Soldering system with driven transfer wheel and transfer device

Abstract

The invention relates to a soldering system, in particular a reflow soldering system, for soldering electrical components provided on a printed circuit board, with a vacuum process chamber (40) which has a movable closing element (44) for closing the vacuum process chamber, with a transport device (34) for transporting the printed circuit boards along a transport direction (18), wherein the transport device comprises at least a first transport section upstream of the vacuum process chamber, a second transport section in the vacuum process chamber (48), and a third transport section downstream of the vacuum process chamber (50), wherein the transport sections comprise drive elements (60) driven by a drive, wherein at least one transfer wheel (124) is provided between the first and the second transport section and / or between the second transport section and the third transport section.wherein the transfer wheel is arranged and designed such that, in the closed vacuum process chamber, it can be moved from a transport position, in which it can interact with a circuit board to be transported, at least indirectly into a deflection position by the sealing element.

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