ELECTRICAL CONNECTION UNIT

Abstract

An electrical connection unit comprises a support, a first busbar, a second busbar, a first electronic component, and a second electronic component. The support has a first surface and a second surface located on a side opposite the first surface. The first busbar is supported by the support. The second busbar is also supported by the support. The first electronic component faces the first surface of the support and is electrically connected to the first busbar. The second electronic component faces the second surface of the support and is electrically connected to the second busbar.

Description

[Technical field]

[0001] Embodiments of the present invention relate to an electrical connection unit. [State of the art]

[0002] An electrical connection unit comprising an electronic component and a busbar connected to the electronic component is known. [State of the art document][Patent document]

[0003] [Patent document 1] Japanese unexamined patent application, first publication no. 2024-037492 [Description of the invention][Problems to be solved by the invention]

[0004] Furthermore, an electrical connection unit is to be miniaturized.

[0005] One embodiment provides an electrical connection unit that can be miniaturized. [Means of solving the problem]

[0006] An electrical connection unit according to one embodiment comprises a carrier, a first busbar, a second busbar, a first electronic component, and a second electronic component. The carrier has a first surface and a second surface located on a side opposite the first surface. The first busbar is supported by the carrier. The second busbar is also supported by the carrier. The first electronic component faces the first surface of the carrier and is electrically connected to the first busbar. The second electronic component faces the second surface of the carrier and is electrically connected to the second busbar. [Effects of the invention]

[0007] According to one embodiment, the electrical connection unit can be miniaturized. [Brief description of the drawings] [ Fig. 1] A cross-sectional view showing an electrical connection unit of a first embodiment. [ Fig. 2] A perspective view to describe a main body of the first embodiment. [ Fig. 3] A perspective view to describe a subunit of the first embodiment. [ Fig. 4] A partially separated perspective view of the subunit of the first embodiment. [ Fig. 5] A perspective view to describe an electronic component and a connecting component of the first embodiment. [ Fig. 6] A perspective view to describe the electronic component and the connection component of the first embodiment. [ Fig. 7] A perspective view showing the connecting component of the first embodiment. [ Fig. 8] A perspective view showing a routing board of the first embodiment. [ Fig. 9] A partially separated perspective view of the laying board of the first embodiment. [ Fig. 10] A top view showing the installation board of the first embodiment. [ Fig. 11] A partially separated perspective view of the electrical connection unit of the first embodiment. [ Fig. 12] A view from below showing the routing board of the first embodiment. [ Fig. 13] A cross-sectional view along line F13-F13 of a Fig. 10 depicted structure. [ Fig. 14] A top view showing part of an electrical connection unit of a first modification example of the first embodiment. [ Fig. 15] A cross-sectional view along line F15-F15 of the in Fig. 14 depicted structure. [ Fig. 16] A top view showing part of an electrical connection unit of a second modification example of the first embodiment. [ Fig. 17] A cross-sectional view showing an electrical connection unit of a third modification example of the first embodiment. [ Fig. 18] A cross-sectional view showing an electrical connection unit of a fourth modification example of the first embodiment. [ Fig. 19] A perspective view showing part of an electrical connection unit of a fifth modification example of the first embodiment. [ Fig. 20] A cross-sectional view along line F20-F20 of the in Fig. 19 depicted structure. [ Fig. 21] A cross-sectional view showing an electrical connection unit of a second embodiment. [ Fig. 22] A perspective view showing part of the electrical connection unit of the second embodiment. [ Fig. 23] A cross-sectional view along line F23-F23 of the in Fig. 22 depicted structure. [ Fig. 24] A cross-sectional view along line F24-F24 of the in Fig. 22 depicted structure. [ Fig. 25] A cross-sectional view showing an electrical connection unit of a third embodiment. [ Fig. 26] An expanded perspective view showing part of the electrical connection unit of the third embodiment. [ Fig. 27] A cross-sectional view showing part of the electrical connection unit of the third embodiment. [Embodiments of the invention]

[0008] The following descriptions illustrate embodiments with reference to the drawings. In the following description, assemblies with the same or similar functions are named using the same reference numerals. Redundant descriptions of these assemblies can be omitted. Note that the assembly described below does not limit the scope of the embodiment.

[0009] In the present disclosure, the terms are defined as follows. The term "connection" is not limited to a mechanical connection and may also include an electrical connection. That is to say, the term "connection" is not limited to a case in which two elements that are connection targets are directly connected and may include a case in which two elements that are connection targets are connected by another, intervening element. The term "reception" is not limited to the case in which the entire component is received, but may also include the case in which only a part of the component is received (a state in which the remaining part of the component protrudes). The term "facing" indicates that virtual projection images of two target objects overlap when viewed from a certain direction.This means that the term "facing" is not limited to the case where two target objects are directly facing each other, but can also include the case where two target objects are facing each other in a state in which another element is located between them. The term "next to" is not limited to the case where two elements are in contact with each other, but can also include the case where two elements are arranged in such a way that they are separated from each other. "Parallel," "orthogonal," or "equal" can each include "substantially parallel," "substantially orthogonal," or "substantially equal," respectively.

[0010] In the present disclosure, a +X direction, a -X direction, a +Y direction, a -Y direction, a +Z direction, and a -Z direction are defined as follows. The +X direction is a direction from a first end 80e1 to a second end 80e2 of a metal plate 80, which is described later (see Fig. 2) The -X direction is a direction opposite to the +X direction. If the +X and -X directions are not distinguished, the directions will be referred to simply as the "X direction" in the following. The +Y direction and the -Y direction are directions that intersect the X direction (for example, orthogonal to it). The +Y direction is a direction from a third end 80e3 to a fourth end 80e4 of the metal plate 80, which will be described later (see Fig. 2) The -Y direction is a direction opposite to the +Y direction. If the +Y and -Y directions are not distinguished, the directions will be referred to simply as the "Y direction" in the following. The +Z direction and the -Z direction are directions that intersect the X and Y directions (for example, orthogonal to them). The +Z direction is a direction from a second surface 40s2 of a laying board 40M, which will be described later, to a first surface 40s1 (see Fig. 1) The -Z direction is the opposite of the +Z direction. When the +Z and -Z directions are not distinguished, they are simply referred to as the "Z direction" in the following. The Z direction is an example of a "first direction." The X direction or the Y direction is an example of a "second direction."

[0011] If the X and Y directions are not distinguished, the directions can be referred to as the "horizontal direction" in the following. The Z direction can be referred to as the "vertical direction" in the following. The side with the +Z direction can be referred to as "top" and the side with the -Z direction as "bottom". However, these terms are descriptive and do not define a gravity direction of an electrical connection unit 1 (an installation position of the electrical connection unit 1). (First embodiment)<1. Structure of the electrical connection unit>

[0012] Fig. Figure 1 is a cross-sectional view depicting an electrical connection unit 1 of an embodiment. The electrical connection unit 1 is, for example, an in-vehicle device attached to a vehicle such as an electric vehicle (EV), a hybrid electric vehicle (HEV), or a plug-in hybrid electric vehicle (PHEV). The electrical connection unit 1 may be referred to, for example, as an "electrical junction box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device.

[0013] The electrical connection unit 1 includes, for example, a main body MU, a metal plate 80, insulating foils 91A and 91B, a plurality of heat transfer elements 92, a plurality of heat transfer sections 93 and an insulating cover 94. <2nd main body>

[0014] First, the main body MU is described.

[0015] Fig. Figure 2 is a perspective view illustrating the main body MU. The main body MU is a section that performs a main function (for example, switching electrical connection states or overcurrent protection) of the electrical connection unit 1. In the present embodiment, the main body MU is divided into a plurality of subunits SU. The main body MU is formed by connecting a plurality of subunits SU. In the present embodiment, the main body MU contains three subunits SU (subunits SUX, SUY, and SUZ). Each subunit SU can be referred to as a "circuit assembly body".

[0016] The subunit SUX has a primary electrical function. For example, the subunit SUX contains a plurality of electronic components 10X and a primary routing board 40X. The plurality of electronic components 10X are electrically connected to the primary routing board 40X. The plurality of electronic components 10X includes, for example, one or more electronic components 10XU and one or more electronic components 10XL (see Fig. 1) The electronic component 10XU is arranged on its side in the +Z direction with respect to the first routing board 40X (routing board 40M). The electronic component 10XU faces a first surface 40s1 of the routing board 40M. In contrast, the electronic component 10XL is arranged on its side in the -Z direction with respect to the first routing board 40X (routing board 40M). The electronic component 10XL faces a second surface 40s2 of the routing board 40M.

[0017] The subunit SUY has a secondary electrical function. This secondary function differs from the primary function. For example, the subunit SUY contains a plurality of electronic components 10Y and a second routing board 40Y. The plurality of electronic components 10Y are electrically connected to the second routing board 40Y. The plurality of electronic components 10Y includes, for example, one or more electronic components 10YU and one or more electronic components 10YL (see Fig. 1) Electronic component 10YU is arranged on its side in the +Z direction with respect to the second routing board 40Y (routing board 40M). Electronic component 10YU faces the first surface 40s1 of routing board 40M. In contrast, electronic component 10YL is arranged on its side in the -Z direction with respect to the second routing board 40Y (routing board 40M). Electronic component 10YL faces the second surface 40s2 of routing board 40M.

[0018] The subunit SUZ has a third electrical function. This third function is distinct from the first and second functions. For example, the subunit SUZ contains a plurality of electronic components 10Z and a third routing board 40Z. The plurality of electronic components 10Z are electrically connected to the third routing board 40Z. The plurality of electronic components 10Z includes, for example, one or more electronic components 10ZU and one or more electronic components 10ZL (see Fig. 1) The electronic component 10ZU is arranged on the side in the +Z direction with respect to the third routing board 40Z (routing board 40M). The electronic component 10ZU faces the first surface 40s1 of the routing board 40M. In contrast, the electronic component 10ZL is arranged on the side in the -Z direction with respect to the third routing board 40Z (routing board 40M). The electronic component 10ZL faces the second surface 40s2 of the routing board 40M.

[0019] In the present embodiment, the three subunits SUX, SUY, and SUZ are arranged such that they lie in the X direction. For example, subunit SUX is arranged on the +X direction side with respect to subunit SUY. Subunit SUX and subunit SUY are electrically connected via a plurality of coupling busbars 75 that extend across the first routing board 40X and the second routing board 40Y. Subunit SUZ, on the other hand, is arranged on the -X direction side with respect to subunit SUY. Subunit SUZ and subunit SUY are electrically connected via a plurality of coupling busbars 75 (in Fig. (2 is only one shown) connected, extending across the third routing board 40Z and the second routing board 40Y. The coupling busbar 75 can be arranged on the side in the +Z direction or the side in the -Z direction with respect to the majority of subunits SU.

[0020] In the present embodiment, the three routing boards 40X, 40Y, and 40Z, contained in the three subunits SUX, SUY, and SUZ, are arranged in the same plane. In other words, the three routing boards 40X, 40Y, and 40Z are arranged at the same height in the Z-direction. Thus, the three routing boards 40X, 40Y, and 40Z form one large routing board 40M.

[0021] The routing board 40M has the first surface 40s1 and the second surface 40s2 (see Fig. 1) The first surface 40s1 is a surface oriented in the +Z direction. The first surface 40s1 is formed, for example, by a first surface 51a (described later) of a flat surface section 51 of the base plate 41 of the three routing boards 40X, 40Y, and 40Z. The second surface 40s2, on the other hand, is located on the side opposite the first surface 40s1. The second surface 40s2 is a surface oriented in the -Z direction. The second surface 40s2 is formed, for example, by a second surface 51b (described later) of the flat surface section 51 of the base plate 41 of the three routing boards 40X, 40Y, and 40Z.

[0022] In the present embodiment, the three subunits SUX, SUY, and SUZ have the same or a similar basic structure. Therefore, one subunit, SU, will be described in detail below. If the subunits SUX, SUY, and SUZ are not distinguished, they will simply be referred to as "subunit SU." Similarly, if the electronic components 10X, 10Y, and 10Z are not distinguished, they will simply be referred to as "electronic component 10." Likewise, if the electronic components 10XU, 10YU, and 10ZU are not distinguished, they will simply be referred to as "electronic component 10U."If electronic component 10XL, electronic component 10YL, and electronic component 10ZL are not distinguished, they are simply referred to as "electronic component 10L." If first routing board 40X, second routing board 40Y, and third routing board 40Z are not distinguished, they are simply referred to as "routing board 40." A subunit SU contained within three subunits SUX, SUY, and SUZ is an example of a "first subunit." Conversely, another subunit SU contained within three subunits SUX, SUY, and SUZ is an example of a "second subunit."

[0023] Note that the main body MU need not be subdivided into a plurality of subunits SU, as in the example described above. That is, the main body MU can be formed from a plurality of electronic components 10 and a distribution board 40. Furthermore, the two or more subunits SU are not limited to subunits SU with different functions, but can also be subunits SU with the same function. <3. Subunit Structure>

[0024] Next, the structure of the subunit SU will be described.

[0025] Fig. Figure 3 is a perspective view to describe subunit SU. Fig. Figure 4 is a partially disassembled perspective view of subunit SU. Subunit SU contains, for example, a plurality of electronic components 10, a plurality of connection components 20 for connecting components, a plurality of connection components 30 for external connection, and a routing board 40. The connection components 20 and 30 are elements that form a power supply path in the vertical direction. The connection components 20 and 30 can be referred to as "vertical routing elements". <3.1 Electronic component and connection component for connecting components>

[0026] First, the electronic component 10 and the connection component 20 for connecting components are described.

[0027] Electronic component 10 is an electronic component attached according to a function required for subunit SU. Electronic component 10 could be, for example, a connector, a fuse, a relay (for example, a mechanical relay or a solid-state relay), a capacitor, a branching component, any of several different sensors (for example, a current sensor or a voltage sensor), an electronic control unit, or an electronic component assembly in which two or more of these components are combined. Note that the type of electronic component 10 is not limited to the above example. Electronic component 10 could, for example, be a heat-generating component that produces heat when energy is supplied.Below, an electronic component of the first kind 10M and an electronic component of the second kind 10N are described as examples of the electronic component 10.

[0028] The connection component 20 is a component that electrically connects the electronic component 10 to the routing board 40. The connection component 20 forms part of a power supply path in the subunit SU. The connection component 20 is made of a metal (for example, copper or a copper alloy). The connection component 20 can be referred to as a "metal component". A first-type connection component 20M and a second-type connection component 20N are described below as examples of the connection component 20. <3.1.1 Electronic component of the first kind>

[0029] Fig. Figure 5 is a perspective view showing the electronic component of the first kind 10M and the connection component of the first kind 20M. For simplicity, in Fig. Figure 5 shows the electronic component 10M and the connection component 20M with reference to the position of the electronic component 10 (electronic component 10U), which is arranged on the side in the +Z direction with respect to the routing board 40. The electronic component of the first type 10M is an electronic component in which a plurality of terminals 13 are arranged at one end of the electronic component 10M. The electronic component 10M includes, for example, a housing 11, a component body 12, a plurality of terminals 13, and a plurality of mounting sections 14. (Housing)

[0030] The housing 11 is an outer element that forms most of the outer shape of the electronic component 10M. The housing 11 is made of, for example, synthetic resin and has insulating properties. The housing 11 contains the component body 12. The housing 11 and the component body 12 can be formed from a single piece.

[0031] In the present embodiment, the housing 11 has an insulating rib 11a that projects horizontally (for example, in the X-direction) and extends in the Z-direction. The insulating rib 11a has, for example, a plate-like shape formed horizontally (for example, in the X-direction) and in the Z-direction. The insulating rib 11a extends, for example, over the entire length of the housing 11 in the Z-direction. The insulating rib 11a is arranged between the plurality of terminals 13 (a terminal 13A and a terminal 13B, which will be described later). The insulating rib 11a electrically isolates terminal 13A from terminal 13B. In the present embodiment, a portion of the insulating rib 11a is arranged between first sections 21 (which will be described later) of two connection components 20M that are connected to the electronic component 10M.The insulating rib 11a electrically isolates the first sections 21 of the two connecting components 20M connected to the electronic component 10M from each other. (Component body)

[0032] The component body 12 is a section that performs a main function of the electronic component 10M. For example, if the electronic component 10M is a relay, the component body 12 contains a switch (for example, a contact) that toggles between a conductive and a non-conductive state. For example, if the electronic component 10M is a fuse, the component body 12 contains a melting section that blows when an overcurrent flows. For example, if the electronic component 10M is a capacitor, the component body 12 contains a section that stores electrical charge. (Connection)

[0033] Terminal 13 is an electrical connection section exposed to the outside of the housing 11. Terminal 13 is electrically connected to the component body 12 inside the housing 11. In the present embodiment, the electronic component 10M includes one terminal 13A and one terminal 13B as the plurality of terminals 13. One of the terminals 13A and 13B is a terminal on the positive electrode side. The other of the terminals 13A and 13B is a terminal on the negative electrode side. One of the terminals 13A and 13B is an example of a "first terminal." The other of the terminals 13A and 13B is an example of a "second terminal."

[0034] In the present embodiment, terminal 13A and terminal 13B are provided at one end of the electronic component 10M in a horizontal direction (for example, in the X-direction). Terminal 13A and terminal 13B are arranged such that they lie in the horizontal direction (for example, in the Y-direction). Each terminal 13 has a mounting hole 13h to which a fastening element 71 (for example, a screw or a bolt), which will be described later, is attached. The mounting hole 13h is open in the horizontal direction (for example, in the X-direction). An inner circumferential surface of the mounting hole 13h of the electronic component 10M has a groove for the screw. (Fortification section)

[0035] Mounting section 14 is a section for fixing the electronic component 10M. Mounting section 14 has a mounting hole 14h to which a fastening element 112 (for example, a screw or a bolt; see Fig. 11), which will be described later. The mounting hole 14h is open in the Z-direction. Mounting hole 14h is an insertion hole through which the fastening element 112 passes. A fixing target for the fastening section 14 will be described later. <3.1.2 First-type connection component>

[0036] The connecting component of the first type 20M is a component that electrically connects the electronic component of the first type 10M to the routing board 40. In the present embodiment, the connecting component 20M electrically connects the electronic component 10M to a busbar 42 (see Fig. 8), which is contained in the routing board 40. In the present embodiment, a width L12 of the connecting component 20M in a longitudinal direction (for example, the X-direction) of the electronic component 10M is smaller than a width L11 of the electronic component 10M in the longitudinal direction. The connecting component 20M includes, for example, a first section 21 and a second section 22. (First section)

[0037] The first section 21 of the connecting component 20M is a section connected to terminal 13 of the electronic component 10M. The first section 21 is a plate-shaped or rectangular parallelepiped section extending in the Z-direction. The first section 21 extends in the Z-direction along one end (for example, an end in the X-direction) of the electronic component 10M. The first section 21 is a vertical section oriented in the Z-direction with respect to the routing board 40 (for example, with respect to a busbar 42, which will be described later). The first section 21 is horizontally adjacent (for example, in the X-direction) to the electronic component 10M.For example, the first section 21 borders the terminal 13 of the electronic component 10M in a horizontal direction (for example, in the X direction) and is connected to the terminal 13 of the electronic component 10M from a horizontal direction (for example, in the X direction).

[0038] The first section 21 of the connecting component 20M has a first mounting hole 21h through which the fastening element 71 (for example, a screw or a bolt) passes. The first mounting hole 21h is open in the horizontal direction (for example, in the X direction). The first section 21 has a recess 25 around the first mounting hole 21h. The recess 25 is a receiving section that accommodates a head of the fastening element 71 that has been inserted into the first mounting hole 21h. The fastening element 71, passing through the first mounting hole 21h, is connected to the mounting hole 13h of the terminal 13 of the electronic component 10M, so that the first section 21 is physically and electrically connected to the terminal 13 of the electronic component 10M. The first section 21 need not have the recess 25. (Second Section)

[0039] The second section 22 of the connection component 20M is a section that is connected to the busbar 42 (see Fig. 8) The second section 22 projects horizontally (for example, in the X direction) from the end of the first section 21 on the -Z direction side. The second section 22 is a plate section provided in the horizontal direction. The second section 22 borders the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The second section 22 of the connecting component 20M is attached to the fastening element 43 (for example, a screw or a bolt; see Fig. 8) is attached, projecting from the busbar 42 in the +Z direction and out of the Z direction, and is physically and electrically connected to the busbar 42. In the present embodiment, the second section 22 of the connecting component 20M has a second mounting hole 22h through which the fastening element 43 passes. The second mounting hole 22h is open in the Z direction. In the second section 22, the fastening element 43 passes through the second mounting hole 22h. A coupling element 44 (for example, a nut; see Fig. 3) is coupled to the tip of the fastening element 43, which passes through the second fastening hole 22h, thereby fixing the second section 22 to the busbar 42. In the present embodiment, the first section 21 and the second section 22 form an L-shaped connecting component 20M. <3.1.3 Second type electronic component>

[0040] Fig. Figure 6 is a perspective view showing the second-order electronic component 10N and the second-order connection component 20N. For simplicity, in Fig. Figure 6 shows the electronic component 10N and the connection component 20N with reference to the position of the electronic component 10 (electronic component 10U), which is arranged on the side in the +Z direction with respect to the routing board 40. The second type of electronic component 10N is an electronic component in which two terminals 13 are arranged separately at both ends in the horizontal direction of the electronic component 10N. The electronic component 10N includes, for example, a housing 11, a component body 12, and a plurality of terminals 13. Note that among the assemblies of the electronic component 10N, those assemblies that have similar functions to the electronic component 10M are designated with the same reference numerals.In this case, the “electronic component 10M” in the description of electronic component 10N can be replaced by the “electronic component 10N” in the description of electronic component 10M described above.

[0041] In electronic component 10N, terminals 13A and 13B are arranged separately at both ends of the electronic component 10N in a horizontal direction (for example, in the X-direction). Each terminal 13 has a mounting hole 13h to which a fastener 72 (for example, a screw or a bolt), described later, is attached. The mounting hole 13h is open in the Z-direction. For example, the mounting hole 13h of electronic component 10N is an insertion hole through which the fastener 72 passes. One of the terminals 13A and 13B is an example of a "first terminal." The other of the terminals 13A and 13B is an example of a "second terminal." <3.1.4 Second type connection component>

[0042] The connecting component of the second type 20N is a component that electrically connects the electronic component of the second type 10N to the routing board 40. In the present embodiment, the connecting component 20N electrically connects the electronic component 10N to the busbar 42 (see Fig. 8), which is contained in the routing board 40. In the present embodiment, a width L12 of the connecting component 20N in the longitudinal direction (for example, in the X-direction) of the electronic component 10N is smaller than a width L11 of the electronic component 10N in the longitudinal direction. The connecting component 20N includes, for example, a first section 21, a second section 22, and a third section 23. (First section)

[0043] The first section 21 of the connecting component 20N is a section connected to terminal 13 of the electronic component 10N. The first section 21 is a rectangular parallelepiped section extending in the Z-direction. The first section 21 is a vertical section oriented in the Z-direction relative to the routing board 40 (for example, relative to the busbar 42). The first section 21 borders terminal 13 of the electronic component 10N in the Z-direction and is connected to terminal 13 of the electronic component 10N in the Z-direction. The first section 21 of the connecting component 20N has a first mounting hole 21h into which the fastening element 72 engages. The first mounting hole 21h is open in the Z-direction. An inner circumferential surface of the first mounting hole 21h of the connecting component 20N has a groove for the screw.The fastening element 72, which passes through the mounting hole 13h of the terminal 13 of the electronic component 10N, is connected to the mounting hole 21h of the first section 21, so that the first section 21 is physically and electrically connected to the terminal 13 of the electronic component 10N. (Second Section)

[0044] The second section 22 of the connecting component 20N is a section that is connected to the busbar 42 (see Fig. 8) The second section 22 projects horizontally (for example, in the X direction) from the end of the first section 21 on the -Z direction side. The second section 22 is a plate section provided in the horizontal direction. The second section 22 borders the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The second section 22 of the connecting component 20N is attached in the Z direction to the fastening element 43 (for example, a screw or a bolt; see Fig. 8) is attached, projecting from the busbar 42 in the +Z direction, and is physically and electrically connected to the busbar 42. In the present embodiment, the second section 22 of the connecting component 20N has a second mounting hole 22h through which the fastening element 43 passes. The second mounting hole 22h is open in the Z direction. In the second section 22, the fastening element 43, which will be described later, passes through the second mounting hole 22h. A coupling element 44 (for example, a nut; see Fig. 3) is coupled to the tip of the fastening element 43, which passes through the second fastening hole 22h, thereby fixing the second section 22 to the busbar 42. (Third Section)

[0045] The third section 23 is a standing wall (side wall) extending horizontally in the +Z direction from both ends of the second section 22. The third section 23 is a wall provided in the Z direction. The third section 23 is connected to the first section 21 and also to the second section 22. For example, the third section 23 extends diagonally, increasing in the X direction as it extends in the -Z direction. The third section 23 can be provided in the connection component 20M described above. The connection component 20N, however, does not need to include the third section 23. <3.1.5 Structure in relation to the connection component>

[0046] In the present embodiment, the connecting components 20 (for example, connecting component 20M and connecting component 20N) are heat storage elements (heat-absorbing elements) that increase the heat capacity of the energy supply path of the electrical connecting unit 1. The connecting component 20 stores (absorbs) at least some of the heat generated, for example, by the electronic component 10. Alternatively / additionally, the connecting component 20 can store (absorb) at least some of the heat generated by the busbar 42 itself due to the energy supply. The connecting component 20 can be referred to as a "heat-storing component" or a "heat-absorbing component".

[0047] In the present embodiment, the busbar 42 is arranged at a position remote from the terminal 13 of the electronic component 10 (for example, at a position remote in the Z direction). The connecting component 20 is arranged between the electronic component 10 and the busbar 42. In the present disclosure, the phrase "the connecting component is arranged between the electronic component and the busbar" is not limited to the case where part of the connecting component is arranged between the electronic component and the busbar when viewed from the X or Y direction.The phrase "the connecting component is arranged between the electronic component and the busbar" can correspond to a case in which part of the connecting component is located between the electronic component and the busbar when viewed from a direction inclined with respect to the X-direction or the Y-direction. The connecting component 20 electrically connects the terminal 13 of the electronic component 10 to the busbar 42.

[0048] In the present embodiment, the thickness of at least one part of the connecting component 20 is greater than a plate thickness (a thickness in the Z direction) T3 of the busbar 42 (see Fig. 13) For example, a thickness T1 of at least a part of the connecting component 20 in the X-direction is greater than the plate thickness T3 of the busbar 42. In the present embodiment, the thickness T1 of the first section 21 of the connecting component 20 in the X-direction is greater than the plate thickness T3 of the busbar 42. In the present embodiment, the thickness T1 of the first section 21 in the X-direction is greater than the plate thickness T3 of the busbar 42 over the entire length of the first section 21 in the Z-direction. For example, the thickness T1 of the first section 21 of the connecting component 20 in the X-direction is twice or more than the plate thickness T3 of the busbar 42. From another perspective, a thickness T2 of the second section 22 of the connecting component 20 in the Z-direction can be greater than the plate thickness T3 of the busbar 42.

[0049] In the present embodiment, the thickness T1 of the first section 21 of the connecting component 20 in the X-direction is greater than the thickness T2 of the second section 22 of the connecting component 20 in the Z-direction. In the present embodiment, the thickness T1 of the first section 21 in the X-direction is greater than the thickness T2 of the second section 22 in the Z-direction over the entire length of the first section 21 in the Z-direction. <3.2 Connection component for external connection>

[0050] Next, the connection component 30 for the external connection will be described.

[0051] Fig. Figure 7 is a perspective view showing the connection component 30 for the external connection. The connection component 30 is a component that electrically connects an external busbar 76 to the distribution board 40. In the present embodiment, the connection component 30 electrically connects the external busbar 76 to the busbar 42 contained in the distribution board 40 (see Figure 7). Fig. 8) The external connecting busbar 76 is electrically connected to an external device. In the present disclosure, the “external device” is an electrical device that exists outside the electrical connecting unit 1. The external device is, for example, a battery attached to a vehicle or an inverter for driving a motor of the vehicle, but is not limited to these examples. The connecting component 30 includes, for example, a first section 31, a second section 32, and a third section 33. (First section)

[0052] The first section 31 is a section connected to the external busbar 76. The first section 31 is a rectangular parallelepiped section extending in the Z-direction. The first section 31 is a vertical section oriented in the Z-direction relative to the routing board 40 (for example, relative to the busbar 42). The first section 31 borders the external busbar 76 in the Z-direction and is connected to the external busbar 76 in the Z-direction. The first section 31 has a first mounting hole 31h through which a fastener 73 (for example, a screw or a bolt) passes. The first mounting hole 31h is open in the Z-direction. An inner circumferential surface of the first mounting hole 31h has a groove for the screw.The fastening element 73, which passes through the mounting hole 76h of the external connecting busbar 76, is coupled to the mounting hole 31h of the first section 31, so that the first section 31 is physically and electrically connected to the external connecting busbar 76. (Second Section)

[0053] The second section 32 is a section that is connected to the busbar 42 (see Fig. 8) The second section 32 projects horizontally (for example, in the X direction) from the end of the first section 31 on the -Z direction side. The second section 32 is a plate section provided in the horizontal direction. The second section 32 borders the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The second section 32 is attached in the Z direction to the fastening element 43 (for example, a screw or a bolt; see Fig. 8) is attached, projecting from the busbar 42 in the +Z direction, and is physically and electrically connected to the busbar 42. In the present embodiment, the second section 32 has a second mounting hole 32h through which the mounting element 43 passes. The second mounting hole 32h is open in the Z direction. In the second section 32, the mounting element 43, which will be described later, passes through the second mounting hole 32h. The coupling element 44 (for example, a nut; see Fig. 3) is coupled to the tip of the fastening element 43, which passes through the second fastening hole 32h, thereby fixing the second section 32 to the busbar 42. (Third Section)

[0054] The third section 33 is a standing wall (side wall) extending horizontally in the +Z direction from both ends of the second section 32. The third section 33 is a wall provided in the Z direction. The third section 33 is connected to the first section 31 and also to the second section 32. For example, the third section 33 extends diagonally to increase in the X direction (or Y direction) while running parallel in the -Z direction. The connecting component 30 does not need to include the third section 33.

[0055] Note that the size ratio (e.g., a size ratio with respect to thicknesses T1, T2, and T3) between the connection component 20 described above and the busbar 42 also applies to the connection component 30 to which the external connection busbar 76 is connected. For example, in the description of connection component 30, "connection component 20" can be replaced by "connection component 30", "first section 21" can be replaced by "first section 31", and in the description of connection component 20, "second section 22" can be replaced by "second section 32". <3.3 Installation board>

[0056] Next, the routing board 40 will be described.

[0057] Fig. Figure 8 is a perspective view depicting the routing board 40. The routing board 40 is a component that forms at least part of a power supply path between the plurality of electronic components 10 and / or at least part of a power supply path between the electronic component 10 and an external device. In the present disclosure, the “routing board” denotes a board-like routing structure. The term “board-like” denotes a plate-like shape along a plane when viewed as a whole, irrespective of any fine detail.In the present disclosure, the term "plate-shaped," "sheet-shaped," or "flat" shape is not limited to the case where it is completely flat and may include a case in which a fixing structure, a rib, or the like, projecting in the Z-direction, is partially present, a case in which a non-uniform shape, following the thickness of the busbar, is present on the surface, and the like. In the present embodiment, the routing board 40 has a plate-shaped form in the X and Y directions.

[0058] The distribution board 40 includes, for example, a base plate 41, one or more (for example, a plurality of) busbars 42, and a plurality of fastening elements 43. In the present embodiment, the base plate 41 and the plurality of busbars 42 are integrated by insert forming. For example, the distribution board 40 is formed as a single element by insert forming the busbar 42 with the base plate 41 after the fastening element 43 has been fixed to the busbar 42. That is, the busbar 42 is integrated with the base plate 41 without the use of a fastening element such as a screw or bolt. Note that the distribution board 40 can also be formed by a different structure instead of insert forming. A modification example in which the distribution board 40 is formed by a different structure is described later.

[0059] Fig. Figure 9 is a partially separated perspective view of the routing board 40. For the sake of simplicity, the base plate 41, the busbar 42 and the fastening element 43 are described below with reference to the drawings in which the routing board 40 is partially separated. <3.3.1 Base plate>

[0060] The base plate 41 is a retaining element that integrally holds (supports) the majority of the horizontally spaced busbars 42. The base plate 41 is made, for example, of synthetic resin and has insulating properties. The base plate 41 electrically insulates the majority of the busbars 42 from one another. The base plate 41 is an example of a "base element." The base plate 41 can also be referred to as an "insulating substrate." In the present embodiment, the base plate 41 forms a carrier SB that is arranged between the majority of electronic components 10U and 10L. In the present embodiment, the carrier SB is formed from an insulating element (base plate 41). The base plate 41 includes, for example, a flat surface section 51, a majority of fixing sections 52, and a majority of fixing sections 53. The flat surface section 51 and the fixing section 53 are described below.Fixing section 52 will be described later. (Flat surface section)

[0061] The flat surface section 51 is a section formed in the base plate 41 in a plate-like shape. The flat surface section 51 has the form of a plate that is formed in the horizontal direction. The flat surface section 51 forms a main section of the base plate 41. The flat surface section 51 forms an (insulating) base section of the base plate 41. In the present embodiment, the flat surface section 51 extends over the entire width in the X direction of the base plate 41 and over the entire width in the Y direction of the base plate 41, with the exception of four corner sections of the base plate 41.

[0062] The flat surface section 51 has a first surface 51a and a second surface 51b. The first surface 51a is a surface oriented in the +Z direction. The first surface 51a is a flat surface provided in the horizontal direction. The first surface 51a forms at least part of a first surface 41s1 of the routing board 40M described above. The first surface 51a is one or more (e.g., a plurality of) electronic components 10U and the insulating cover 94 (see Fig. 1) facing the electrical connection unit 1. The second surface 51b is located on the side opposite the first surface 51a. The second surface 51b is a surface oriented in the -Z direction. The second surface 51b is a flat surface provided in the horizontal direction. The second surface 51b forms at least part of a second surface 41s2 of the routing board 40M described above. The second surface 51b is one or more (e.g., a plurality of) electronic components 10L and the metal plate 80 (see Fig. 1) facing. One thickness direction (plate thickness direction) of the flat surface section 51 is the Z-direction.

[0063] The flat surface section 51 has, for example, one or more (for example, a plurality of) receiving sections 55 in which the busbars 42 are each received. The plurality of receiving sections 55 are spaced apart from one another in the X or Y direction. Each of the receiving sections 55 is, for example, a through-hole that penetrates the flat surface section 51 (the base plate 41) in the Z direction. Note that the receiving section 55 can be a recess provided on the first surface 51a or the second surface 51b of the flat surface section 51 and is recessed in the Z direction, instead of a through-hole. For example, the receiving section 55 can be a recess from the first surface 51a of the flat surface section 51 in the -Z direction or a recess from the second surface 51b of the flat surface section 51 in the +Z direction.In the present disclosure, the wording “the receiving section penetrates the flat surface section in the first direction (Z-direction)” may include a case in which part of the total length of the receiving section 55 penetrates the flat surface section 51 in the Z-direction (for example, the remaining part of the receiving section 55 may be a recess in the Z-direction or be provided within the base plate 41 and not be exposed to the outside of the base plate 41).Similarly, in the present disclosure, the phrase “the receiving section is recessed in the first direction (Z direction)” may include a case in which part of the total length of the receiving section 55 is recessed in the Z direction (for example, a remaining part of the receiving section 55 may be a through hole penetrating the flat surface section 51 in the Z direction, or be provided within the base plate 41 and not be exposed to the outside of the base plate 41).

[0064] Each receiving section 55 has an outer shape that, viewed from the Z-direction, corresponds to the shape of the busbar 42 to be received. In the present embodiment, the flat surface section 51, for example, includes five receiving sections 55A, 55B, 55C, 55D, and 55E as the plurality of receiving sections 55. Receiving section 55A is provided to correspond to a busbar 42A, which will be described later, and receives the busbar 42A. Receiving section 55B is provided to correspond to a busbar 42B, which will be described later, and receives the busbar 42B. Receiving section 55C is provided to correspond to a busbar 42C, which will be described later, and receives the busbar 42C. Receiving section 55D is provided to correspond to a busbar 42D, which will be described later, and receives the busbar 42D.The receiving section 55E is provided in such a way that it corresponds to a busbar 42E, which will be described later, and accommodates the busbar 42E. (Fixation section)

[0065] The fixing section 53 is a fixing section to which the electronic component 10 is attached. The fixing section 53 is, for example, a projection that extends in the Z-direction from the flat surface section 81. The fixing section 83 faces the mounting section 14 of the electronic component 10 in the Z-direction. The fixing section 53 has a coupling hole 53h that is open in the +Z direction. An inner circumferential surface of the coupling hole 53h has a groove for the screw. The fixing section 53 is formed, for example, by embedding a metal component with the coupling hole 53h in the flat surface section 51 of the base plate 41.

[0066] A fastening element 112 (for example, a screw or a bolt) passes through the fastening hole 14h of the fastening section 14 of the electronic component 10 in the Z direction. When the fastening element 112, passing through the fastening hole 14h of the fastening section 14 of the electronic component 10, engages in the coupling hole 53h of the fixing section 53, the electronic component 10 is fixed to the base plate 41.

[0067] In the present embodiment, the fixing section 53, to which the electronic component 10U is attached, projects in the +Z direction from the flat surface section 51 of the base plate 41. The mounting section 14 of the electronic component 10U is fixed to the fixing section 53 from the side in the +Z direction. Conversely, the fixing section 53, to which the electronic component 10L is attached, projects in the -Z direction from the flat surface section 51 of the base plate 41. The mounting section 14 of the electronic component 10L is fixed to the fixing section 53 from the side in the -Z direction. <3.3.2 Busbar>

[0068] The busbar 42 is a routing element (electrical connection element) contained in the routing board 40. The busbar 42 is, for example, a routing element for electrically connecting a plurality of electronic components 10. Alternatively, the busbar 42 can also be a routing element for connecting the electronic component 10 to an external device. The busbar 42 is made of a metal (for example, copper or a copper alloy) and is conductive. In the present embodiment, the routing board 40 contains, for example, five busbars 42A, 42B, 42C, 42D, and 42E as a plurality of busbars 42. The five busbars 42A, 42B, 42C, 42D, and 42E are arranged such that they are positioned at intervals in the horizontal direction. The five busbars 42A, 42B, 42C, 42D and 42E contain sections that are arranged in the same plane.The five busbars 42A, 42B, 42C, 42D and 42E are at least partially adjacent to each other in the X or Y direction. The five busbars 42A, 42B, 42C, 42D and 42E are supported by the flat surface section 51 of the base plate 41.

[0069] Each of the five busbars 42A, 42B, 42C, 42D and 42E is received in the receiving section 55, is at least partially exposed towards the first surface 51a of the base plate 41 and is at least partially exposed towards the second surface 51b of the base plate 41. Instead of the through-hole that penetrates the base plate 41 in the Z-direction, each of the five receiving sections 55A, 55B, 55C, 55D and 55E corresponding to the five busbars 42 can be a recess from the first surface 51a of the flat surface section 51 in the -Z-direction or a recess from the second surface 51b of the flat surface section 51 in the +Z-direction. (Busbar routing structure)

[0070] At least a portion of each busbar 42 has a plate-like shape extending horizontally. At least a portion of each busbar 42 is received in the receiving section 55 and extends along the flat surface section 51. That is, at least a portion of each busbar 42 extends along the first surface 51a of the flat surface section 51. At least a portion of each busbar 42 extends horizontally within the receiving section 55. In the present embodiment, each busbar 42 has a plate-like shape extending horizontally over its entire length. Each busbar 42 is received in the receiving section 55 over its entire length and extends along the flat surface section 51.A section of each busbar 42 that is received into the receiving section 55 and extends along the flat surface section 51 may be referred to below as the "plate section 42p". The busbar 42 is an element that forms a horizontal power supply path. The busbar 42 may also be referred to as the "horizontal routing element".

[0071] Fig. Figure 10 is a top view showing the routing board 40. The board section 42p of each busbar 42 has, for example, a first connecting section 61, a second connecting section 62 and an extending section 63.

[0072] The first connection section 61 is a section connected to a connection component 20 (hereinafter referred to as "first connection component 20"). The first connection component 20 is a connection component that connects an electronic component 10 (hereinafter referred to as "first electronic component 10") to the busbar 42. The first connection section 61 is a section of the busbar 42 that overlaps the first connection component 20 when viewed from the Z-direction. The first connection section 61 is adjacent to the first connection component 20 in the Z-direction and is connected to the first connection component 20 in the Z-direction.

[0073] The second connection section 62 is a section that is connected to another connection component 20 (hereinafter referred to as "second connection component 20"). The second connection component 20 is a connection component that connects another electronic component 10 (hereinafter referred to as "second electronic component 10"), which is contained within the plurality of electronic components 10, to the busbar 42. The second connection section 62 is a section of the busbar 42 that overlaps the second connection component 20 when viewed from the Z-direction. The second connection section 62 is adjacent to the second connection component 20 in the Z-direction and is connected to the second connection component 20 in the Z-direction.

[0074] Note that the second connection section 62, instead of the example above, can also be a section connected to another connection component 30 (hereinafter referred to as "second connection component 30"). The connection component 30 is a connection component for connecting an external device to the busbar 42. In this case, the second connection section 62 is a section of the busbar 42 that overlaps the second connection component 30 as viewed from the Z-direction. The second connection section 62 is adjacent to the second connection component 30 in the Z-direction and is connected to the second connection component 30 in the Z-direction.

[0075] The second connection section 62 can be a section that is in contact with the coupling busbar 75 in order to be connected to a different subunit SU instead of the connection components 20 and 30. In this case, the second connection section 62 is a section of the busbar 42 that overlaps the coupling busbar 75 when viewed from the Z-direction. The second connection section 62 is adjacent to the coupling busbar 75 in the Z-direction and is connected to the coupling busbar 75 from the Z-direction.

[0076] The extending section 63 extends from the first connecting section 61 in the X-direction or in the Y-direction. The extending section 63 is provided between the first connecting section 61 and the second connecting section 62. The extending section 63 extends over the first connecting section 61 and the second connecting section 62. The extending section 63 connects the first connecting section 61 with the second connecting section 62.

[0077] In the present embodiment, the first connecting section 61, the second connecting section 62, and the extending section 63 have a plate-like shape formed in the horizontal direction. In the present embodiment, each busbar 42 is received in the receiving section 55 at least above the first connecting section 61 and the second connecting section 62 and extends along the flat surface section 51. For example, the first connecting section 61, the second connecting section 62, and the extending section 63 are received in the receiving section 55 and extend along the flat surface section 51.

[0078] In the present embodiment, the extending sections 63 of some busbars 42 are received in the receiving section 55 such that they extend over both sides of a region R, specifically through the region R that overlaps the electronic component 10 when viewed from the Z direction. For example, the extending section 63 extends linearly in the X direction. The extending section 63 extends over a region R that overlaps the electronic component 10 when viewed from the Z direction, over both the +X-direction and -X-direction sides of region R. That is, the busbar 42 is received in the receiving section 55 in such a way that it can easily be routed along a better path (for example, a path with a shorter distance) without being obstructed by the presence of the electronic component 10.

[0079] The one or more busbars 42 may, in addition to the first connecting section 61, the second connecting section 62, and the extending section 63, have an extension 64. The extension 64 is a section in which the busbar 42 extends to increase a heat dissipation area and / or to increase heat storage capacity (heat absorption). The extension 64 is a section that is not used for electrical connections. For example, the extension 64 is located on the side opposite the extending section 63 with respect to the first connecting section 61 (or the second connecting section 62). The extension 64 has a plate-like shape formed in the horizontal direction. The extension 64 is received in the receiving section 55 and extends along the flat surface section 51.The extension 64 extends to the region R, which overlaps the electronic component 10 as seen from the Z direction, and has an end 42e1 of the busbar 42 at a position which overlaps the electronic component 10 as seen from the Z direction.

[0080] Some routing examples for busbar 42 are described below. The majority of electronic components 10 contain three electronic components 10A, 10B, and 10C. Electronic components 10A and 10B, for example, are type 10M. Electronic component 10C, for example, is type 10N. The type of electronic component 10 is not limited to the example above.

[0081] In the present embodiment, each of the electronic components 10A and 10B is an example of the electronic component 10 (electronic component 10U) arranged laterally in the +Z direction with respect to the base plate 41. The electronic components 10A and 10B face the first surface 51a of the flat surface section 51 of the base plate 41 (the first surface 40s1 of the routing board 40M) laterally in the +Z direction. Each of the electronic components 10A and 10B is an example of a "first electronic component". From a broader perspective, electronic component 10A is an example of a "first electronic component", and electronic component 10B is an example of a "third electronic component".

[0082] Electronic component 10C, on the other hand, is an example of electronic component 10 (electronic component 10L) arranged laterally in the -Z direction with respect to the base plate 41. Electronic component 10C faces the second surface 51b of the flat surface section 51 of the base plate 41 (the second surface 40s2 of the routing board 40M) laterally in the -Z direction. Electronic component 10C is an example of a "second electronic component".

[0083] In the present embodiment, electronic component 10B (electronic component 10U) and electronic component 10C (electronic component 10L) overlap at least partially when viewed from the Z-direction. For example, electronic component 10B overlaps terminal 13A of electronic component 10C when viewed from the Z-direction.

[0084] The majority of connection components 20 contain six connection components 20A, 20B, 20C, 20D, 20E, and 20F. The majority of connection components 30 contain two connection components 30A and 30B. The majority of coupling busbars 75 contain two coupling busbars 75A and 75B. The majority of external connection busbars 76 contain two external connection busbars 76A and 76B. (First installation example)

[0085] First, a routing example for busbar 42A is described. Busbar 42A has a first connection section 61, a second connection section 62, and an extending section 63. Viewed from the Z-direction, the first connection section 61 is located in the +X direction relative to electronic component 10A. The first connection section 61 is electrically connected to terminal 13A of electronic component 10A via connection component 20A, which is the first connection component 20. Viewed from the Z-direction, the second connection section 62 is located in the -X direction relative to electronic component 10A. The second connection section 62 is electrically connected to another subunit SU via the coupling busbar 75A.

[0086] Extending section 63 is received in receiving section 55 such that, viewed from the Z-direction, it extends over both sides of region R through region R, which overlaps electronic component 10A. For example, extending section 63 extends linearly in the X-direction. Extending section 63 extends over region R, which overlaps electronic component 10A viewed from the Z-direction, over the +X-direction side and the -X-direction side of region R. Busbar 42A, for example, is a busbar contained in the positive electrode line PL in electrical connection unit 1. Busbar 42A is an example of a "first busbar." Receiving section 55A is an example of a "first receiving section." (Second installation example)

[0087] Next, an installation example for busbar 42B is described. Busbar 42B has the first connection section 61, the second connection section 62, the extending section 63, and the extension 64. The first connection section 61 is electrically connected to terminal 13B of electronic component 10A via connection component 20B, which is the first connection component 20. The second connection section 62 is electrically connected to the external connection busbar 76A via connection component 30A, which is the second connection component 30. The extension 64 extends to region R, which overlaps electronic component 10A as viewed from the Z-direction, and has an end 42e1 of busbar 42 at a position that overlaps electronic component 10A.Similar to busbar 42A, busbar 42B can also have an extending section 63 that, viewed from the Z direction, extends through region R, which overlaps electronic component 10, and across both sides of region R. For example, busbar 42B is a busbar contained in the positive electrode line PL in electrical connection unit 1. (Third laying example)

[0088] Next, an example of the busbar layout 42C is described. Busbar 42C contains the first connecting section 61, the second connecting section 62, the extending section 63, and the extension 64. The first connecting section 61 is electrically connected to terminal 13B of electronic component 10B via connecting component 20C, which is the first connecting component 20. The second connecting section 62 is electrically connected to another subunit SU via the coupling busbar 75B. The extension 64 extends to region R, which overlaps electronic component 10B as viewed from the Z-direction, and has an end 42e1 of busbar 42 at a position that overlaps electronic component 10B as viewed from the Z-direction. Busbar 42C is, for example, a busbar contained in the negative electrode line NL in electrical connecting unit 1.Busbar 42C is another example of a "first busbar". Receiver section 55C is another example of a "first receiver section". (Fourth laying example)

[0089] Next, an installation example for busbar 42D is described. Busbar 42D has a first connection section 61, a second connection section 62, and an extending section 63. The first connection section 61 is electrically connected to terminal 13A of electronic component 10B via connection component 20D, which is the first connection component 20. The second connection section 62 is electrically connected to terminal 13A of electronic component 10C via connection component 20E, which is the second connection component 20. Busbar 42D is, for example, a busbar contained in the negative electrode line NL in electrical connection unit 1. Busbar 42D is an example of a "second busbar." The receiving section 55D is an example of a "second receiving section." (Fifth laying example)

[0090] Next, an installation example for busbar 42E is described. Busbar 42E has a first connection section 61, a second connection section 62, and an extending section 63. The first connection section 61 is electrically connected to terminal 13B of electronic component 10C via connection component 20F, which is the first connection component 20. The second connection section 62 is electrically connected to the external connection busbar 76B via connection component 30B, which is the second connection component 30. Busbar 42E is, for example, a busbar contained in the negative electrode line NL in electrical connection unit 1. (Exposure structure of the busbar)

[0091] Next, an exposure structure of busbar 42 is described. The following describes an exposure structure of busbar 42 with reference to... Fig. 8 and Fig. 9 described. In the present embodiment, at least a portion of the extending section 63 of the busbar 42 is exposed to the outside of the base plate 41 on the upper and lower surface sides. For example, the extending section 63 of the busbar 42 is exposed to the outside of the base plate 41 on the upper and lower surface sides at least in a portion of a region R (see Fig. 10) exposed, overlapping the electronic component 10 as seen from the Z direction.

[0092] In the present embodiment, the busbar 42 is received in the receiving section 55 at least over its entire length between the first connecting section 61 and the second connecting section 62 and extends along the first surface 51a of the flat surface section 51. The busbar 42 is exposed to the outside of the base plate 41 on the upper surface side and the lower surface side at least over its entire length between the first connecting section 61 and the second connecting section 62.

[0093] In the present embodiment, the busbar 42 is received in the receiving section 55 over its entire length and extends along the first surface 51a of the flat surface section 51. The busbar 42 is exposed to the outside of the base plate 41 on both the upper and lower surface sides over its entire length. <3.3.3 Fastener>

[0094] Next, the fastening element 43 will be described with reference to Fig. 9 described. The fastening element 43 is a component for fixing the busbar 42 and a connection target component (the connection component 20, the connection component 30 or the coupling busbar 75) of the busbar 42. The fastening element 43 is, for example, a crimping bolt fixed to the busbar 42. The fastening element 43 is, for example, a “fastening section”.

[0095] In the present embodiment, the first connecting section 61 and the second connecting section 62 of the busbar 42 each have a through-hole 42h. The through-hole 42h penetrates the busbar 42 in the Z-direction. The fastening element 43 is, for example, a bolt with a shank 43a and a head 43b. A circumferential surface of the shank 43a has a groove for the screw. The head 43b has a diameter larger than that of the shank 43a. The head 43b of the fastening element 43 is riveted and fixed to the busbar 42 in such a way that the shank 43a passes through the through-hole 42h of the busbar 42. With this fixing, the fastening element 43 is electrically and physically connected to the busbar 42, in a state in which the shaft 43a protrudes in the Z-direction from the through hole 42h of the busbar 42.The fastening element 43 is not limited to fixing by riveting, but can also be fixed to the busbar 42 by welding or other methods.

[0096] In the present embodiment, the connecting component 20 is attached to the fastening element 43 in the Z-direction after it has been previously fixed to the electronic component 10 via the fastening element 72 or the fastening element 71. For example, in the connecting component 20, the shaft 43a of the fastening element 43 is inserted into the fastening hole 22h of the second section 22. The coupling element 44 (for example, a nut) is connected to the shaft 43a of the fastening element 43, which protrudes from the fastening hole 22h of the second section 22 of the connecting component 20. The coupling element 44 is, for example, attached to the shaft 43a in the Z-direction. This coupling secures the second section 22 of the connecting component 20 to the fastening element 43.

[0097] In the present embodiment, the busbar 42 has a first surface 42s1 and a second surface 42s2 (see Fig. 13) The first surface 42s1 is a surface oriented in the +Z direction. The second surface 42s2, however, is located on the side opposite the first surface 42s1. The second surface 42s2 is a surface oriented in the -Z direction.

[0098] In the present embodiment, the fastening element 43, to which the connecting component 20 corresponding to the electronic component 10U is attached, projects laterally in the +Z direction from the first surface 42s1 of the busbar 42. The connecting component 20 corresponding to the electronic component 10U is attached to the busbar 42 laterally in the +Z direction such that the shaft 43a of the fastening element 43 is inserted into the mounting hole 22h of the connecting component 20. The connecting component 20 corresponding to the electronic component 10U is fixed to the busbar 42, for example, by means of the coupling element 44, in a state in which it is in contact with the first surface 42s1 of the busbar 42 laterally in the +Z direction.

[0099] In contrast, the fastening element 43, to which the connecting component 20 corresponding to the electronic component 10L is attached, projects laterally in the -Z direction from the second surface 42s2 of the busbar 42. The connecting component 20 corresponding to the electronic component 10L is attached to the busbar 42 laterally in the -Z direction such that the shaft 43a of the fastening element 43 is inserted into the mounting hole 22h of the connecting component 20. The connecting component 20 corresponding to the electronic component 10L is fixed to the busbar 42, for example, via the coupling element 44, in a state in which it is in contact with the second surface 42s2 of the busbar 42 laterally in the -Z direction. <4. Metal plate, insulating film, heat transfer element and insulating cover>

[0100] Next, the metal plate 80, the insulating foils 91A and 91B, the heat transfer element 92, the heat transfer section 93 and the insulating cover 94 are described. <4.1 Metal plate>

[0101] Fig. Figure 11 is a partially unfolded perspective view of the electrical connection unit 1. The metal plate 80 is an element for ensuring the rigidity of the electrical connection unit 1 and for improving its heat dissipation properties. The metal plate 80 is made of a metal (for example, aluminum or an aluminum alloy). The metal plate 80 is an example of a "rigid element." The metal plate 80 can also be referred to as a "metal element" or a "heat dissipation element." In the present embodiment, the metal plate 80 is arranged on the side opposite the routing board 40M with respect to the electronic component 10L, and the routing board 40M is fixed to it.

[0102] The metal plate 80 is rectangular in the X direction when viewed from the Z direction. The metal plate 80 has a first end 80e1, a second end 80e2, a third end 80e3 and a fourth end 80e4 (see Fig. 2) The first end 80e1 and the second end 80e2 are a pair of ends of the metal plate 80 in the longitudinal direction, separated from each other in the X-direction. The third end 80e3 and the fourth end 80e4 are a pair of ends of the metal plate 80 in the lateral direction, separated from each other in the Y-direction. The metal plate 80 has, for example, a flat surface section 81 and a plurality of fixing sections 82.

[0103] The flat surface section 81 is a section formed in the metal plate 80 in a plate-like shape. The flat surface section 81 has a plate-like shape formed in the horizontal direction. The flat surface section 81 forms a main section of the metal plate 80. The flat surface section 81 forms a base section (metal base section) of the metal plate 80. In the present embodiment, the flat surface section 81 has a size that covers the three subunits SU from below. The flat surface section 81 faces the laying plates 40 of the three subunits SU. In the present embodiment, there is a space S1 (see Fig. 13) between the metal plate 80 and the second surface 51b of the flat surface section 51 of each subunit SU, and the metal plate faces the second surface 51b of the flat surface section 51 of each subunit SU. The electronic component 10L is accommodated in space S1. That is, the electronic component 10L is arranged in the Z direction between the routing board 40M and the metal plate 80.

[0104] The fixing section 82 is a section for fixing the base plate 41 of each subunit SU to the metal plate 80. The fixing section 82 is positioned in a location corresponding to the fixing section 52 of the base plate 41 of each subunit SU when viewed from the Z-direction. The fixing section 82 is a cylindrical or prismatic projection that extends in the +Z direction from the flat surface section 81 of the metal plate 80. The fixing section 82 faces the fixing section 52 of the base plate 41 in the Z-direction. The fixing section 82 has a coupling hole 82h that is open in the +Z direction. An inner circumferential surface of the coupling hole 82h has a groove for the screw.

[0105] The base plate 41 is fixed to the fixing section 82 of the metal plate 80 by means of the fixing section 52. The fixing section 52 has an insertion hole 52h, which faces the coupling hole 82h of the fixing section 82 of the metal plate 80. A fastening element 111 (for example, a screw or a bolt) passes through the insertion hole 52h. When the fastening element 111, which passes through the insertion hole 52h of the fixing section 52 of the base plate 41, engages in the coupling hole 82h of the fixing section 82 of the metal plate 80, the base plate 41 is fixed to the metal plate 80. <4.2 Insulating film>

[0106] The insulating films 91A and 91B are insulating elements for the electrical insulation of the metal plate 80 from the circuit board 40M. The insulating films 91A and 91B consist, for example, of a synthetic resin such as polyester or polyimide and have insulating properties.

[0107] The insulating foil 91A is rectangular and extends along the flat surface section 81 of the metal plate 80. The insulating foil 91A is sheet-shaped and extends horizontally. The insulating foil 91A is arranged between the flat surface section 81 of the metal plate 80 and the routing board 40 of each subunit SU. In the present embodiment, the insulating foil 91A has an opening through which the heat transfer section 93, which will be described later, passes. If a required insulating property is ensured by other means, the insulating foil 91A can be omitted.

[0108] The insulating foil 91B is rectangular and extends along the upper surface of the heat transfer section 93. The insulating foil 91B is sheet-shaped and extends horizontally. The insulating foil 91B is arranged between the heat transfer section 93 and the heat transfer element 92. Note that instead of the above example, the insulating foil 91B can be provided between the routing board 40 of each subunit SU and the plurality of heat transfer elements 92. If a required insulating property is ensured by other means, the insulating foil 91B can be omitted. If the heat transfer element 92 has an insulating property and the required insulating property is ensured by the heat transfer element 92, the insulating foil 91B can be omitted. <4.3 Heat transfer element>

[0109] The heat transfer element 92 is an element for transferring the heat generated by the electronic component 10 at the time of energy supply and / or the heat generated by the busbar 42 itself at the time of energy supply (Joule heat) to the metal plate 80. The heat transfer element 92 is, for example, a heat transfer film (for example, a thermally conductive silicone film) that is elastic. The heat transfer element 92 is made, for example, of a material with a higher thermal conductivity than that of the base plate 41. However, the heat transfer element 92 is not limited to the above example, but can also be a heat transfer element made of a thermally conductive gel or another material.

[0110] Fig. Figure 12 is a bottom view showing the routing board 40. In the present embodiment, the majority of the heat transfer elements 92 are partially provided in the routing board 40. For example, the majority of the heat transfer elements 92 are arranged in positions that overlap a portion of the busbar 42 when viewed from the Z-direction. More precisely, the majority of the heat transfer elements 92 are arranged in positions that overlap a portion of the busbar 42 near the electronic component 10 (for example, electronic components 10A and 10B) when viewed from the Z-direction. In the present embodiment, the majority of the heat transfer elements 92 are arranged in positions that overlap the connecting component 20 when viewed from the Z-direction. Note that the arrangement position of the heat transfer element 92 is not limited to the example described above.For example, the heat transfer element 92 can be arranged in a position that does not overlap the connecting component 20 or in a position that does not overlap the electronic component 10 as seen from the Z direction.

[0111] Fig. 13 is a cross-sectional view along line F13-F13 of the in Fig. The structure shown in Figure 10 is described. In the present embodiment, the heat transfer element 92 is arranged between the metal plate 80 and the busbar 42. The heat transfer element 92 transfers the heat transferred from the electronic component 10 to the busbar 42 and / or the heat generated by the busbar 42 from the busbar 42 to the metal plate 80.

[0112] In the present embodiment, part of the heat transfer element 92 is in contact with the busbar 42 at a position that overlaps the connecting component 20 when viewed from the Z-direction. In this case, the heat transfer element 92 easily transfers the heat transferred from the terminal 13 of the electronic component 10 to the connecting component 20 from the connecting component 20 via the busbar 42 to the metal plate 80. Instead of / in addition to the above example, part of the heat transfer element 92 can be in contact with the busbar 42 at a position that overlaps the connecting component 30 when viewed from the Z-direction. In this case, the heat transfer element 92 easily transfers the heat transferred from an external device to the connecting component 30 from the connecting component 30 via the busbar 42 to the metal plate 80.

[0113] In the present embodiment, a portion of the heat transfer element 92 is arranged in a position that overlaps the head 43b of the fastening element 43 when viewed from the Z-direction and is in contact with the head 43b of the fastening element 43. In this case, the heat transfer element 92 easily transfers the heat transferred from the terminal 13 of the electronic component 10 to the connecting component 20 from the fastening element 43 to the metal plate 80. When a portion of the heat transfer element 92 is in contact with the head 43b of the fastening element 43, the heat transfer element 92 easily transfers the heat transferred from an external device to the connecting component 30 from the fastening element 43 to the metal plate 80.

[0114] Part of the heat transfer element 92 can be in contact with the busbar 42 at a position that overlaps the electronic component 10 when viewed from the Z-direction. In this case, the heat transfer element 92 readily transfers the heat transferred from the electronic component 10 to the busbar 42 from the busbar 42 to the metal plate 80. Note that a heat transfer element can be provided between the busbar 42 and the electronic component 10.

[0115] In the present embodiment, the electronic component 10U is not in contact with the busbar 42 in the area where the connecting component 20 attached to the electronic component 10L and the electronic component 10U overlap in the Z-direction. That is, in the area where the connecting component 20 attached to the electronic component 10L and the electronic component 10U overlap in the Z-direction, an air gap AS is provided between the electronic component 10U and the busbar 42. The presence of this air gap AS between the electronic component 10U and the busbar 42 prevents heat transferred from the electronic component 10L to the busbar 42 from being transferred from the busbar 42 to the electronic component 10U.

[0116] This applies equally if the corresponding relationship between electronic component 10U and electronic component 10L is reversed. In an area where the connecting component 20 attached to electronic component 10U and electronic component 10L overlap in the Z-direction, electronic component 10L is not in contact with busbar 42. That is, in the area where the connecting component 20 attached to electronic component 10U and electronic component 10L overlap in the Z-direction, an air gap AS is provided between electronic component 10L and busbar 42. <4.4 Heat transfer section>

[0117] The heat transfer section 93 is a structure in which the space S1 between the flat surface section 81 of the metal plate 80 and the heat transfer element 92 is filled, and heat is transferred from the heat transfer element 92 to the flat surface section 81 of the metal plate 80. The heat transfer section 93 is an example of a projecting section extending from the metal plate 80 to the laying board 40M. The heat transfer section 93 is, for example, a block element made of metal (e.g., copper, a copper alloy, aluminum, or an aluminum alloy). The heat transfer section 93 is made of a material that has a higher thermal conductivity than the heat transfer element 92. The heat transfer section 93 is a rigid element that is less prone to deformation than the heat transfer element 92.The heat transfer section 93 is positioned so that it overlaps the heat transfer element 92 when viewed in the Z-direction. For example, the heat transfer section 93 has the same area as the heat transfer element 92 when viewed in the Z-direction. The thickness of the heat transfer section 93 in the Z-direction is greater than the thickness of the heat transfer element 92 in the Z-direction.

[0118] The heat transfer section 93 is fixed to the flat surface section 81 of the metal plate 80 and projects from the flat surface section 81 of the metal plate 80 towards the heat transfer element 92. In the present embodiment, the heat transfer element 92 is compressed and held between the busbar 42 and the heat transfer section 93. The heat transfer section 93 is fixed to the metal plate 80, for example, by a fastening element (a screw or a bolt). However, the method used to fix the heat transfer section 93 to the metal plate 80 is not limited to the above example and can be implemented by other means such as gluing or welding. <4.5 Insulating cover>

[0119] The insulating cover 94 is referred to again above. Fig. 1 described. The insulating cover 94 prevents the main body MU from coming into contact with the energy supply path. The insulating cover 94 is made, for example, of a synthetic resin and has insulating properties. The insulating cover 94 has, for example, a box-shaped form that is open on the side in the -Z direction. The insulating cover 94 has a plurality of vent holes 94h. The insulating cover 94 is attached to the metal plate 80 in the Z direction. Note that the insulating cover 94 is not limited to a box-shaped form, but can also be a sheet-like element that covers the energy supply path of the main body MU. <5. Advantages>

[0120] As a first comparative example, an electrical connection unit is considered in which electronic components are arranged only on the side in the +Z direction of the routing board 40. Miniaturizing the electrical connection unit (e.g., reducing the area as seen from the Z direction) can be difficult in the construction of this first comparative example, as it is necessary to arrange a number of electronic components only on one side of the routing board 40, while simultaneously ensuring that the electronic components do not interfere with each other.

[0121] As a second comparative example, a module is considered in which electronic components are arranged only on the side in the +Z direction of the routing board 40, and a rigid element (e.g., the metal plate 80) is provided on the side in the -Z direction of the routing board 40. An electrical connection unit is considered, which is formed by arranging a plurality of such modules in an overlapping manner in the Z direction. In the construction of the second comparative example, there are a plurality of rigid elements that are spaced apart from each other in the Z direction, and it may be difficult to reduce the height of the electrical connection unit.

[0122] In contrast, the electrical connection unit 1 in the present embodiment comprises a carrier (e.g., the base plate 41), a first busbar (e.g., the busbar 42C), a second busbar (e.g., the busbar 40D), a first electronic component (e.g., the electronic component 10B), and a second electronic component (e.g., the electronic component 10C). The carrier has a first surface (e.g., the first surface 51a) and a second surface (e.g., the second surface 51b), which is located on a side opposite the first surface. The first busbar is supported by the carrier. The second busbar is also supported by the carrier. The first electronic component is arranged facing the first surface of the carrier and is electrically connected to the first busbar.The second electronic component is arranged facing the second surface of the carrier and is electrically connected to the second busbar.

[0123] According to such a design, the majority of electronic components 10 hardly interfere with each other, since the majority of electronic components 10 are arranged separately on the side in the +Z direction and the side in the -Z direction of the carrier, and the majority of electronic components 10 can be easily arranged close to each other when viewed from the Z direction. Thus, for example, compared to a case where the majority of electronic components 10 are arranged only on one side (e.g., only on the side in the +Z direction) of the carrier, it is possible to miniaturize the electrical connection unit 1 (e.g., to reduce its area when viewed from the Z direction).

[0124] According to another aspect, the electrical connection unit 1, in addition to the structure described above, includes a rigid element (e.g., the metal plate 80) which is arranged on the side in the -Z direction relative to the support and the majority of electronic components 10. The support is fixed to the rigid element. According to such a structure, in which the majority of electronic components 10 are arranged separately on the side in the +Z direction and the side in the -Z direction of the support, the strength required for the electrical connection unit 1 can be easily ensured by a single rigid element. Thus, for example, the height of the electrical connection unit 1 can be reduced compared to a case where multiple rigid elements are spaced apart from one another in the Z direction.

[0125] In the present embodiment, the first and second electronic components overlap at least partially when viewed in the Z-direction. According to this design, the majority of electronic components 10 can be arranged closer together when viewed in the Z-direction. This makes it possible to further miniaturize the electrical connection unit 1 (e.g., to further reduce its area when viewed in the Z-direction).

[0126] In the present embodiment, the carrier includes a first receiving section (e.g., receiving section 55C) that is recessed into the first or second surface or penetrates the carrier in the Z-direction, and a second receiving section (e.g., 55D) that is recessed into the first or second surface or penetrates the carrier in the Z-direction. At least a portion of the first busbar is received in the first receiving section. At least a portion of the second busbar is received in the second receiving section. According to such a design, the height of the structure in which the carrier and the busbar are integrated can be reduced compared to a case where the busbar is placed on the surface of the carrier. Thus, the height of the electrical connection unit 1 can be further reduced.

[0127] In the present embodiment, the second busbar is at least partially exposed towards the first surface and at least partially towards the second surface. According to this design, both the electronic component 10U, located on the side in the +Z direction of the support, and the electronic component 10L, located on the side in the -Z direction of the support, can be easily connected to the second busbar. This increases the flexibility in arranging the routing path or the components of the electrical connection unit 1. Thus, the electrical connection unit 1 can be further miniaturized.

[0128] In the present embodiment, the first busbar and the second busbar are at least partially adjacent to each other in the X or Y direction. According to this configuration, the height of the structure in which the support and the busbar are integrated can be reduced compared to a case where the first busbar is located on the first surface of the support (on the surface on the side in the +Z direction) and the second busbar is located on the second surface of the support (on the surface on the side in the -Z direction). Thus, the height of the electrical connection unit 1 can be further reduced.

[0129] In the present embodiment, the first electronic component is electrically connected to the second busbar in addition to the first. This design allows for greater flexibility in the arrangement of the routing path or the components of the electrical connection unit 1. Consequently, the electrical connection unit 1 can be further miniaturized.

[0130] In the present embodiment, the carrier is formed from one or more insulating elements (e.g., the base plate 41). According to such a design, the majority of electronic components 10, which are arranged separately on the side in the +Z direction and the side in the -Z direction of the carrier, can be easily electrically connected by a simple assembly. Thus, the electrical connection unit 1 can be further miniaturized. <6. Modification Examples>

[0131] The following are some modification examples. Note that in each modification example, the structure differs from the one described below and corresponds to the structure of the first embodiment. (First modification example)

[0132] Fig. Figure 14 is a top view showing part of an electrical connection unit 1 of a first modification example. The electrical connection unit 1 of the present modification example contains, as electronic components 10 (electronic components 10U), arranged on the side in the +Z direction with respect to the base plate 41, an electronic component 10A, an electronic component 10B, an electronic component 10C, and an electronic component 10D. The electrical connection unit 1 also contains an electronic component 10E (electronic component 10L), arranged on the side in the -Z direction with respect to the base plate 41. Electronic component 10A is an example of a "first component." Electronic component 10E is an example of a "second component."In the present embodiment, electronic component 10A and electronic component 10E overlap at least partially when viewed from the Z-direction. For example, component body 12 of electronic component 10A and component body 12 of electronic component 10E overlap at least partially when viewed from the Z-direction.

[0133] In the present modification example, the electrical connection unit 1 contains seven busbars 42A, 42B, 42C, 42D, 42E, 42F, and 42G as a plurality of busbars 42. The seven busbars 42A, 42B, 42C, 42D, 42E, 42F, and 42G are located at least partially adjacent to each other in the X or Y direction. Each of the seven busbars 42A, 42B, 42C, 42D, 42E, 42F, and 42G is exposed at least partially to the first surface 51a of the base plate 41 and at least partially to the second surface 51b of the base plate 41.

[0134] In the present modification example, the electrical connection unit 1 contains connection components 20A, 20B, 20C, 20D, 20E, 20F, 20H, 20I, and 20J as a plurality of connection components 20. Additionally, the electrical connection unit 1 contains coupling busbars 75A, 75B, and 75C as a plurality of coupling busbars 75. The connection relationship between the busbars 42B, 42C, 42D, and 42E and the electronic components 10A, 10B, and 10C is the same as in the first embodiment. Therefore, a description of the connection relationship is omitted.

[0135] The first connection section 61 of busbar 42A is electrically connected to terminal 13A of electronic component 10A via connection component 20A. The second connection section 62 of busbar 42A is electrically connected to terminal 13A of electronic component 10D via connection component 20G. Busbar 42A is an example of a "first busbar".

[0136] Busbar 42B contains the first connection section 61, the second connection section 62, and a third connection section 65. The first connection section 61 of busbar 42B is electrically connected to terminal 13B of electronic component 10A via connection component 20A. The second connection section 62 of busbar 42B is electrically connected to connection component 30A. The third connection section 65 of busbar 42B is electrically connected to terminal 13A of electronic component 10E via connection component 20I. Busbar 42B is an example of a "second busbar".

[0137] The first connection section 61 of busbar 42F is electrically connected to terminal 13B of electronic component 10D via connection component 20H. The second connection section 62 of busbar 42F is electrically connected to the coupling busbar 75A. Busbar 42F is an example of a "first power supply path".

[0138] The first connection section 61 of busbar 42G is electrically connected to terminal 13B of electronic component 10E via connection component 20J. The second connection section 62 of busbar 42G is electrically connected to the coupling busbar 75C. Busbar 42G is an example of a "second power supply path".

[0139] Fig. 15 is a cross-sectional view along line F15-F15 of the in Fig. The structure shown in Figure 14 is shown. In the present modification example, the electronic component 10A and the connecting components 20A and 20B are arranged on the side in the +Z direction with respect to the base plate 41. The electronic component 10E and the connecting components 20I and 20J are arranged on the side in the -Z direction with respect to the base plate 41.

[0140] In the present modification example, the heat transfer element 92 is in contact with the extending section 63 of the busbar 42G, to which the electronic component 10E is connected laterally in the -Z direction. An insulating film 91B and a heat transfer section 93 are provided between the heat transfer element 92 and the flat surface section 81 of the metal plate 80. Part of the heat transferred from the electronic component 10E to the busbar 42G is transferred to the metal plate 80 via the heat transfer element 92 and the heat transfer section 93.

[0141] According to such a design, the electrical connection unit 1 can be miniaturized similarly to the first embodiment. In the present modification example, in the electrical connection unit where the first and second energy supply paths are switchable, the electronic component 10A, which is electrically connected to the first energy supply path, and the electronic component 10E, which is electrically connected to the second energy supply path, can be arranged close to each other. Compared to the case where the electronic component 10A and the electronic component 10E are arranged on one side of the carrier, it is therefore easy to miniaturize the electrical connection unit 1 (e.g., to reduce the area viewed from the Z-direction). (Second modification example)

[0142] Fig. Figure 16 is a top view showing part of an electrical connection unit 1 of a second modification example. In the present modification example, the electrical connection unit 1 includes an electronic component 10A as an electronic component 10 (a plurality of electronic components 10U) arranged on the side in the +Z direction with respect to the base plate 41. The electrical connection unit 1 includes electronic components 10B and 10C as electronic components 10 (electronic components 10L) arranged on the side in the -Z direction with respect to the base plate 41. Electronic component 10A is an example of a "first component." Electronic component 10B is an example of a "second component." In the present embodiment, electronic component 10A and electronic component 10B overlap at least partially when viewed from the Z direction.For example, the component body 12 of electronic component 10A and the component body 12 of electronic component 10B overlap at least partially when viewed from the Z direction.

[0143] In the present modification example, the electrical connection unit 1 contains five busbars 42A, 42B, 42C, 42D, and 42E as a plurality of busbars 42. The connection relationship between the five busbars 42A, 42B, 42C, 42D, and 42E and the electronic components 10A, 10B, and 10C is the same as in the first embodiment. Therefore, a description of the connection relationship is omitted.

[0144] In the present modification example, the electronic component 10A and the connecting components 20A and 20B are arranged on the side in the +Z direction with respect to the base plate 41. The electronic component 10B and the connecting components 20C and 20D, on the other hand, are arranged on the side in the +Z direction with respect to the base plate 41. The electronic component 10C and the connecting components 20E and 20F are arranged on the side in the +Z direction with respect to the base plate 41.

[0145] According to such a design, the electrical connection unit 1 can be miniaturized similarly to the first embodiment. In the present modification example, in the electrical connection unit with the positive electrode line PL and the negative electrode line NL, the electronic component 10A connected to the positive electrode line PL and the electronic component 10B connected to the negative electrode line NL can be arranged close to each other. Compared to the case where the electronic component 10A and the electronic component 10B are arranged on one side of the carrier, it is therefore easy to miniaturize the electrical connection unit 1 (e.g., to reduce the area viewed from the Z-direction). (Third modification example)

[0146] Fig. Figure 17 is a cross-sectional view showing an electrical connection unit 1 of a third modification example. In the first embodiment described above, the heat transfer section 93 and the metal plate 80 are formed as separate bodies. In the present modification example, however, the heat transfer section 93 and the metal plate 80 are integrally provided as a single component. That is, the heat transfer section 93 is provided as part of the metal plate 80 and is formed integrally with the flat surface section 81. The heat transfer section 93 is a projecting section that extends in the +Z direction from a portion of the flat surface section 81. The heat transfer section 93 has, for example, the shape of a rectangular parallelepiped. The shape of the heat transfer section 93 is the same as the shape of the heat transfer section 93 of the first embodiment.

[0147] According to such a design, the electrical connection unit 1 can be miniaturized similarly to the first embodiment. In the present modification example, the heat transfer section 93 and the metal plate 80 are provided as a single component. According to such a design, the heat transfer property between the heat transfer section 93 and the flat surface section 81 can be easily improved compared to a case where the heat transfer section 93 and the flat surface section 81 are separate bodies. (Fourth modification example)

[0148] Fig. Figure 18 is a cross-sectional view showing an electrical connection unit 1 of a fourth modification example. In the third modification example described above, the heat transfer section 93 has the shape of a rectangular parallelepiped. In the present modification example, however, the heat transfer section 93 is formed by deforming a portion of the flat surface section 81 laterally in the +Z direction by compression molding or the like. In the present modification example, the heat transfer section 93 is provided as part of the metal plate 80 and is formed integrally with the flat surface section 81. The heat transfer section 93 is a projecting section that extends in the +Z direction from a portion of the flat surface section 81.Even with such a setup, the heat transfer property between the heat transfer section 93 and the flat surface section 81 can be easily improved compared to a case where the heat transfer section 93 and the flat surface section 81 are separate bodies. (Fifth modification example)

[0149] Fig. Figure 19 is a perspective view showing an electrical connection unit 1 of a fifth modification example. Fig. 20 is a cross-sectional view along the line F20-F20 of the in Fig. The structure shown in Figure 19. As in the first embodiment, the electrical connection unit 1 of the present modification example has a space S1 in which the electronic component 10L is accommodated between the base plate 41 and the metal plate 80. If the electronic component 10L generates heat during energy input, heat can be trapped in the space S1.

[0150] In the present modification example, the flat surface section 51 of the base plate 41 has a heat dissipation opening 121. The opening 121 penetrates the flat surface section 51 in the Z-direction and is connected to the space S1 between the routing board 40 and the metal plate 80. Air can flow through the opening 121. The air in the space S1 between the routing board 40 and the metal plate 80 rises, for example, in response to heating, and can move above the routing board 40 through the opening 121.

[0151] According to this design, heat is less likely to become trapped in the space S1 between the distribution board 40 and the metal plate 80. If heat is less likely to become trapped in space S1, the heat dissipation properties of the busbar 42 are improved. If the heat dissipation properties of the busbar 42 are improved, the heat dissipation properties of the electrical connection unit 1 can be further improved. (Second embodiment)

[0152] Next, a second embodiment is described. The second embodiment differs from the first in that busbars 42 are arranged in a two-layer structure within a mounting board 40M. Apart from what is described below, the structure is the same as in the first embodiment.

[0153] Fig. Figure 21 is a cross-sectional view showing an electrical connection unit 1 of the second embodiment. In the present embodiment, the routing board 40M includes one or more base plates 41 (see Figure 21). Fig. 22) and a plurality of busbars 42. The plurality of busbars 42 contains one or more busbars 42U and one or more busbars 42L.

[0154] The 40M routing board (routing board 40), for example, contains a first routing layer 40Ma, a second routing layer 40Mb, and an insulating layer 40Mc. The first routing layer 40Ma, the second routing layer 40Mb, and the insulating layer 40Mc each extend horizontally in a plate-like fashion. The first routing layer 40Ma, the second routing layer 40Mb, and the insulating layer 40Mc are stacked in the Z-direction.

[0155] The surface of the first routing layer 40Ma is exposed laterally in the +Z direction to form the first surface 40s1 of the routing board 40M. The surface of the second routing layer 40Mb is exposed laterally in the -Z direction to form the second surface 40s2 of the routing board 40M. The insulating layer 40Mc is arranged between the first routing layer 40Ma and the second routing layer 40Mb in the Z direction. Part of the insulating layer 40Mc is located in the Z direction between the busbar 42U and the busbar 42L. The insulating layer 40Mc electrically isolates the busbar 42U from the busbar 42L.

[0156] In the present embodiment, the first routing layer 40Ma, the second routing layer 40Mb, and the insulating layer 40Mc are formed integrally by an insulating element. Alternatively, the first routing layer 40Ma, the second routing layer 40Mb, and the insulating layer 40Mc can be formed separately and then layered together. Furthermore, in a case where an insulating property between the busbar 42U and the busbar 42L, as described later, is ensured by other means, the insulating layer 40Mc can be omitted.

[0157] The busbar 42U is a busbar 42 in which half or more of the busbar 42 is arranged in the first routing layer 40Ma. At least a portion of the busbar 42U is accommodated in the receiving section 55 provided in the first routing layer 40Ma and extends horizontally along the first routing layer 40Ma. At least a portion of the busbar 42U is exposed towards the first surface 40s1 of the routing board 40M. A portion of the busbar 42U may be bent and arranged in the second routing layer 40Mb. The busbar 42U may be electrically connected to the electronic component 10U or the electronic component 10L.

[0158] The busbar 42L is a busbar 42 in which half or more of the busbar 42 is arranged in the second routing layer 40Mb. At least a portion of the busbar 42L is received in the receiving section 55 provided in the second routing layer 40Mb and extends horizontally along the second routing layer 40Mb. At least a portion of the busbar 42L is exposed towards the second surface 40s2 of the routing board 40M. A portion of the busbar 42L may be bent and arranged in the first routing layer 40Ma. The busbar 42L may be electrically connected to the electronic component 10U or the electronic component 10L.

[0159] Fig. Figure 22 is a perspective view showing part of the electrical connection unit 1. Fig. 23 is a cross-sectional view along line F23-F23 of the in Fig. 22 depicted structure. Fig. 24 is a cross-sectional view along line F24-F24 of the in Fig. The structure shown in Figure 22. The electrical connection unit 1, for example, has a base plate 41 and a plurality of busbars 42 (busbars 42A and 42B).

[0160] The base plate 41 contains a first layer 41a, a second layer 41b, and a third layer 41c. The first layer 41a forms at least part of the first routing layer 40Ma of the routing plate 40M. The second layer 41b forms at least part of the second routing layer 40Mb of the routing plate 40M. The third layer 41c forms at least part of the insulating layer 40Mc of the routing plate 40M. As described above, the first layer 41a, the second layer 41b, and the third layer 41c can be formed in one piece by an insulating element or can be layered after being formed separately.

[0161] Busbar 42A is an example of busbar 42U described above. At least part of busbar 42A is received in the receiving section 55 provided in the first layer 41a of the base plate 41 and extends in a horizontal direction.

[0162] Busbar 42B is an example of busbar 42L described above. At least part of busbar 42B is received in the receiving section 55 provided in the second layer 41b of the base plate 41 and extends in a horizontal direction.

[0163] In the present embodiment, the busbar 42A and the busbar 42B overlap at least partially when viewed from the Z-direction. For example, when viewed from the Z-direction, the extending section 63 of the busbar 42A, which is located in the first layer 41a, and the extending section 63 of the busbar 42B, which is located in the second layer 41b, intersect and extend in a state in which they are spaced apart from each other in the Z-direction.

[0164] Next, with further reference to Fig. 21 describes a heat dissipation structure of the second embodiment. In the present embodiment, the routing board 40M has an opening 40g that exposes at least a portion of the busbar 42U laterally in the -Z direction. In the present embodiment, the plurality of heat transfer elements 92 includes one or more heat transfer elements 92U that are in contact with the busbar 42U, and one or more heat transfer elements 92L that are in contact with the busbar 42L. The plurality of heat transfer sections 93 includes one or more heat transfer sections 93U corresponding to the busbar 42U, and one or more heat transfer sections 93L corresponding to the busbar 42L.

[0165] The heat transfer element 92U is inserted into the opening 40g provided in the routing board 40M and is in contact with the busbar 42U from the side in the -Z direction inside the routing board 40M. The heat transfer element 92U is in contact with the busbar 42U when it is positioned in the opening 40g. The heat transfer section 93U projects further outwards in the +Z direction than the heat transfer section 93L. The heat transfer element 92U is compressed and held between the busbar 42U and the heat transfer section 93U. The heat transfer element 92L, on the other hand, is in contact with the busbar 42L from the side in the -Z direction outside the routing board 40M. The heat transfer element 92L is compressed and held between the busbar 42L and the heat transfer section 93L.

[0166] According to this design, compared to the design of the first embodiment, it is easier to create a structure in which the majority of busbars 42 intersect three-dimensionally. This allows for greater freedom in the routing of the busbar 42 in a structure where the majority of electronic components 10 are arranged separately on the side in the +Z direction and the side in the -Z direction of the support. Consequently, it is possible to further miniaturize the electrical connection unit 1 (e.g., to reduce its area as seen from the Z direction). (Third embodiment)

[0167] Next, a third embodiment is described. The third embodiment differs from the first embodiment in that a plurality of routing plates 40M are arranged separately on the side in the +Z direction and the side in the -Z direction of the metal plate 80. Apart from what is described below, the setup is the same as in the first embodiment.

[0168] Fig. Figure 25 is a cross-sectional view showing an electrical connection unit 1 of the third embodiment. In the present embodiment, the carrier SB includes a plurality of routing boards 40M (routing board 40MU and 40ML) and a metal plate 80.

[0169] The routing plate 40MU is arranged on its side in the +Z direction with respect to the metal plate 80. The first surface 40s1 in the routing plate 40MU, oriented in the +Z direction, is an example of a "first surface of the support". The base plate 41 contained in the routing plate 40MU is an example of a "first insulating element". The first surface 51a of the base plate 41 forms at least part of the first surface 40s1 in the routing plate 40MU, oriented in the +Z direction.

[0170] The majority of electronic components 10U are arranged on the side in the +Z direction with respect to the distribution board 40MU. The majority of electronic components 10U face the first surface 40s1 of the distribution board 40MU. The majority of electronic components 10U are electrically connected to one or more busbars 42 contained in the distribution board 40MU. The busbar 42 contained in the distribution board 40MU is an example of a "first busbar".

[0171] On the other hand, the electronic component 10 is not located between the routing board 40MU and the metal plate 80. The heat transfer element 92 is located between the routing board 40MU and the metal plate 80.

[0172] The routing plate 40ML is arranged on its side in the -Z direction with respect to the metal plate 80. The second surface 40s2 in the routing plate 40ML, oriented in the -Z direction, is an example of a "second surface of the support". The base plate 41 contained in the routing plate 40ML is an example of a "second insulating element". The second surface 51b of the base plate 41 forms at least part of the second surface 40s2 in the routing plate 40ML, oriented in the -Z direction.

[0173] The majority of electronic components 10L are arranged on the side in the -Z direction with respect to the routing board 40ML. The majority of electronic components 10L face the second surface 40s2 of the routing board 40ML. The majority of electronic components 10L are electrically connected to one or more busbars 42 contained in the routing board 40ML. The busbar 42 contained in the routing board 40ML is an example of a "second busbar".

[0174] On the other hand, the electronic component 10 is not located between the routing board 40ML and the metal plate 80. The heat transfer element 92 is located between the routing board 40ML and the metal plate 80.

[0175] In the present embodiment, the electrical connection unit 1 comprises an insulating cover 94U and an insulating cover 94L as a plurality of insulating covers 94. The insulating cover 94U, for example, has a box-shaped form that is open on the side in the -Z direction. The insulating cover 94U is attached to the metal plate 80 from the side in the +Z direction and covers the plurality of electronic components 10U and the routing board 40MU. The insulating cover 94L, for example, has a box-shaped form that is open on the side in the +Z direction. The insulating cover 94L is attached to the metal plate 80 from the side in the -Z direction and covers the plurality of electronic components 10L and the routing board 40ML.

[0176] Fig. Figure 26 is a perspective view showing part of the electrical connection unit 1 of the third embodiment. Fig. Figure 27 is a cross-sectional view showing part of the electrical connection unit 1 of the third embodiment. In the present embodiment, the metal plate 80 includes a flat surface section 81, a plurality of fixing sections 82, and a plurality of fixing sections 83.

[0177] The plurality of fixing sections 82 includes a plurality of fixing sections 82 that project from the flat surface section 81 in the +Z direction, and a plurality of fixing sections 82 that project from the flat surface section 81 in the -Z direction. The fixing section 52 of the routing board 40MU is fixed to the plurality of fixing sections 82 that project from the flat surface section 81 in the +Z direction. The fixing section 52 of the routing board 40ML is fixed to the plurality of fixing sections 82 that project from the flat surface section 81 in the -Z direction.

[0178] The fixing section 83 is a fixing section for directly fixing the electronic component 10 to the metal plate 80 without the intermediate base plate 41. The fixing section 83 is located at a position corresponding to the mounting section 14 of the electronic component 10 when viewed in the Z direction. The fixing section 83 is a cylindrical or prismatic projection that extends in the Z direction from the flat surface section 81. The plurality of fixing sections 83 includes a plurality of fixing sections 83 extending in the +Z direction from the flat surface section 81 and a plurality of fixing sections 83 extending in the -Z direction from the flat surface section 81.

[0179] In the present embodiment, the flat surface section 51 of the base plate 41S is provided with a through-hole 51h. The through-hole 51h penetrates the base plate 41 in the Z-direction. The fixing section 83 is inserted into the through-hole 51h of the flat surface section 51 of the base plate 41. The fixing section 83 faces the mounting section 14 of the electronic component 10 in the Z-direction. The fixing section 83 has a coupling hole 83h that is open in the Z-direction. An inner circumferential surface of the coupling hole 83h has a groove for the screw.

[0180] A fastening element 112 (for example, a screw or a bolt) passes through the fastening hole 14h of the fastening section 14 of the electronic component 10 in the Z direction. When the fastening element 112, passing through the fastening hole 14h of the fastening section 14 of the electronic component 10, engages in the coupling hole 83h of the fixing section 83 of the metal plate 80, the electronic component 10 is fixed to the metal plate 80 without the intermediate base plate 41.

[0181] Next, with further reference to Fig. 25 describes a heat dissipation structure according to the third embodiment. In the present embodiment, the metal plate 80 includes one or more (e.g., a plurality of) heat dissipation sections 101U and one or more (e.g., a plurality of) heat dissipation sections 101L.

[0182] The heat dissipation section 101U is a heat dissipation section for promoting heat dissipation from the metal plate 80. The heat dissipation section 101U is, for example, a projection or a fin made of metal. The heat dissipation section 101U can be formed integrally with the metal plate 80 from a single piece of metal or attached to the metal plate 80 after being formed separately from the metal plate 80.

[0183] In the present embodiment, the at least one heat dissipation section 101U overlaps the heat transfer element 92, which is in contact with the busbar 42 contained in the routing board 40ML, when viewed from the Z direction. That is, the at least one heat dissipation section 101 overlaps the heat transfer element 92, when viewed from the Z direction, in order to transfer heat from the electronic component 10L to the metal plate 80. Note that the arrangement of the heat dissipation section 101U is not limited to the example described above.

[0184] The base plate 41 of the routing board 40MU has an opening 41h at a position corresponding to the heat dissipation section 101U. The opening 41h penetrates the base plate 41 of the routing board 40MU in the Z direction. The heat dissipation section 101U passes through the opening 41h of the base plate 41 of the routing board 40MU. The heat dissipation section 101U projects laterally in the +Z direction from the flat surface section 81 of the metal plate 80 over at least a portion of the base plate 41 of the routing board 40MU. The heat dissipation section 101U is exposed towards a space A1 between the insulating cover 94U and the routing board 40MU. The heat dissipation section 101U releases some of the heat transferred from the electronic component 10U or the electronic component 10L to the metal plate 80 into the space A1 between the insulating cover 94U and the routing board 40MU.

[0185] The heat dissipation section 101L is a heat dissipation section designed to promote heat dissipation from the metal plate 80. The heat dissipation section 101L is, for example, a metal projection or fin. The heat dissipation section 101L can be formed integrally with the metal plate 80 from a single piece of metal or attached to the metal plate 80 after being formed separately.

[0186] In the present embodiment, the at least one heat dissipation section 101L overlaps the heat transfer element 92, which is in contact with the busbar 42 contained in the routing board 40MU, when viewed from the Z direction. That is, the at least one heat dissipation section 101L overlaps the heat transfer element 92, when viewed from the Z direction, in order to transfer heat from the electronic component 10U to the metal plate 80. Note that the arrangement of the heat dissipation section 101L is not limited to the example described above.

[0187] The base plate 41 of the routing board 40ML has an opening 41h at a position corresponding to the heat dissipation section 101L. The opening 41h penetrates the base plate 41 of the routing board 40ML in the Z-direction. The heat dissipation section 101L passes through the opening 41h of the base plate 41 of the routing board 40ML. The heat dissipation section 101L projects laterally in the -Z-direction from the flat surface section 81 of the metal plate 80 over at least a portion of the base plate 41 of the routing board 40ML. The heat dissipation section 101L is exposed towards a space A2 between the insulating cover 94L and the routing board 40ML. The heat dissipation section 101U releases some of the heat transferred from the electronic component 10U or the electronic component 10L to the metal plate 80 into the space A2 between the insulating cover 94L and the routing board 40ML.

[0188] According to such a design, it is possible, similar to the first embodiment, to miniaturize the electrical connection unit (e.g., to reduce its area when viewed in the Z-direction). According to the present embodiment, a metal plate 80 can be shared by a plurality of routing boards 40M. Thus, for example, the height of the electrical connection unit 1 can be reduced compared to a design in which a plurality of modules, each equipped with a metal plate 80, are arranged in the Z-direction relative to a routing board 40M.

[0189] Several embodiments and modification examples have been described above. However, the embodiment and modification examples are not limited to those described above. For example, some embodiments and modification examples can be implemented in combination with one another.

[0190] The routing board 40 is not limited to a structure in which the base plate 41 and the busbar 42 are integrated by insert forming. For example, the busbar 42 can be positioned in the receiving section 55 after the base plate 41, which provides the receiving section 55 for receiving the busbar 42, has been formed. In this case, the busbar 42 can be fitted to the receiving section 55 or fixed to the receiving section 55 by an adhesive or other fastener. In these cases, potting can be performed to fill any gap between the busbar 42 and the receiving section 55.

[0191] A basic element of the busbar 40 is not limited to the base plate 41 with the plate-shaped, flat surface section 51. The busbar 40 can be a basic element (for example, an insulating film) with a sheet-like, flat surface section 51. In this case, the receiving section 55 can be formed by a portion of the flat surface section 51 that follows the outer shape of the busbar 42. In the present disclosure, the term "sheet-like" or "sheet" is not limited to an element with a thickness of 1 mm or more, and an element (a so-called film) with a thickness of less than 1 mm can also be used.

[0192] The base plate 41 of the installation board 40 can contain a plurality of elements (plate elements or sheet metal elements). These elements are provided to accommodate the plurality of busbars 42, which are arranged horizontally. For example, the plurality of elements are integrated by joining the plurality of busbars 42 together, for instance, by laminate forming. The plurality of elements forms the flat surface section 51. In this case, the receiving section 55 can be formed in a hollow shape within the base plate 41 (between the plurality of elements). The plurality of elements can be a plurality of plate elements, a plurality of sheet metal elements, or a combination of a plate element and a sheet metal element. The plate element can, for example, be a flexible plate element.The flat surface section 51 formed from the majority of the elements has an opening through which at least the first connecting section 61 and the second connecting section 62 of the busbar 42 are exposed.

[0193] The connection between the electronic component 10 and the busbar 42 is not limited to the connection via the connecting component 20. The electronic component 10 can be connected directly to the busbar 42 by means of a fastening element (for example, a bolt or a screw), by welding, or similar means. [List of reference symbols] 1 electrical connection unit SU subunit 10 electronic components 13, 13A, 13B connection 20 connection components 30 connection components 40 installation board 41 Base plate 42 busbar 51 flat surface section 51a first surface 51b second surface 55 Recording section 80 Metal plate (rigid element) 101U Heat dissipation section 101L Heat Dissipation Section SB carrier

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