CHIP HOUSING FOR AN INTEGRATED CIRCUIT WITH FIBER OPTICS IN MOLDING MATERIAL AND METHOD FOR MANUFACTURING A CHIP HOUSING

Abstract

Warping in system-in-package (SiP) technology can manifest as interface delamination, casing cracking, and / or wire sagging in the wafer-level package. Implementing glass fibers in a forming step of a SiP process improves the package's warping performance by controlling the mismatch of common material elements (CTEs) between the different materials that cause warping. Glass fiber material, or other suitable materials, can be added to the top or bottom of the package to control the shape at which warping occurs due to mismatch, such as concave or convex warping.As a result, implementing glass fibers in one forming step of the SiP process reduces housing warpage, strengthens the housing, and reduces manufacturing costs due to the low cost of glass fibers, while requiring only minimal adjustment compared to conventional methods.

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