Three-dimensional non-conductive carrier with a metallized surface layer and method for producing such a three-dimensional non-conductive carrier with a metallized surface layer

DE102025112679A1Undetermined Publication Date: 2026-10-01ROBERT BOSCH GMBH
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Patent Information

Application Number
DE102025112679
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-04-01
Publication Date
2026-10-01

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Abstract

Three-dimensional non-conductive support with a metallized surface layer, wherein the metallized surface layer is arranged on an underlying laser-melted section of the three-dimensional non-conductive support, wherein the laser-melted section comprises a microporous surface at an interface with the metallized surface layer, wherein the microporous surface has a smooth topography with a surface roughness value (Rz) of a few micrometers.
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Citation Information

Patent Citations

  • Metallized plastic surface and method for processing metallized plastic surfaces

    DE102006041610B3

  • Metallizing a surface of polymeric-substrates useful for producing conductive structures during laser direct structuring-method, comprises e.g. metallizing the substrate wetted with an alkaline solution by chemical deposition of a metal

    DE102011055117A1

  • Method and manufacturing system for the additive manufacturing of a circuit unit as well as circuit unit

    DE102023100450A1

  • Method of producing formed circuit component

    EP2555601A1