DISPLAY DEVICE

Abstract

A display device according to one embodiment comprises a substrate having a display area comprising multiple subpixels, each containing a first subpixel, a second subpixel, and a third subpixel, and a non-display area surrounding the display area; a first electrode located on the substrate in each of the subpixels; a bank located on the first electrode, positioned at a boundary between adjacent subpixels, covering a circumferential portion of an upper surface of the first electrode, and comprising a first bank on the first electrode and a second bank on the first bank; and an organic layer located on the first electrode and the bank, extending over the multiple subpixels, wherein the first bank has an overlapping portion that overlaps with the second bank and a first exposed portion that is exposed by the second bank and comprises a side surface.The bench contains a groove section formed in such a way that it is recessed from an upper surface of the bench, and a separating section that surrounds the first exposed section in a top view.

Description

[0001] The present application claims priority over Korean patent application No. 10-2024-0169650, filed on November 25, 2024. BACKGROUND OF THE INVENTION Area of ​​the invention

[0002] This registration text refers to a display device. Description of the related area

[0003] As the information society progresses, there is an increasing need for display devices that can show images, and various types of display devices are used, such as liquid crystal display devices (LCD devices) and display devices with organic light-emitting diodes (OLED displays).

[0004] The display device contains several pixels and is equipped with several switching elements to control and manage the pixels. SUMMARY OF THE INVENTION

[0005] One objective of the embodiments of this application is to provide a display device that can improve lateral leakage current between adjacent subpixels.

[0006] Another function of the embodiments of this application is to provide a display device that can absorb external light falling under a bench.

[0007] Another objective of the embodiments of this application is to provide a display device that can improve the spreading capability of a second encapsulation layer (or an organic encapsulation layer).

[0008] A further objective of the embodiments of this application is to provide a display device with low reflections.

[0009] At least one of these problems is solved by the features of the independent claim. The problems addressed in this application are not limited to those mentioned above, and further problems can be derived from the following embodiments.

[0010] To solve the above-mentioned problem, a display device according to one embodiment comprises a substrate having a display area comprising several subpixels, each containing a first subpixel, a second subpixel, and a third subpixel, and a non-display area surrounding the display area; a first electrode located on the substrate in each of the subpixels; a bank located on the first electrode, positioned at a boundary between adjacent subpixels, covering a circumferential section of an upper surface of the first electrode, and comprising a first bank on the first electrode and a second bank on the first bank; and an organic layer located on the first electrode and the bank, extending over the several subpixels.In a preferred embodiment, the first bench comprises an overlapping section that overlaps with the second bench, and a first exposed section that is exposed by the second bench and includes a side surface, wherein the bench includes a groove section that is formed such that it is recessed by an upper surface of the bench, and a separating section that surrounds the first exposed section in a top view.

[0011] To solve the aforementioned problems, a display device according to one embodiment comprises a substrate having a display area comprising several subpixels, each containing a first subpixel, a second subpixel, and a third subpixel, and a non-display area surrounding the display area; a first electrode located on the substrate in each of the subpixels; a bank located on the first electrode, positioned at a boundary between adjacent subpixels, covering a circumferential section of an upper surface of the first electrode, and comprising a first bank on the first electrode and a second bank on the first bank; a separating section on an upper surface of the bank between adjacent subpixels; and an organic layer located on the first electrode, the bank, and the separating section, extending over the several subpixels.In a preferred embodiment, the first bench comprises an overlapping section that overlaps with the second bench, and a first exposed section that is exposed by the second bench and includes a side surface, wherein the bench includes a groove section that is formed such that it is recessed from the upper surface of the bench.

[0012] The specific details of further embodiments are included in the detailed description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a top view of a display device according to one embodiment; Fig. 2 is a cross-sectional view of the scoreboard of Fig. 1 in a bent state; Fig. 3 is a cross-sectional view taken along line AA' from Fig. 1 was taken; Fig. Figure 4 shows a precise cross-sectional view of the light-emitting layer of Fig. 3; Fig. Figure 5 is an accurate cross-sectional view of the light-emitting layer according to an alternative embodiment; Fig. Figure 6 is a top view showing the arrangement of subpixels in the display area of Fig. 1 illustrates; Fig. 7 is a cross-sectional view taken along line BB' from Fig. 6 was taken; Fig. Figure 8 is a schematic diagram showing the improvement in the spreading capability of the second encapsulation layer due to the groove section according to Fig. 7 illustrates; Fig. 9 is a cross-sectional view of a display device according to a further embodiment; Fig. Figure 10 is a top view illustrating the arrangement of subpixels in a display area according to a further embodiment; Fig. Figure 11 is a top view illustrating the arrangement of subpixels in a display area according to a further embodiment; Fig. Figure 12 is a top view illustrating the arrangement of subpixels in a display area according to a further embodiment; Fig. Figure 13 is a top view illustrating the arrangement of subpixels in a display area according to a further embodiment; Fig. 14 is a cross-sectional view taken along line CC' from Fig. 13 was taken; Fig. Figure 15 is a top view illustrating the arrangement of subpixels in a display area according to a further embodiment; Fig. 16 is a cross-sectional view taken along line DD' from Fig. 15 was taken; Fig. 17 is a cross-sectional view of a display device according to a further embodiment; Fig. Figure 18 is a perspective view of a display device according to a further embodiment and Fig. 19 is a cross-sectional view taken along line EE' from Fig. 18 was taken. DETAILED DESCRIPTION OF THE INVENTION

[0013] The following describes embodiments with reference to the accompanying drawings.

[0014] The same reference numerals refer to the same components. Additionally, the thickness, ratios, and dimensions of components may be exaggerated in the drawings for the purpose of effectively illustrating the technical content. Although they are shown to a scale different from their actual scale for the sake of clarity, the components are not limited to the scale shown in the drawing.

[0015] In the application text, if a component (or a surface, a layer, a part, etc.) is mentioned as "on", "connected to" or "coupled to" another component, it means that it may be directly connected to / coupled to the other component or that a third component may be arranged between them.

[0016] The expression “and / or” is understood to contain one or more combinations that may be defined by associated components.

[0017] The terms "first," "second," etc., are used to describe different components; however, the components are not intended to be limited by these terms. The terms are used merely to distinguish one component from another. For example, a first component may be referred to as a second component, and conversely, the second component may be referred to as the first component, without altering the scope of the embodiments. It is intended that the singular forms also include the plural forms, unless the context clearly indicates otherwise.

[0018] Terms such as "below," "lower," "above," "upper," etc., are used here to describe the relationship between components depicted in the drawings. These terms are relative concepts and are described based on the direction indicated in the drawing. For example, unless explicitly stated with terms such as "directly" or "immediately," one or more other components may be positioned between two described components. Spatially relative terms such as "below," "under," "lower," "above," and "upper" can be used to facilitate the description of the relationship between one component or element and one or more others, as illustrated in the drawings.These spatially relative terms should be understood to encompass various orientations of a component during use or operation, in addition to the orientation shown in the drawings. For example, if a component shown in the drawings is inverted, a component described as "under" or "below" another component may then be positioned "above" that component. Similarly, the term "under" can, for example, include both upward and downward directions.

[0019] It is further understood that the terms "include", "constitute" and the like are intended to establish the presence of specified characteristics, numbers, steps, operations, components, parts or a combination thereof, but are not intended to exclude the presence or possibility of one or more other characteristics, numbers, steps, operations, components, parts or combinations thereof.

[0020] The various features of the embodiments of the disclosure can be combined or assembled either partially or completely in a technically different way, and each embodiment can be implemented independently or in conjunction with related embodiments.

[0021] The display devices according to the embodiments of this application text are described below with reference to the accompanying drawings.

[0022] Fig. 1 is a top view of a display device according to one embodiment;

[0023] With reference to Fig. In one embodiment, a display device 1 can include a display panel 100. The display panel 100 can include a display area DA containing several pixels PX and a non-display area NDA surrounding the display area DA. Each pixel can contain several subpixels. The display area DA can have a rectangular planar shape. However, the display area DA is not limited to this and can have a square, circular, elliptical, or other polygonal planar shape. For example, the display area DA can have a rounded rectangular shape, but it is not limited to this and can also be a rectangular shape with pointed corners.

[0024] In the embodiments, the first direction DR1 and the second direction DR2 are different directions that intersect each other, e.g., directions that intersect perpendicularly in a top view. Fig. In general, the first direction DR1 corresponds to the direction of extension of the short sides of the display panel 100, and the second direction DR2 can correspond to the direction of extension of the long sides of the display panel 100. However, the directions mentioned in the embodiments are to be understood as relative directions, and the embodiments are not limited to the directions mentioned.

[0025] The display area DA can contain short sides extending in the first direction DR1 and long sides extending in the second direction DR2. The non-display area NDA can surround the display area DA. The non-display area NDA can be located on one side and the far side of the display area DA in the first direction DR1 and on one side and the far side of the display area DA in the second direction DR2.

[0026] The display panel 100 can further contain sensor non-display areas NDA_S and sensor holes SH, which are surrounded by the sensor non-display areas NDA_S. The sensor holes SH1 and SH2 can be surrounded by the display area DA in a top view. The sensor holes SH1 and SH2 can, for example, be two in number, as shown in Fig. Figure 1 shows one embodiment, but the embodiments of this application are not limited thereto. For example, a single sensor hole may be provided. The two sensor holes SH1 and SH2 may be provided for arranging an infrared sensor and a camera sensor, respectively; however, the embodiments of this application are not limited to this configuration. The sensor non-display area NDA_S may be arranged between the sensor holes SH1 and SH2 and the display area DA. The sensor non-display area NDA_S may completely surround the sensor holes SH1 and SH2. Pixels PX need not be arranged in the sensor non-display area NDA_S. In certain embodiments, an optical surface may be arranged instead of the sensor holes SH1 and SH2. Pixels PX may be arranged in the optical surface, but the number of pixels PX per unit area of ​​the optical surface may be less than the number of pixels PX per unit area of ​​the display area DA.

[0027] A gate driver unit (GIP) can be located in the non-display area (NDA), which is positioned on each side of the display area (DA) in the first direction (DR1). A low-voltage line (VSSL) can be located outside the gate driver unit (GIP) in the non-display area (NDA). For example, as shown in Fig. As shown in Figure 1, the low potential voltage line VSSL extends from a flexible printed circuit board FPCB, passes through a sub-area SR and a bending area BR, and is positioned outside the gate drive unit GIP in the non-display area NDA while surrounding the display area DA.

[0028] The non-display area NDA, located on the opposite side of the display area DA in the second direction DR2, can extend further in the second direction DR2 from the central section of that side of the display area DA. The width in the first direction DR1 of the non-display area NDA, extending further in the second direction DR2 from the central section of the opposite side of the display area DA in the second direction DR2, can be smaller than the width in the first direction DR1 of the non-display area NDA adjacent to the opposite side of the display area DA in the second direction DR2.

[0029] The display device 1 can include a main area MR, a sub-area SR, and a bending area BR between the main area MR and the sub-area SR. The display area DA and the non-display area NDA surrounding the display area DA on all four sides can form the main area MR, while the section extending in the second direction DR2 from the central section of the far side of the display area DA can form the bending area BR and the sub-area SR. The bending area BR can be positioned between the sub-area SR and the main area MR. The sub-area SR can include a first contact surface PA1 and a second contact surface PA2, which is located at the opposite end of the sub-area SR in the second direction DR2. The display device 1 can further include a data driver DIC and a printed circuit board FPCB.The data driver unit (DIC) can be located in the first contact area PA1, and the flexible printed circuit board (FPCB) can be attached to the second contact area PA2. The first contact area PA1 and the second contact area PA2 can each contain a number of connection pads that connect the data driver unit (DIC) and the flexible printed circuit board (FPCB). The data driver unit (DIC) can be provided, for example, in the form of a driver chip IC, but is not limited to this. In one embodiment, the data driver unit (DIC) is arranged using a chip-on-plastic process and mounted directly on the display panel 100, but is not limited to this and can also be arranged using a chip-on-glass or chip-on-thin-film process.

[0030] The display panel 100 according to one embodiment can further include a crack detection pattern CSP surrounding the low-potential voltage line VSSL. The crack detection pattern CSP can be arranged such that it completely surrounds the display area DA, as shown in Fig. Figure 1 shows that, for example, the crack detection pattern CSP can be arranged on the outside of the low-potential voltage line VSSL. However, the embodiments of this application are not limited to this, and the crack detection pattern CSP need not be partially arranged in the non-indication area NDA on the opposite side of the indication area DA in the second direction DR2.

[0031] Fig. 2 is a cross-sectional view showing a bent state of the scoreboard in Fig. 1 illustrates.

[0032] With reference to Fig. 2. According to one embodiment, the bending area BR of the display panel 100 of the display device 1 can be bent in the thickness direction (or the third direction DR3). This allows the main area MR and the sub-area SR to overlap in the thickness direction. The display panel 100 can be bent such that the bottom surface of the main area MR and the top surface of the sub-area SR face each other. A flexible printed circuit board FPCB can be attached to the end of the sub-area SR.

[0033] Fig. 3 is a cross-sectional view taken along line AA' from Fig. 1 was taken.

[0034] With reference to Fig. 3 The display panel 100 can contain a substrate 101, a buffer layer 102, a first thin-film transistor 120, a second thin-film transistor 130, a storage electrode 140, an emission surface 150, an encapsulation layer 170, a contact layer 180 and an upper organic layer 190. Fig. Figure 5 illustrates a cross-section of three subpixels of one of the pixels PX.

[0035] Substrate 101 can contain one or more plastic materials. For example, substrate 101 can be a multi-substrate containing several plastic materials such as polyimide, but is not limited to this. For example, substrate 101 can contain a first substrate section 101a containing an organic material, a second substrate section 101b containing an organic material, and a third substrate section 101c containing an inorganic material, but the embodiments described in this application are not limited to these.

[0036] A buffer layer 102 can be arranged on the substrate 101. The buffer layer 102 can minimize or delay the diffusion of moisture or oxygen penetrating the substrate 101. The buffer layer 102 can be formed by alternating stacking of silicon nitride (SiNx) and silicon oxide (SiOx) at least once, but is not limited to this.

[0037] A first light-shielding layer 126 can be arranged at the buffer layer 102. The first light-shielding layer 126 can prevent light from passing through the first semiconductor layer 123 of the first thin-film transistor 120. For example, the first semiconductor layer 123 can be arranged to overlap with the first light-shielding layer 126. The first light-shielding layer 126 can be a single layer or a multiple layer formed from, but is not limited to, one or more alloys of molybdenum (Mo), aluminum (Al), chromium (Cr), nickel (Ni), neodymium (Nd), and copper (Cu).

[0038] The first insulating layer 103 can be arranged on the first light-shielding layer 126. The first insulating layer 103 can prevent a short circuit between the components of the first thin-film transistor 120 and the first light-shielding layer 126. The first insulating layer 103 can be made of the same material as the buffer layer 102, but is not limited to this. For example, the first insulating layer 103 can be made of an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), but is not limited to this.

[0039] A first thin-film transistor 120 can be arranged on the first insulating layer 103. The first thin-film transistor 120 can include a first source electrode 121, a first gate electrode 122, a first semiconductor layer 123, and a first drain electrode 124.

[0040] The first semiconductor layer 123 can be arranged on the first insulating layer 103. The first semiconductor layer 123 can contain, but is not limited to, a metal oxide semiconductor such as indium gallium zinc oxide (IGZO) or a silicon-based semiconductor material such as amorphous silicon or polycrystalline silicon. The first semiconductor layer 123 can contain a channel region, a source region, and a drain region.

[0041] The polycrystalline semiconductor layer can exhibit higher mobility than the amorphous semiconductor layer and the oxide semiconductor layer, which can result in lower power consumption and improved reliability. Therefore, the driver transistor can be formed using a polycrystalline semiconductor layer.

[0042] A second insulating layer 104 can be arranged on the first semiconductor layer 123. The second insulating layer 104 can be made of the same material as the first insulating layer 103 and can prevent short circuits between the first semiconductor layer 123 and other components of the first thin-film transistor 120.

[0043] A first gate electrode 122 can be arranged on the second insulating layer 104. The first gate electrode 122 can be arranged such that it overlaps with the channel region of the first semiconductor layer 123, which is positioned on the second insulating layer 104. The first gate electrode 122 can be arranged as a single layer or multiple layers containing materials such as molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), or their compounds. The first gate electrode 122 can be arranged together with a gate conductor.

[0044] A third insulating layer 105 can be arranged at the first gate electrode 122. The third insulating layer 105 can be made of the same material as the first insulating layer 103 or the second insulating layer 104.

[0045] A first source electrode 121 and a first drain electrode 124 can be arranged on the third insulation layer 105.

[0046] The first source electrode 121 and the first drain electrode 124 can be electrically connected to the first semiconductor layer 123 via contact holes. The first source electrode 121 and the first drain electrode 124 can be made of a metallic material. For example, the first source electrode 121 and the first drain electrode 124 can be a single layer or multiple layers made of, but are not limited to, molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or alloys thereof.

[0047] The first source electrode 121 and the first drain electrode 124 can be arranged together with the data line. For example, the data line can be made of the same material as the first source electrode 121 and the first drain electrode 124 and can be formed in the same layer, but is not limited to this.

[0048] The storage electrode 140 can be arranged separately from the first thin-film transistor 120. The storage electrode 140 can contain a first storage electrode 141 and a second storage electrode 142.

[0049] The first storage electrode 141 can be arranged in the same layer as the first gate electrode 122 and made of the same material, but is not limited to this.

[0050] The second storage electrode 142 can be arranged on the first storage electrode 141. The second storage electrode 142 can be arranged on the third insulating layer 105, and a capacitor can be formed between the first storage electrode 141 and the second storage electrode 142, with the third insulating layer 105 acting as a dielectric. The second storage electrode 142 can be made of the same material as the first storage electrode 141, but is not limited to this.

[0051] The second thin-film transistor 130 can be arranged at a distance from the first thin-film transistor 120 and the storage electrode 140. The second thin-film transistor 130 can include a second source electrode 131, a second gate electrode 132, a second semiconductor layer 133, and a second drain electrode 134.

[0052] The second light-shielding layer 136 can be arranged in the same layer as the second storage electrode 142.

[0053] The second light-shielding layer 136 can prevent light from reaching the second semiconductor layer 133, similar to the first light-shielding layer 126, thereby extending the lifetime of the second thin-film transistor 130. For example, the second semiconductor layer 133 can be arranged overlapping with the second light-shielding layer 136.

[0054] The fourth insulating layer 106 can be arranged on the second light-shielding layer 136. The fourth insulating layer 106 can be made of the same material as the first insulating layer 103, the second insulating layer 104, or the third insulating layer 105, but is not limited to this.

[0055] The second semiconductor layer 133 can be arranged on the fourth insulating layer 106. The second semiconductor layer 133 can contain a source region, a drain region, and a channel region between the source region and the drain region.

[0056] The second semiconductor layer 133 can contain, but is not limited to, a metal oxide semiconductor such as indium gallium zinc oxide, amorphous silicon or a silicon-based semiconductor material such as polycrystalline silicon.

[0057] The fifth insulating layer 108 can be arranged on the second semiconductor layer 133. The fifth insulating layer 108 can be made of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layer 105, or the fourth insulating layer 106, but is not limited to this.

[0058] The second gate electrode 132 can be arranged on the fifth insulation layer 108.

[0059] The second gate electrode 132 can be made of the same material as the first gate electrode 122. For example, the second gate electrode 132 can be formed as a single layer or a multiple layer containing, but not limited to, molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), or their compounds.

[0060] The sixth insulating layer 109 can be arranged at the second gate electrode 132. The sixth insulating layer 109 can be made of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layer 105, the fourth insulating layer 106, or the fifth insulating layer 108, but is not limited to this.

[0061] The first source electrode 121, the first drain electrode 124, the third storage electrode 143, the second source electrode 131 and the second drain electrode 134 can be arranged on the sixth insulation layer 109.

[0062] The second source electrode 131 and the second drain electrode 134 can be made of the same material as the first source electrode 121 and the first drain electrode 124 and can be arranged in the same layer. For example, the second source electrode 131 and the second drain electrode 134 can be a single layer or a multiple layer made of, but are not limited to, molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). The second source electrode 131 can be electrically connected to the second storage electrode 142.

[0063] The first thin-film transistor 120 can be a switching transistor and the second thin-film transistor 130 can be a control transistor, however the embodiments are not limited to this.

[0064] The first source electrode 121 and the first drain electrode 124 can have a first protective layer 111 arranged on them.

[0065] The first protective layer 111 can flatten the upper part of the first thin-film transistor 120 and protect the first thin-film transistor 120. The first protective layer 111 can be made of an organic material. For example, the first protective layer 111 can be formed from an organic material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin, but is not limited to these.

[0066] The second protective layer 112 can be arranged on top of the first protective layer 111. The second protective layer 112 can be made of the same material as the first protective layer 111, but is not limited to it.

[0067] A connecting electrode 145 can be arranged between the first protective layer 111 and the second protective layer 112.

[0068] The connecting electrode 145 can electrically connect the second thin-film transistor 130 and the light-emitting layer 150. The connecting electrode 145 can be made of the same material as the first source electrode 121 and the first drain electrode 124, but is not limited to this.

[0069] The connecting electrode 145 can be a single layer or a multiple layer made of, but is not limited to, molybdenum (Mo), aluminium (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu).

[0070] The light-emitting layer 150 can be arranged on the second protective layer 112. The light-emitting layer 150 can include a first electrode 151, an organic layer 152, and a second electrode 153. A third protective layer can also be arranged on the second protective layer 112, but the embodiments of this application are not limited thereto. If the third protective layer is arranged, an additional connecting electrode similar to the connecting electrode can also be arranged.

[0071] The first electrode 151 can be arranged on the second protective layer 112. The first electrode 151 can be electrically connected to the first thin-film transistor 120 via a contact hole formed in the second protective layer 112. The first electrode 151 can be a reflective electrode that reflects light, but is not limited to this. The first electrode 151 can comprise a stacked structure of aluminum (Al) and titanium (Ti) (Ti / Al / Ti), a stacked structure of aluminum (Al) and ITO (ITO / Al / ITO), or a high-reflectivity metal material such as an APC alloy, and can be formed as a single layer or a multiple layer, but is not limited to this.

[0072] The organic layer 152 can be arranged at the first electrode 151. The organic layer 152 can contain one or more light-emitting structures (or light-emitting elements) stacked at the first electrode 151 in the order of a hole transport layer and an electron transport layer, or in the reverse order. The organic layer 152 can be, but is not limited to, an organic light-emitting layer, an inorganic light-emitting layer, a light-emitting quantum dot layer, a micro light-emitting diode, or a micro-mini light-emitting diode. For example, in the display panel 100 according to one embodiment of this application, the organic layer 152 can contain an organic light-emitting layer. The organic layer 152 can contain a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer.

[0073] A second electrode 153 can be arranged on the organic layer 152. The second electrode 153 can be a transparent electrode that transmits light, but is not limited to this. For example, the second electrode 153 can contain a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), or a metal that transmits visible light.

[0074] A bank 154 can be arranged to expose the first electrode 151. The bank 154 can define an opening (or an emission surface EA) of a subpixel and can be arranged to cover an edge segment of the first electrode 151. Each subpixel can contain a red emission surface, a green emission surface, and a blue emission surface. For example, a subpixel can be defined as a pixel, but the terminology is not limited to this.

[0075] The bank 154 can comprise a first bank 154a and a second bank 154b arranged adjacent to the first bank 154a. The first bank 154a can be a black bank containing a black-based material, and the second bank 154b can contain a transparent-based material. The second bank 154b can contain the same material as the spacer 155 and can be formed by a grid mask or a slot; however, the embodiments described in this application are not limited to these. A bank 154 can be arranged to expose the first electrode 151. The bank 154 can have a separation section that is recessed in a thickness direction. That is, the bank 154 can contain a separation section, and the separation section can contain a trench section TRP, as shown in Fig. Figure 3 shows that in trench section TRP, the entire second bank 154b and part of the first bank 154a can be sunk, however, the embodiments of this application are not limited to this and it may be that only the entire second bank 154b is sunk or only part of the second bank 154b is sunk.

[0076] The organic layer 152 has the advantage of improving a lateral leakage flow because a flow path is extended through the trench section TRP.

[0077] A spacer 155 can also be arranged on the bench 154.

[0078] An encapsulation layer 170 can be arranged on the bank 154 or the light-emitting layer 150. The encapsulation layer 170 can contain one or more insulating layers. For example, the encapsulation layer 170 can contain a first encapsulation layer 171, a second encapsulation layer 172 arranged in addition to the first encapsulation layer 171, and a third encapsulation layer 173 arranged in addition to the second encapsulation layer 172. The encapsulation layer 170 can contain one or more layers of inorganic material and one or more layers of organic material. For example, the first encapsulation layer 171 and the third encapsulation layer 173 can contain an inorganic material, and the second encapsulation layer 172 can contain an organic material.

[0079] A contact buffer layer 181 can be arranged on the encapsulation layer 170. For example, the contact buffer layer 181 can be arranged on the third encapsulation layer 173. The contact buffer layer 181 can be made of the same material as the buffer layer 102. A first contact-conducting layer can be arranged on the contact buffer layer 181. A contact insulation layer 184 can be arranged on the first contact-conducting layer. The contact insulation layer 184 can prevent a short circuit between contact electrodes. The contact insulation layer 184 can contain an organic or an inorganic material. Fig. Figure 5 illustrates the contact insulation layer 184 containing an organic material; however, the embodiments of this application are not limited thereto. A second contact-conducting layer can be arranged on the contact insulation layer 184.

[0080] The first contact-conducting layer can contain a second contact electrode 182 and the second contact-conducting layer can contain a first contact electrode 185.

[0081] The second contact electrode 182 can be electrically connected to the first contact electrode 185 by a contact hole formed in the contact insulation layer 184.

[0082] The first contact electrode 185 and the second contact electrode 182 can contain metallic materials. For example, the first contact-conducting layer and the second contact-conducting layer can be formed from titanium (Ti), nickel (Ni), aluminum (Al), or an alloy thereof, and can be formed as a triple layer such as titanium (Ti) / aluminium (Al) / titanium (Ti), but are not limited to this.

[0083] A filter insulation layer 114 can be arranged on the contact layer 180, and a black matrix BM can be arranged on the filter insulation layer 114. A color filter 191 can be arranged on the black matrix BM. The color filter 191 can be a red color filter, a green color filter, or a blue color filter; however, the embodiments described in this application are not limited to these. The color filter 191 can overlap with the first electrode 151.

[0084] In Fig. 5 illustrates that the separation distance between the black matrices BM at both ends of the color filter 191 is smaller than the separation distance between the first banks 154a at both ends of the first electrode 151 positioned below it; however, the embodiments of this application are not limited to this and the separation distance between the black matrices BM at both ends of the color filter 191 may be larger than the separation distance between the first banks 154a at both ends of the first electrode 151 positioned below it.

[0085] An upper organic layer 190 can be arranged on the color filter 191, however, the embodiments of this application are not limited thereto.

[0086] Fig. Figure 4 shows a precise cross-sectional view of the light-emitting layer of Fig. 3.

[0087] With reference to Fig. 4. The light-emitting layer 150 can extend over a first subpixel PX1, a second subpixel PX2, and a third subpixel PX3. The pixel PX of Fig. 3 can contain multiple subpixels PX1 to PX3.

[0088] The thickness of the light-emitting layer 150 can differ in each subpixel PX1, PX2 and PX3, however, the embodiments of this application are not limited to this and the thickness of the light-emitting layer 150 can also be the same in each subpixel PX1, PX2 and PX3.

[0089] Organic layer 152 can contain a first organic layer 152a located in the first subpixel PX1, a second organic layer 152b located in the second subpixel PX2, and a third organic layer 152c located in the third subpixel PX3. The light-emitting layers EML1, EML2, and EML3 in the respective organic layers 152a, 152b, and 152c can be physically separated; however, the lower and upper layers of the light-emitting layers EML1, EML2, and EML3 above the subpixels PX1, PX2, and PX3 can be formed as a single unit. The thickness of the light-emitting layers EML1, EML2, and EML3 can differ. For example, the thickness of the first light-emitting layer EML1 may be the greatest, followed by the second light-emitting layer EML2, and the thickness of the third light-emitting layer EML3 may be the smallest, but the embodiments of this application are not limited thereto.

[0090] The hole injection layer (HIL) can be arranged at the first electrode 151. The hole injection layer (HIL) can be positioned between the first electrode 151 and the light-emitting layers EML1, EML2, and EML3. The hole injection layer (HIL) can be formed in one piece over the subpixels PX1, PX2, and PX3. For example, the hole injection layer (HIL) can be made from a hole injection material selected from substances such as MTDATA, CuPc, TCTA, NPB (NPD), HATCN, TDAPB, PEDOT / PSS, F4TCNQ, and N-(biphenyl 4-yl)-9,9-dimethyl-N-(4-(9-phenyl-9H-carbazol-3-yl)phenyl)-9H-fluorene-2-amine; however, the embodiments described in this application are not limited to these.

[0091] The hole transport layer (HTL) can be located on the hole injection layer (HIL). The hole transport layer (HTL) can be positioned between the hole injection layer (HIL) and the light-emitting layers (EML1), (EML2), and (EML3). The hole transport layer (HTL) can be formed monolithically over the subpixels (PX1), (PX2), and (PX3). The hole transport layer (HTL) can contain one or more arylamine-based compounds selected from the group consisting of NPB (N,N'-naphthyl-N,N'-phenylbenzidine), TPD (N,N'-bis-(3-methylphenyl)-N,N'-bis-(phenyl)benzidine), PPD, TTBND, FFD, p-dmDPS, TAPC; aromatic starburst amines such as TCTA, PTDATA, TDAPB, TDBA, 4-α, TCTA; Materials of the Spiro and conductor type such as Spiro-TPD, Spiro-mTTB, Spiro-2; and NPD (N,N'-Dinaphthyl-N,N'-Diphenyl-benzidine), s-TAD and MTDATA (4,4',4"-Tris(N-3-Methylphenyl-N-Phenyl-Amino)-Triphenylamine) are included, however, the embodiments of this application are not limited thereto.

[0092] The light-emitting layers EML1, EML2, and EML3 can be arranged on the hole transport layer HTL. The first subpixel PX1 can have the first light-emitting layer EML1, the second subpixel PX2 can have the second light-emitting layer EML2, and the third subpixel PX3 can have the third light-emitting layer EML3.

[0093] The thickness of the light-emitting layers EML1, EML2, and EML3 can differ. For example, the first light-emitting layer EML1 can have a thickness in the range of 60 to 80 nm, the second light-emitting layer EML2 can have a thickness in the range of 30 to 50 nm, and the third light-emitting layer EML3 can have a thickness in the range of 10 to 30 nm; however, the embodiments of this application are not limited to these.

[0094] The first light-emitting layer EML1, the second light-emitting layer EML2 and the third light-emitting layer EML3 can contain materials that emit light in the visible light spectrum by combining holes and electrons that are transported separately.

[0095] An electron barrier layer (EBL) can be placed on any of the light-emitting layers EML1, EML2, and EML3. The electron barrier layer EBL can also be placed as a single unit over the subpixels PX1, PX2, and PX3.

[0096] An electron transport layer (ETL) can be arranged on the electron barrier layer (EBL). The electron transport layer (ETL) can be arranged in one piece over the subpixels PX1, PX2, and PX3. The electron transport layer (ETL) can be formed from anthracene derivatives and lithium quinolate (Liq) or can contain materials selected from oxadiazole, triazole, phenanthroline, benzoxazole, benzthiazole, or benzimidazole (e.g., 2-[4-(9,10-Di-2-naphthalenyl-2-anthracenyl)phenyl]-1-phenyl-1H-benzimidazole), however, the embodiments of this application are not limited thereto.

[0097] The second electrode 153 can be arranged on the electron transport layer ETL.

[0098] Fig. Figure 5 is an accurate cross-sectional view of the light-emitting layer according to an alternative embodiment.

[0099] With reference to Fig. 4 and Fig. 5. The organic layer 152_1 can contain a first organic layer 152a_1, which is located in the first subpixel PX1, a second organic layer 152b_1, which is located in the second subpixel PX2, and a third organic layer 152c_1, which is located in the third subpixel PX3. In this application text, as in Fig. 4 and Fig. Figure 5 illustrates the light-emitting layer of the organic layer 152, 152_1 for each subpixel PX1, PX2, PX3 as being formed in one or two stacks, however, the embodiments of this application are not limited thereto and the light-emitting layer may be formed in three or more stacks.

[0100] The light-emitting layers in the respective organic layers 152a_1, 152b_1, and 152c_1 may be physically separate; however, the lower and upper layers of the light-emitting layers above the subpixels PX1, PX2, and PX3 may be formed as a single unit. The thickness of the light-emitting layers may vary. For example, the first light-emitting layer in the first subpixel may have the greatest thickness, followed by the second light-emitting layer in the second subpixel, with the third light-emitting layer in the third subpixel having the smallest thickness; however, the embodiments of this application are not limited to these. Additionally, the light-emitting layers in each organic layer 152a_1, 152b_1, and 152c_1 may contain two or more layers.

[0101] The hole injection layer (HIL) can be arranged at the first electrode 151. The hole injection layer (HIL) can be positioned between the first electrode 151 and the light-emitting layers EML1a, EML2a, and EML3a. The hole injection layer (HIL) can be formed in one piece over the subpixels PX1, PX2, and PX3. For example, the hole injection layer (HIL) can be made from a hole injection material selected from substances such as MTDATA, CuPc, TCTA, NPB (NPD), HATCN, TDAPB, PEDOT / PSS, F4TCNQ, and N-(biphenyl 4-yl)-9,9-dimethyl-N-(4-(9-phenyl-9H-carbazol-3-yl)phenyl)-9H-fluorene-2-amine; however, the embodiments described in this application are not limited to these.

[0102] The first hole transport layer (HTL1) can be located on the hole injection layer (HIL). The first hole transport layer (HTL1) can be positioned between the hole injection layer (HIL) and the light-emitting layers (EML1a), EML2a, and EML3a. The first hole transport layer (HTL1) can be formed monolithically over the subpixels (PX1), PX2, and PX3. The first hole transport layer (HTL1) can contain one or more selected compounds from the group consisting of arylamine-based compounds such as NPB (N,N'-naphthyl-N,N'-phenylbenzidine), TPD (N,N'-bis-(3-methylphenyl)-N,N'-bis-(phenyl)benzidine), PPD, TTBND, FFD, p-dmDPS, TAPC; aromatic starburst amines such as... B. TCTA, PTDATA, TDAPB, TDBA, 4-a, TCTA; Spiro- and conductor-type materials such as e.g.Spiro-TPD, Spiro-mTTB, Spiro-2; and NPD (N,N'-Dinaphthyl-N,N'-Diphenyl-Benzidine), s-TAD and MTDATA (4,4',4"-Tris(N-3-Methylphenyl-N-Phenyl-Amino)-Triphenylamine), however, the embodiments of this application are not limited thereto.

[0103] The light-emitting layers EML1a, EML2a, and EML3a can be arranged on the first hole transport layer HTL1. The first subpixel PX1 can have a first light-emitting layer EML1a within it, the second subpixel PX2 can have a second light-emitting layer EML2a within it, and the third subpixel PX3 can have a third light-emitting layer EML3a within it. The light-emitting layers EML1a, EML2a, and EML3a can be identical to the respective light-emitting layers EML1, EML2, and EML3 in Fig. 4.

[0104] The thickness of the light-emitting layers EML1a, EML2a, and EML3a can differ. For example, the first light-emitting layer EML1a can have a thickness in the range of 60 to 80 nm, the second light-emitting layer EML2a can have a thickness in the range of 30 to 50 nm, and the third light-emitting layer EML3a can have a thickness in the range of 10 to 30 nm; however, the embodiments described in this application are not limited to these.

[0105] A hole barrier layer (HBL) can be placed on each of the light-emitting layers EML1a, EML2a, and EML3a. The hole barrier layer (HBL) can be placed in a single unit over the subpixels PX1, PX2, and PX3.

[0106] The first electron transport layer ETL1 can be arranged at the hole barrier layer HBL. The first electron transport layer ETL1 can be arranged in one piece over the subpixels PX1, PX2, and PX3. The first electron transport layer ETL1 can be formed from an anthracene derivative and lithium quinolate (Liq), or it can contain one or more of the following selected from the group consisting of oxadiazole, triazole, phenanthroline, benzoxazole, benzthiazole, or benzimidazole (e.g., 2-[4-(9,10-Di-2-naphthalenyl-2-anthracenyl)phenyl]-1-phenyl-1H-benzimidazole), however, the embodiments of this application are not limited thereto.

[0107] A common charge-generating layer (CGL) can be arranged at the first electron transport layer (ETL1). The common charge-generating layer (CGL) can be arranged between the first electron transport layer (ETL1) and the second hole transport layer (HTL2). The common charge-generating layer (CGL) can contain a conductor material; however, the embodiments described in this application are not limited to such materials.

[0108] The second hole transport layer HTL2 can be arranged on the common charge layer CGL. The second hole transport layer HTL2 can be positioned between the hole barrier layer HBL and the light-emitting layers EML1b, EML2b, and EML3b. The second hole transport layer HTL2 can be formed in one piece over the subpixels PX1, PX2, and PX3. The material of the second hole transport layer HTL2 can be the same as that of the first hole transport layer HTL1; however, the embodiments described in this application are not limited to this.

[0109] The light-emitting layers EML1b, EML2b, and EML3b can be arranged on the second hole transport layer HTL2. The first subpixel PX1 can have a first second light-emitting layer EML1b within it, the second subpixel PX2 can have a second second light-emitting layer EML2b within it, and the third subpixel PX3 can have a third second light-emitting layer EML3b within it. The light-emitting layers EML1b, EML2b, and EML3b can be identical to the respective light-emitting layers EML1a, EML2a, and EML3a.

[0110] The thickness of the light-emitting layers EML1b, EML2b, and EML3b can differ. For example, the first light-emitting layer EML1b can have a thickness in the range of 60 to 80 nm, the second light-emitting layer EML2b can have a thickness in the range of 30 to 50 nm, and the third light-emitting layer EML3b can have a thickness in the range of 10 to 30 nm; however, the embodiments described in this application are not limited to these.

[0111] An electron barrier layer (EBL) can be placed on each of the light-emitting layers EML1b, EML2b, and EML3b. The electron barrier layer EBL can be placed in a single unit over the subpixels PX1, PX2, and PX3.

[0112] The second electron transport layer ETL2 can be arranged at the electron barrier layer EBL. The second electron transport layer ETL2 can be arranged in one piece over the subpixels PX1, PX2, and PX3. The second electron transport layer ETL2 can be formed from anthracene derivatives and lithium quinolate, or one or more selected from the group consisting of oxadiazole, triazole, phenanthroline, benzoxazole, benzthiazole, or benzimidazole (e.g., 2-[4-(9,10-Di-2-naphthalenyl-2-anthracenyl)phenyl]-1-phenyl-1H-benzimidazole), however, the embodiments of this application are not limited thereto.

[0113] A second electrode 153 can be arranged at the second electron transport layer ETL2.

[0114] Fig. Figure 6 is a top view showing the arrangement of subpixels in the display area of Fig. 1 illustrates.

[0115] With reference to Fig. 6. A display panel 100 according to one embodiment can contain several subpixels PX1, PX2, and PX3. For example, the first subpixel PX1 can be a red subpixel, the second subpixel PX2 can be a green subpixel, and the third subpixel PX3 can be a blue subpixel; however, the embodiments of this application are not limited thereto. A boundary of each subpixel PX1, PX2, and PX3 can be a non-emissive surface NEA ( Fig. 3) be.

[0116] The first electrode 151 can be exposed by banks 154a and 154b. For example, a planar form of the first electrode 151 exposed by banks 154a and 154b can be circular, but the embodiments described in this application are not limited to such forms.

[0117] The first bank 154a may be exposed by the second bank 154b. Although Fig. Figure 6 merely illustrates an area of ​​the first bank 154a that is exposed by the second bank 154b; in practice, the first bank 154a can also be an area that overlaps with the second bank 154b (the overlapping section OVP of Fig. 7 and Fig. 8) included.

[0118] The first bank 154a may contain a first exposed section EP1, which is exposed by the second bank 154b. The first exposed section EP1 may contain a side surface of bank 154 ( Fig. 3) The first exposed section EP1 can surround the first electrode 151, which is exposed by banks 154a and 154b, in a plan view. For example, the first exposed section EP1 can completely surround the first electrode 151, which is exposed by banks 154a and 154b, in a plan view. The first exposed section EP1 can overlap with the first electrode 151 in a plan view while surrounding an area exposed by banks 154a and 154b.

[0119] Bank 154 may contain the separation section (or trench section TRP) referred to above. Fig. 3 is described, and trench section TRP can surround the first exposed section EP1 in a plan view. As in Fig. As shown in Figure 6, bank 154 can further contain a groove section HP. The groove section HP can be located between adjacent subpixels PX1, PX2, and PX3.

[0120] For example, the groove section HP may have a shape in which a first side extending in a first direction DR1 and a second side extending in a second direction DR2 intersect each other (e.g. a cross shape), but the embodiments of this application text are not limited thereto.

[0121] Fig. 7 is a cross-sectional view taken along line BB' from Fig. 6 was taken.

[0122] With reference to Fig. 7. The bank 154 can contain a trench section TRP and a groove section HP, and the groove section HP can be located between adjacent trench sections TRP. The trench section TRP can omit the bank 154 in one thickness direction. For example, the trench section TRP can completely penetrate the second bank 154b and partially penetrate the first bank 154a. In contrast, the groove section HP can partially penetrate the second bank 154b. The depth of the trench section TRP can be greater than the depth of the groove section HP.

[0123] Additionally, the inclination a of an inner surface of the bench 154, where the trench section TRP is formed, can be greater than the inclination b of an inner surface of the bench 154, where the groove section HP is formed. For example, the inclination a can be about 60 degrees or more, and the inclination b can be in the range of about 30 degrees to about 50 degrees; however, the embodiments of this application are not limited thereto.

[0124] The fact that the depth of trench section TRP is greater than the depth of groove section HP, and that the slope a of the inner surface of bank 154 at which trench section TRP is formed is greater than the slope b of the inner surface of bank 154 at which groove section HP is formed, is due to the different functions of trench section TRP and groove section HP. As described above, trench section TRP serves to separate the organic layer 152 into the non-radiating surface NEA or to enhance a current path of the organic layer 152, and thus a greater depth and slope are preferred. In contrast, groove section HP, described below, serves to improve the propagation capability of the second encapsulation layer (or the organic encapsulation layer) and therefore does not need to have the same depth and slope as trench section TRP.

[0125] Fig. Figure 8 is a schematic diagram showing the improvement in the spreading capability of the second encapsulation layer due to the groove section according to Fig. 7 illustrates.

[0126] With reference to Fig. 7 and Fig. 8 A first encapsulation layer 171 can be arranged on the bank 154, which contains a groove section HP. A second encapsulation layer 172' can be formed on the first encapsulation layer 171 and can contain an organic material (or an organic insulating material). The second encapsulation layer 172', which is applied to the emission surfaces EA1 and EA3, can be difficult to distribute into the non-emissive surface NEA. In particular, as shown in Fig. As shown in Figure 8, if an inner surface (or a side surface) of the first bank 154a and the second bank 154b is aligned to form a step, distribution outside the step into the non-radiating surface NEA may be very difficult, and it may also be very difficult to laterally distribute the second encapsulation layer 172' applied to the non-radiating surface NEA.

[0127] However, in a display panel 100 according to one embodiment, the bank 154 contains the groove section HP, which is arranged between the trench sections TRP, making it possible to laterally distribute the second encapsulation layer 172', which is applied to the non-radiating surface NEA.

[0128] Additionally, if the thickness of the second encapsulation layer 172' is increased (or if the amount of the second encapsulation layer 172' applied is increased), the second encapsulation layer 172' can be sufficiently distributed across the non-radiating surface NEA and the emission surfaces EA1 and EA3; however, the thickness of the second encapsulation layer 172' can be applied downwards. According to illustration 100 of one embodiment, even when the thickness of the second encapsulation layer 172' is applied downwards, the propagation capability of the second encapsulation layer 172' can be improved.

[0129] The following descriptions of the display devices according to further embodiments are provided. In the following embodiments, precise explanations of the reference numerals or configurations are given with reference to... Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7 to Fig. Items 8, which have already been described, have been omitted to avoid redundancy.

[0130] Fig. Figure 9 is a cross-sectional view of a display device according to a further embodiment.

[0131] With reference to Fig. 9 a trench section TRP_1 of a display panel 100_1 of a display device according to this embodiment completely penetrates the second bank 154b and does not penetrate the first bank 154a at all, which can be seen from the display panel 100 according to Fig. 7 distinguishes.

[0132] An organic layer 152 in trench section TRP_1 can directly touch an upper surface of the first bank 154a.

[0133] Further details are as above with reference to Fig. 7 was described, and will be omitted below.

[0134] Fig. Figure 10 is a top view illustrating the arrangement of subpixels in a display area according to a further embodiment. Fig. Figure 11 is a top view illustrating the arrangement of subpixels in a display area according to a further embodiment. Fig. Figure 12 is a top view illustrating the arrangement of subpixels in a display area according to a further embodiment.

[0135] With reference to Fig. 10, Fig. 11 to Fig. 12 can be a slot section HP of Fig. They have 7 different forms.

[0136] For example, a groove section HP_1 of a display board 100_2 can be according to Fig. 10. If a groove section HP_2 of a display board 100_3 has an X-shape, it can be a groove section HP_2 according to Fig. 11 have a shape in which a second side extending in a second direction DR2, a third side extending in a diagonal direction between a first direction DR1 and the second direction DR2, and a fourth side having a bilaterally symmetrical shape with respect to the second side based on a first side, intersect each other and can be a groove section HP_3 of a display board 100_4 according to Fig. 12 have a zigzag shape.

[0137] A form of the groove section according to embodiments is not limited to those found in Fig. 10, Fig. 11 to Fig. 12 are illustrated, and can be modified as needed.

[0138] Fig. Figure 13 is a top view illustrating the arrangement of subpixels in a display area according to a further embodiment. Fig. 14 is a cross-sectional view taken along line CC' from Fig. 13 was taken.

[0139] With reference to Fig. 13 and Fig. 14 a bank 154_1 of a display board 100_5 differs from the display board 100 according to Fig. 6 and Fig. 7 in that it contains a second exposed section EP2.

[0140] In particular, the second exposed section EP2 can project outwards from a first exposed section EP1 in a plan view. For example, the second exposed section EP2 can be provided multiple times, and the multiple second exposed sections EP2 can be arranged such that they are spaced apart in a plan view. Fig. Figure 13 illustrates, for example, the second exposed section EP2 as being arranged diagonally between a first direction DR1 and a second direction DR2, and illustrates four second exposed sections EP2, although the embodiments of this application are not limited thereto. The second exposed sections EP2 may be spaced at equal intervals, although the embodiments of this application are not limited thereto. In certain embodiments, the second exposed section EP2 may be arranged in the first direction DR1 or the second direction DR2.

[0141] For example, a planar form of the second exposed section EP2 may essentially be an equilateral triangle or a right-angled triangle, but the embodiments of this application text are not limited thereto.

[0142] For example, the outline of a planar form of the first bank 154a, exposed by the second bank 154b, may contain at least one projection that extends outwards. The projection may be equal to the second exposed section EP2.

[0143] According to one embodiment, the benches 154a and 154b comprise a first bench 154a exposed by a second bench 154b, and a second exposed section EP2 located between the overlapping section OVP ( Fig. 14) and the first exposed section EP1, wherein the second exposed sections EP2 are arranged such that they are spaced apart from each other (with a protrusion or an angled structure applied to the bench), thereby improving the spreading capability of the second encapsulation layer (or the organic encapsulation layer). Fig. Figure 13 illustrates a case in which a projecting structure is applied to the bench. In this application, applying a projecting or angular structure to the bench means that a shape formed by an outline of the first exposed section EP1 and the second exposed section EP2 of the bench has a projecting or angular shape (or a polygonal shape). Fig. 13 can be an angular shape formed by an outline of the exposed sections EP1 and EP2.

[0144] Fig. Figure 14 illustrates a cross-sectional shape of benches 154a and 154b, with no second exposed section EP2 arranged.

[0145] As in Fig. 13 and Fig. As shown in Figure 14, the first bank 154a can cover a circumferential section of a first electrode 151 and expose a central section of the first electrode 151. A second bank 154b_1 can be arranged on top of the first bank 154a and overlap with it. The second bank 154b_1 can expose a section of the first bank 154a. That is, the first bank 154a can contain an overlapping section OVP that overlaps with the second bank 154b_1 and exposed sections EP1 and EP2 that are exposed by the second bank 154b_1. The exposed sections EP1 and EP2 can include a first exposed section EP1 projecting from one end of the second bank 154b_1 to the central section of the first electrode 151, and a second exposed section EP2 arranged between the first exposed section EP1 and the overlapping section OVP.The first exposed section EP1 may contain an inner surface (or a side surface) of the first bank 154a. An upper surface of the second exposed section EP2 may directly contact an organic layer 152, and a side surface of the first exposed section EP1 may directly contact the organic layer 152.

[0146] A second encapsulation layer 172 can be arranged on top of a first encapsulation layer 171 and contain an organic insulating material. The second encapsulation layer 172, which contains an organic insulating material and has a considerable thickness, can be difficult to distribute from an emissive surface EA to a non-emissive surface NEA when applied to the emissive surface EA.

[0147] If a structure such as a protruding thin layer is applied to a surface of the first encapsulation layer 171, the surface tension between the second encapsulation layer 172 and the first encapsulation layer 171 may increase, allowing the second encapsulation layer 172 to overcome the step and spread out; however, in such a case, the role of the first encapsulation layer 171 in blocking external moisture may be reduced.

[0148] However, in the display panel 100_5 according to this embodiment, the first bank 154a can be exposed by the second bank 154b_1 and contains a second exposed section EP2, which is located between the overlapping section (see OVP in Fig. 14) and the first exposed section EP1, wherein the second exposed sections EP2 are arranged such that they are spaced apart from each other (with a projecting structure applied to the bench). That is to say, as in Fig. As shown in Figure 14, by arranging an inner surface of the first bank 154a and an inner surface of the second bank 154b_1 such that they are spaced apart in an area where the second exposed section EP2 is applied, a step between the inner surfaces of the first and second banks 154a and 154b_1 can be reduced. As a result, the spreading capability of the second encapsulation layer (or the organic encapsulation layer) can be improved.

[0149] Fig. Figure 15 is a top view illustrating the arrangement of subpixels in a display area according to a further embodiment. Fig. 16 is a cross-sectional view taken along line DD' from Fig. 15 were taken.

[0150] With reference to Fig. 15 and Fig. 16 A display board 100_6 according to this embodiment differs from the display board 100 according to Fig. 6 and Fig. 7 in that it contains a separating section RAS.

[0151] With reference to Fig. 16. According to this embodiment, the separation section RAS can be arranged on an upper surface of a second bank 154b_3 and in a non-radiating area NEA. A bank 154b_2 according to this embodiment may not contain a trench section. The separation section RAS serves to physically separate an organic layer 152, 152' and a second electrode 153, 153', respectively. That is, the organic layer 152, which is directly arranged on the upper surface of the second bank 154b_2, and the organic layer 152', which is directly arranged on an upper surface of the separation section RAS, are physically separated, and the second electrode 153 on the organic layer 152 and the second electrode 153' on the separation section RAS can be physically separated.

[0152] The display panel 100_6 according to this embodiment can also use a bank structure that refers to Fig. 13 and Fig. 14 is described.

[0153] Fig. Figure 17 is a cross-sectional view of a display device according to a further embodiment.

[0154] With reference to Fig. 17 contains a separation section RAS, an open section OP, and a first electrode 151 may be exposed in the open section OP. The position and number of the open section OP are not specified in Fig. 17 is limited and it can be formed in different positions or have different numbers. The open section OP can be located in a non-radiating area NEA.

[0155] With reference to Fig. 16 and Fig. In section 17, a second electrode 153 receives a low-potential voltage from a low-potential voltage line and must be electrically connected across all subpixels PX1, PX2, and PX3. Thus, the isolation section RAS contains the open section OP, which allows the second electrode 153 within the isolation section RAS to be physically connected to the second electrode 153 outside the isolation section RAS in a top-down view.

[0156] Fig. Figure 18 is a perspective view of a display device according to a further embodiment and Fig. 19 is a cross-sectional view taken along line EE' from Fig. 18 was taken.

[0157] The display device 2 according to the embodiment of Fig. 18 and Fig. 19 differs from the display device 1 according to the embodiment of Fig. 1 in that it is a foldable display device.

[0158] In this registration text, the folding axis A1, around which the display device 2 folds, can be the same as the second direction DR2.

[0159] A cover frame TF is arranged at the uppermost part of the display device 2. The cover frame TF comprises a first cover frame TF1, which is arranged on one side, and a second cover frame TF2, which is arranged on the opposite side with respect to the hinge axis A1. The cover frame TF is positioned to cover the edges of the display panel 100_7. The cover frame TF can protect the display panel 100_7 from external influences. The cover frame TF can form the frame of the display device 2.

[0160] A cover layer CG can be arranged under the cover frame TF. The cover layer CG is arranged in addition to the display panel 100_7.

[0161] By being positioned on the display panel 100_7, the cover layer CG serves to protect the components located underneath from external forces.

[0162] The panel assembly is located on the underside of the cover layer CG. The panel assembly includes the display panel 100_7 and a plate PLT. The display panel 100_7 can be substantially identical to any of the display panels 100 to 100_6 described above.

[0163] The PLT panel can be positioned beneath the 100_7 display panel and may contain various panels that support the 100_7 display panel. For example, one or more panels may include a back panel supporting the 100_7 display panel, a top panel made of SUS material positioned beneath the back panel, a bottom panel made of SUS material with patterns formed on the hinge section positioned beneath the top panel, a heat dissipation layer for heat dissipation, and a middle panel covering the uneven surface resulting from the various components of the hinge assembly.

[0164] The plate PLT may have a slot pattern PTN formed on it. The slot pattern PTN may be formed at the position corresponding to the folding surface FA of the display panel 100_7. The slot pattern PTN may be an etched section in the form of a slot formed in the plate PLT. The plate PLT may be made of metal, such as a SUS material, which may cause the plate PLT to encounter resistance when folded or unfolded due to the strength of the metal. The slot pattern PTN may impart flexibility to the plate PLT. According to one embodiment of this application, a slot pattern PTN is formed in a plate PLT in a second direction DR2 (or a direction of the long axis) of the display panel 100_7 to face a first unfolding surface NFA1 and a second unfolding surface NFA2, but the embodiment is not limited thereto.For example, the slot pattern PTN can be formed in a first direction DR1 (or a direction of the short axis) of the scoreboard 100_7 and arranged with the first fold-out surface NFA1 and the second fold-out surface NFA2 in between. That is, the scoreboard 100_7 can be folded in the first direction DR1 or folded in the second direction DR2.

[0165] A central plate MST is arranged beneath the panel assembly. The central plate MST supports the components arranged above it. Additionally, the hinge assembly 200 and the cover frame CF are arranged beneath the central plate MST; their upper surfaces may be uneven. The central plate MST can flatten the uneven lower surface. The central plate MST can be made of materials such as plastic, polyimide, or metal to improve the rigidity of the display device 2. For example, the central plate MST may contain aluminum or SUS; however, the embodiments described in this application are not limited to these materials.

[0166] The intermediate plate MST can contain a first intermediate plate section MSTH1, which is positioned in the first fold-out surface NFA1, and a second intermediate plate section MSTH2, which is positioned in the second fold-out surface NFA2.

[0167] The hinge assembly 200 is arranged below the panel assembly. The hinge assembly 200 is positioned at the lower part of the folding surface FA. The hinge assembly 200 can have an elongated shape along the folding axis A1. The hinge assembly 200 can perform a folding movement with a rotation on one side and the other side with respect to the folding axis A1.

[0168] The cover frame CF is arranged beneath the hinge assembly 200. A receiving groove can be formed on the upper surface of the cover frame CF, where a section of the hinge assembly 200 can be positioned. The cover frame CF comprises a first cover frame CF1, which is arranged on one side of the hinge axis A1, and a second cover frame CF2, which is arranged on the opposite side. The cover frame CF can serve as a housing that defines the sides and rear of the display device 2. The cover frame CF can protect the display device 2 from external influences. The cover frame CF can be coupled to the hinge assembly 200. Depending on the rotation of the cover frames CF1 and CF2, the display device 2 can be folded in and out.

[0169] Additional coupling elements BM1, BM2, and BM3 can be arranged between adjacent components MST, PLT, PNL, and CG to connect the components. The first coupling element, BM1, can couple the intermediate plate sections MSTH1 and MSTH2 to the upper plate PLT in each fold-out surface NFA1 and NFA2; the second coupling element, BM2, can couple the plate PLT, PTN to the upper display panel 100_7; and the third coupling element, BM3, can couple the display panel 100_7 to the cover layer CG.

[0170] The coupled plate PLT and intermediate plate MST can be mounted on the cover frames CF1 and CF2. The display device 2 can perform folding and unfolding actions via the hinge assembly 200, which is arranged on the cover frames CF1 and CF2.

[0171] Detailed explanations regarding display board 100_7, which have already been given, are omitted.

[0172] The display device according to various embodiments of this application text can be described as follows.

[0173] According to one aspect of the present invention, a display device comprises a substrate having a display area comprising several subpixels, each containing a first subpixel, a second subpixel, and a third subpixel, and a non-display area surrounding the display area; a first electrode arranged on the substrate in each of the subpixels; a bank arranged on the first electrode, positioned at a boundary between adjacent subpixels, covering a circumferential section of an upper surface of the first electrode, and comprising a first bank on the first electrode and a second bank on the first bank; and an organic layer arranged on the first electrode and the bank, extending over the several subpixels.The first bank may include an overlapping section that overlaps with the second bank, and / or a first exposed section that is exposed by the second bank and includes a side surface. The bank may include a grooved section formed within the bank, e.g., such that it is countersunk from a top surface of the bank, and / or a separating section that surrounds the first exposed section in a plan view.

[0174] The groove section can be located between adjacent subpixels. The groove section can be formed in the second bank.

[0175] The separation section may contain a trench section formed within the bank, for example, such that it is sunk below the upper surface of the bank. The depth of the trench section may be greater than the depth of the groove section. The trench section may be formed within the second bank.

[0176] The trench section can completely penetrate the second bank. The trench section can extend to the first bank and / or expose the first bank. The groove section may, for example, only partially penetrate the second bank.

[0177] The slope of a side surface of the trench section can be greater than the slope of a side surface of the groove section.

[0178] The display device may further include a second electrode on the organic layer. The display device may further include an encapsulation layer on the second electrode. The second encapsulation layer may contain an organic material. The encapsulation layer may include a first encapsulation layer, a second encapsulation layer on the first encapsulation layer, and a third encapsulation layer on the second encapsulation layer. The first and second encapsulation layers, or the first, second, and third encapsulation layers, may have different material compositions.

[0179] The first bank may contain an overlapping section that overlaps with the second bank. The first bank may contain a first exposed section that is exposed by the second bank and includes a side surface of the first bank. The first bank may contain a second exposed section that is exposed by the second bank and is located between the overlapping section and the first exposed section. The second exposed section may include a top surface of the first bank.

[0180] The second exposed section can be provided multiple times. In a top view, adjacent sections of the second exposed section can be spaced apart from each other.

[0181] According to another aspect, a display device includes a substrate having a display area with multiple subpixels containing a first subpixel, a second subpixel, and a third subpixel, and a non-display area surrounding the display area; a first electrode located at each subpixel on the substrate; a bank positioned at a boundary between adjacent subpixels to cover a circumferential section of an upper surface of the first electrode, and comprising a first bank at the first electrode and a second bank at the first bank; a separating section on an upper surface of the bank between adjacent subpixels; and an organic layer extending over the subpixels at the first electrode, the bank, and the separating section.The first bank may contain an overlapping section that overlaps with the second bank, and / or a first exposed section that is exposed by the second bank and has a side surface. The bank may contain a grooved section that is countersunk from its top surface.

[0182] The groove section can be located between adjacent subpixels.

[0183] The separation section can separate the organic layer. The organic layer that directly touches the upper surface of the bank and the organic layer that directly touches an upper surface of the separation section can be spaced apart from each other.

[0184] The display device may further include a second electrode on the organic layer and an encapsulation layer on the second electrode. The second encapsulation layer may contain an organic material. The encapsulation layer may include a first encapsulation layer, a second encapsulation layer on the first encapsulation layer, and a third encapsulation layer on the second encapsulation layer.

[0185] The separation section may contain an opening. In a top view, the second electrode inside the separation section and the second electrode outside the separation section may be connected at the opening.

[0186] The first bank can contain an overlapping section that overlaps with the second bank. The first bank can contain a first exposed section that is exposed by the second bank and includes a side surface. The first bank can contain a second exposed section that is exposed by the second bank and is located between the overlapping section and the first exposed section.

[0187] The second exposed section can be provided multiple times. In a top view, adjacent sections of the second exposed section can be spaced apart from each other.

[0188] The display device according to the embodiments is advantageous in absorbing external light that falls under a bank by incorporating a black-based material into the bank.

[0189] The display device according to the embodiments is advantageous in attenuating lateral leakage current between adjacent subpixels by separating an organic layer that is formed in one piece over all subpixels, using a trench that is formed in a protective layer.

[0190] The display device according to the embodiments is advantageous in improving the propagation capability of a second encapsulation layer (or an organic encapsulation layer) by forming a groove in the bank at the boundary (or non-radiating area) between adjacent pixels.

[0191] The display device according to the embodiments is advantageous in improving the spreading capability of the second encapsulation layer (or an organic encapsulation layer) by exposing a first bank with a second bank and providing a second exposed section arranged between an overlapping section and a first exposed section, wherein the second exposed sections are arranged such that they are spaced apart from each other (e.g. a protrusion or an angled structure applied to the bank).

[0192] The display device according to the embodiments is advantageous in improving the spreading capability of the second encapsulation layer (or an organic encapsulation layer) by applying a protrusion or an angled structure to the bank itself, even when the thickness of the second encapsulation layer (or the organic encapsulation layer) is reduced.

[0193] The display device according to the embodiments is advantageous in improving the spreading capability of the second encapsulation layer (or an organic encapsulation layer) by applying a protrusion or an angled structure to the bank itself, even when the bank has a steep lateral slope.

[0194] The display device according to the embodiments is advantageous in providing a display device with low reflections by absorbing external light that falls under the bench.

[0195] The advantages that can be realized through this application text are not limited to the foregoing, and further advantages not explicitly described here can be easily understood by experts from the following description.

[0196] Although embodiments of this invention have been described above with reference to the accompanying drawings, it is understood that the technical configuration of the invention described above can be implemented in further specific forms by those skilled in the art without altering the technical concept or essential features of the present invention. Therefore, it is to be understood that the embodiments described above are exemplary and not limited in any respect. Furthermore, the scope of the present invention is defined by the claims set forth below, rather than by the detailed description above. Additionally, it should be interpreted such that all modifications or variants derived from the meaning and scope of the claims, and their corresponding concepts, are included within the scope of the invention. DESCRIPTION OF REFERENCE MARKS 1 Display device 100, 100_1, 100_2, 100_3, 100_4, 100_5, 100_6, 100_7 Scoreboard QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] KR 10-2024-0169650

[0001]

Claims

Display device comprising: a substrate (101) having a display area (DA) comprising several subpixels containing a first subpixel (PX1), a second subpixel (PX2), and a third subpixel (PX3), and a non-display area (NDA) surrounding the display area (DA); a first electrode (151) located on the substrate (101) in each of the subpixels; a bank (154) located on the first electrode (151), positioned at a boundary between adjacent subpixels, covering a circumferential section of the first electrode (151), and comprising a first bank (154a) on the first electrode (151) and a second bank (154b) on the first bank (154);and an organic layer (152) arranged at the first electrode (151) and the bank (154) extending over the multiple subpixels, wherein the first bank (154a) includes an overlapping section (OVP) that overlaps with the second bank (154b) and a first exposed section (EP1) exposed by the second bank (154b) and containing a side surface of the first bank (154a), and the bank (154) includes a groove section (HP) formed in a top surface of the bank (154) and a separation section surrounding the first exposed section (EP1) in a top view. Display device according to claim 1, wherein the groove section (HP) is arranged between adjacent subpixels. Display device according to claim 1 or 2, wherein the separating section comprises a trench section (TRP) formed in the upper surface of the bank, and the depth of the trench section (TRP) is greater than the depth of the groove section (HP). Display device according to claim 3, wherein the trench section (RP) completely penetrates the second bank (154b) and / or the groove section (HP) partially penetrates the second bank (154b). Display device according to claim 3 or 4, wherein an inclination of a side surface of the trench section (TRP) is greater than an inclination of a side surface of the groove section (HP). Display device according to one of the preceding claims, further comprising: a second electrode (153) on the organic layer (152) and an encapsulation layer (170) on the second electrode (153), wherein the encapsulation layer (170) contains an organic material, wherein the encapsulation layer (170) comprises a first encapsulation layer (171), a second encapsulation layer (172) on the first encapsulation layer (171) and a third encapsulation layer (173) on the second encapsulation layer (172). Display device according to one of the preceding claims, wherein the first bank (154a) further comprises a second exposed section (EP2) which is exposed by the second bank (154b) and is arranged between the overlapping section (OVP) and the first exposed section (EP1). Display device according to claim 7, wherein the second exposed section (EP2) is provided multiple times and adjacent of the multiple second exposed sections (EP2) are spaced apart from each other in a top view. Display device according to one of the preceding claims, wherein the display device is a foldable display device. Display device according to claim 9, wherein the display device comprises a first side extending in a first direction or a direction of the short axis and a second side extending in a second direction or a direction of the long axis and is configured to fold a folding axis parallel to the direction of the long axis. Display device according to one of the preceding claims, wherein the bank (154) comprises a black-based material. Display device comprising: a substrate (101) having a display area (DA) comprising several subpixels, each containing a first subpixel (PX1), a second subpixel (PX2), and a third subpixel (PX3), and a non-display area (NDA) surrounding the display area (DA); a first electrode (151) located on the substrate (101) in each of the subpixels; a bank (154) located on the first electrode (151), positioned at a boundary between adjacent subpixels, covering a circumferential section of the first electrode (151), and comprising a first bank (154a) on the first electrode (151) and a second bank (154b) on the first bank (154a); a separating section (RAS) formed in the bank (154) between adjacent subpixels;and an organic layer (152) arranged at the first electrode (151), the bank (154) and the separation section (RAS) extending over the multiple subpixels, wherein the first bank (154a) includes an overlapping section (OVP) that overlaps with the second bank (154b) and a first exposed section (EP1) exposed by the second bank (154b) and containing a side surface of the first bank (154a), and the bank (154) includes a groove section (HP) formed in the upper surface of the bank. Display device according to claim 12, wherein the separating section (RAS) separates the organic layer (152) and the organic layer (152) that directly touches the upper surface of the bank (154) and the organic layer that directly touches an upper surface of the separating section (RAS) are spaced apart from each other. Display device according to claim 12 or 13, further comprising: a second electrode (153) on the organic layer (152) and an encapsulation layer (170) on the second electrode (153), wherein the encapsulation layer (170) contains an organic material, wherein the encapsulation layer (170) comprises a first encapsulation layer (171), a second encapsulation layer (172) on the first encapsulation layer (171) and a third encapsulation layer (173) on the second encapsulation layer (172). Display device according to claim 14, wherein the separating section (RAS) comprises an opening (OP) and, in a top view, the second electrode (153) is connected in the separating section (RAS) and the second electrode (153) is connected outside the separating section (RAS) at the opening (OP).

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