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DE102025113290A1Undetermined Publication Date: 2026-10-08ZF FRIEDRICHSHAFEN AG
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Patent Information

Application Number
DE102025113290
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-04-04
Publication Date
2026-10-08

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Abstract

Printed circuit board arrangement (1) comprising: - a printed circuit board (2); - at least two electrical components (3, 4) arranged on, in particular on or in, the printed circuit board (2); - at least one potting compound (5) surrounding the at least two electrical components (3, 4) at least partially, wherein: - at least one structural body (6) arranged in a region (7) between the at least two electrical components (3, 4) and surrounded at least partially by the potting compound (5), wherein the structural body (6) is configured to define or direct a fracture (8) of the potting compound (5) at its fracture location and / or in its fracture path at least partially, preferably predominantly, particularly preferably completely.
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Citation Information

Patent Citations

  • Electronic assembly and method for manufacturing the electronic assembly

    DE102013206852A1

  • Method for manufacturing a semiconductor component and semiconductor component

    DE102017129975A1

  • Power semiconductor module and power unit

    DE112014006397B4

  • Circuit module

    US20190318973A1

  • Improved recyclability of potted electronics using compressible thermal foam

    WO2024213456A1