semiconductor package is expelled directly from the housing, thus preventing heat transfer to further downstream parts of the fluid channel and, consequently, the housing. According to this embodiment, a cooling device is provided which effectively cools semiconductor devices by directly expelling liquid onto the device and / or its heat sink. This embodiment is particularly intended for use in immersion cooling systems. A directed flow of coolant allows more display coolers to be attached to surface-mount devices (SMDs) without the risk of shading, such as bubble adhesion. The cooling device acts as an injection point of cold coolant into a larger immersion cooling bath / cell after contact with the area of ​​high temperature (unsealed, no backflow). This enables effective cooling of semiconductor packages with the highest power losses by directly expelling coolant onto the semiconductor package. The high flow rate reduces the blow-out effect. A blow-out effect can occur when small, localized gas bubbles adhere to a surface being cooled, reducing heat transfer. In one embodiment, the housing includes turbulator elements that project into the fluid channel to create turbulence in the coolant flow at a boundary layer on the heat-emitting surface. Integrated turbulators increase heat transfer by preventing laminar flow at a boundary layer of the heat exchange surface. The increased flow rate at the device reduces blowouts and enhances heat transfer to the fluid. In one embodiment, the outlet section is located on a side wall of the housing opposite the heat exchange surface, and the outlet section comprises a plurality of openings. In this embodiment, the outlet section is not configured to accommodate, for example, a tube or connector for directing the coolant away from the cooling device. The heated coolant, which has absorbed heat within the housing, is expelled directly through the plurality of openings into an immersion cooling bath in which both the semiconductor housing and the cooling device are immersed. The cooling device does not necessarily need to be sealed, since it is located in the liquid itself. Other cooling device versions are possible, such as double-sided, endless, etc.In the case of passive elements such as magnetic elements, which also require effective cooling, other forms of cooling devices are also provided, such as a bell-shaped cover or direct ejection through a nozzle. According to another aspect of the disclosure, a cooling system is provided, wherein the system comprises the cooling device of the first and second aspects and a semiconductor housing, wherein the semiconductor housing comprises the heat-emitting surface, the heat-emitting surface being configured to match the housing, in particular the heat exchange surface. In one embodiment of the further aspect of the disclosure, the cooling system comprises one or more snap-fit ​​connectors forming the inlet and / or outlet section; a pipe system for conveying the coolant to and / or away from the cooling device; a cooler connected to the pipe system and configured to remove heat from the coolant; a pump for circulating the coolant through the cooling device, the pipe system, and the cooler; a temperature sensor; and a controller for controlling the flow of coolant through the pump based on temperature sensor data. According to another aspect of the disclosure, an immersion cooling system is provided, wherein the system comprises the cooling device according to some embodiments of the preceding aspects; a semiconductor housing, wherein the semiconductor housing comprises the heat-emitting surface; and an immersion bath into which the semiconductor housing is immersed. In particular, the immersion bath can be an immersion cell, which can also be described as a closed system. The system can be passive or active, with a passive system being defined as one without any means of circulating the coolant. In contrast, an active system can be one that includes active mechanical means of circulating the coolant. In one embodiment, the immersion cooling system comprises one or more snap-fit ​​connectors forming the inlet section; a pipe system for conveying the coolant to the cooling device; a cooler connected to the pipe system and configured to remove heat from the coolant; a pump for circulating the coolant through the cooling device, the pipe system, and the cooler; a temperature sensor; and a controller for controlling the flow of coolant through the pump based on temperature sensor data. All embodiments of each aspect of the disclosure are also intended to be embodiments of all other aspects of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS Exemplary embodiments of the disclosure are described with reference to the following figures: Fig. 1 shows a first exemplary embodiment of the first aspect of the present disclosure. Fig. 2 shows the embodiment of Fig. 1. Fig. 3 shows another view of the embodiment of a cooling device according to Fig. 1. Fig. 4 shows a cooling device of the second aspect of the disclosure. Fig. 5 shows an embodiment of the cooling device shown in Fig. 4. Fig. 6 shows a closed view of a cooling device according to the present disclosure. Fig. 7 shows an interior view of a cooling device configured to be stacked together with a plurality of cooling devices according to the disclosure. Fig. 8 shows an arrangement comprising a plurality of stacked cooling devices according to Fig. 7. Fig. 9 shows another aspect of the cooling device of the first aspect of the disclosure. Fig. 10 shows a cooling system.Figure 11 shows an immersion cooling system. DETAILED DESCRIPTION The following detailed description refers to the accompanying drawings. The drawings show specific examples in which the invention can be implemented. It is understood that the features and principles described in relation to the various examples can be combined with one another unless expressly stated otherwise. As in the claims, designations of certain elements as "first element," "second element," "third element," etc., are not to be understood as enumerative. Instead, such designations serve solely to refer to different "elements." That is to say, for example, that the existence of a "third element" does not require the existence of a "first element" and a "second element." A semiconductor package has electrically connected terminals and includes at least one semiconductor element with electrodes.The contact surfaces are electrically connected to the electrodes, which implies that the contact surfaces are the electrodes and vice versa. Fig. 1 shows a cooling device 1 of the aspect of the present disclosure. The cooling device comprises a housing 2. The housing 2 has a substantially rectangular shape. At one end face, the housing 2 comprises an inlet section 3 and an outlet section 4. The housing 4 surrounds a liquid chamber 5. On a main side wall of the housing 2, the housing 2 comprises at least one heat exchange surface 6. The description refers to the accompanying figures, in which the housing may include two or more heat exchange surfaces. However, for ease of understanding, the description may use the singular form to refer to features. The heat exchange surface 6 is configured to match a heat-emitting surface 7 of a semiconductor package 8. The semiconductor package 8 is attached to the housing 2. The semiconductor package 8 is secured by a screw 9. The fluid chamber 5 within the housing 2 comprises distribution elements 10. The distribution elements 10 are arranged within the housing and divide the housing 2 into one or more channels for a coolant, i.e., a fluid channel 11. The coolant is guided along a path of the fluid channel 11 from the inlet section 3 to the outlet section 4. The fluid channel 11 directs the coolant past the heat exchange surface 6. The heat-emitting surface 7 is in thermal contact with the fluid channel 11. The heat-emitting surface 7 forms a side wall of the housing 2. In this embodiment, the heat-emitting surface 7 corresponds to the heat exchange surface 6. To bring the heat-emitting surface 7 of the semiconductor package 8 into contact with the fluid channel 11, the package 2 includes an opening 12. The opening 12 is located on the heat exchange surface 6 of the package 2. The semiconductor package 8 is at least partially fitted into the opening 12; that is, for example, the back side of the semiconductor package 8, which may be an exposed chip termination area or a thermally conductive interface material, can be located adjacent to the fluid chamber 5. Distribution elements 10 are arranged to divide the liquid chamber 5 into two or more sub-chambers for each semiconductor package 8. Distribution elements 10 can include flanges, openings, bridges, or bars that form subdivisions of the liquid chamber 5. The distribution elements 10 form one or more U-shaped fluid channels, i.e., a flow reverser. In addition to or as an alternative to the distribution elements 10, turbulator elements (not shown in Fig. 1) can be formed in the liquid chamber 5 to prevent laminar fluid flow and improve heat exchange at the heat exchange surface of the package 6. To accommodate the screw 9, which is intended to fasten the semiconductor package 8 to the housing 2, the housing includes a mounting section 13. The mounting section 13 is a cylindrical projection with a longitudinal axis that is substantially perpendicular to a plane of the heat exchange surface 6. An end face of the cylindrical projection may be coplanar and / or lie in the plane of the heat exchange surface 6. The mounting section may include a bore with a threaded inlet. The opening 12 includes or is surrounded by a frame-like recess 14, that is, a stepped section in the circumferential side wall of the housing adjacent to the heat exchange surface 6. The frame-like recess 14 is configured to fit with a housing or a shaped body of the semiconductor housing 8. Due to the stepped section, the shaped body of the semiconductor package 8 extends into the package 2 by penetrating a surface of the package 2. A labyrinth is provided between the shaped body of the semiconductor package 8 and the package 2 by the stepped section, which helps to seal the liquid chamber 5 from the outside environment. The frame-like recess can include a seal 15, which may be an O-ring, a profile seal, or a lip seal. Part of the seal 15, or another type of seal, may also be placed on or in the mounting section 13. The mounting section 13 may be provided with a recess to accommodate this seal. Fig. 2 shows the embodiment of Fig. 1, wherein the seal 15 is not an O-ring but an adhesive 16. The adhesive 16 replaces the O-ring of Fig. 1. The adhesive 16 can be insulating and configured to create a leak-proof connection between the shaped body of the semiconductor package 8 and the housing 2. The adhesive 16 can also be applied to the mounting section 13 (not shown in Fig. 2). Fig. 3 shows another embodiment of a cooling device 1. Fig. 3 shows an example of a cooling device 1 suitable for more than two semiconductor packages 8 side by side. In this embodiment, the package includes more than one heat exchange surface 6. A second heat exchange surface is arranged opposite the heat exchange surface 6 and adapted to accommodate semiconductor packages 8 in the same way as the heat exchange surface 6. Fig. 4 shows a cooling device of the second aspect of the disclosure. In this embodiment, the fluid channel 5 is not liquid-tight. A gap 17 can be provided between the shaped body of the semiconductor device 8 and the housing 2. A leakage flow of the cooling fluid is possible through the gap 17; that is, the leakage flow of the cooling fluid can leave the housing 2 through the opening 12 and not through the outlet section 4. The inlet section 3 is provided at an end face of the housing 2. Furthermore, the housing includes two turbulator elements 18. The turbulator elements 18 project into the fluid channel 5. The turbulator elements 18 are configured to generate turbulence at least at one boundary layer of the heat exchange surface 6, and the coolant flows past the heat exchange surface 6. The turbulence increases the Reynolds number, which improves the heat transfer from the heat exchange surface 6 to the coolant. Fig. 5 shows an embodiment of the cooling device shown in Fig. 4. The housing 2 comprises the outlet section 4, which is arranged on the side wall of the housing 2. The outlet section 4 is formed by at least one opening in a surface of the side wall of the housing 2 opposite the heat exchange surface 6. Thus, the coolant enters the housing 2 at the inlet section 3 and exits the housing 2 through the openings 4 after passing over the heat exchange surface 6. In this embodiment, the housing can be part of an immersion cooling system, with the coolant being discharged through the openings into an immersion cooling bath (not shown). Fig. 6 shows a closed view of a cooling device 1 according to Fig. 5. The housing 2 is closed, with two semiconductor housings 8 attached to the heat exchange surfaces 6. Fig. 7 shows an interior view of a cooling device 1 configured to be stacked with a plurality of cooling devices 1 according to the disclosure. The housing 2 includes mounting sections 19, which may be flanges comprising through holes. Furthermore, the housing 2 includes snap connectors 20. The snap connectors 20 can be arranged to positively lock with respective locking features on the respective subsequent housing 2 in a mounting position where a plurality of cooling devices are stacked together. For stabilization, the housing further includes a central flange 21. The inlet section 3 may have a different diameter than the outlet section 4 for hydraulic equalization between the cooling devices 1. A flow restrictor 33 can be arranged between the inlet section 3 and / or the outlet section 4 of the liquid chamber 5. The flow restrictors can be configured to allow essentially the same fluid flow rate through each stacked cooling device 1 up to a limited, predefined number of stacked cooling devices in the case of a continuous inlet section 3 and outlet section 4 forming a common rail for supplying cool liquid and returning hot liquid. Fig. 8 shows an arrangement comprising a plurality of stacked cooling devices 1 according to Fig. 7. The cooling devices 1 of Fig. 7 are arranged in the mounting position, i.e., stacked together. Semiconductor packages 8 are mounted between the housings 2. In the stacked arrangement, semiconductor packages 8 can be pressed into the frame-like recesses 14 and against the seal 15 over the respective subsequent housing 2. That is, the semiconductor packages 8 are arranged between the housings 2 and are pressed together by a suitable connector 22, which can be inserted through the mounting sections 19 and which can be configured to press each of the housings 2 against each other. Here, as many cooling devices as needed can be cascaded, either in a chained configuration or via a common inlet flow (current through all cells or current into each cell via a common rail and outlet in each device). Fig. 9 shows another aspect of the cooling device according to the disclosure. The cooling device 1 can be connected to the semiconductor housing 8 using a clamp 23 or by sliding it onto the semiconductor housing 8, which is, for example, secured using retaining clips. In the embodiment where the cooling device 1 is used in an immersion cooling bath, there is no need for a liquid-tight connection. That is, some tolerances and leakage gaps between the cooling device 1 and the semiconductor housing 8 are permissible or can even serve as an outlet for hot liquid. In this case, the terminals 23 can be inexpensive clamps, since there is no need for precise pressure distribution. If the cooling device 1 slides on the semiconductor housing 8, tolerances for both the slide rails and the holders allow for a mechanical clearance between the cooling device 1 and the semiconductor housing 8. Fig. 10 shows a cooling system 24. The cooling system 24 comprises a cooling device 1, for example, according to the first aspect of the present disclosure. The cooling system 24 further comprises the semiconductor packages 8. The cooling device 1 is connected to a pipe system 25 via the inlet section 3 and the outlet section 4. Both the inlet section 3 and the outlet section 4 can be formed by a snap-fit ​​connector. The cooling system 24 can be a passive system: The cooling device 1 is not supplied by a pump, but instead uses heat generated in the semiconductor parts to drive the flow of the coolant via a thermally driven static pressure difference. Here, the system acts like a snorkel, making it possible to draw coolant from low-temperature areas of the cooling volume. In this way, temperatures in the media can be equalized horizontally and over greater distances than would be possible by thermally driven flow alone. The cooling system 24 can be an active system. In this case, the cooling system 24 further comprises a pump 26 for circulating the coolant through the cooling device and the pipe system 25. The cooling system can also include a controller 27, a temperature sensor 28, and a cooler 29. Fig. 11 shows an immersion cooling system 30. The immersion cooling system 30 comprises an immersion bath 31 into which the cooling device 1 is immersed according to the second aspect of the disclosure. Semiconductor packages 8 are also immersed in the immersion bath 31 and attached to the cooling device 1 according to the second aspect of the disclosure. The cooling device 1 is again connected to a pipe system 25, but only one connection to the pipe system 25 is present, namely the inlet section 3. The immersion cooling system 30 can be equipped with a pump for circulating the liquid or it can use convection. A cooler 29 can be connected to the immersion cooling system 30. The cooling device 1 serves as a distribution element for pre-cooled coolant, directing the pre-cooled coolant precisely to the point of highest thermal load, which may be the semiconductor packages 8.Leakage flows of the cooling fluid can enter the immersion bath 31 through the gap 17. The immersion bath 31 has an outlet 32 ​​that can direct heated cooling fluid to a further cooling system, e.g., a cooler. Thus, the immersion cooling bath 31, together with the immersed cooling device 1, can also be part of the cooling system 24 according to Fig. 10, as described in the second aspect of the disclosure. Since the cooling device 1 in the immersion cooling bath 31 enables focused cooling of hot spots such as power semiconductors, high fluid flow rates occur only where needed; that is, the overall fluid flow rate of the entire device can be reduced compared to conventional immersion cooling. Other components with lower heat dissipation, such as passives or conductors, can be cooled, depending on their maximum allowable temperature, either by the heated return flow from the adapter outlets or by bypass ports for cool fluid. Because the power loss density of these components is significantly lower, either hotter incoming fluid and / or lower flow rates are acceptable. The cooling devices 1 according to the disclosure, which are used in an immersion cooling environment, reduce the cooling effort by directing a flow of cooling media from a cold area (reservoir, heat exchanger, etc.) directly into the area with the highest temperature of the cooling media pool. In this way, cooling of hot spots can occur at the minimum bath temperature instead of at the average bath temperature. To minimize design complexity, the cell will not have a return line but will be built as an open system. In this way, each device doubles as an injection point for cold media into the bath. Here, the fluid is already at elevated temperatures and exits the device through an outlet system that flows into the total volume of the immersion cooling fluid. Reference symbol list 1. Cooling device 2. Housing 3. Inlet section 4. Outlet section 5. Liquid chamber 6. Heat exchange surface 7. Heat-emitting surface 8. Semiconductor housing 9. Screw 10. Distribution elements 11. Fluid / fluid channel 12. Opening 13. Mounting section 14. Frame-like recess 15. Seal / O-ring 16. Adhesive 17. Gap 18. Turbulator elements 19. Mounting section 20. Snap connector 21. Central flange 22. Connector 23. Clamp 24. Cooling system 25. Piping system 26. Pump 27. Controller 28. Temperature sensor 29. Cooler (K) 30. Immersion cooling system 31. Immersion bath 32. Outlet 33. Flow restrictor

Claims

Cooling device for cooling a discrete semiconductor package, the device comprising: a housing, wherein the housing includes a heat exchange surface configured to match a corresponding heat-emitting surface of the semiconductor package, and wherein the housing surrounds a fluid chamber and includes distribution elements arranged to form a fluid channel for a cooling fluid through the fluid chamber between an inlet section and an outlet section, wherein the fluid channel is configured to direct a flow of the cooling fluid within the housing along the heat exchange surface; wherein the housing includes an opening that allows a thermal connection between the heat-emitting surface of the semiconductor package and the fluid channel;wherein the opening is arranged at the heat exchange surface, and wherein a pressure-resistant elastic element is arranged inside the opening, forming the heat exchange surface. Cooling device for cooling a discrete semiconductor package, the device comprising: a housing, the housing comprising a heat exchange surface configured to match a corresponding heat-emitting surface of the semiconductor package, and the housing surrounding a fluid chamber and comprising distribution elements arranged to form a fluid channel for a cooling fluid through the fluid chamber between an inlet section and an outlet section, the fluid channel being configured to direct a flow of the cooling fluid within the housing along the heat exchange surface; the opening comprising a frame-like recess on a circumferential circumference of the opening, the recess being formed by a step to an inside of the housing, and being configured to receive and fit the semiconductor package; and a seal being arranged on the step. Cooling device according to claim 1 or 2, wherein the heat-emitting surface is in thermal contact with the fluid channel, in particular wherein the heat exchange surface or the corresponding heat-emitting surface forms a side wall of the housing. Cooling device according to claim 1, wherein the pressure-resistant elastic element is a silicone film or a latex film. Cooling device according to one of the preceding claims, wherein the housing comprises a mounting section configured to attach the semiconductor package to the housing, wherein the mounting section comprises a threaded hole to accommodate a screw. Cooling device according to one of the preceding claims, wherein the housing comprises at least two openings. Cooling device according to claim 2, wherein the seal comprises an O-ring or an adhesive to create a liquid-tight connection between the housing and the semiconductor housing. Cooling device according to one of the preceding claims, wherein the fluid channel is not liquid-tight, but wherein a gap is provided between the housing and the semiconductor housing to allow a leakage flow of the cooling fluid through the opening. Cooling device for cooling a discrete semiconductor package, the device comprising: a housing, wherein the housing comprises a heat exchange surface configured to match a corresponding heat-emitting surface of the semiconductor package, and wherein the housing surrounds a fluid chamber and includes distribution elements arranged to form a fluid channel for a cooling fluid through the fluid chamber between an inlet section and an outlet section, wherein the fluid channel is configured to direct a flow of the cooling fluid within the housing along the heat exchange surface; wherein the outlet section is arranged on a side wall of the housing opposite the heat exchange surface, and wherein the outlet section comprises a plurality of openings. Cooling system comprising the cooling device according to any one of claims 1-9; and a semiconductor housing, wherein the semiconductor housing comprises the heat-emitting surface, wherein the heat-emitting surface is configured to match the housing, in particular the heat exchange surface. Cooling system according to claim 10, further comprising one or more of a snap connector forming the inlet and / or outlet section; a pipe system for transporting the coolant to and / or away from the cooling device; a cooler connected to the pipe system and configured to remove heat from the coolant; a pump for circulating the coolant through the cooling device, the pipe system and the cooler; a temperature sensor; a controller for controlling the flow of the coolant through the pump based on temperature sensor data. Immersion cooling system comprising: the cooling device of claim 8 or 9; a semiconductor housing, wherein the semiconductor housing comprises the heat-emitting surface; and an immersion bath into which the semiconductor housing is immersed. Immersion cooling system according to claim 12, further comprising one or more of: a snap connector forming the inlet section; a pipe system for conveying the coolant to the cooling device; a cooler connected to the pipe system and configured to remove heat from the coolant; a pump for circulating the coolant through the cooling device, the pipe system and the cooler; a temperature sensor; a controller for controlling the flow of the coolant through the pump based on temperature sensor data.

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