POWER MODULE PACKAGE, INCLUDING A POWER FLAT CONNECTOR

DE102026100423A1Undetermined Publication Date: 2026-10-22SEMICON COMPONENTS IND LLC
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Patent Information

Application Number
DE102026100423
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-21
Filing Date
2026-01-05
Publication Date
2026-10-22

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Abstract

The implementations described herein relate to a power module package that may, for example, include a semiconductor chip assembly and a leadframe connected to the semiconductor chip assembly, wherein the leadframe includes at least one power flat connector through which the current connected to the semiconductor chip assembly flows. The power module package may include a molding compound that is partially arranged over the semiconductor chip assembly and the leadframe, wherein the at least one power flat connector is exposed outside a surface of the molding compound.
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Citation Information

Patent Citations

  • Semiconductor package comprising an encapsulation means with a peripheral side wall comprising a recess therein, and a conductor arranged in the recess

    DE102025118195A1