Laser system and method for assembling a laser system

Abstract

A laser system (100) comprising the following components: a heat exchanger (103) with a bore (108) extending through the heat exchanger (103), a carrier (104) on which a semiconductor amplifier chip (107) is mounted, the carrier (104) comprising a base (104-1) and a mounting (120), the base (104-1) covering one end of the bore (108) and the mounting (120) extending into the bore (108) and accommodating the semiconductor amplifier chip (107), and the mounting (120) comprising circumferential projections (121) increasing a contact surface between the carrier (104) and the heat exchanger (103), and a lens (101) arranged on the heat exchanger (103) and above the bore (108).

Description

Related registrations

[0001] This application claims priority over US patent application US 12 / 623,886 dated November 23, 2009, to which full reference is hereby made. Background of the invention

[0002] Lasers have a wide range of applications, and their uses are expanding as their advantages are tested in new markets and regions. Such expanded applications often require significant innovations to meet the needs of these new uses. The availability of new types of lasers is crucial in these processes. Currently, many new wavelengths of inexpensive laser diodes are available, and their properties have the potential to increase the use of lasers in industry, medicine, and domestic applications by opening up applications that require high-performance lasers for mass production and low-cost applications.

[0003] To implement such projects in practice, it is necessary to solve key problems. In particular, the higher energy levels require improvements in numerous areas, including heat dissipation, size, cost, and safety. It is especially important to reduce the cost of laser systems for domestic applications or other consumer or niche laser markets. In such markets, there is a need for efficient manufacturing to achieve costs suitable for mass production.

[0004] Cost minimization requires not only large-scale component production but also minimizing complexity and the associated assembly work. Specifically, machining or manual alignment adjustment should be avoided. Such problems have been solved for low-energy semiconductor optical devices, such as LEDs (light-emitting diodes), used for reading optical data carriers and the like. In these systems, the semiconductor LEDs must operate at specific energy levels, but precise optical alignment and focus are not required because emission occurs close to the data carrier, and signal detection does not necessitate precise focusing. The absence of the need for focusing or refocusing is characteristic of current mass-production laser chip applications.

[0005] However, applications for inexpensive high-energy lasers, such as those described in our pending application PCT / US2009 / 001350, published as WO 2009 / 111010 A1, require precise optical alignment of a laser with a device and, in some cases, a sharp focus. Therefore, in the consumer sector, the cost of the laser components of a system must be reduced. The production costs of such systems include the production of the laser semiconductor chip, mounting or arranging the chip in a fixture, and aligning and testing the fixture. Summary of the invention:

[0006] Testing and alignment still require human involvement for each device. Eliminating or minimizing human labor is a critical hurdle for enabling the mass-market use of high-energy lasers or other mass-produced devices, including portable medical alignment and other applications requiring high-energy lasers, especially those that also require focusing and / or aligning the laser beam.

[0007] A potentially inexpensive laser system is described that provides potential multi-watt laser capabilities in a package suitable for mass production and user applications. The system can provide a wide variety of wavelengths, specifically wavelengths from 500 to 2000 nanometers (nm). For user applications, eye-safe wavelengths emitted in the range of high water absorption are preferred.

[0008] Aspects of the present invention relate to a laser system suitable for making high-energy laser technologies available for large-scale market applications, for example in medical clinics, medical field applications, forensics / law enforcement, and / or in the consumer sector. A key innovation is the combination of various techniques for producing laser systems that can be assembled from simple parts in a few movements or steps or manufacturing steps, and that operate in "plug and play" mode, regardless of whether they are powered by a wall outlet or a battery.

[0009] The system is largely characterized by its self-assembly capability through the use of suitable, configured parts. In a first aspect, the system is self-assembling due to the provision of parts that can be assembled through simple physical contact. For example, a chip carrier and a heat sink are designed such that the carrier, to which the chip is attached, can be inserted into the heat sink and held in position by a tight fit. This fit can optionally be increased using adhesive or solder. In a second aspect, the system is rotationally self-aligning or self-tapping. In a third aspect, the components are at least partially self-aligning due to their radial centering within a recess in at least one component.

[0010] According to other aspects, the system further comprises at least one optical element. The optical element is preferably attached via the recess in the system. A fan may be included in the system to increase heat dissipation. Each component that is not functionally rotationally symmetrical is preferably timed or fitted during the assembly process such that it can be assembled in a predetermined rotational position relative to the rest of the system.

[0011] In general, according to one aspect, the invention comprises a laser system comprising a heat exchanger with a bore extending through the heat exchanger, a carrier on which a semiconductor gain chip is attached, wherein at least a part of the carrier is attached in the bore, and a lens is attached to the heat exchanger and the bore.

[0012] In this embodiment, a fan is provided to circulate air over the heat exchanger. In another example, the fan directs air towards or over the area onto which the laser light is focused.

[0013] In general, according to another aspect, the invention comprises a method for assembling high-power semiconductor laser systems to provide lasers that are passive or self-aligning and have predefined focus points or image planes, without requiring alignment or adjustment after manufacture.The method comprises fixing a semiconductor laser chip on a substrate, the substrate having power connections and heat distribution means, arranging the substrate in a heat exchange ratio with a heat exchanger, whereby the heat exchanger and the substrate can be brought into an efficient heat exchange contact passively or self-aligningly, and fixing an optical element on one or both heat exchangers for the diode laser and the substrate, wherein laser systems produced by this method each have at least one output laser beam from each semiconductor laser chip, each beam having a predetermined direction of propagation without requiring any alignment or adjustment after fabrication.

[0014] In exemplary embodiments, the chip is connected to the carrier via a heat distribution mount attached to a body of the carrier, the mount having a body that defines the engagement depth with the heat exchanger. The heat exchanger has a central bore, and the outer surfaces of the inlet section of the mount's bore and the inner surfaces of the bore are designed or constructed to create close proximity between their surfaces during assembly, thus enabling efficient heat transfer between the laser diode and the heat exchanger. Preferably, the components are mutually self-aligning, at least partially by virtue of their radial centering within a recess in at least one component.In some cases, each part that is not functionally rotationally symmetrical is self-aligning during the assembly process in such a way that it can be joined in a predetermined rotational position relative to the rest of the system.

[0015] For assembly, a base T provides a fitting point for at least one of the ribs, which differs from the other ribs in shape or arrangement. The laser facet is centered in the system when the assembly is complete by fixing the laser in an area on the carrier that is centered after the mutual alignment of the carrier and the heat exchanger.

[0016] In general, according to another aspect, a method for assembling semiconductor laser systems is provided to supply lasers that are self-aligning and have predefined focus distances or image planes without having to adjust or set them after fabrication, wherein the method comprises fixing a semiconductor laser chip on a substrate and arranging the substrate in a heat exchange relationship with a heat exchanger, self-aligning in a heat exchange contact.

[0017] In general, according to another aspect, a method for assembling optical systems is provided which are self-aligning and have predefined focus distances or image planes and which require adjustment after fabrication, wherein the method comprises fixing an optical element on a heat exchanger for a ground laser and arranging the optical element in a heat exchange relationship with a heat exchanger, wherein the heat exchanger and the optical element are self-aligning in a heat exchange contact.

[0018] In general, according to a further aspect, the invention comprises a laser diode mounting system, wherein the system includes a semiconductor laser, at least one heat distribution means, a heat exchanger and at least one optical component, wherein the optical component is fixed to one or more of the support and the heat exchanger, wherein the laser produced by this method has an output laser beam from the semiconductor laser chip and each beam has a predefined propagation direction without orientation.

[0019] In general, according to another aspect, the invention comprises a housing system that serves as a housing for a laser system, with at least one contact that is arranged at the interface where the light is emitted, which, when activated, enables or allows operation of the laser assembly.

[0020] In some examples, a contact is activated by a rolling motion or a pressure sensor. In some examples, the optical emission is proportionally controlled by feedback from the contact.

[0021] The aforementioned and other features of the invention include several novel design details and combinations of parts, as well as other advantages, which are now described in detail with reference to the accompanying drawings and are highlighted in the claims. It is understood that the specific method and apparatus comprising the invention are shown for illustrative purposes and not as a limitation of the invention. The principles and features of this invention can be used in various and numerous embodiments without deviating from the scope of the invention.

[0022] In the accompanying drawings, the reference symbols refer to the same or similar components in the different views. The drawings must be drawn to scale.

[0023] Regarding the drawings:

[0024] Fig. Figure 1 is a perspective view, partly as an exploded view, of a laser system that incorporates aspects of the invention.

[0025] Fig. 2 is a cross-section of the laser system made of Fig. 1,

[0026] Fig. Figure 3 is a perspective view of the laser chip and its mounting.

[0027] Fig. Figure 4 is a top view of the attached laser chip.

[0028] Fig. 5a is a perspective view of a lens suitable for the laser system,

[0029] Fig. 5b is a side view of a lens in the X direction that is suitable for the laser system,

[0030] Fig. 5d is a side view of a lens in the Y direction that is suitable for the laser system,

[0031] Fig. Figure 6 is a top view of the laser system shown in Figure 6.

[0032] Fig. 7 and Fig. Figure 8 shows a device that incorporates aspects of the invention with an alternative lens mounting system.

[0033] Fig. 9 and Fig. Figure 10 shows a device that incorporates aspects of the invention and features a simple fastening system when a fin or other high-range heat exchanger is not required.

[0034] Fig. 11 shows that the instrument is made from the Fig. 1 or Fig. 7 and a cooling fan that can be attached to it,

[0035] Fig. 12 and Fig. Figure 13 shows examples of methods that align the embodiments of a laser machine,

[0036] Fig. Figure 14 shows a method for a self-aligning laser machine,

[0037] Fig. Figure 15 shows a perspective view of a housing system for surrounding an assembled laser machine with an embedded or integrated sensor system.

[0038] Fig. Figure 16 shows a perspective view of an alternative housing system. Fig. 15 for surrounding an assembled laser machine with an embedded laser system

[0039] Fig. Figure 17 shows a flowchart of a housing system for surrounding an assembled laser machine with an embedded sensor system. Detailed description of preferred embodiments

[0040] The terms used herein generally retain their conventional meanings. "Optical element" is used as a term known from the prior art, encompassing components such as a lens, prism, mirror, light guide, diffuser, or a similar element that modifies the light distribution or pattern or serves as an optical profile for the laser output. "Clocking" or "fitting" or "clocked" or "fitted" refers to the provision of direct, rotationally symmetrical alignment between predetermined means or components of an assembly. A laser power supply can be any power source including a battery or a pluggable power supply. "Passively aligning" or "self-aligning" refers to the alignment of parts in an assembly where the elements are aligned by mechanical or optical alignment elements, so that the laser does not necessarily need to be switched on.It must be powered to see where the laser light is focused or transmitted. A "heat spreader" is a type of heat sink comprising any device, or sections thereof, suitable for distributing heat from a first area to a second area larger than the first.

[0041] In its basic structure, the improved housing system for the self-aligning assembly and provision of a housing for semiconductor lasers or, more generally, semiconductor gain chips comprises at least one semiconductor gain chip (such as a laser chip) bonded to a suitable substrate and connected to a power supply, and a heat exchanger that contacts the substrate. Preferably, the system components are mutually self-aligning during assembly or have already been aligned by machine or manually using a fitting mechanism and other arrangement mechanisms. In particular, both a self-aligning laser system and a method for its manufacture are provided.

[0042] Fig. Figure 1 is a perspective view, partly in exploded view, of a first embodiment of an assembled laser system. Fig. 1 indicates the system 100 an application focus lens 101 , a heat dissipation device 103 , which is referred to as a heat exchanger or cooling sink, having an end face 102 a TO-can (transistor outline can) type of laser carrier 104 the refinements described below, and one or more (typically two or three) power cables 105 , 106 for the laser and optionally for other subsystems. In a finished device of this embodiment, air or other fluid is drawn through the fins of the heat exchanger. 103 circulates. A central borehole 108 in the heat exchanger 103 It provides a mounting point or area for other parts of the system and contributes to their alignment. The lower edge 160 the lens 101 It is preferably used for rotationally symmetrical fitting during assembly.

[0043] Fig. Figure 2 shows a cross-section of the system 100 out of Fig. 1. The lens 101 is optionally attached to the heat exchanger 103 using epoxy or solder applied to the proximal end face 102 of the heat exchanger 103 and / or within the heat exchanger bore 108 is applied, held, thereby aligning the lens with the central bore of the heat exchanger. 103 is aligned. The semiconductor gain chip, such as a laser chip, is aligned. 107 is on the TO-can (transistor outline can) assembly 104 attached, as shown in detail below, and connected to the power lines 105 , 106 connected. The distance between the laser 107 and the focusing lens 101 is secured by two locking lugs or projections. 140 , 142 controlled or set, or defined, which are in the central channel 8 of the heat exchanger 103are arranged. According to this embodiment, the corner of the channel on the front face serves this purpose. 102 as a locking tab or stop. A cross-section through the trajectory of the light or through the light distribution or path of the light emitted by the laser chip. 107 is emitted, is indicated by the reference symbols 110 within the central canal 108 of the heat exchanger shown or described.

[0044] The space between the lens 101 and the TO-can 104 (transistor outline can) is laterally or sideways through the walls of the bores. 108The space is limited and typically filled with air. In certain applications, the space is primarily filled with a plurality of inert gases, such as nitrogen or gas mixtures. In other embodiments, the space is evacuated, creating a vacuum. In examples where the space is filled with a controlled atmosphere, such as a plurality of inert gases or a vacuum, a hermetic seal is used at the interface between the lens. 101 and the heat exchanger 103 and the TO-can assembly 104 (transistor outline can) and the heat exchanger 103 generated.

[0045] The TO-can 104The TO-can is secured or attached to the heat exchanger using a fastener such as epoxy or solder. The extent of the area where the fastener fixes the TO-can can vary from surrounding the entire surface of the TO-can to a single point on the TO-can surface.

[0046] Fig. 3 shows the laser carrier 104 more detailed. The TO-Art carrier 104 includes a cylindrical base 104-1 and a heat exchanger and a mounting assembly (mount = fastening) 120 , which are located on the surface 104-6 the base 104-1 protrudes. The fastening 120 has extensions or protrusions 121 , a base area or section 124 and an optional lower mounting 126 , which may be made of non-electrically conductive material. The laser 107 with a front surface 128For light emission, the lower mounting 126 bound, or attached to it, for example by means of solder, and is electrically connected by cable connections 130 , 132 with the lines 104-2 and 104-3 connected. The lines 104-2 and 104-3 extend through the base 104-1 which is an electrically insulating material (such as glass) 104-4 and 104-5 includes and are connected to the current electrodes or wires 105 , 106 which are characterized by their base 104-1 the carrier, connected. The wires 105 , 106 ends at wire bonds 130 , 132 or wire connections. The anode wire bonds 130 are typically via a guide 134 connected, which can be circular, oval or flat in cross-sectional shape, and the cathode wire bonds 132 are typically directly connected to the fastening120 connected. The wire connections can be reversed, as a design choice to connect one current conductor to the anode connection and the other to the cathode.

[0047] The laser 107 is a semiconductor laser diode (or “on-chip”). Such lasers are described, for example, in our pending applications US 2007 / 002915 A1 and PCT / US2009 / 001350, published as WO 2009 / 111010 A1 (to which we hereby incorporate our full references wherever permitted). However, other types of laser chips may be used, including gallium arsenide laser chips. Laser chips with any wavelength and material system may also be used in this assembly. In the Fig. The 3 lasers shown bring wires from each wire bond 130 , 132 a current on or through a semiconductor laser chip 107 (from top to bottom or from beginning to end as in Fig. 2 and Fig. 3 shown) and light is emitted perpendicular to the direction of the differential current through the laser facet. 128 emitted. (The other surfaces are normally coated in such a way that they reflect the generated wavelengths.) As can be seen schematically from the cross-sectional view of Fig. As can be seen in section 2, the emitting facet is 128 preferably on the lens 101 centered.

[0048] Fig. 4 shows the assembly made of Fig. 3 in a top view, so that the relationships between the laser 107 , its optional carrier 126 and the wire bonds 130 , 132 are clear. Furthermore, the mechanical, aligned interface that the carrier 104 with the heat exchanger 103 It is shown to self-align rotationally symmetrically. In detail, a groove or recess is shown. 138 in the carrier 104 shown. The mechanical groove or recess. 138is used to the carrier 104 with the heat exchanger 103 The heat exchanger is guided by a mechanical tooth or lug to align it rotationally symmetrically. In other embodiments, a tool (not shown) is used in between to ensure the rotationally symmetrical orientation or arrangement of the support. 104 with regard to the heat exchanger 103 to fix, if the carrier 104 into the central bore 108 of the heat exchanger 103 is used. The optional mechanical groove 138 A recess or optical reference can be helpful to mechanically fix the parts during assembly so that the parts are fitted or aligned or correctly positioned while epoxy or solder permanently bonds the parts together.

[0049] The fastening 120 of the carrier 104 out of Fig. 4 has features to improve heat transfer from the laser chip 107 to the heat exchanger 103 to facilitate. Firstly, the fastening features 120 peripheral extensions or protrusions 121 on, whereby through the outer surface of the shaped projections, as with the rest of the fastening 120 Increased surface contact is provided and heat is conductively contacted with the bore of a heat exchanger, as with heat exchangers. 103 of the preceding figures. The entire perimeter coverage of the fastening. 120 plus the advantages 121 The circumference is preferably 200° or more, such as 240° or more. Thermal contact is further improved by the use of thermally conductive binders or solder where necessary.

[0050] Secondly, the fastening 120 a central projection or extension or base 124 in the middle of the mounting to position the laser107 for example, to position it at the center of the device's rotation and it also acts as a heat distributor to dissipate heat from the laser. 107 or the optional lower mounting 126 into the fastening 120 to drain away. The curved sides of the base 127 are designed in such a way as to improve such heat transfer. Although not physically illustrated, in other embodiments a lens or other optical element, such as a volumetric Bragg element, gate, cover, or diffractive optic, is fixed to the peripheral or edge-mounted projections or attachment.

[0051] The Fig. 5a, Fig. 5b, Fig. Figure 5c shows a more detailed view of the lens. 101 The lens in such systems is typically aspherical and differs in profile in the x-direction compared to the y-direction, since the laser facet 128The light emitted from the front face exhibits a different dispersion or distribution in the direction across its width (“y” in this figure) compared to its height (“x” in this figure). The lens is designed to produce either a bundled beam or a focused point. The radius of curvature of the lens differs in the x and y dimensions of the lens. In the present embodiment, this is achieved by providing a volume of material with a suitable refractive index and shaping the material to have a complex surface profile, as shown in the Fig. 5a, Fig. 5b, Fig. Shown in section 5c. The wavy surface 151 The lens can have a different radius of curvature across the x-axis plane compared to the y-axis plane, so that a location of constant bending exists. 152 It is not a circle, unlike a circularly symmetrical lens. The lens 101A base is typically used. 153 include a means through which the emitted light can be transmitted and preferably also a transmission plate. 154 , which is used to cover the entire lens 101 at the heat exchanger surface 102 (shown in Fig. 1) or to attach or tie it in another location. The main material for sections of the lenses 151 , 153 and 154 It can be the same or different. For efficiency reasons, casting the lens in a single operation from a single material is preferred. One edge surface 160 the record 154 which is optionally right-angled, is preferably used to align the lens 101 in relation to the area 102 of the heat exchanger 103 , as in Fig. 1 shown and from there with the laser facet 128The optical surfaces of the lens (not specified) are preferably coated with a non-reflective material. Coatings for other purposes, including scratch protection, are also conceivable.

[0052] Fig. 6 shows the lens 101 with a selected edge 160 , which are connected to the heat exchanger 103 aligns. According to this embodiment, the radially or outwardly extending fins of the heat exchanger are aligned. 103 outer ends, alternating as straight ends 170 and T-shaped ends 171 are designed to increase the heat exchange area. However, the fin would 172 As shown here, the system has a T-shaped end; this is not the case in this embodiment. Using this anomaly as a reference allows for a reliable arrangement of the heat exchanger. 103regarding the other components, including the support 104 , the laser 107 and the lens edges 160 and provides a way to achieve this automatically during manufacturing.

[0053] Fig. Figure 7 shows an alternative fastening arrangement in perspective view and Fig. Figure 8 shows a cross-section through the center of the same embodiment. A TO-Tan type assembly. 204 , similar to the carrier 104 out of Fig. 3 is in a recess 208 in the heat exchanger 203 It is attached. The heat exchanger serves as a heat sink and also contributes to the assembly. 204 an aspherical lens 264 the lens 101 in Fig. 4 in an implementation. How best to Fig. As can be seen in section 8, the lens 284 cut in such a way that they fit into the recess 208It can be used. The lens is designed in many ways to enable a reliable arrangement, including, for example, a flat edge. 265 and / or a point of reference 266 Each of these components is held in position by epoxy or solder and by mechanical surfaces or locking lugs, or by optical or mechanical alignment of the reference marks, as in Fig. 1, held or positioned.

[0054] The Fig. 9 and Fig. Figure 10 shows another type of assembly which is particularly suitable when the removal of heat by flowing air is not required, so that the assembly does not need to be designed to be cooled with internal air or with another cooling fluid, or via transfer cooling. Fig. Figure 9 is a perspective view and Fig. Figure 10 is a cross-sectional view. A laser housing assembly. 304is the same as the assemblies 104 , 204 of the preceding embodiments. The assembly 304 is housed in a box-like heat exchanger casing 310 held, which has a central bore 308 features the case 310 It also includes a few screws. 375 with Allen heads 376 , which are in the box in Fig. 9 are arranged as shown and which are in a heat sink (not shown) in Fig. 10 (cross-section) are screwed in, which also serve to dissipate heat from the box housing 310 serves as a case. 310 The heat exchanger is designed in such a way that it has two lenses. 381 and 382 in contrast to a single lens as in the previous embodiments, however it can also have only one lens. The central bore 308 has three indentations 361 , 362 and 363 (see Fig. 10) to provide reliable stops for the lenses and the assembly 304 The assembly is typically fitted with a mechanical groove and lug, as in Fig. 4 (not shown). The rectangular profile of the heat exchanger housing. 310 in combination with the screws 375 , provides an alignment for the entire assembly.

[0055] Two lenses 381 and 382 are in the Fig. 9 and Fig. Shown in 10. Dividing the optical function between two lenses can improve the design and the reliability of the lens arrangement in this and other embodiments. In particular, the outer lens can 381These lenses serve to focus the output laser on a target. Reference marking mechanisms for lens alignment may be provided. The slightly varying lens diameters in these figures provide means to ensure a suitable lens installation sequence.

[0056] The design shown here uses cooling by convection or conduction. Other cooling methods can be used. Fig. Figure 11 shows the addition of a cooling fan to the system. To a device according to Fig. 1 with a lens 101 , a heat exchanger 103 and a TO-Can type laser / electronic carrier 104 An adapter can be added to some applications. The adapter 190 exhibits a first proximal end 192 on, the size of which is such that it fits in or onto the distal end of the heat exchanger 103 fits and has a slot 195or other means of connection with electrical current 196 up. The adapter 190 has a second distal end 194 , which is adapted to fit in or onto a pre-assembled or pre-packaged fan 198 to fit. In this way, an accessory, such as a fan and / or other accessory, can be added to an assembly of a finished product, and at the same time, as shown here, it is possible to provide it as an accessory for the laser after manufacturing.

[0057] The Fig. 12 and Fig. Figure 13 shows cross-sectional views illustrating two potential methods for passively aligning the embodiments of a laser machine. Fig. 12 fits the laser housing assembly 104 on a pedestal 401 , which is a through-hole or through-bore 402 and a surface 403 It includes a key feature. 404aligns with the groove 138 The surface 104-6 the laser housing assembly 104 sits floating on an upper surface 403 . Edge surfaces 405 are used to measure the edge surface 160 the lens 101 to align.

[0058] In Fig. 13 fits the laser housing assembly 104 on a pedestal 501 , which has a through hole 502 and an upper surface 503 contains. The area 104-6 the laser housing assembly 104 sits floating on the upper surface 503 A key feature 504 fits in the central channel 108 of the heat exchanger 103 The edge surface 506 of the key feature 504 aligns with the edge surface 405 . The area 505 is used to assemble the laser housing 104 close to the ledges 121 to adapt. If the laser housing assembly104 regarding the heat exchanger 103 The key feature or assembly aid is aligned. 504 from the central canal 108 removed. The edge surface 405 is used to create an edge surface 160 the lens 101 to align according to what is in Fig. 12 is shown.

[0059] Fig. Figure 14 shows a cross-sectional view of a method for self-aligning exemplary embodiments of a laser machine. A heat sink 601 is similar to the 103 with the exception that the central channel 602 between the ledges 121 by a distance that defines the area of ​​movement of the unit 104 limited extension and it enables a laser housing assembly 104 to fit in one direction. This allows 104 regarding 106 to align oneself. A surface 603is used to assemble the laser housing 104 due to the close fit of the protrusions 121 to align base 153 the lens 101 fit into the lens channel 604 of the heat exchanger 601 An edge surface 160 is used to adjust the lens 101 regarding the heat exchanger 601 and the laser housing assembly 104 to align.

[0060] The Fig. 15 and Fig. Figure 16 shows perspective views of a housing system for a laser machine. Fig. 15 is the case 701 constructed in such a way as to form a fully assembled laser system. The housing 701 has an exit window 703 , which allows the laser light to pass through, a series of openings 704to allow the passage of air and a sensor system including one or more contacts, in this case represented by two contact wheels 702 The sensor system is configured with the laser system to act as a safety mechanism. Its purpose is to detect pressure and movement to prevent the end user from being exposed to unnecessary laser light. In this case, the contact wheels serve this purpose. 702 or the spherical contacts 712 out of Fig. 16. Firstly, they serve as pressure sensors to confirm that the device is in contact with a treatment zone, such as the patient's skin. Secondly, they serve as motion sensors to confirm that the device is being moved a certain distance away from the original treatment zone to prevent damage from excessive exposure to laser light. The contacts are also preferably used to control the emission of the laser assembly. An electrical signal is generated that is proportional to the pressure and / or rotation of the contacts. This electrical signal is then processed and used as a means of controlling the emission from the laser assembly.

[0061] The emission from the laser assembly 100 It is controlled by the use of a control system which receives electrical input from the sensors and sends an electrical signal to the laser assembly. 100 Applied, it is produced. Fig. Figure 17 shows a block diagram of the housing and controls as depicted in Fig. 15 and Fig. 16. A case 701 The laser machine includes 100 , a tax system 721 , a sensor system 702 and a power supply 722 The sensor system 702 is connected to the tax system 721 connected via wires. The control system 721 is connected to the laser assembly via a separate set of wires.

[0062] In an implementation where the sensor system 702 When activated, either by pressure or movement, an electrical signal is transmitted to the control system, which then generates a different electrical signal that powers the laser assembly and allows emission. The resulting emission from the laser assembly is usually either continuous or pulsed, or a combination of both. The control panel in Fig. 17 is designed in such a way that electrical feedback from the sensor system is received. 702 It is used to generate an electrical signal which, when applied to the laser assembly, produces an emission pattern that is a function of the feedback. In one embodiment, it generates 702 an electrical signal that is proportional to the wire or proportion at which the housing 701 is being moved.

[0063] The electrical signal is sent to the control panel. 721 transmitted and processed there. The control panel 721 It then emits a continuous electrical signal to the laser machine, which is detected during the movement. The control panel 721 is also used to send a signal to the laser assembly 100 to provide a signal that is proportional to the signal from the sensor system 702 is received, which is generated when the housing 701is in contact with an object and is moved. When the sensor system 102 is arranged in contact with an object and the housing 701 When a device is moved, the sensor system detects the degree of change in movement and generates an electrical signal proportional to the degree or change in movement. This signal is then displayed on the control panel. 721 adapted. The control panel is suitable for certain applications. 721 a pulsed electrical signal to the laser assembly 100 from which the time it is switched on, and / or repeatedly proportionally to the degree of movement during the time in the movement is felt. In other applications, the control panel outputs 721 a constant electrical signal to the laser assembly 100 It only switches off when movement is felt.

[0064] A system like in Fig. 15 and Fig. Figure 16 shows an application in the use of lasers against the skin for the treatment of wrinkles, acne, warts, skin cancer, and / or other skin diseases. In one embodiment, the fan blows cooling air to the heat sink of the laser diode, and the same fan simultaneously cools the skin near and / or the point of skin being treated with laser light. The lens in all embodiments is ideally shaped to provide a relatively uniform light onto the surface of the target skin, such that there are no hot spots that could burn the skin. Another embodiment includes a detractive lens to split the light into many discrete or individual elements (or points of light) to treat the skin in certain areas while leaving adjacent areas untreated, thus enabling faster skin healing and limited burns. The rolling of the elements from Fig. 15 and Fig. The 16 element is used to trigger the laser so that it fires in such a way that the skin is treated evenly with a controlled number of overlapping light pulse areas. This rolling element design benefits the user because a large area of ​​skin can be treated quickly, as the laser automatically fires or emits when new skin is positioned under the laser tip. This allows the user to simply roll the device over the contours of their skin, covering areas with many evenly spaced paths. According to one embodiment, the rotating wheel is designed to rotate in only one direction, preventing the laser from rolling back onto skin that has recently been treated. This prevents double treatment of the tissue in question, which is typically undesirable because it can lead to pain and redness of the tissue.In another embodiment, the lenses are configured to produce a focal point of light with a diameter of 500 μm or less, creating a concentrated light source that cuts tissue and simultaneously coagulates the edges of the cut. In yet another embodiment, the laser lens is configured to achieve a point that does not cut the tissue but coagulates a relatively large area of ​​the tissue with a diameter of 5 to 10 millimeters. Other embodiments and features

[0065] Many options and variations are available. In one embodiment, as shown, a fan is provided to blow air over the heat exchanger, which is connected to a laser housing, e.g., the fins of the device. Fig. 1. The fan is fixed to the device by means of a clip, a set of screws, or an interference fit. In the exemplary embodiment from Fig. 11 is a fan “on behind” the laser type with respect to the downstream optics and blows or pushes air over the chip or its substrate. Such an arrangement causes a minimal change in the profile of the device.

[0066] The lasers themselves and many of the system's components are described above or are known, and several standard materials and components are used to construct the devices according to the invention.

[0067] Solder materials for attaching the chip are preferably gold-tin or indium. Other materials include gold-germanium, tin-silver, tin-silver-copper, bismuth-tin, or binary or tertiary alloys of these materials.

[0068] A sub-mount, if used at all, is usually made of aluminum nitride (preferred), pure copper, copper / tungsten, beryllium oxide, or aluminum oxide. Ideally, no sub-mount is used at all, and the laser chip is mounted directly onto the heat sink, preferably using a soft solder such as indium to allow for thermal disequilibrium.

[0069] The TO-Art carrier ( 104 , etc.) is preferably made of copper, but other materials may be used, including aluminium, cold-rolled steel and nickel-cobalt iron alloys such as a Kova brand alloy.

[0070] Wire bonds: If an electrically insulating underlayment is used, such as aluminum nitride, then wire bonds are suitable. 132 on the sub-mounting base (e.g. 126 in Fig. 4) required from the copper guide to the column or stand106 If the chip is directly on the socket 124 What is mounted is just a set of wire bonds, e.g. 130 in Fig. 4. A wire bond is required from the top surface of the chip to a guide pin. Wire bonds are made from conventional materials such as copper, aluminum, or gold. Heat sink:

[0071] The heat sink is preferably made of aluminum for good thermal dissipation and is optionally black anodized to further increase heat radiation. Copper can also be used, as can other conventional materials for heat sinks. Assembly size:

[0072] The laser system is preferably smaller than two inches in diameter and smaller than six inches long, making it portable and lightweight. Guide material:

[0073] Cobalt-iron alloy materials are preferred for devices carrying a current of 4 amperes or more in many applications. In contrast, a standard industry-designed pin guide of 0.45 millimeters (mm) in diameter, manufactured from conventional materials such as copper or cobalt-iron alloys, will experience thermal, mechanical, and / or electrical failure at 4 amperes or more.

[0074] The specific design of the carrier, shown herein as a TO-can type, is not critical, and different proportions and shapes of the body and different arrangements of the body and other parts have the same function and are provided for. Other TO-can embodiments include a square or rectangular mounting that attaches to the projections. 121The design dispenses with a fixed surface and has a chosen shape relative to the surface on which the laser is mounted. Other embodiments may include more or fewer guides extending through the base.

[0075] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as they would normally be understood by a person skilled in the art with regard to the disclosed invention. Although some methods and materials similar to or identical with those described herein may be used in practice or for testing the present invention, the preferred methods, apparatus, and materials are as described herein. The publications cited herein and the material for which they are cited are specifically incorporated by reference where such reference is permitted. Nothing herein shall be construed as a concession that the invention is not authorized to predate any such disclosure for the purposes of an earlier invention, if relevant.These skilled professionals will recognize, or be able to reproduce, the specific embodiments of the invention described herein without using further routine experiments. Such equivalents are encompassed by the following claims. QUOTES INCLUDED IN THE DESCRIPTION

[0076] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0077] US 12 / 623886

[0001] US 2009 / 001350 [0005, 0047] WO 2009 / 111010 A1 [0005, 0047] US 2007 / 002915 A1

[0047]

Claims

[1] A laser system comprising, a heat exchanger with a bore extending through the heat exchanger, a carrier on which a semiconductor amplifier chip is attached, wherein at least a part of the support is arranged in the bore, and a lens that is positioned on the heat exchanger and above the bore. [2] System according to claim 1, wherein the support comprises a base and a fastening, wherein the base covers one end of the bore and the fastening extends into the bore and accommodates the semiconductor amplifier chip. [3] System according to claim 2, wherein the attachment on the circumference comprises projections that increase the contact surface between the support and the heat exchanger. [4] System according to claim 1, wherein a mechanical interface between the support and the heat exchanger is rotationally symmetric with the support in relation to the heat exchanger. [5] System according to claim 1, wherein the heat exchanger comprises fins. [6] System according to claim 1, wherein the heat exchanger comprises radially extending fins. [7] System according to claim 1, wherein the heat exchanger is mechanically attached to a heat sink. [8] System according to claim 1, wherein the base defines a connection depth with the heat exchanger. [9] System according to claim 1, wherein the support comprises a base for heat distribution on which the semiconductor amplifier chip is mounted. [10] A system according to claim 1, wherein components are at least partially self-adjusting by virtue of their radial centering within a recess in at least one component. [11] A system according to claim 1, wherein components are not functionally rotationally symmetric such that they can be assembled in a predetermined rotational arrangement with respect to the rest of the system. [12] A system according to claim 1, further comprising a volumetric Bragg element that is fixed to the mounting. [13] System according to claim 1, further comprising a diffractive optical element that is fixed to the mounting area. [14] System according to claim 1, wherein the fastening comprises projections arranged on the circumference which extend at an angular extent of at least over 200° with respect to the central axis of the fastening area. [15] System according to claim 1, further comprising a fan to direct air over the heat exchanger. [16] System according to claim 1, wherein the lens is aspherical, cylindrical or toric. [17] System according to claim 1, wherein the carrier is a TO-style can (transistor outline can) and the semiconductor amplifier chip is mounted on a socket of the TO-style can in such a way that the laser facet is centered in the system when the assembly is fully assembled. [18] System according to claim 1, further comprising a fan to flow air over the area on which the laser light is projected. [19] System according to claim 1, further comprising a fan to circulate air over the skin of a patient onto whom the laser light is projected. [20] A method for assembling high-power semiconductor laser systems to provide lasers that are passively or self-aligning and have predefined focal points or image planes without aligning them after fabrication, the method comprising Fixing a semiconductor laser chip onto a substrate, wherein the substrate has power connections and heat distribution means, Arranging the carrier in a heat exchange relationship with a heat exchanger, whereby the heat exchanger and the carrier are in passive or self-aligned efficient heat exchange contact, and Fixing an optical element to one or both of the heat exchanger for the laser diode and the support, wherein laser systems produced by this method each have at least one output laser beam per semiconductor laser chip, each beam having a predefined propagation direction, without alignment or adjustment after manufacture. [21] Method of assembly according to claim 20, wherein the chip is connected to the carrier via a heat distribution attachment which is mounted on a body of the carrier. [22] Method for assembly according to claim 21, wherein the fastening has a body which defines the depth of engagement with the heat exchanger. [23] Method for assembly according to claim 22, wherein the fastening has a body that defines the depth of engagement with the heat exchanger, and the heat exchanger has a central bore, and the outer surface of the bore inlet section of the fastening and the inner surface of the bore are designed or configured to create a close proximity between their surfaces over the assembly to enable efficient heat transfer between the laser diode and the heat exchanger. [24] Method according to claim 21, wherein the laser chip is mounted on a heat distribution base section of the mounting. [25] Method for assembly according to claim 20, wherein the components are mutually self-aligning, at least partially by their radial centerings within a recess in at least one component. [26] Method of assembly according to claim 20, wherein a fan is attached to the system to increase heat dissipation. [27] Method for assembly according to claim 20, wherein each component which is not functionally rotationally symmetric is self-aligning during the assembly process, so that it can be assembled in a predetermined rotational position with respect to the rest of the system. [28] Method of assembly according to claim 20, wherein the fastening has peripheral extensions which serve for heat distribution in order to increase the heat transfer rate between the fastening and the heat exchanger. [29] Method of assembly according to claim 28, wherein the fastening together with the peripheral extensions extend at an angle of at least approximately 200° with respect to the central axis of the support. [30] Method for assembly according to claim 20, wherein the arrangement of one or both heat exchangers and the support is provided by the use of locking lugs. [31] Method of assembly according to claim 20, wherein ribs provided to increase the efficiency of heat exchange or dissipation extend outwards from the center of the device. [32] Method of assembly according to claim 31, wherein at least some of the ribs have T-shaped end sections to increase the degree of heat dissipation. [33] Method for assembly according to claim 31, wherein the method further comprises a base for indexing or fitting, which is distinguished from the other ribs in shape and position or arrangement by providing at least one of the ribs. [34] Method of assembly according to claim 20, further comprising increased heat dissipation by providing an adapter for connecting a fan to the system. [35] Method for assembly according to claim 20, wherein alignment of the support, the heat exchanger and at least one optical element is achieved by fitting. [36] Method for assembly according to claim 20, wherein at least one lens is aspherical, cylindrical or toric. [37] Method for assembly according to claim 20, wherein the laser facet is centered in the system when the assembly is centered by fixing the laser in an area on the carrier, after mutual alignment of the carrier and the heat exchanger. [38] Method of assembly according to claim 20, wherein the fastening is assembled such that it is thermally connected to a recess within a heat dissipation element attached to a device. [39] Method for assembling semiconductor laser systems to provide lasers that are self-aligning and have predefined focus distances or image planes without alignment after fabrication, the method comprising fixing a semiconductor laser chip on a substrate and arranging the substrate in a heat exchange relationship with a heat exchanger, wherein the heat exchanger and the substrate are self-aligning in a heat exchange contact. [40] Method for assembling optical systems that are self-aligning and have predetermined focus distances or image planes without alignment after fabrication, the method comprising fixing an optical element on a heat exchanger for a diode laser, and arranging the optical element in a heat exchange relationship with a heat exchanger, wherein the heat exchanger and the optical element are self-aligning in a heat exchange contact. [41] Laser diode mounting system, the system comprising, a semiconductor laser, at least one heat distribution medium a heat exchanger, and at least one optical component, wherein the optical component is attached to a or is fixed to several of the support and the heat exchanger, wherein the lasers produced by this method have an output laser beam from the semiconductor laser chip, wherein each beam has a predefined propagation direction without adjustment. [42] A housing system that serves as a housing for a laser system, with at least one contact arranged at an interface where the light is emitted, which, when activated or enabled, allows operation of the laser assembly. [43] Contact according to claim 42 which is activated by a rolling or rotating movement. [44] Contact according to claim 42 which is activated by a pressure sensor. [45] An imitated light according to claim 42, wherein the optical emission is controlled proportionally by feedback from the contact.