Optical devices and methods for their manufacture

Abstract

A method comprises fabricating a photonic integrated circuit comprising: a first waveguide; a second waveguide above the first waveguide, wherein the second waveguide is optically coupled to the first waveguide; a first external coupler optically coupled to the second waveguide; and a first interconnect structure. The method further comprises: attaching an electronic die to a first side of the photonic integrated circuit; direct bonding a first photonic die to a second side of the photonic integrated circuit, wherein, after direct bonding, the first photonic die is optically coupled to the first waveguide; and fabricating a second interconnect structure above the first photonic die and the photonic integrated circuit.