METHOD FOR MANUFACTURING A CHIP HOUSING, CHIP HOUSING, WAFER STRUCTURE AND METHOD FOR TREATMENT A CHIP HOUSING COMPONENT

DE102025103261A1Undetermined Publication Date: 2026-07-30INFINEON TECHNOLOGIES AG
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
INFINEON TECHNOLOGIES AG
Filing Date
2025-01-29
Publication Date
2026-07-30

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Abstract

A method for manufacturing a chip package is provided. The method involves forming a metal oxide layer on a chip structure and applying a salt solution to the metal oxide layer to form a layered double hydroxide (LDH).
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