Computer system comprising a motherboard and a housing over a chip mounted directly on the motherboard, and manufacturing process for it

By directly mounting an IC chip on a mainboard with a housing over it and establishing electrical connections, the challenges of form factor and routing flexibility in handheld devices are addressed, achieving a compact and efficiently connected system-level assembly.

DE112009005588B4Active Publication Date: 2026-05-28SK HYNIX NAND PRODUCT SOLUTIONS CORP
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Patent Information

Application Number
DE112009005588
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Priority Date
2008-09-08
Filing Date
2009-08-27
Publication Date
2026-05-28
Estimated Expiration
2029-08-27

AI Technical Summary

Technical Problem

Existing handheld computing devices face challenges in achieving a small form factor and sufficient routing flexibility due to the use of package-on-package (PoP) architectures, which increase thickness and limit layer count, and mounting components side-by-side increases surface area.

Method used

A system-level assembly where an integrated circuit (IC) chip is directly mounted on a mainboard with a housing positioned over the IC chip, forming direct-chip attach (DCA), and electrical connections are established between the IC chip, housing, and other components on the mainboard, using intermediate connections and a multilayer substrate.

Benefits of technology

This configuration reduces overall thickness and maintains a compact form factor while enhancing routing flexibility and reducing surface area, allowing for efficient electrical connections and potential electromagnetic interference suppression.

✦ Generated by Eureka AI based on patent content.

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Abstract

Computer system (100) comprising the following: a mainboard (110); a DCA IC chip (120) that is attached directly to the mainboard (110); a housing (150c) comprising a substrate (160c) and a first IC chip (170c) arranged on the substrate (160c), wherein the housing (150c) is attached to the main board (110) and is arranged over at least one section of the DCA IC chip (120); and at least one further component (130a) that is arranged on the mainboard (110); wherein the main board (110) includes at least one electrical path (190a) that couples the DCA IC chip (120) to the housing (150c), and includes at least one further electrical path (190b) that couples the DCA IC chip (120) to the at least one further component (130a), characterized by the fact that The computer system (100) further comprises a radiation shield which is electrically grounded to the mainboard (110) and extends over a top of the housing (150c).
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Citation Information

Patent Citations

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    JP2005109306A

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