ARTIFICIAL INTELLIGENCE INTEGRATED CIRCUIT SYSTEM CONFIGURED WITH STACKED THREE-DIMENSIONAL STORAGE DEVICES

Abstract

A stacked AI engine system that uses three-dimensional (3D) memory devices. The system includes one or more memory-integrated circuit (IC) devices coupled in a stacked configuration with a logic IC device. The memory ICs each comprise a plurality of first memory devices configured on a first semiconductor substrate element, and the logic IC comprises multiple chiplets, each having multiple groups, with each group comprising multiple disks configured on a second semiconductor substrate element.Each disk includes a first network-on-a-chip (NoC) device coupled to one of the first storage devices, a second NoC device coupled to a second storage device, multiple compute engine devices coupled to the NoC devices, an output buffer device (OB device) coupled to the compute engines, and a single-instruction multiple data (SIMD) device coupled to the OB device. These IC devices can be configured to overlay an organic substrate element and are interconnected via links in underfill layers.

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