Semiconductor device structure and method for forming the same
DE102025149997A1Undetermined Publication Date: 2026-07-30TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
- Filing Date
- 2025-12-02
- Publication Date
- 2026-07-30
Abstract
A semiconductor device structure and a method for its formation are described. The method includes forming a fin structure over a substrate, forming a sacrificial gate structure on a portion of the fin structure, and removing an exposed portion of the fin structure to form a source / drain cavity. The exposed portion of the fin structure is removed by a cyclic etching process, which comprises multiple cycles, each consisting of a plasma generation stage, an etching stage, and a rinse stage. The shape of the source / drain cavity is controlled by adjusting the ratio of the rinse stage duration to the plasma generation and etching stage durations.
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