Laser arrangement and method for processing a workpiece

DE102025102013A1Undetermined Publication Date: 2026-07-23TRUMPF LASER SE
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
TRUMPF LASER SE
Filing Date
2025-01-21
Publication Date
2026-07-23

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Abstract

The present invention relates to a laser arrangement (10) for processing, in particular micro- and / or nano-processing, a workpiece (12) by means of a pulsed laser beam (14) with features of claim 1 and a method for processing, in particular micro- and / or nano-processing, a workpiece (12) by means of a pulsed laser beam (14) with features of the dependent claim.
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Citation Information

Patent Citations

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