Semiconductor device
DE102026102418A1Undetermined Publication Date: 2026-07-23RENESAS ELECTRONICS CORP
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Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- RENESAS ELECTRONICS CORP
- Filing Date
- 2026-01-21
- Publication Date
- 2026-07-23
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Abstract
A semiconductor device is used, comprising: a semiconductor substrate with a chip area; and an interlayer insulating film on the semiconductor substrate, the chip area comprising: a circuit area; and a sealing ring area positioned around the circuit area. The semiconductor device comprises: a first wiring formed on the interlayer insulating film in the circuit area; and a second wiring formed on the interlayer insulating film in the sealing ring area. The semiconductor device further comprises: an insulating film covering the first wiring and the second wiring; and an organic insulating film on the insulating film. A concave section is formed on the upper surface of the second wiring.An end section of the organic insulating film is positioned on a first section of the second wiring, which is positioned closer to an edge section of the chip area than the concave section.
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