Printed circuit board arrangement with a temperature sensor

DE102025113291B3Undetermined Publication Date: 2026-08-06ZF FRIEDRICHSHAFEN AG
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
ZF FRIEDRICHSHAFEN AG
Filing Date
2025-04-04
Publication Date
2026-08-06

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Abstract

Printed circuit board arrangement (10; 20), comprising: - a printed circuit board (1) with spring contacts (2); - a temperature sensor (3); - one or more electrical conductors connecting the temperature sensor to the printed circuit board by contacting the temperature sensor and the spring contacts of the printed circuit board; - a power semiconductor (4) whose temperature is measured by the temperature sensor by contacting the power semiconductor, wherein the power semiconductor is electrically connectable to a busbar (5) and the electrical conductor is arranged to pass through a recess in the busbar.
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Citation Information

Patent Citations

  • Electronic assembly and methods for its manufacture

    DE102009053472A1

  • sensor for detecting a temperature of a fluid medium

    DE102016210854A1

  • Temperature measurement system for power semiconductors arranged on a base plate of an inverter

    DE102023211384A1