Electronic module unit with double sealing
DE102025112015A1Undetermined Publication Date: 2026-10-01AESCULAP AG
Patent Information
- Application Number
- DE102025112015
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-03-27
- Publication Date
- 2026-10-01
Smart Images
Figure 00000000_0000_ABST
Abstract
The present disclosure relates to an electronic module unit (1) comprising a housing (2, 3) having a first housing part (2) and a second housing part (3), and an electronic module (4) which is received in the housing (2, 3), wherein the first housing part (2) and the second housing part (3) cooperate to enclose the electronic module (4). According to the disclosure, the first housing part (2) and the second housing part (3) are connected to each other along their common contact surface by at least two spatially separated sealing seams (5, 6).
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Citation Information
Patent Citations
Housing for an electrical component and method for manufacturing a housing for an electrical component
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