ELECTRICAL CONNECTION UNIT

DE102026102074A1Undetermined Publication Date: 2026-07-23YAZAKI CORP
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
YAZAKI CORP
Filing Date
2026-01-19
Publication Date
2026-07-23

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Abstract

An electrical interconnect includes a heat dissipation element, a first electronic component, a first heat transfer element, a second electronic component, and a second heat transfer element. The first electronic component is located on the first side of the heat dissipation element. The first heat transfer element is located on the first side of the first electronic component and is configured to be positioned between the first electronic component and an external heat sink. The second electronic component is located on the second side of the heat dissipation element. The second heat transfer element is positioned between the second electronic component and the heat dissipation element.
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