POWER SEMUBLER HOUSING WITH A SHAPED BODY WITH PROPOSE AND METHOD FOR MANUFACTURING THE SAME

Abstract

A power semiconductor package comprising: a conductor frame comprising a plurality of first conductors, a power semiconductor chip electrically connected to the conductor frame, and a molded body encapsulating the power semiconductor chip, the molded body comprising a first side, a opposite second side, and lateral sides connecting the first and second sides, the first conductors projecting from a first of the lateral sides of the molded body, the first conductors comprising end faces facing away from the first of the lateral sides of the molded body, and lateral faces extending from the first of the lateral sides to the respective end face, and wherein at least two opposite lateral faces of each of the first conductors are completely covered by projections of the molded body, and wherein the projections of the molded body of opposite conductors are spaced apart from each other.

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