Processing device, vacuum arrangement and method

DE102025102420A1Undetermined Publication Date: 2026-08-06VON ARDENNE ASSET GMBH & CO KG
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
VON ARDENNE ASSET GMBH & CO KG
Filing Date
2025-01-23
Publication Date
2026-08-06

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Abstract

According to various embodiments, a sputtering processing device comprises: an electrode (440); a first bearing device (152t) which is configured to hold one of the sputtering targets associated with the electrode (440); a mechanism (152m) which is configured to excite a movement of the electrode (440) relative to the first bearing device (152t), which displaces the electrode (440) and the first bearing device (152t) relative to each other and / or rotates the electrode (440) relative to a gravitational direction.
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Citation Information

Patent Citations

  • Magnetron arrangement and method for operating a magnetron arrangement

    DE102015101208A1

  • magnetron assembly

    DE102015104615A1

  • Coating device and a method for operating a coating device

    DE102023116093A1