Electronic device

Abstract

An electronic device (10) comprises a substrate (20), a base (30), multiple modules (40), and a pressure element (50) made of an electrically conductive material. The base is arranged on a front surface (21) of the substrate and mounted on the substrate. The multiple modules are electrically connected to the substrate via the base. The pressure element is arranged to overlap the multiple modules in a thickness direction of the substrate in a plan view. The pressure element has a base plate that presses the multiple modules against the base and a projecting section extending from the base plate toward the substrate. The projecting section is positioned between the multiple modules in the plan view.

Description

TECHNICAL AREA

[0001] The disclosure in this description relates to an electronic device. BACKGROUND

[0002] JP 2006-108674 A discloses an electronic device comprising a mainboard, a socket mounted on the mainboard, and a central processing unit. The contents of JP 2006-108674 A are incorporated herein by reference to explain technical elements in this description. SUMMARY

[0003] In JP 2006-108674 A, the central processing unit (CPU) is electrically connected to the mainboard via its socket. This allows the CPU to be easily detached from the mainboard. However, if multiple modules are used to achieve higher functionality, each of these modules can act as a source of electromagnetic noise, and each can also be affected by electromagnetic noise generated by other modules. In other words, the electronic device exhibits low electromagnetic compatibility (EMC) performance. Further improvements for electronic devices are anticipated with regard to the above considerations, or other considerations not mentioned.

[0004] One of the objectives of the present disclosure is to provide an electronic device that can improve EMC performance while facilitating the replacement of modules.

[0005] An electronic device according to one aspect of the disclosure comprises a substrate with one surface, a base, multiple modules, and a pressure element. The base is arranged and mounted on one surface of the substrate. The multiple modules are electrically connected to the substrate via the base. The pressure element comprises a base plate arranged to overlap the multiple modules in one thickness direction of the substrate in a top view and to press the multiple modules against the base, and a projecting section extending from the base plate toward the substrate. The pressure element is made of an electrically conductive material. The projecting section is arranged between the multiple modules in a top view.

[0006] According to the disclosed electronic device, the multiple modules are electrically connected to the substrate via the base. The pressure element presses the multiple modules in place to ensure a reliable electrical connection between the multiple modules and the base, and consequently between the multiple modules and the substrate. This allows the multiple modules to be easily detached from the substrate. Additionally, the pressure element has a projecting section extending from the base plate toward the substrate, positioned between the modules in a top view. This projecting section acts as a shield against electromagnetic noise between the modules, thus improving EMC performance.

[0007] The several embodiments disclosed in this description employ different technical means to achieve their respective objectives. Reference numerals in parentheses in the claims illustrate the correspondence with parts of embodiments described later and are not intended to limit the technical scope. The tasks, features, and advantages disclosed in this description become apparent by reference to the following detailed descriptions and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a top view showing an example of an electronic device according to a first embodiment. Fig. Figure 2 is a top view of the electronic device, with one pressure element omitted. Fig. Figure 3 is a top view of the electronic device with modules omitted. Fig. Figure 4 is a perspective view of the pressure element as seen from a rib. Fig. Figure 5 is a top view of the pressure element as seen from a forward section. Fig. Figure 6 is a cross-sectional view along line VI-VI in Fig. 1. Fig. Figure 7 is a top view showing a modification. Fig. Figure 8 is a cross-sectional view showing a modification. Fig. Figure 9 is a top view of an example of an electronic device according to a second embodiment in which a pressure element and modules are omitted. Fig. Figure 10 is a cross-sectional view showing the electronic device. Fig. Figure 11 is a cross-sectional view showing an example of an electronic device according to a third embodiment. Fig. Figure 12 is a top view showing the position of a spring element. DETAILED DESCRIPTION

[0008] Several embodiments are described below with reference to the drawings. Duplicate descriptions can be avoided by assigning the same reference numerals to the corresponding elements in each embodiment. In cases where only part of the configuration is described in each embodiment, the configurations of other sections previously described in other embodiments can be applied to these parts. Furthermore, not only the combinations of configurations explicitly shown in the description of the respective embodiments, but also the configurations of the several embodiments can be partially combined, even if not explicitly shown, provided that there is no problem with the combinations. (First embodiment)

[0009] First, a schematic configuration of an electronic device is described. The electronic device can also be referred to as an electronic control unit (ECU). ECU is an abbreviation for electronic control unit. The electronic device can be mounted on a mobile object. Examples of mobile objects include a vehicle, an aircraft, a ship, construction equipment, and agricultural machinery. The mobile object can be manned or unmanned. <Elektronische Vorrichtung>

[0010] Fig. Figure 1 is a top view showing an example of an electronic device. Fig. Figure 1 shows a part of the electronic device, in particular an environment of a base, several modules and a pressure element. Fig. 2 is a view where the print element is made of Fig. Number 1 is omitted. Fig. 2 is a preceding section indicated by a dashed line to show a positional relationship. Fig. 3 is a view where the modules are from Fig. 2 are omitted. Fig. Figure 4 is a perspective view of the pressure element as seen from a rib. Fig. Figure 5 is a top view of the pressure element as seen from a protruding section. Fig. 5. Heat dissipation fins are indicated with dashed lines to show a positional relationship. Fig. Figure 6 is a cross-sectional view along line VI-VI in Fig. 1. In Fig. For simplicity, spring elements are indicated by dashed lines in Figure 6. Hatching is also applied to electronic components that form the modules. Fig. For the sake of simplicity, the connection surfaces of a substrate that are electrically connected to the modules via the socket are omitted. Additionally, only a section of the socket's contact pins protruding from the socket body is shown.

[0011] The exemplary electronic device 10 is an electronic control unit mounted in a vehicle. The electronic device 10 can be an autonomous driving ECU or an ADAS ECU, which performs control to assist driving operations. “ADAS” is an abbreviation for “Advanced Driving Assistant System.” For example, levels 3 to 5, as defined by the Society of Automotive Engineers (SAE International), correspond to autonomous driving levels, while levels 1 to 2 correspond to driver assistance levels. The electronic device 10 can also be an infotainment ECU or a cockpit ECU. A cockpit ECU is an ECU that controls devices such as a gauge, a navigation device, and an air conditioning device. The electronic device 10 can be an integrated ECU that consolidates several control functions.

[0012] In the following, a thickness direction of a substrate (mainboard or motherboard) is referred to as the Z-direction. Furthermore, a direction perpendicular to the Z-direction is referred to as the X-direction, and a direction perpendicular to both the Z-direction and the X-direction is referred to as the Y-direction. Unless otherwise specified, a shape viewed in a plane in the Z-direction—that is, a shape along an XY plane defined by the X-direction and the Y-direction—is referred to as a planar shape. A top view, when viewed in the Z-direction, can simply be referred to as a top view.

[0013] The electronic device 10 comprises the substrate 20, the base 30, several modules 40, and a pressure element 50. As an example, the electronic device 10 may also include thermally conductive elements 60, spring elements 70, and screws 80. The electronic device 10 may also include a housing, which is not shown.

[0014] The substrate 20 can also be referred to as a printed circuit board, circuit board, or printed circuit board. The substrate 20 is a so-called motherboard. The substrate 20 can also be referred to as a main board. The substrate 20 has a front surface 21 and a rear surface 22. The front surface 21 corresponds to a surface. The rear surface 22 is a surface opposite the front surface 21 in the Z-direction, which is a thickness direction of the substrate 20. The planar shape of the substrate 20 is not particularly restricted. For example, the substrate 20 has an essentially rectangular planar shape.

[0015] The substrate 20 comprises an insulating base element and a conductor. The insulating base element is made of a material with electrically insulating properties, such as resin. The insulating base element can be made of a material containing only resin or a material containing resin with glass fabric or nonwoven fabric. The conductor is made of a metallic material with reliable electrical conductivity, such as copper. At least one section of the conductor forms a circuit together with components mounted on the substrate 20. The components comprise multiple modules 40. The components may include components mounted on the substrate 20.

[0016] The conductor has wiring. The wiring can be formed by structuring a metal foil. The wiring is arranged on at least one surface layer of the front surface 21. In addition to the surface layer of the front surface 21, the wiring can be arranged on a surface layer of the back surface or within an interior of the insulating base element. The substrate 20 can be a single-sided substrate, a double-sided substrate, or a multilayer substrate having three or more wiring layers. The conductor can have a via conductor or a through-hole termination area. The via conductor is a conductor, such as a plating, in a through-hole (via) defined in the insulating layer that forms the insulating base element. The via conductor electrically connects wiring between different layers.The through-hole connection surface is formed on a wall surface of a through-hole that extends through the substrate 20 in the Z-direction. The conductor may include a conductor that does not provide a circuit function (wiring function), such as a conductor for heat dissipation.

[0017] The exemplary substrate 20 is a multilayer substrate featuring internal layer wiring. The substrate 20 has terminal pads 23 and 24 acting as conductors. Terminal pads 23 and 24 are electrically connected to a ground layer 25, which is internal layer wiring. The ground layer 25 is a so-called solid ground. Terminal pads 23 and 24 are conductors that provide a ground potential serving as a reference potential within the substrate 20. Terminal pad 23 is a section of wiring arranged on the surface layer of the front surface 21, which is exposed by a varnish (not shown). Terminal pad 23 is arranged according to a protruding section 52 of the printing element 50. Terminal pad 23 is arranged to overlap with at least one section of the protruding section 52 in the top view.

[0018] The connection surfaces 24 are through-hole connection surfaces. The substrate 20 defines through-holes 26. Each of the connection surfaces 24 is located on a wall surface of the through-hole 26 and around an opening of the through-hole 26. The substrate 20 defines four through-holes 26, that is, it has the four connection surfaces 24. The through-holes 26 are located in positions that do not overlap with the modules 40 in the plan view. The substrate 20 has connection surfaces that correspond to the multiple modules 40 (not shown).

[0019] The base 30 electrically connects the modules 40 to the substrate 20. The base 30 is located on the front surface 21 and mounted on the substrate 20. The base 30 has a base body 31 and contact pins 32. The exemplary base 30 also has a metal element 33.

[0020] The base body 31 has several contact pins 32. The base body 31 is made of an electrically insulating material, such as resin. The base body 31 can be a cast resin product. The base body 31 has a mounting section 311, a separating section 312, and an outer edge section 313. The mounting section 311 is a section in which the several modules 40 are arranged. The separating section 312 divides the mounting section 311 into several mounting sections corresponding to the modules 40. The outer edge section 313 is arranged to surround the mounting section 311 and the separating section 312.

[0021] The exemplary base body 31 has a box-shaped structure that opens in the Z-direction. The base body 31 has a substantially rectangular, planar shape. The assembly section 311 and the separating section 312 form a base of the base body 31, and the outer edge section 313 forms a side wall of the base body 31. The outer edge section 313 has a substantially rectangular frame shape in plan view. The outer edge section 313 has a tubular shape. The assembly section 311 and the separating section 312 are continuous with an inner surface of the outer edge section 313 near a lower end of the outer edge section 313. The base, defined by the assembly section 311 and the separating section 312, has a substantially rectangular shape in plan view.

[0022] The separating section 312 has a substantially cruciform shape in plan view. The separating section 312 has a section extending in the X direction and a section extending in the Y direction. Within the separating section 312, the section extending in the X direction and the section extending in the Y direction intersect. The separating section 312 divides the base into four mounting sections corresponding to the modules 40. The mounting sections are arranged at the four corners of the base. At the base of the plinth body 31, the separating section 312 is thinner than the mounting sections. The separating section 312 is continuous with the mounting sections such that the surface of the separating section 312 and the surfaces of the mounting sections facing the substrate 20 are flush with each other.The assembly section 311 is a thick section and the separation section 312 is a thin section.

[0023] The multiple mounting sections can differ in shape or size, or they can be identical. In the exemplary base body 31, the four mounting sections are identical in shape and size.

[0024] The contact pins 32 are wiring elements made of a metal material with reliable electrical conductivity, such as copper. The contact pins 32 are partially covered by the base body 31, while other parts of the base body 31 are exposed. The contact pins 32 have at least several contact pins 321. The contact pins 321 electrically connect the modules 40 and the substrate 20. The contact pins 321 are arranged on the mounting section 311. The contact pins 321 are exposed from an upper surface of the mounting section 311 and extend in the Z-direction. The contact pins 321 are arranged corresponding to the terminal surfaces 43 of the modules 40.

[0025] The contact pins 32 further comprise contact pins 322. The contact pins 322 electrically connect the protruding section 52 of the pressure element 50 to the substrate 20. The contact pins 322 are arranged on the subdivision section 312. The number of contact pins 322 is not specifically limited. There can be one or more contact pins 322 for a single protruding section 52. The exemplary contact pins 32 comprise multiple contact pins 322 arranged along the subdivision section 312. The multiple contact pins 322 are arranged along substantially the entire length of the subdivision section 312 in a direction of extension in which the subdivision section 312 extends.

[0026] The contact pins 32 are connected to corresponding contact surfaces of the substrate 20 via solder joints 35, which are arranged on a lower surface of the base 30. Each solder joint 35 can be spherical. The contact pins 321 are electrically connected to the contact surfaces of the substrate 20 via the solder joints 35. The contact pins 322 are electrically connected to the contact surface 23 via the solder joints 35.

[0027] The metal element 33, which is part of the base 30, is arranged, for example, to improve the strength or heat dissipation performance of the base 30. The metal element 33 is located outside the base body 31. The metal element 33 is located adjacent to the outer edge section of the base body 31. The metal element 33 is, for example, mechanically connected to the base body 31 at a location not shown.

[0028] The exemplary metal element 33 supports the pressure element 50 on the front surface 21 of the substrate 20. An upper end of the metal element 33 is located approximately at the same height as an upper end of the outer edge section 313 in the Z-direction or is located above the upper end of the outer edge section 313. In plan view, the metal element 33 has a substantially rectangular frame shape that surrounds the base body 31. The metal element 33 is secured to the substrate 20 either directly or indirectly. The metal element 33 can be secured to the substrate 20 by soldering or by screw fastening. The metal element 33 has through-holes 331 for securing the pressure element 50 to the substrate 20. The through-holes 331 are arranged corresponding to the through-holes 26 of the substrate 20. The exemplary through-holes 331 are arranged at each of the four corners of the rectangular metal element 33.

[0029] The modules 40 are arranged on the front surface 21 of the substrate 20 via the socket 30. The modules 40 are electrically connected to the substrate 20 via the socket 30. The modules 40 form a circuit together with the substrate 20. Each of the modules 40 can be a printed circuit board on which electronic components are mounted on a substrate, or it can be a semiconductor package containing at least one semiconductor chip. The modules 40 can also be integrated circuit chips, such as microcontrollers. The electronic device 10 comprises the multiple modules 40.

[0030] The exemplary modules 40 comprise modules 40A, 40B, 40C, and 40D. Modules 40A, 40B, 40C, and 40D are modularized by functional units. The four modules 40 are printed circuit boards (PCBs). These PCBs can also be referred to as sub-boards. Each module 40 has a substrate 41 and electronic components 42 mounted on the substrate 41. The modules 40 are arranged on the mounting section 311 of the socket body 31. The substrate 41 has contact pads 43 on its lower surface, which faces the mounting section 311. The contact pads 43 are arranged in a grid pattern on the lower surface of the substrate 41. The electronic components 42 are arranged on an upper surface of the substrate 41. The modules 40 are LGA-type modules. LGA is an abbreviation for Land Grid Array.

[0031] The pressure element 50 contains an electrically conductive material. The pressure element 50 is made of a metallic material, such as Al, Cu, or Mg. The pressure element 50 presses the multiple modules 40 to ensure reliable electrical conduction between the modules 40 and the base 30 (in particular, the contact pins 321). The pressure element 50 presses the multiple modules 40 toward the base 30 in the Z-direction, i.e., toward the substrate 20. In addition to pressing the modules 40, the pressure element 50 can also have other functions, such as dissipating heat generated by the modules 40.

[0032] The pressure element 50 comprises at least one base plate 51 and the projecting section 52. The exemplary pressure element 50 further comprises heat dissipation fins 53. The base plate 51 is arranged to overlap the multiple modules 40 in plan view. The base plate 51 presses the multiple modules 40 against the base 30. The projecting section 52 extends from the base plate 51 towards the substrate 20. The projecting section 52 is arranged between the modules 40 in plan view.

[0033] The exemplary base plate 51 has a substantially rectangular, flat plate shape in plan view. The base plate 51 is arranged to overlap the entire base body 31 in plan view. The base plate 51 is positioned such that its outline in plan view substantially coincides with that of the base 30, which includes the metal element 33. The base plate 51 has a lower surface facing the substrate 20, and this lower surface is in direct or indirect contact with the electronic components 42 of the modules 40. The exemplary base plate 51 is in contact with the electronic components 42 via the thermally conductive elements 60. When pressure is exerted by the base plate 51, the contact surfaces 43 of the modules 40 ensure reliable electrical conduction via the corresponding contact pins 321.

[0034] The lower surface of the base plate 51 is in direct or indirect contact with an upper end of the metal element 33. The exemplary base plate 51 is in direct contact with the upper end of the metal element 33. The metal element 33 supports an outer edge section of the lower surface of the base plate 51. The base plate 51 presses the modules 40, while the metal element 33 supports the base plate 51. The base plate 51 defines through-holes 511 for securing the pressure element 50 to the substrate 20. The through-holes 511 are arranged at several positions on the base plate 51. The exemplary through-holes 511 are each arranged at the four corners of the rectangular base plate 51. The through-holes 511 correspond to the through-holes 331 of the metal element 33.

[0035] The foregoing section 52 is formed continuously with the lower surface of the base plate 51 and projects towards the substrate 20. The foregoing section 52 is in direct or indirect contact with the socket 30. The exemplary foregoing section 52 is in direct contact with the contact pins 322 of the socket 30. The foregoing section 52 does not overlap with the mounting sections in the top view, but overlaps with the separating section 312. The foregoing section 52 has a substantially cruciform shape in the top view. The foregoing section 52 has a first extending section 521, which extends in the X direction, and a second extending section 522, which extends in the Y direction. The foregoing section 52 is approximately the same size as, or slightly smaller than, the separating section 312 in the top view.The foregoing section 52 has a head end 523 in contact with all contact pins 322 that project from the separating section 312. The foregoing section 52 is in contact with the contact pins 322 while it is pressed, thereby ensuring a good electrical connection with the contact pins 322.

[0036] The preceding section 52 divides an area in which the multiple modules 40 are arranged into sections for the respective modules 40. The preceding section 52 separates the mounting sections from one another and also the modules 40 from one another. The preceding section 52 separates the adjacent modules 40 from one another. The exemplary preceding section 52 extends to a position that is closer to the substrate 20 in the Z-direction than the modules 40. The head end 523 is positioned below the surface of the substrate 41 on which the connection surfaces are formed. The head end 523 is positioned below the upper surface of the mounting section 311. The preceding section 52 completely separates the adjacent modules 40 from one another in the arrangement direction in which the adjacent modules are arranged.

[0037] The heat dissipation fins 53 are continuous with the base plate 51. The heat dissipation fins 53 increase the surface area for heat exchange. The shape, number, and position of the heat dissipation fins 53 are not particularly restricted. The exemplary heat dissipation fins 53 extend from the upper surface of the base plate 51 away from the substrate 20 in the Z-direction. The pressure element 50 has several heat dissipation fins 53. Each of the heat dissipation fins 53 has a substantially rectangular planar shape, with the Y-direction being a longitudinal direction and the X-direction a transverse direction. The several heat dissipation fins 53 are arranged side by side in the X-direction at a predetermined distance. The heat dissipation fins 53 are arranged such that at least a portion of the heat dissipation fins 53 overlaps with the modules 40 in the Z-direction.

[0038] A cooling method can be air cooling or water cooling. For example, the heat dissipation fins 53 can be arranged within a flow path of a cooler (not shown) to exchange heat between the heat dissipation fins 53 and a coolant. The base plate 51 can form part of the cooler that includes the flow path. A pin fin can be used instead of the flat, plate-shaped heat dissipation fins 53.

[0039] The thermally conductive elements 60 are arranged to improve heat dissipation performance when the pressure element 50 acts as a heat sink. The thermally conductive elements 60 are positioned between the base plate 51 and the electronic components 42 and are in contact with both. The thermally conductive elements 60 transfer heat generated by the electronic components 42 to the pressure element 50. The thermally conductive elements 60 can be made of TIM, such as a heat-dissipating gel or a thermally conductive film. TIM stands for Thermal Interface Material. The thermally conductive elements 60 overlap with at least a portion of the electronic components 42, which are present in the multiple modules 40 in the Z-direction.The thermally conductive elements 60 overlap with at least one of the electronic components 42, which generates a particularly large amount of heat among the multiple electronic components. The thermally conductive elements 60 thermally connect the electronic components 42 and the base plate 51.

[0040] The spring elements 70 exert a force on the base plate 51 of the pressure element 50 to press the modules 40. The spring elements 70 exert a reaction force due to elastic deformation on the base plate 51 as a force that presses the modules 40. The exemplary spring elements 70 have metal spring elements 70A arranged between the heads 801 of the screws 80 and the base plate 51. The spring elements 70A are arranged for each screw 80. The spring elements 70A generate a reaction force in the Z-direction due to deformation in a state in which the pressure element 50 is secured to the substrate 20 by the screws 80. As a result, a state is maintained in which the modules 40 are pressed through the base plate 51.

[0041] The screws 80 are fasteners that secure the pressure element 50 to the substrate 20. Each screw 80 has a head 801 and a shank section 802 extending from the head 801 in the Z-direction. The exemplary electronic device 10 has bushings 81 that are secured to the substrate 20. The bushings 81 are inserted into the through holes 26 of the substrate 20. The bushings 81 are secured to the substrate 20, for example, by an interference fit. The bushings 81 have ends that engage with the rear surface 22. Each bushing 81 has an extending section that extends beyond the front surface 21. At least one section of the extending section of the bushing 81 is inserted into the through hole 331 of the metal element 33. The socket 81 defines a screw hole 811 which is open at the upper end of the socket 81.The screw 80 is inserted into the screw hole 811 through the through hole 511 of the base plate 51 and the through hole 331 of the metal element 33 and tightened. In this tightened (i.e., fixed) state, the spring elements 70A are compressed between the heads 801 and the base plate 51. The base plate 51 is electrically connected to the terminal surfaces 24 via the screws 80 and the bushings 81. The base plate 51 is electrically connected to the terminal surfaces 24 via the metal element 33. <Zusammenfassung der ersten Ausführungsform>

[0042] The electronic device 10 according to the present embodiment comprises the substrate 20, the base 30, the multiple modules 40, and the pressure element 50, which contains an electrically conductive material. The base 30 is arranged on the front surface 21 of the substrate 20 and mounted on the substrate 20. The multiple modules 40 are electrically connected to the substrate 20 via the base 30. The pressure element 50 is arranged to overlap the multiple modules 40 in the thickness direction of the substrate 20 in a top view. The pressure element 50 comprises the base plate 51, which presses the multiple modules 40 against the base 30, and the projecting section 52, which extends from the base plate 51 toward the substrate 20. The projecting section 52 is positioned between the modules 40 in a top view.

[0043] As described above, the multiple modules 40 are not mounted directly on the substrate 20, but are electrically connected to the substrate 20 via the base 30. The pressure exerted by the pressure element 50 ensures a reliable electrical connection between the multiple modules 40 and the base 30, and consequently between the multiple modules 40 and the substrate 20. This allows the modules 40 to be easily detached from the substrate 20. Additionally, the pressure element 50 has a projecting section 52, which extends from the base plate 51 towards the substrate 20 and is positioned between the modules 40 in the top view. The projecting section 52 acts as a shield against electromagnetic noise between the modules 40. Compared to a configuration without the projecting section 52, the influence of electromagnetic noise generated by one module 40 on the other modules 40 can be reduced.Therefore, EMC performance can be improved.

[0044] Since the pressure element 50 contains an electrically conductive material, heat generated by the multiple modules 40 can be dissipated via the pressure element 50. The base plate 51, which presses the multiple modules 40, may need to be of a certain size, which likely causes the base plate 51 to warp. In the present disclosure, the preceding section 52 can improve the stiffness of the pressure element 50, thereby preventing warping of the base plate 51. As a result, heat generated by the multiple modules 40 can be dissipated efficiently. Furthermore, reliable electrical conductivity between the modules 40 and the base 30 can be ensured.

[0045] As shown, the aforementioned section 52 can be arranged to divide the area in which the multiple modules 40 are arranged into sections for the respective modules 40. According to this configuration, the influence of electromagnetic noise generated by one of the modules 40 on another of the modules 40 can be reduced, compared to a configuration in which the aforementioned section 52 is arranged only in a portion of the area between the adjacent modules 40. In other words, the EMC performance can be further improved.

[0046] As shown, the preceding section 52 can be arranged such that the head end 523 is positioned closer to the substrate 20 in the thickness direction than the multiple modules 40. According to this configuration, the influence of electromagnetic noise generated by one module 40 on another module 40 can be reduced, compared to a configuration in which the head end 523 is positioned further away from the substrate 20 than the modules 40. In other words, the EMC performance can be further improved.

[0047] As shown, the protruding section 52 can be in contact with the socket 30. The contact between the protruding section 52 and the socket 30 improves the EMC performance compared to a configuration in which the protruding section 52 is not in contact with the socket 30, i.e., a configuration in which the head end 523 is positioned above the socket 30.

[0048] As shown, the protruding section 52 can be electrically connected to a conductor that provides a predetermined potential on the substrate 20. In the illustrated electronic device 10, the protruding section 52 is electrically connected via the base 30 to the terminal 23, which provides a ground potential. As a result, the pressure element 50 is secured at a predetermined potential, thereby improving shielding against electromagnetic noise. A combination of the pressure element 50 and the conductor of the substrate 20 can shield against electromagnetic noise. The predetermined potential is not limited to ground potential; it can be a power supply potential.

[0049] As shown, the electronic device 10 can have spring elements 70. The spring elements 70 exert a force on the base plate 51 of the pressure element 50 to press the modules 40. The base plate 51 can press the modules 40 with a simple structure using a reaction force from spring deformation.

[0050] As shown, the electronic device 10 can have fasteners that secure the pressure element 50 to the substrate 20. The illustrated electronic device 10 has screws 80 as the fasteners. In a configuration that has the fasteners securing the pressure element 50 to the substrate 20, the pressure element 50 can be electrically connected to a conductor that provides a predetermined potential on the substrate 20. In the illustrated electronic device 10, the pressure element 50 is electrically connected to the terminals 24, which provide a ground potential. As a result, the pressure element 50 is secured at a predetermined potential, thereby improving the shielding against electromagnetic noise. The predetermined potential is not limited to the ground potential. The predetermined potential can be a power supply potential.

[0051] As shown, the electronic device 10 can have the thermally conductive elements 60 between at least one of the multiple modules 40 and the pressure element 50. The thermally conductive elements 60 contribute to an increased contact area and improved adhesion. Thus, the heat dissipation performance can be improved compared to a configuration in which the modules 40 are in direct contact with the pressure element 50 (in particular the base plate 51).

[0052] As shown, the pressure element 50 can have heat dissipation fins 53 that are connected to the base plate 51. The heat dissipation fins 53 increase the surface area (i.e., the heat dissipation area), thereby improving the heat dissipation performance. <modifikationen>

[0053] An example in which the base 30 includes the metal element 33 has been described, but the disclosure is not limited thereto. A metal element with a support function of the pressure element 50 can be provided separately from the base 30. The base 30 can also be provided without the metal element 33.

[0054] The number of modules 40 and assembly sections is not limited to the examples described above. The shapes of the separating section 312 and the preceding section 52 are not limited to the examples described above. For example, as in Fig. Figure 7 shows modules 40E and 40F. In other words, the number of modules 40 can be two. Fig. 7 corresponds Fig. 2. Each of the modules 40E and 40F has a substantially rectangular planar shape, with the Y-direction being the longitudinal direction and the X-direction the transverse direction. The modules 40E and 40F are arranged side by side in the X-direction. The base body 31 has two mounting sections and a separating section 312. The separating section 312 has a substantially I-shaped planar form extending in the Y-direction. The foreground section 52 also has a substantially I-shaped planar form, like the separating section 312. Although an example with two modules 40 is shown, the number of modules 40 can be three, five, or more.

[0055] Although an example has been described in which the printing element 50 is secured to the substrate 20, the present disclosure is not limited to this. For example, as described in Fig. Figure 8 shows that the pressure element 50 is screwed onto the base 30. Fig. 8 corresponds Fig. 6. The electronic device 10 has screws 82 as fastening elements for securing the pressure element 50 to the base 30. Fig. Figure 8 defines the metal element 33 screw holes 332 that open at the upper end of the metal element 33. Each screw 82 has a head 821 and a shank section 822. Several shank sections 822 are inserted into the screw holes 332 through the through holes 511 of the base plate 51 and screwed in. The contact surfaces 24 are arranged on a surface layer on the front surface 21 of the substrate 20. The base plate 51 is electrically connected to the contact surfaces 24 via the metal element 33. (Second embodiment)

[0056] The present embodiment is a modified example based on the preceding embodiment and may include the contents of the preceding embodiment. In the preceding embodiment, the protruding section is in contact with the base. Alternatively, the protruding section may be in contact with the substrate.

[0057] Fig. Figure 9 is a top view showing an example of an electronic device according to the present embodiment. Fig. 9 are similar to those in Fig. 3. One printing element and modules were omitted. Fig. Figure 10 is a cross-sectional view showing the electronic device. Fig. 10 corresponds Fig. 6.

[0058] In the electronic device 10 according to the present embodiment, the structure of the base 30 differs from that of the previous embodiment. The base body 31 has four mounting sections, the outer edge section 313, and an opening 314. The opening 314 extends through the base body 31 in the Z-direction. The exemplary opening 314 is a through-hole provided in a section corresponding to the subdivision section 312 described in the previous embodiment. The opening 314 has a substantially cross-shaped planar form. The opening 314 subdivides the base body 31 into the four mounting sections. The contact pins 32 have contact pins 321 located in the mounting sections and do not have contact pins 322.

[0059] The preceding section 52 has a substantially cross-shaped planar form, similar to the preceding embodiment. The preceding section 52 is longer in the Z-direction than the preceding section 52 according to the preceding embodiment. The preceding section 52 is inserted into the opening 314. The head end 523 of the preceding section 52 is in contact with the front surface 21 of the substrate 20. The preceding section 52 is in contact with the terminal surface 23 in order to be electrically connected to the terminal surface 23. Fig. 10. The preceding section 52 is in direct contact with the connection surface 23. However, the preceding section 52 can also be in indirect contact with the connection surface 23 via an electrically conductive seal. Other configurations are the same as those described in the preceding embodiment. <Zusammenfassung der zweiten Ausführungsform>

[0060] In the present embodiment, the preceding section 52 is also arranged such that the head end 523 is positioned closer to the substrate 20 in the thickness direction of the substrate than the multiple modules 40. Therefore, the EMC performance can be further improved. Furthermore, the preceding section 52 is electrically connected to the terminal surface 23, which provides a ground potential. As a result, the shielding effect against electromagnetic noise can be improved.

[0061] As shown, the protruding section 52 can be in contact with the substrate 20. The EMC resistance can be improved compared to a configuration in which the protruding section 52 is in contact with the socket 30, since the protruding section 52 is longer.

[0062] As shown, the foregoing section 52 can be in contact with the substrate 20 through the opening 314 defined in the socket 30. As a result, the EMC performance can be improved without increasing the number of components. (Third embodiment)

[0063] The present embodiment is a modified example based on the preceding embodiment and may include the elements of the preceding embodiment. In the preceding embodiments, the screw elements are arranged on the base plate. Alternatively, spring elements may be arranged on the rear surface of the substrate.

[0064] Fig. Figure 11 is a cross-sectional view showing an example of an electronic device according to the present embodiment. Fig. 11 corresponds Fig. 6. Fig. Figure 12 is a top view showing the electronic device. Fig. 12 corresponds Fig. 2. In Fig. 12. Spring elements are indicated by a dashed line, and a projecting section is indicated by a dash-dotted line to show their positional relationship. Additionally, a support section of the compression element is shown.

[0065] In the electronic device 10 according to the present embodiment, the base 30 does not have a metal element 33. Instead of the metal element 33, the pressure element 50 has a support section 54. The support section 54 extends from the base plate 51 toward the substrate 20. The support section 54 can have any structure that can support other parts of the pressure element 50 on the front surface 21 of the substrate 20. For example, the support section 54 can be arranged to surround the base 30 in plan view. Several support sections 54 can be arranged at distributed positions. The exemplary support section 54 has a substantially rectangular frame shape in plan view that surrounds the base 30.

[0066] The support section 54 defines screw holes 55 that open at a lower end of the support section 54 to secure the pressure element 50 to the substrate 20. The screw holes 55 are defined corresponding to the through holes 26 of the substrate 20. The exemplary screw holes 55 are defined at each of the four corners of a rectangular shape. The lower end of the support section 54 is in contact with the front surface 21 of the substrate 20. The support section 54 is in contact with the connection surfaces 24 to be electrically connected to them.

[0067] The spring element 70 has a metal backplate 70B instead of the spring elements 70A. The backplate 70B is arranged on the rear surface 22 of the substrate 20. The backplate 70B pulls the pressure element 50 towards the substrate 20 using a reaction force due to spring deformation, thereby generating a pressure force from the pressure element that presses the modules 40.

[0068] The backplate 70B has a main body 71 and several legs 72. The main body 71 is arranged to overlap at least a portion of each of the modules 40 in plan view. The main body 71 is in contact with the rear surface 22 in a state where the backplate 70B is secured to the substrate 20. The legs 72 are continuous with the main body 71. When the backplate 70B is secured to the substrate 20, at least a portion of each leg 72 is located away from the rear surface 22. It is preferred that the number of legs 72 be three or more to achieve stable fixation.

[0069] In the exemplary backplate 70B, the main body 71 has a frame shape. In plan view, the main body 71 has a substantially rectangular frame shape. The main body 71 is arranged to overlap the substrate 41 of each module 40 in plan view. The legs 72 extend from the four corners of the main body 71. The backplate 70B has the four legs 72. The backplate 70B has curved sections at the boundaries between the main body 71 and the legs 72, as well as at intermediate positions of the legs 72. The legs 72 are elastically deformable in the Z-direction. The legs 72 are arranged such that almost their entire lengths are spaced from the back surface 22.

[0070] The legs 72 have distal ends that define through-holes 73 for securing the screws 83 to the support section 54. The legs 72 have proximal ends that are connected to the main body 71. The distance between the distal ends of adjacent legs 72 is greater than the distance between the proximal ends of adjacent legs 72. The legs 72 extend obliquely from the main body 71. When the screws 83 are tightened, the spring-loaded reaction force of the legs 72 pushes the pressure element 50 against the substrate 20, and the base plate 51 pushes the modules 40 against the base 30. Each of the screws 83 has a head 831 and a shank section 832. The shaft section 832 of the screw 83 is inserted into the through hole 73 of the leg 72 and the through hole 26 of the substrate 20 and is screwed into the screw hole 55 of the support section 54.Other configurations are the same as those described in the previous embodiment. <Zusammenfassung der dritten Ausführungsform>

[0071] The electronic device 10 of this embodiment is also provided with the spring element 70. The base plate 51 can press the modules 40 with a simple structure using a reaction force of spring deformation.

[0072] As shown, the spring element 70 can have the backplate 70B, which is arranged on the rear surface 22 of the substrate 20. The backplate 70B is arranged to overlap at least a portion of each module 40 in plan view and has the main body 71, which is in contact with the rear surface 22. The backplate 70B also has the multiple legs 72, which are arranged continuously or continuously with the main body 71, extending from the rear surface 22, and are mechanically connected to the pressure element 50 through the through-holes 26. The baseplate 51 is forced toward the substrate 20 by the reaction force generated by the spring deformation of the backplate 70B, thereby pressing the modules 40.

[0073] As a result, the number of components in the electronic device 10 can be reduced, while the removal of the modules 40 is facilitated, and an improvement in EMC performance is achieved. Additionally, the backplate 70B can reduce warping of the substrate 20. Thus, reliable electrical conduction between the modules 40 and the base 30, and consequently between the modules 40 and the substrate 20, can be ensured. For example, it is possible to maintain a reliable thermal connection between the electronic components 42 and the baseplate 51, thereby improving heat dissipation. For example, reliable electrical conduction can be ensured between the protruding section 52 and the connection surface 23. Reliable electrical conduction can be ensured between the support section 54 and the connection surfaces 24.

[0074] The configuration described in the second embodiment, in particular the configuration in which the base 30 defines the opening 314 and the foreground section 52 is in contact with the substrate 20 through the opening 314, can be combined with the configuration described in the present embodiment. (Other embodiments)

[0075] The disclosure in this description, the drawings, and the like is not limited to the exemplary embodiments. The disclosure includes exemplary embodiments and modifications by those skilled in the art based on the exemplary embodiments. For example, the disclosure is not limited to the combinations of components and / or elements shown in the embodiments. The disclosure can be implemented in various combinations. The disclosure may include additional sections that can be added to the embodiments. The disclosure includes those in which the components and / or elements of the embodiments are omitted. The disclosure includes the exchange or combination of components and / or elements between one embodiment and another embodiment. The technical scope disclosed is not limited to the description of the embodiments.It is understood that some disclosed technical areas are specified by the description of the claims and that any modification has the equivalent meaning and scope of the description of the claims.

[0076] The disclosure in the description, drawings, and the like is not limited by the description of the claims. The disclosures in the description, drawings, and the like encompass the technical ideas described in the claims and, furthermore, extend to a wider variety of technical ideas than those in the claims. Therefore, various technical ideas can be extracted from the disclosure in the description, drawings, and the like without being limited to the description of the claims.

[0077] When an element or layer is described as being "above" or "connected," the element or layer may be positioned directly above or connected to another element or layer, or there may be an intervening element or layer between them. Conversely, when an element or layer is described as being "directly above" or "directly connected," there is no intervening element or layer. Other terms used to describe the relationships between elements (for example, "between" versus "directly between" and "adjacent" versus "directly adjacent") should be interpreted similarly. As used herein, the term "and / or" encompasses any combination and all combinations relating to one or more of the related items listed.For example, the term A and / or B can refer to only A, only B, or both A and B.

[0078] Spatial relative terms such as "inside," "outside," "back," "below," "low," "above," "high," etc., are used herein to facilitate descriptions that describe relationships between one element or feature and another. Spatial relative terms may be intended to indicate different orientations of a device in use or operation, in addition to those shown in the drawings. For example, if the device in the figure is flipped over, an element described as "below" or "directly below" another element or feature will be oriented "above" the other element or feature. Therefore, the term "below" can refer to both above and below. The device may be oriented in the other direction (rotated 90 degrees or in any other direction), and the spatial relative terms used herein are interpreted accordingly. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2006-108674 A [0002, 0003]< / modifikationen>

Claims

[1] Electronic device comprising: a substrate (20) with a surface (21); a base (30) which is arranged and mounted on one surface of the substrate; several modules (40) which are electrically connected to the substrate via the base; and a pressure element (50), comprising: a base plate (51) arranged to overlap with the multiple modules in one thickness direction of the substrate in a plan view and to press the multiple modules against the base; and a projecting section (52) extending from the base plate towards the substrate and made of an electrically conductive material, wherein The preceding section is arranged between the multiple modules in the top view. [2] Electronic device according to claim 1, wherein the preceding section divides an area in which the multiple modules are arranged into sections for the respective modules. [3] Electronic device according to claim 1 or 2, wherein the foreground section has a head end (523) which is closer to the substrate in the thickness direction than the multiple modules. [4] Electronic device according to claim 3, wherein the foreground section is in contact with the substrate. [5] Electronic device according to claim 4, wherein the base defines an opening (314), and The preceding section is in contact with the substrate through the opening. [6] Electronic device according to claim 3, wherein the foreground section is in contact with the base. [7] Electronic device according to any one of claims 3 to 6, wherein the substrate has a conductor (23) that provides a predetermined potential, and the preceding section is electrically connected to the conductor. [8] Electronic device according to any one of claims 1 to 7, further comprising a spring (70) which exerts a force on the base plate of the pressure element to press the multiple modules. [9] Electronic device according to claim 8, wherein the substrate defines several through holes (26) at positions that do not overlap with the multiple modules in the top view, the spring has a backplate (70B) which is located on a rear surface of the substrate opposite one surface, the backplate is arranged to overlap with at least part of each of the multiple modules in the top view, the backplate has: a main body (71) arranged in contact with the rear surface; and several legs (72) which are arranged continuously with the main body and away from the rear surface, the multiple legs are mechanically connected to the pressure element via the through holes in order to generate a reaction force due to elastic deformation of the back plate, and The reaction force pushes the base plate towards the substrate to press the multiple modules. [10] Electronic device according to any one of claims 1 to 9, further comprising a fastening element (80, 83) that secures the pressure element to the substrate. [11] Electronic device according to any one of claims 1 to 9, further comprising a fastening element (82) that secures the pressure element to the base. [12] Electronic device according to claim 10 or 11, wherein the substrate has a conductor (24) that provides a predetermined potential, and the pressure element is electrically connected to the conductor in a state in which the pressure element is secured. [13] Electronic device according to one of claims 1 to 12, further comprising a heat-conducting element (60) arranged between the pressure element and at least one of the several modules. [14] Electronic device according to any one of claims 1 to 13, wherein the pressure element has a heat dissipation fin (53) which is continuous with the base plate.

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