Power module with defect in potting compound, method for its manufacture and method for detecting a short circuit in a power module

DE102025122484B3Undetermined Publication Date: 2026-07-16VOLKSWAGEN AG
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Patent Information

Application Number
DE102025122484
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-06-06
Publication Date
2026-07-16
Estimated Expiration
2045-06-06

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Abstract

Power module (1), comprising: - a planar carrier (2), - a first metallization pad (3) applied to a surface (8) of the carrier (2), - a second metallization pad (4) applied to the surface (8) of the carrier (2), wherein the first metallization pad (3) and the second metallization pad (4) are spaced apart from each other by a first gap (5), - an electrically insulating potting compound (6) into which the first metallization pad (3) and the second metallization pad (4) are at least partially cast and which at least partially fills the first gap (5), wherein the potting compound (6) has a defect (7) in which the first gap (5) is not filled by potting compound (6) and which extends along the surface (8) of the carrier (2) from the first metallization pad (3) to the second metallization pad (4),wherein on both sides and the defect (7) the first gap (5) is filled with the potting compound (6) and the defect (7) is bounded from above by the potting compound (6).
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Citation Information

Patent Citations

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    US20070120240A1

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    US20170345804A1

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    WO2019025314A1