Component assembly method and component assembly fixture

Abstract

A component assembly method in a component assembly device (1, 8) comprising: a circuit board holding device (2, 9) with a holding element (21, 91) which, for mounting a component on a circuit board (11, 12, 13) with a non-planar component mounting surface (11a, 12a, 13a), holds the circuit board (11, 12, 13) at a holding position (211X, 211Y) on a circuit board holding surface (21a, 91a) and rotates the circuit board (11, 12, 13); a circuit board transfer device (3) that charges and unloads the circuit board (11, 12, 13) in relation to the circuit board holding surface (21a, 91a) of the holding element (21, 91); a component feeding device (4) that feeds the component to be mounted on the circuit board (11, 12, 13); and a component loading device (6) which receives the component from the component feeding device (4) and moves the component in two orthogonal directions within a horizontal plane and in a vertical direction to mount the component on a mounting section (11d, 12c) on the circuit board (11, 12, 13) which is held at the holding position (211X, 211Y) on the circuit board holding surface (21a, 91a); the component assembly process includes: a PCB information input step of entering PCB information relating to the position of a positioned section for positioning the PCB (11, 12, 13) on the PCB holding surface (21a, 91a) and the position of the mounting section (11d, 12c); a circuit board loading and holding step of loading the circuit board (11, 12, 13) into the holding position (211X, 211Y) on the circuit board holding surface (21a, 91a) by the circuit board transfer device (3) and holding the charged circuit board (11, 12, 13) at the holding position (211X, 211Y) on the circuit board holding surface (21a, 91a) by holding means (211, 212; 931a, 931b) provided in the circuit board holding device (2, 9); a circuit board rotation step of rotating the retaining element (21, 91) of the circuit board holding device (2, 9) such that a normal to the mounting section (11d, 12c) on the non-planar component mounting surface (11a, 12a, 13a) is directed in the vertical direction, based on pre-stored circuit board holding device information relating to the position of a rotary shaft (222) for the retaining element (21, 91) in the circuit board holding device (2, 9), a positional relationship between the rotary shaft (222) and the circuit board holding surface (21a, 91a) and the position of the holding position (211X, 211Y) on the circuit board holding surface (21a, 91a), and the input circuit board information; a calculation step for a compensated mounting position of calculating compensation amounts in the two orthogonal directions within the horizontal plane and in the vertical direction for the position of the mounting section (11d, 12c), whose normal is directed vertically during the board rotation step, based on a rotation amount of the holding element (21, 91) during the board rotation step, the board holding device information and the board information, and calculating a compensated mounting position from the compensation amounts in the two orthogonal directions within the horizontal plane and in the vertical direction and the board information; and a component assembly step of mounting the component to the mounting section (11d, 12c) on the circuit board (11, 12, 13), based on the compensated mounting position.

Description

TECHNICAL FIELD

[0001] The present invention relates to a component mounting method and a component mounting apparatus for mounting components on a circuit board having a non-planar component mounting surface. STATE OF THE ART

[0002] As circuit boards with a non-planar component mounting surface, for example, there are cited: a circuit board with a component mounting surface of a curved shape consisting of a part with a columnar shape, a part with a spherical shape, or the like, a circuit board with component mounting surfaces consisting of multiple surfaces inclined at a plurality of angles such as a pyramid shape, and the like. For example, JP H11-154 798 A (paragraph 0009 and Fig. 4) A component mounting method in which a component is attracted to a tip end of an attraction head (component attraction nozzle) and mounted on an inclined mounting section wall surface (component mounting surface) of a three-dimensional board (board with a non-planar component mounting surface). The attraction head is configured to be movable in the horizontal and vertical directions and to be rotatable about an axis extending in the vertical direction. Furthermore, the tip end portion of the attraction head is configured to be rotatable about an axis extending in the horizontal direction, that is, to be bendable relative to the axis extending in the vertical direction.In the component mounting method, a component is attracted to the outermost end of the attraction head, and the attraction head is bent and moved at its outermost end portion depending on the inclination angle of the mounting section wall surface of the three-dimensional board to mount the component on the mounting section wall surface of the three-dimensional board. Further related art is disclosed in JP 2009-27015 A, JP 2007-214227 A, JP 2000-277991 A, JP 2005-66760 A, DE 11 2006 003 165 T5, DE 601 03 217 T2, and JP 2000-299597 A. DOCUMENT OF THE PRIOR ART SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION

[0003] In the component mounting method described in Patent Document 1, when mounting a component on the inclined mounting section wall surface of the three-dimensional board, the attraction head must be moved in a bending direction, that is, in a direction normal to the mounting section wall surface, and thus, complicated operation control is required. On the other hand, when component mounting is performed by moving the attraction head in the vertical direction with the head bent, only simple operation control is required. However, this raises concerns about positional deviations occurring when mounting a component on the inclined mounting section wall surface of the three-dimensional board.

[0004] Furthermore, the component attraction nozzle is reciprocated between a component feeder and the board a number of times equal to the number of components to be mounted to perform component mounting. For boards with a planar shape, all mounting sections are set to a fixed mounting reference height. Thus, the vertical movement stroke of the component attraction nozzle can be set to the necessary minimum, making it possible to shorten component mounting time. However, for boards with a non-planar component mounting surface, not all mounting sections are set to a fixed mounting reference height. Therefore, the vertical movement stroke of the attraction head may become longer, and the component mounting time tends to increase.

[0005] The present invention has been made in consideration of the foregoing circumstances, and it is an object thereof to provide a component mounting method and a component mounting apparatus capable of accurately and in a short time mounting a component on a board having a non-planar component mounting surface through simple component mounting operation control. SOLVING THE PROBLEMS

[0006] To solve the foregoing problems, the invention according to claim 1 lies in a component mounting method in a component mounting apparatus, comprising: a board holding device having a holding member that holds the board at a holding position on a board holding surface and rotates the board for mounting a component on a board having a non-planar component mounting surface; a board transfer device that loads and unloads the board with respect to the board holding surface of the holding member; a component feeding device that feeds the component to be mounted on the board;and a component loading device that receives the component from the component feeder and moves the component in two orthogonal directions within a horizontal plane and in a vertical direction to mount the component to a mounting portion on the board held at the holding position on the board holding surface; wherein the component mounting method comprises: a board information input step of inputting board information related to the position of a positioned portion for positioning the board on the board holding surface and the position of the mounting portion; a board loading and holding step of loading the board into the holding position on the board holding surface by the board transfer device and holding the loaded board at the holding position on the board holding surface by holding means provided in the board holding device;a board rotation step of rotating the holding member of the board holding device so that a normal to the mounting portion on the non-planar component mounting surface is directed in the vertical direction, based on pre-stored board holding device information relating to the position of a rotating shaft for the holding member in the board holding device, a positional relationship between the rotating shaft and the board holding surface, and the position of the holding position on the board holding surface, and the input board information;a compensated mounting position calculation step of calculating compensation amounts in the two orthogonal directions within the horizontal plane and in the vertical direction for the position of the mounting portion whose normal is directed in the vertical direction in the board rotation step, based on a rotation amount of the holding member in the board rotation step, the board holding device information, and the board information, and calculating a compensated mounting position from the compensation amounts in the two orthogonal directions within the horizontal plane and in the vertical direction and the board information; and a component mounting step of mounting the component to the mounting portion on the board based on the compensated mounting position.

[0007] The invention according to claim 2 lies in that in claim 1 the board holding device is formed to be movable in the vertical direction, and that the component mounting step comprises compensatingly moving the board holding device in the vertical direction with respect to the compensation amount in the vertical direction calculated in the compensated mounting position calculating step.

[0008] The invention according to claim 3 lies in that in claim 1 or 2, the invention comprises: a board position detection step of capturing an image of the board held at the holding position on the board holding surface by an image capturing device and detecting, by means of the image, positional deviation amounts of the board relative to the holding position, and that the compensated mounting position calculation step comprises calculating the compensation amounts in the two orthogonal directions within the horizontal plane and in the vertical direction for the position of the mounting portion whose normal is directed in the vertical direction in the board rotating step, based on the positional deviation amounts, a rotation amount of the holding member in the board rotating step, the board holding device information, and the board information.

[0009] The invention according to claim 4 lies in that in any one of claims 1 to 3, the invention comprises: a post-rotation mounting position detection step of capturing an image of the mounting portion by the image capturing device after the holding member has been rotated to align the normal to the position of the mounting portion in the vertical direction in the board rotation step, and detecting the position of the mounting portion after rotation by means of the image, and a recompensated board position calculation step of recompensating the compensated mounting position by the difference between the position of the mounting portion after rotation detected by means of the image and the compensated mounting position calculated in the compensated mounting position calculation step,and that the component mounting step comprises mounting the component to the mounting portion on the board based on the compensated mounting position that has been compensated again.,

[0010] The invention according to claim 5 lies in a component mounting apparatus comprising: a board holding device having a holding member that holds the board at a holding position on a board holding surface and rotates the board for mounting a component on a board having a non-planar component mounting surface; a board transfer device that loads and unloads the board with respect to the board holding surface of the holding member; a component feeding device that feeds the component to be mounted on the board; a component loading device that receives the component from the component feeding device and moves the component in two orthogonal directions within a horizontal plane and in a vertical direction to mount the component at a mounting portion on the board held at the holding position on the board holding surface;and a control device that controls the operation of the board holding device, the board transfer device, the component feeding device, and the component loading device; the control device comprising: input means for inputting board information related to the position of a positioned portion for positioning the board on the board holding surface and the position of the mounting portion, and board holding device information related to the position of a rotary shaft for the holding member in the board holding device, a positional relationship between the rotary shaft and the board holding surface, and the position of the holding position on the board holding surface; storage means for storing the input board information and board holding device information;Board loading and holding means for loading the board into the holding position on the board holding surface by the board transfer device and holding the loaded board at the holding position on the board holding surface by holding means provided in the board holding device; Board rotating means for rotating the holding member of the board holding device so that a normal to the mounting portion on the non-planar component mounting surface is directed in the vertical direction based on the board information and the board holding device information;Compensated mounting position calculation means for calculating compensation amounts in the two orthogonal directions within the horizontal plane and in the vertical direction for the position of the mounting portion whose normal is directed in the vertical direction by the board rotation means, based on a rotation amount of the holding member by the board rotation means, the board holding device information, and the board information, and for calculating a compensated mounting position from the compensation amounts in the two orthogonal directions within the horizontal plane and in the vertical direction and the board information; and component mounting means for mounting the component to the mounting portion on the board based on the compensated mounting position.

[0011] The invention according to claim 6 lies in that in claim 5 the board holding device is formed to be movable in the vertical direction, and that the component mounting means compensatingly moves the board holding device in the vertical direction with respect to the compensation amount in the vertical direction calculated by the compensated mounting position calculating means.

[0012] The invention according to claim 7 lies in that in claim 5 or 6, the invention comprises: an image capturing device capable of capturing an image of the board; that the control device is provided with board position detecting means for capturing an image of the board held at the holding position on the board holding surface by the image capturing device and for detecting, by means of the image, positional deviation amounts of the board relative to the holding position;and that the compensated mounting position calculating means calculates compensation amounts in the two orthogonal directions within the horizontal plane and in the vertical direction for the position of the mounting portion whose normal is directed in the vertical direction by the board rotating means, based on the position deviation amounts, the rotation amount of the holding member by the board rotating means, the board holding device information, and the board information;

[0013] The invention according to claim 8 lies in that in any one of claims 5 to 7, the holding member is composed of a first holding member having a first rotary shaft capable of rotating about a horizontal axis and a second holding member having a second rotary shaft rotatable about an axis orthogonal to the first rotary shaft on the first holding member, and that the board rotating means individually rotates the first holding member and the second holding member in the board holding device so that a normal to the mounting portion on the non-planar component mounting surface is directed in the vertical direction based on the board information and the board holding device information. EFFECTS OF THE INVENTION

[0014] According to the invention in claim 1, the holding member in the board holding device is rotated so that the normal to the mounting portion on the non-planar component mounting surface is directed in the vertical direction based on the board holding device information and the board information. Thus, after the component picked up by the component loading device is moved to the normal to the mounting portion, it is possible to mount the component on the mounting portion through simple component mounting operation control involving moving the component loading device only in the vertical direction.Therefore, complicated component mounting operation control involving moving the component loading device in an inclined direction, as is the case in the prior art, becomes unnecessary, and thus it becomes possible to prevent the positional deviations of the component at the mounting portion and mount the component at the mounting portion in a short time. Furthermore, the compensation amounts for the position of the mounting portion are calculated based on the rotation amount of the holding member, the board holder information, and the board information, and the compensated mounting position is calculated from the compensation amounts for the position of the mounting portion and the board information. Thus, it is possible to calculate the compensated mounting position that is accurate in the horizontal direction and the vertical direction. Accordingly, it is possible to accurately mount the component at the mounting portion.

[0015] According to the invention in claim 2, compensation in the vertical direction for the position of the mounting section is performed by moving the board holding device in the vertical direction. Here, the component loading device is reciprocated between the component feeder and the board a number of times corresponding to the number of components to be mounted to perform component mounting. In the case of a planar board, all mounting sections are set to become a fixed mounting reference height, and thus, it is possible to set the movement stroke in the vertical direction of the component loading device to the necessary minimum, shortening the component mounting time.However, in the case of a board with a non-planar component mounting surface, especially in the case of, for example, a corrugated board whose distance between the component mounting surface and the center of the rotating shaft for the holding member in the board holding device varies, not all of the mounting sections become the fixed mounting reference height. For this reason, the mounting sections are set to become the fixed mounting reference height by moving the board holding device in the vertical direction. Thus, it is possible to set the movement stroke in the vertical direction of the component loading device to the necessary minimum. Thus, it can be realized that the component mounting time is reduced when mounting components on a board with a non-planar component mounting surface.

[0016] According to the invention in claim 3, the positional deviation amounts relative to the holding position of the board holding surface of the holding member are detected by an image, the compensation amounts for the position of the mounting portion are calculated based on the positional deviation amounts, the rotation amount of the holding member, the board holding device information, and the board information, and the compensated mounting position is calculated from the compensation amounts for the position of the mounting portion and the board information. Thus, it is possible to obtain the compensated mounting position that is accurate by taking the positional deviation amounts into account. Accordingly, it is possible to mount the component on the mounting portion more accurately.

[0017] According to the invention in claim 4, the position of the mounting position after the rotation of the holding member in the board holding device is detected by an image, and the compensated mounting position is recompensated by the difference between the position of the mounting portion and the compensated mounting position. Thus, even in the case where, for example, a hole is provided at the mounting portion for inserting the component therein, and the position in the horizontal direction of the center of the hole is changed by the rotation of the holding member, the accuracy of the compensated mounting position at the mounting portion is increased by the recompensation, and thus, mounting can be performed by smoothly inserting the component into the hole at the mounting portion.

[0018] According to the invention in claim 5, the board rotation means is configured to rotate the holding member in the board holding device so that the normal to the mounting portion on the non-planar component mounting surface is directed in the vertical direction based on the board holding device information and the board information. Thus, after the component picked up by the component loading device is moved to the normal to the mounting portion, it is possible to mount the component on the mounting portion through a simple component mounting operation control involving moving the component loading device only in the vertical direction.Therefore, complicated component mounting operation control involving moving the component loading device in an inclined direction, as performed in the prior art, becomes unnecessary, and thus it is possible to prevent the positional deviation of the component at the mounting portion and thus mount the component at the mounting portion in a short time. Furthermore, the compensated mounting position calculation means is configured to calculate the compensation amounts for the position of the mounting portion based on the rotation amount of the holding member, the board holder information, and the board information, and to calculate the compensated mounting position from the compensation amounts for the position of the mounting portion and the board information. Thus, it is possible to obtain the compensated mounting position that is accurate in the horizontal direction and the vertical direction.Accordingly, it is possible for the component mounting means to precisely mount the component to the mounting section.

[0019] According to the invention in claim 6, the component mounting means is configured to compensate for the position in the vertical direction of the mounting portion on the non-planar component mounting surface by moving the board holding device in the vertical direction. However, in the case of the board having a non-planar component mounting surface, particularly in the case of, for example, a corrugated board, which changes in the distance between the component mounting surface and the center of the rotating shaft for the holding member in the board holding device, not all of the mounting portions become a fixed mounting reference height for the aforementioned reason. For this reason, the mounting portions are set to become the fixed mounting reference height by moving the board holding device in the vertical direction.This makes it possible to set the vertical movement stroke of the component loading device to the necessary minimum. Thus, the component mounting means can shorten the component assembly time when assembling the components at the assembly section.

[0020] According to the invention in claim 7, the compensated mounting position calculation means is configured to calculate the compensation amounts for the position of the mounting portion based on the positional deviation amounts detected by an image, the rotation amount of the holding member, the board holding device information, and the board information, and to calculate the compensated mounting position from the compensation amounts for the position of the mounting portion and the board information. Thus, it is possible to obtain the compensated mounting position that is accurate by taking the positional deviation amounts into account.

[0021] Accordingly, it is possible for the component mounting means to mount the component to the mounting section more accurately.

[0022] According to the invention in claim 8, the board rotating means is configured to individually rotate the first holding member and the second holding member in the board holding device so that the normal to the mounting portion on the non-planar component mounting surface is directed in the vertical direction based on the board information and the board holding device information. Thus, even in the case of, for example, a board having a spherical shape, it is possible to mount the component on the mounting portion by moving the component picked up by the component loading device only in the vertical direction. Accordingly, by simple component mounting operation control, it is possible to accurately and quickly mount the component on a board having a component mounting surface that is more complicated and non-planar. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view schematically showing the entire construction of a component mounting apparatus in a first embodiment according to the present invention. Fig. 2 is a front view schematically showing a board holding device, a board transfer device and a component loading device in the component mounting apparatus in Fig. 1 shows. Fig. 3 is a side view schematically showing the board holding device and the component loading device in the component mounting apparatus in Fig. 1 shows. Fig. 4 is a perspective view showing an example of a circuit board on which components are mounted by the component mounting device in Fig. 1 must be mounted. Fig. 5 (A), (B) are perspective views showing states before and after loading the board onto the board holder in the component mounting apparatus in Fig. Show 1. Fig. 6 (A), (B) are a plan view and a front view schematically showing a board holding device in a component mounting apparatus in a second embodiment according to the present invention. Fig. Fig. 7 is a perspective view showing an example of a circuit board on which components are mounted by the component mounting device in Fig. 6 can be mounted. Fig. 8 (A), (B) are perspective views showing states before and after loading the board onto the board holding device in the component mounting apparatus in Fig. Show 6. Fig. 9 (A), (B) are a graph showing coordinates for explaining a method of calculating compensation amounts in the X, Y, and Z directions for the position of a mounting portion, and a graph showing the details of the coordinates. Fig. 10 (A), (B) are diagrams showing the operations of mounting components at a first mounting position and a second mounting position on a board mounted on the board holding device in the component mounting apparatus in Fig. 1 is held. Fig. Fig. 11 (A) is a diagram showing the operation of mounting a component at a first mounting position on a board mounted on the board holding device in the component mounting apparatus in Fig. 6, and (B), (C) are diagrams showing the operations of mounting a component at a second mounting position. Fig. 12 is a flowchart for explaining the operations for component mounting by the component mounting device in Fig. 1. Fig. 13 is a flowchart for explaining various operations for component mounting by the component mounting device in Fig. 1. EMBODIMENTS FOR IMPLEMENTING THE INVENTION

[0023] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the figures, a board transfer direction is regarded as the Y direction, a horizontal direction orthogonal to the Y direction is regarded as the X direction, and a vertical direction orthogonal to the Y direction is regarded as the Z direction. First of all, a component mounting apparatus 1 in the first embodiment will be described. As shown in the Fig. 1-3, the component mounting apparatus 1 in the first embodiment is schematically constructed by a board holding device 2, three board transfer devices 3, a component feeding device 4, a component loading device 6, and a control device 7 for controlling the operations of these devices 2-6. The component loading device 1 mounts components on a board 11 having a non-planar component mounting surface 11a, such as in Fig. 4 shown.

[0024] In a plan view, the circuit board 11 is formed in a rectangular shape, and in a side view, in a shape including a circular arc portion and portions protruding from the opposite ends of the circular arc. That is, the circuit board 11 is formed in a shape manufactured by cutting the circular arc portion at end portions of a hollow cylindrical member in the axial direction and by integrating respective band-like members and the respective cut portions together. The peripheral surface on the circular arc shape of the circuit board 11 is formed as a component mounting surface 11a on which a plurality of components are respectively mounted at a plurality of mounting portions 11d, which are provided, for example, in a lattice-like manner.Furthermore, the band-like portions of the board 11 are formed as a positioned portion 11b in contact with a guide device 211 serving as a holding means of the board holding device 2 to which reference is made, and as a clamping portion 11c clamped by a clamping member 212 serving as a holding member in the board holding device 2.

[0025] As in the Fig. 1-3, the board holding device 2 is in the middle on the deep side (the middle of the upper side in Fig. 1) is arranged on an upper surface of a base 10, and is configured so that the board 11 transferred by the board transfer device 3 via a board holding table 21 can be loaded from the board transfer device 3 onto a board holding surface 21a by the upward movement in the Z direction by a moving device 23, which will be discussed later, and is also configured so that the board 11 can be loaded from the board holding surface 21a onto the board transfer device 3 by the downward movement in the Z direction by the moving device 23. In order to mount components on the board 11 by a method, which will be discussed later, the board holding device 2 is further a device that rotates the board 11 while holding it at holding positions 211X, 211Y, which will be discussed later.The board holding device 2 is generally composed of the board holding table 21 as a holding member that supports and holds the board 11, a rotating device 22 that rotates the board 11 held on the board holding table 21 together with the board holding table 21 about an axis in the Y direction, and the moving device 23 that moves the board 11 held on the board holding table 21 together with the board holding table 21 and the rotating device 22 in the Z direction.

[0026] The board holding table 21 is formed in the shape of a rectangular parallelepiped, and an upper surface thereof is formed as the board holding surface 21a on which the board 11 is supported and held. The board holding surface 21a is provided with an L-shaped guide member 211 that comes into contact with two orthogonal side portions of the positioned portion 11b of the board 11 to be supported to position and hold the board 11 in the X-axis direction and the Y-axis direction, and the clamp member 212 that presses an upper surface of the clamp portion 11c to clamp the board 11 between itself and the board holding surface 21a. The contact positions in the X and Y directions on the guide device 211 with the positioned portion 11b of the board 11 are set for the board 11 as the holding positions 211X, 211Y on the board holding surface 21a.The clamping element 212 is constructed to be capable of clamping or releasing the board 11 when it is brought close to or separated from the board holding surface 21a.

[0027] The rotating device 22 is generally composed of a rotary table 221 that fixedly supports the board holding table 21 and is rotatable about a pair of rotating shafts 222 that extend outwardly from opposite ends in the Y direction, a pair of support members 223 that respectively support the pair of rotating shafts 222 so as to be rotatable, a pulley mechanism 224 and a stepping motor 225 for rotating the rotating shafts 222 for the rotary table 221, and a support table 226 that mounts the support members 223 and the stepping motor 225. The board holding table 21 is configured to be capable of being positioned at arbitrary rotational positions by the stepping motor 225.

[0028] The moving device 23 is generally composed of four guide members 231 that pass through four corners of the support table 226 of the rotary device 22 and guide the movement of the support table 226 in the Z direction, a ball screw mechanism 232 and a stepping motor 233 for moving the support table 226 in the Z direction, and a support table 234 that mounts the four guide members 231 and the stepping motor 233. The board holding table 21 is configured to be positioned at any position in the Z direction by the stepping motor 233.

[0029] The three board transfer devices 3 are each arranged to form a straight line across the board holding device 2 and on opposite sides in the Y direction of the board holding device 2. The board transfer device 3 on one side in the Y direction loads the board 11 onto the board holding device 2 before component mounting, the board transfer device 3 above the board holding device 2 positions the loaded board 11 in a component mounting position, and the board transfer device 3 on the other side in the Y direction is a device that unloads the board 11 from the board holding device 2 after component mounting. The respective board transfer devices 3 are similar in structure and are each generally composed of a pair of guide rails 31 for guiding the transfer of the board 11 and a pair of conveyor belts 32 for transferring the board 11.The pair of guide rails 31 extend in the Y direction and are arranged parallel to each other so that they are spaced apart by almost the same distance as the width between the positioned portion 11b and the clamping portion 11c of the board 11. The pair of conveyor belts 32 are laid side by side directly under the guide rails 31.

[0030] The component feeding device 4 is a device mounted on the front side (lower side in Fig. 1) is arranged on an upper surface of the base 10 and feeds components of various types accommodated in a plurality of cassette-type feeders 41. Each feeder 41 is generally composed of a feeder main body 41a with a component supply roll 42 mounted at its rear portion, and a component removal portion 41b provided at a front portion of the feeder main body 41a. The component supply roll 42 wraps a carrier tape 42a thereon, on which components are arranged at regular intervals and covered by a cover tape (not shown).The feeder 41 is configured to pull out the carrier tape 42a at regular intervals by means of a sprocket (not shown) provided in the feeder main body 41a and pull out the cover tape, thereby supplying components one by one to the component take-out section 41b while picking up the carrier tape 24a.

[0031] The component loading device 6 is a device arranged above the upper surface of the base 10, which receives the components from the component supply device 4 and mounts the components on the board 11 transferred to the board holding device 2. The component loading device is generally composed of a pair of fixed rails 51, a head moving rail 52, a component loading head 53, and a component attracting unit 61 for attracting a component.

[0032] The pair of fixed rails 51 extend in the X-direction over the opposite end portions of the two board transfer devices 3 and are arranged parallel to each other. The head moving rail 52 is arranged to extend in the Y-axis direction and is movably supported along the pair of fixed rails 51 at opposite ends thereof. The movement of the head moving rail 52 is controlled by servomotors (not shown) via ball screws (not shown). The component loading head 53 is movably supported along the head moving rail 52. The movement of the loading head 53 is controlled by a servomotor (not shown) via a ball screw (not shown).

[0033] The component attraction unit 61 is generally composed of a nozzle holder portion 611 provided so as to protrude downward from the component loading head 53, and a component attraction nozzle 612 provided at a lower end portion of the nozzle holder portion 611 for attracting and holding the component. The nozzle holder portion 611 is mounted on the component loading head 53 so as to be vertically movable in the Z direction and rotatable about the Z axis by means of servo motors (not shown). The component attraction nozzle 612 is fixed to a lower end portion of the nozzle holder portion 611 and connected to a vacuum pump (not shown) so that a component can be attracted by the nozzle end.In order to detect positional deviations or the like of the board 11 relative to the holding positions 211X, 211Y on the board holding surface 21a through an image, a board image capturing camera 55 is further provided as an image capturing device for capturing the image of the board 11 projecting downward from the component loading head 53. In order to detect the attraction state of the component to the nozzle holder portion 611, a component image capturing camera 62 is further provided for capturing the image of the component between the board holding device 2 and the component supply device 4.

[0034] In the component mounting apparatus 1 of the first embodiment as described above, a description will be given regarding the operation of holding the board 11 on the board holding device 2. As shown in Fig. As shown in Fig. 5, the board 11 is transferred by the board transfer device 3 (not shown) to the upper side of the board holding device 2 and positioned at a predetermined position. Then, the clamping member 212 of the board holding table 21 in the board holding device 2 is opened outward, and the board holding table 21 begins to move upward (see Fig. 5(A)). Thus, the board 11 is loaded from the board transfer device 3 onto the board holding surface 21a of the board holding table 21.

[0035] At this time, the two side portions in the X-direction and the Y-direction of the positioned portion 11b of the board 11 are brought into contact with the holding positions 211X, 211Y on the guide device 211 of the board holding device 2 to be positioned, and the clamping portion 11c of the board 11 is clamped by the clamping member 212 of the board holding device 2 (see Fig. 5(B)). Thereafter, as described in detail later, the board holding table 21 is rotated about the rotary shafts 222 to orient a normal to each mounting portion 11d of the board 11 in the Z direction (vertical direction), and, if necessary, the board holding table 21 is further moved in the Z direction (vertical direction) to position the mounting portion 11d at a mounting reference height. Thereafter, a component is mounted on each mounting portion 11d of the board 11.

[0036] Next, a component mounting apparatus 8 in a second embodiment will be described. Compared with the component mounting apparatus 1 in the first embodiment, the component mounting apparatus 8 in the second embodiment is the same in terms of the structures of the two board transfer devices 3 arranged on the opposite sides in the Y direction of the board holding device 2, the component feeding device 4, the component loading device 6, and the control device 7. As shown in Fig. However, as shown in Figure 6, the board holding device 9 differs in construction from the board holding device 2, and the board transfer device 3 above the board holding device 2 is not provided, and a component loading device 5 is newly provided. Therefore, the board holding device 9 and the component loading device 5 will be described below. The component mounting device 8 mounts components on a board 12, which has, for example, a non-planar component mounting surface 12a, as shown in Figure 6. Fig. 7 shown.

[0037] In a plan view, the circuit board 12 is formed in a circular shape, and in a side view, it is formed in a shape including a circular arc-shaped portion and portions protruding from the opposite ends of the circular arc. That is, the circuit board 12 is formed in a shape produced by cutting off a portion of a spherical member in the direction parallel to the radial direction and integrating an annular member with the cut portion. The spherical edge surface of the circuit board 12 is formed as a component mounting surface 12a on which a plurality of components are to be mounted, respectively, at a plurality of mounting portions 12c arranged, for example, in concentric configurations.Furthermore, the annular portion of the board 12 is formed as a positioned portion 12b, which is inserted into and held by a position holding device 93 as a holding means of the board holding device 9, which will be referred to later, to be positioned and clamped.

[0038] As in Fig. 6, the board holding device 9 is generally composed of a plurality (three in this embodiment) of board holding tables 91 that support and hold boards 12 loaded by the board loading device 5 from the board transfer device 3, a holding table pivoting device 92 that rotates the boards 12 held on the respective board holding tables 91 together with the board holding tables 91 in the circumferential directions of the boards 12, a plurality (three in this embodiment) of positioning devices 93 that insert and hold the boards 12 held on the respective board holding tables 91 to position and clamp the boards 12, a rotating device 22 that rotates the boards 12 held on the respective board holding tables 91 together with the board holding tables 91 around the axis in the Y direction, and a moving device 23,which moves the boards 12 held on the respective board holding tables 91 in the Z direction together with the board holding tables 91 and the rotating device 22. The rotating device 22 and the moving device 23 of the board holding device 9 are the same in construction as those in the first embodiment, and the same elements, for which detailed description is omitted, are given the same reference numerals.

[0039] Each board holding table 91 is formed in a columnar shape and has an upper surface formed as a board holding surface 91a on which the board 12 is supported and held. Further, each board holding table 91 is provided with a pivot shaft 911 extending downward from the lower surface and rotatably supported by a turntable 221. That is, each board holding table 91 is constructed as a second support member located on the turntable 221 as a first support member, rotatable about the rotary shafts 222 as a first rotary shaft, and rotatable about the pivot shaft 911 as a second rotary shaft extending in a direction perpendicular to the rotary shafts 222.

[0040] The holding table pivoting device 92 is generally composed of a pulley mechanism 921 for rotating the respective pivot shafts 911 and a stepping motor 922 fixed to a lower surface of the turntable 221. Each of the blank holding tables 91 is configured to be positioned at arbitrary pivoting positions by the stepping motor 922.

[0041] Each positioning device 93 is arranged adjacent to each board holding table 91 and fixed to the upper surface of the turntable 221. Each positioning device 93 is generally composed of a pair of positioning arms 931a, 931b as holding means that allow the positioned portion 12b of the board 12 to be inserted and held therein, and an arm moving device 932 including a motor, a gear, and the like that move the positioning arm 931b on one side only in parallel relative to the positioning arm 931a on the other side. The positioning arm 931a is fixed to the upper surface of the turntable 221, and the positioning arm 931b is coupled to the arm moving device 932 to be movable in parallel relative to the positioning arm 931a. The pair of positioning arms 931a, 931b is each provided with longitudinally extending, mutually facing groove portions 931c, 931d.

[0042] The positioning device 93 is designed to position and clamp the circuit board 12 on the circuit board holding surface 91a in such a manner that the positioning arm 931b on one side is moved parallel relative to the positioning arm 931a on the other side, thereby inserting and holding the positioned portion 12b of the circuit board 12 supported on the circuit board holding surface 91a into the respective groove portions 931c, 931d. Therefore, the lower position of the groove portion 931c of the fixed positioning arm 931a is set as the reference position for the holding position of the circuit board 12 on the circuit board holding surface 91a.

[0043] The board loading device 5 is a device arranged above the upper surface of the base 10 and which loads the boards 12 between the board transfer devices 3 and the board holding device 9. The board loading device 5 is generally composed of a board loading head 56 and board gripping units 54 for gripping the boards 12. Like the component loading head 53, the board loading head 56 is movably mounted along the head movement rail 52. The movement of the board loading head 56 is controlled by a servo motor (not shown) via a ball screw (not shown).

[0044] The board gripping units 54 are generally composed of a plurality (three in this embodiment) of claw holder sections 541 provided to project downward from the board loading head 56, and pairs of board gripping claws 542 provided at lower end portions of the respective claw holder sections 541 for gripping the boards 11. The claw holder section 541 is supported by the board loading head 56 so as to be movable in the Z direction and rotatable about the Z axis by servo motors (not shown). Each pair of board gripping claws 542 is fixed to a lower end portion of the claw holder section 541 so as to be opened and closed by a servo motor (not shown). The intervals of the three board gripping units 54 are provided so as to be the same as the intervals of the three board holding tables 91.Furthermore, the board transfer device 3 is provided with stoppers (not shown) on the loading side for the boards 12, which stop the three loaded boards 12 at the gaps between the three board gripping units 54. Thus, the three board gripping units 54 are designed to be capable of loading the three boards 12 simultaneously between the board transfer device 3 and the board holding device 9.

[0045] In the component mounting apparatus 8 of the second embodiment having the above-mentioned construction, a description will be given regarding the operation of holding the circuit boards 12 on the circuit board holding device 9. As shown in Fig. 8, each board 12, after being transferred by the board transfer device 3 to the vicinity of the board holding device 9, is moved by the board loading device 5 from the board transfer device 3 to an upper position above the board holding table 91 of the board holding device 9 (see Fig. 8(A)). Then, the board 12 is placed on the board holding surface 91a of the board holding table 91 by the board loading device 5. At this time, the positioned portion 12b of the board 12 is brought between the pair of positioning arms 931a, 931b of the positioning device 93 and is positioned and clamped (see Fig. 8(B)). Thereafter, as described in detail later, the board holding table 91 is rotated about the rotary shafts 222 and the pivot shaft 911 to align a normal to each mounting portion 12c of the board 12 in the Z direction (vertical direction). If necessary, the board holding table 91 is further moved in the Z direction (vertical direction) to position the mounting portion 12c at a fixed mounting reference height. Then, a component is mounted on each mounting portion 12c of the board 12.

[0046] Next, a description will be given regarding the reasons why the board holding table 21, 91 is rotated and the like to direct the normal to the mounting portion 11d, 12c on the board 11, 12 in the Z direction (vertical direction) and to position the mounting portion 11d, 12c at the fixed mounting reference height. The component mounting surface 11a, 12a of the board 11, 12 has a circular arc shape in a side view, and therefore, when the normal to the mounting portion 11d, 12c is inclined relative to the axis in the Z direction, the component attraction nozzle 612 must be moved in an inclined direction, which requires complicated operation control. On the other hand, when a component is mounted by moving the component attraction nozzle 612 in the Z direction to simplify the operation control of the component attraction nozzle 612, there is a fear that a deviation in the position of the component will occur.

[0047] The component attraction nozzle 612 is reciprocated between the component feeder 4 and the circuit board 11, 12 a number of times equal to the number of components to be mounted to perform component mounting. For a circuit board with a planar shape, all mounting sections are set to a fixed mounting reference height. Thus, the vertical movement stroke of the component attraction nozzle 612 can be set to the necessary minimum, making it possible to shorten the component mounting time. However, for circuit boards 11, 12 with a non-planar component mounting surface, not all mounting sections become a fixed mounting reference height. Thus, the vertical movement stroke of the component attraction nozzle 612 may become longer, and the component mounting time tends to increase.Therefore, in the component mounting apparatus 1, 8 in the present embodiment, the above-mentioned problems are solved by performing compensation that rotates the board holding table 21, 91 of the board holding device 2, 9 and, if necessary, moves the board holding table 21, 91 in the Z direction to direct the normal to the mounting portion 11d, 12c in the Z direction and position the mounting portion 11d, 12c at the mounting reference height.

[0048] In the aforementioned compensation method, information about the circuit board 11, 12 and information about the circuit board holding device 2, 9 are used. The information about the circuit board 11, 12 includes the position of the positioned portion 11b, 12b, positions of the mounting portions 11d, 12c, and the like. The position of the positioned portion 11b, 12b is represented by the respective coordinates in the X, Y, Z directions of the two orthogonal sides of the positioned portion 11b that are brought into contact with the guide device 211, and is used when assembling the components with the circuit board 11, 12 positioned and held on the circuit board holding table 21, 91.On the other hand, where components are mounted with the circuit board 11, 12 recognized as an image by the image capturing camera 55, a reference hole (not shown) formed in advance on the circuit board 11, 12 is used as a positioned portion, and thus the position of the reference hole is used as board information instead of the position of the positioned portion 11b, 12b. The position of each mounting portion 11d, 12c is represented by the respective coordinates in the X, Y, Z directions and the inclinations in the X and Y directions.

[0049] Information about the board holding device 2, 9 includes the position in the board holding device 2, 9 of the rotary shafts 222 for the board holding table 21, 91, the positional relationship between the rotary shafts 222 and the board holding surface 21a, 91a, the holding positions 211X, 211Y of the board holding surface 21a, and the like. Regarding the holding position on the board holding surface 91a, as previously noted, the lower position of the groove portion 931c of the positioning arm 931a is set as the reference position. Respective coordinates in the X, Y, Z directions are used to represent the position in the board holding device 2, 9 of the rotary shafts 222 for the board holding table 21, 91, the positional relationship between the rotary shafts 222 and the board holding surface 21a, 91a, and the holding positions 211X, 211Y of the board holding surface 21a.

[0050] The rotation of the board holding table 21, 91 in the board holding device 2, 9 is performed to direct the normal to each mounting section 11d, 12c in the Z direction based on the aforementioned information about the board 11, 12 and the information about the board holding device 2, 9. Thus, after the component picked up by the component attracting nozzle 612 is moved to the normal to each mounting section 11d, 12c, it is possible to mount the component on the mounting section 11d, 12c by a simple component mounting operation control that includes moving the component attracting nozzle 612 only in the vertical direction.Therefore, complicated component mounting operation control involving moving the component attracting nozzle 612 in an inclined direction as performed in the prior art is not required, and positional deviation of the component at each mounting portion 11d, 12c can be prevented, so that it is possible to mount the component at the mounting portion 11d, 12c in a short time.

[0051] Furthermore, compensation amounts in the X, Y, and Z directions for the position of each mounting section 11d, 12c are calculated based on the rotation amount of the board holding table 21, 91, the information about the board 11, 12, and the information about the board holding device 2, 9. The movement in the Z direction of the board holding table 21, 91 in the board holding device 2, 9 is performed based on a calculated compensation amount in the Z direction for the position of each mounting section 11d, 12c. A compensated mounting position of each mounting section 11d, 12c is calculated from the calculated compensation amounts in the X, Y, and Z directions for the position of each mounting section 11d, 12c and the information about the board 11, 12. Based on the compensated mounting position of each such mounting section 11d, 12c calculated in this way, a component is mounted exactly at each mounting section 11d, 12c on the board 11, 12.

[0052] Furthermore, where components are mounted with the circuit board 11, 12 recognized as an image by the image capturing camera 55, image recognition is performed for positional deviation amounts of the circuit board 11, 12 relative to the holding positions 211X, 211Y, and the like. Then, compensation amounts in the X, Y, and Z directions are calculated for the position of each mounting portion 11d, 12c based on the positional deviation amounts recognized as an image, the rotation amount of the board holding table 21, 91, the information about the circuit board 11, 12, and the information about the board holding device 2, 9. Therefore, because the positional deviation amounts are added, components can be mounted more accurately on respective mounting portions 11d, 12c on the circuit board 11, 12.

[0053] Furthermore, component mounting can be performed after the position of each mounting section 11d, 12c on the circuit board 11, 12 has been detected by an image following the rotation of the circuit board holding table 21, 91 in the circuit board holding device 2, 9. In this case, the compensated mounting position of the mounting section 11d, 12c is recompensated only by the difference between the position of the mounting section 11d, 12c on the circuit board 11, 12 detected by an image and the mounting position calculated for the mounting section 11d, 12c.As a result, even in the case where, for example, a hole for inserting a component is provided on the mounting portion 11d, 12c, and the position in the horizontal direction of the center point of the hole is changed due to the rotation of the board holding table 21, 91, the accuracy of the compensated mounting position of the mounting portion 11d, 12c is increased by the re-compensation, and therefore, it is possible to mount the component by smoothly inserting it into the hole on the mounting portion 11d, 12c.

[0054] The aforementioned compensation amounts in the X, Y, Z directions for the position of each mounting section 11d, 12c are deviation amounts between the position coordinates in the machine coordinate system (component mounting device 1) of the mounting section 11d, 12c when the board 11, 12 is loaded onto the board holding table 21, 91 and the position coordinates in the machine coordinate system of the mounting section 11d, 12c when the board holding table 21, 91 is rotated.

[0055] Regarding the X and Z directions, which for example as in Fig. 9, the machine coordinate system is regarded as Xm and Zm, where Zm extends in the vertical direction across a rotation center C of the board holding table 21, 91, and Xm is set to be orthogonal to Zm and extends along the board holding surface 21a, 91a that is horizontal to the board holding table 21, 91, and the mechanical origin point is regarded as M0. Further, the board coordinate system on the board holding surface 21a, 91a is regarded as Xp and Zp, where Zp extends in the vertical direction, and Xp is set to be orthogonal to Zp and becomes the same line as Xm, and the board origin point is regarded as P0.Then, the distance between the mechanical origin point M0 and the rotation center C is regarded as zero in the X direction and B in the Z direction, and the distance between the board origin point P0 and the rotation center C is regarded as A in the X direction and B in the Z direction. Further, Xθ and Zθ are taken as the rotating coordinate system, which is determined when the machine coordinate system Xm, Zm is rotated clockwise by an angle θ around the rotation center C. In the case of image recognition by the board image sensing camera 55, the distance in the X direction is calculated by adding a camera deviation amount ΔA to A.

[0056] The above-mentioned deviation amounts can be derived by first moving the board coordinate system Xp, Zp in parallel (moving over the distance A in the X direction) to align with the machine coordinate system Xm, Zm, and then by rotating the board coordinate system Xp, Zp in alignment with the machine coordinate system Xm, Zm around the rotation center C (rotating by an angle θ clockwise).

[0057] For example, where the position coordinates of the mounting section 11d, 12c in the board coordinate system Xp, Zp are regarded as (xp, zp), the following expression (1) is obtained by converting the coordinates (xp, zp) into the coordinates (xm, zm) in the machine coordinate system Xm, Zm. xm=xp+A, zm=zp

[0058] Then, the coordinates (xm, zm) are converted into the coordinates (xθ, zθ) in the rotating coordinate system Xθ, Zθ. Where Q is considered the distance from the coordinates (xm, zm) to the rotation center C, the following expression (2) is obtained. Q=√(B+zm)2+xm2)

[0059] Where S is considered as the distance from the line connecting the coordinates (xm, zm) and the coordinates (xθ, zθ) to the center of rotation C, then the following expression (3) is obtained. S=Q⋅cosθ / 2

[0060] Where T is considered as the distance from a straight line extending from the coordinates (xθ, zθ) parallel to Zm to the center of rotation C, the following expression (4) is obtained. It is defined as: α = cos -1 ((B + zm) / Q). T=2Scos(π−θ / 2−α)−xm

[0061] Where U is considered as the distance from a straight line extending from the center of rotation C parallel to Xm to the coordinates (xθ, zθ), one then obtains the following expression (5). U=√(Q2−T2)

[0062] From the above, the coordinates (xθ, zθ) can be converted into those in the machine coordinate systems Xm, Zm by the following expression (6). xθ=T=2Scos(π−θ / 2−α)−xm, zθ=U−B=√(Q2−T2)−B=√(((B / zm)2+xm2)−(2Scos(π−θ / 2−α)−xm)2)−B

[0063] Thus, it is possible to calculate the deviation amounts between the position coordinates in the machine coordinate system of the mounting section 11d, 12c when the board 11, 12 is loaded onto the board holding table 21, 91 and the position coordinates in the machine coordinate system of the mounting section 11d, 12c when the board holding table 21, 91 is rotated; that is, the compensation amounts in the X and Z directions for the position of the mounting sections 11d, 12c.

[0064] Next, the aforementioned compensation method will be described, giving a specific example. First, a description will be given for the case where, as in Fig. 10, the center point Cp of a circle of curvature on the component mounting surface 11a, 12a of each board 11, 12 is in agreement with the center point C of the rotary shafts 222 for the board holding table 21, 91 in the board holding device 2, 9, that is, in the case where the distance between the component mounting surface 11a, 12a of each board 11, 12 and the center point C of the rotary shafts 222 for the board holding table 21, 91 is fixed at all times. When the board holding surface 21a, 91a of the board holding table 21, 91 is in a horizontal state, a first mounting portion Pa on the upper side of the component mounting surface 11a, 12a of the board 11, 12 directs a normal Lpa thereto in the Z direction and is positioned at a mounting reference height H (see Fig. 10(A)). Thus, it is possible to mount a component on the first mounting portion Pa accurately and in a short time by a simple operation control involving moving the component attraction nozzle 612 through a minimum stroke in only the Z direction.

[0065] When a component is mounted on a second mounting portion Pb which is spaced counterclockwise by an angle θ degrees from the first mounting portion Pa, the board holding surface 21a, 91a of the board holding table 21, 91 is inclined by the angle θ, that is, the board holding table 21, 91 is rotated clockwise by the angle θ (see Fig. 10(B)). Thus, it is possible to make an adjustment so that the normal Lpb is directed to the second mounting portion Pb in the Z direction, and so that the second mounting portion Pb is positioned at the mounting reference height H. Thus, it is possible to mount a component on the second mounting portion Pb accurately and in a short time through a simple operation control involving moving the component attraction nozzle 612 over the minimum stroke in only the Z direction.

[0066] Next, a description will be given regarding, for example, the case of a corrugated board 13, wherein the distance between a component mounting surface 13a of a board 13 and the center C of the rotary shafts 222 for the board holding table 21, 91 is varied as shown in Fig. 11. For a third mounting section Pc which has a normal Lpc directed thereto in the Z direction and is positioned at the mounting reference height H, when the board holding surface 21a, 91a of the board holding table 21, 91 is inclined by an angle Φc from the horizontal state to a downwardly inclined state, the board holding surface 21a, 91a is rotated clockwise by the angle Φc (see Fig. 11 (A)). Thus, it is possible to mount the component at the third mounting section Pc accurately and in a short time by a simple operation control involving moving the component attraction nozzle 612 over the minimum stroke in only the Z direction.

[0067] For a fourth mounting section Pd directing a normal Lpd thereto in the Z direction, when the board holding surface 21a, 91a of the board holding table 21, 91 is inclined by an angle Φd from the horizontal state to an upwardly inclined state, then the board holding surface 21a, 91a, in the state in which it has been rotated by the angle Φc clockwise, is rotated counterclockwise by the angle Φc + Φd (see Figure 11(B)). Since the fourth mounting section Pd is not positioned at the mounting reference height H, in this case, the board holding table 21, 91 is moved by α in the Z direction (see Fig. 11 (C)). Thus, it is possible to mount the component at the fourth mounting portion Pd accurately and in a short time by a simple operation control involving moving the component attraction nozzle 612 over the minimum stroke in only the Z direction.

[0068] Next, with reference to a Fig. The flowchart shown in Fig. 12 describes a component mounting method by the aforementioned component mounting apparatus 1. It is assumed here that the position in the board holding device 2 of the rotary shafts 222 for the board holding table 21, the positional relationship between the rotary shafts 222 and the board holding surface 21a, and the information about the board holding device 2 including the holding positions 211X, 211Y of the board holding surface 21a have been measured in advance and stored in the controller 7.The control device 7 judges whether or not it has inputted the information about the board 11 including the position of the positioned portion 11b and the positions of mounting portions 11d (Step 1), and if it has not inputted it, it inputs the board information and stores it in a memory of the control device 7 (Step 2: Corresponding to the “board information input step” of the present invention).

[0069] The control device 7 controls the operation of the board transfer device 3 to load a board 11 near the board holding device 2 (step 3), and controls the operation of the board loading device 5 to load the board 11 from the board transfer device 3 onto the board holding device 2 (step 4). At this time, the board 11 is positioned with the positioned portion 11b held in contact with the guide device 211 of the board holding device 2. Then, the operation of the clamping member 212 in the board holding device 2 is controlled to clamp the clamping portion 11c of the board 11 (step 5: corresponding to the "board loading and holding step" in the present invention).

[0070] The control device 7 controls the operation of the rotating device 22 in the board holding device 2 based on the board holding device information and the board information stored in the memory so as to rotate the board holding table 21 so that a normal to a mounting portion 11d on the component mounting surface 11a of the board 11 is directed in the vertical direction (step 6: corresponding to the “board rotating step” in the present invention).Then, compensation amounts in the X, Y, Z directions for the position of a mounting portion 11d are calculated based on the rotation amount of the board holding table 21, the board information, and the board holding device information, and a compensated mounting position of the mounting portion 11d is calculated from the calculated compensation amounts in the X, Y, Z directions for the position of the mounting portion 11d and the board information (steps 7 and 8: corresponding to the “compensated mounting position calculation step” in the present invention).

[0071] The control device 7 judges whether the mounting section 11d is positioned at the mounting reference height (step 9), and if the mounting section 11d is not positioned at the mounting reference height, it controls the operation of the moving device 23 to move the board holding table 21 in the Z direction by a compensation amount for the position of the mounting section 11d, so that the mounting section 11d is positioned at the mounting reference height (step 10). Thereafter, the operation of the component loading device 6 is controlled based on the compensated mounting position calculated for the mounting section 11d, so as to mount the component at the compensated mounting position of the mounting section 11d (step 11: corresponding to the "component mounting step" in the present invention).The component mounting can also be performed by moving the component attracting nozzle 612 by the compensation amount in the Z direction for the position of the mounting portion 11d in the Z direction without moving the board holding table 21.

[0072] The control device 7 judges whether the component mountings on the present board 11 are completed or not (step 12), and if the component mountings on the present board 11 are not completed, it executes the aforementioned steps after returning to step 6. On the other hand, if the component mountings on the present board 11 are completed, the operation of the clamping member 212 in the board holding device 2 is controlled to release the clamping portion 11c of the board 11. Thereafter, the operation of the board loading device 5 is controlled to load a board 11 from the board holding device 2 onto the board transfer device 3 (step 13), and the operation of the board transfer device 3 is controlled to unload the board 11 (step 14).The control device 7 judges whether the manufacturing of all the boards 11 has been completed or not (step 15), and if the manufacturing of all the boards 11 has not been completed, it executes the aforementioned processing after returning to step 1. On the other hand, if the manufacturing of all the boards 11 has been completed, the component assembly program is completed.

[0073] The above component mounting method is a method in which a component is mounted at each mounting portion 11d on the component mounting surface 11a of the circuit board 11, with the positioned portion 11b of the circuit board 11 held in contact with and positioned by the guide device 211 of the circuit board holding device 2. As another component mounting method, there is a method in which a component is mounted at each mounting portion 11d on the component mounting surface 11a of the circuit board 11 by the image recognition of the circuit board 11 by the image capturing camera 55, and the method will be described with reference to a Fig.13 will be described. It is assumed here that the position in the board holding device 2 of the rotary shafts 22 for the board holding table 21, the positional relationship between the rotary shafts 222 and the board holding surface 21a, and the information about the board holding device 2 including the holding positions 211X, 211Y of the board holding surface 21a have been measured in advance and stored in the memory of the control device 7.

[0074] The control device 7 judges whether or not it has inputted the information about the board 11, including the position of the positioned portion 11b and the positions of the mounting portions 11d (step 21). If it has not inputted it, it inputs the board information to store it in the memory of the control device 7 (step 22: corresponding to the "board information input step" of the present invention). Then, the operation of the board transfer device 3 is controlled to load the board 11 near the board holding device 2 (step 23), and the operation of the board loading device 5 is controlled to load the board 11 from the board transfer device 3 onto the board holding device 2 (step 24).In this case, it is sufficient if the accuracy is rough when the positioned portion 11b of the board 11 is brought into contact with the guide device 211 of the board holding device 2 and thereby positioned. Thereafter, the operation of the clamping member 212 in the board holding device 2 is controlled to clamp the clamping portion 11c of the board 11 (Step 25: Corresponding to the "board loading and holding step" in the present invention).

[0075] The control device 7 controls the operations of the board loading device 5 and the board image capturing camera 55 to capture an image of the board 11 (step 26) and detect positional deviation amounts of the board 11 relative to the holding positions 211X, 211Y through an image (step 27: corresponding to the "board position detecting step" in the present invention). The control device 7 then controls the operation of the rotating device 22 in the board holding device 2 based on the board holding device information stored in the memory and the board information so that it rotates the board holding table 21 so that a normal to each mounting portion 11d on the component mounting surface 11a of the board 11 is directed in the vertical direction (step 28: corresponding to the "board rotating step" in the present invention).

[0076] The control device 7 calculates the compensation amounts in the X, Y, Z directions for the position of a mounting portion 11d based on the positional deviation amounts of the board 11 relative to the holding positions 211X, 211Y, the rotation amount of the board holding table 21, the board information, and the board holding device information, and calculates a compensated mounting position of the mounting portion 11d from the compensation amounts in the X, Y, Z directions for the position of the calculated mounting portion 11d and the board information (steps 29 and 30: corresponding to the “compensated mounting position calculation step” in the present invention).Thereafter, it is judged whether the mounting portion 11d is positioned at the mounting reference height or not (step 31), and when the mounting portion 11d is not positioned at the mounting reference height, the operation of the moving device 23 is controlled so that the board holding table 21 is moved by a compensation amount in the Z direction for the position of the mounting portion 11d in the Z direction so that the mounting portion 11d is positioned at the mounting reference height (step 32).

[0077] In the case where it is necessary to increase the accuracy for a compensated mounting position of the mounting portion 11d, such as when there is a hole at a mounting portion 11d on the component mounting surface 11a of the circuit board 11 and thus a situation is likely to occur where the position in the horizontal direction of the center of the hole is changed by the rotation of the circuit board 11, re-capturing the image of the circuit board 11 and detecting the position of the mounting portion 11d after the rotation from an image may be performed. Therefore, the controller 7 judges whether or not to recapture the image of the circuit board 11 (step 33), and proceeds to step 37 if it is unnecessary to recapture the image of the circuit board 11.

[0078] On the other hand, if the image of the board 11 needs to be re-captured, the control device 7 controls the operations of the board loading device 5 and the board image capturing camera 55 to re-capture the image of the board 11 (step 34) and detect the position of the mounting portion 11d after rotation from the image (step 35: corresponding to the "post-rotation mounting position detecting step" in the present invention). Then, the compensated mounting position of the mounting portion 11d is re-compensated by the difference between the position of the mounting portion 11d on the board 11 detected from the image and the compensated mounting position calculated for the mounting portion 11d (step 36: corresponding to the "re-compensated board position calculating step" in the present invention).Thereafter, the operation of the component loading device 6 is controlled based on the compensated mounting position calculated for the mounting section 11d or the compensated mounting position that has been compensated again, to mount the component at the compensated mounting position of the mounting section 11d (Step 37: Corresponding to the “component mounting step” in the present invention).

[0079] The control device 7 judges whether the component mountings on the present board 11 are completed or not (step 38), and if the component mountings on the present board 11 are not completed, it executes the aforementioned processing after returning to step 28. On the other hand, if the component mountings on the present board 11 are completed, the control device 7 controls the operation of the clamping member 212 in the board holding device 2 to release the clamping portion 11c of the board 11. Then, the operation of the board loading device 5 is controlled to load the board 11 from the board holding device 2 onto the board transfer device 3 (step 39), and the operation of the board transfer device 3 is controlled to unload the board 11 (step 40).The control device 7 judges whether the manufacturing of all the boards 11 has been completed or not (step 41), and if the manufacturing of all the boards 11 has not been completed, it executes the aforementioned processing after returning to step 21. On the other hand, if the manufacturing of all the boards 11 has been completed, the component assembly program is completed. INDUSTRIAL APPLICABILITY

[0080] The present invention is applicable to the case where components are mounted on a board having a non-planar component mounting surface such as a curved surface, an inclined surface, or the like. DESCRIPTION OF REFERENCE SYMBOLS 1, 8 component assembly device, 2, 9 board holding device, 3 board transfer device, 4 component feeding device, 5 board loading device, 6 component loading device, 7 control device, 11, 12, 13 board, 11a, 12a, 13a Component mounting surface, 11d, 12c assembly section, 21, 91 blank holding table, 21a, 91a board holding surface, 22 rotating device, 23 movement device, 55 image capture device, 92 Second turning device, 93 positioning device, 211, 212, 931a, 931b holding means, 211X, 211Y holding position, 221 holding element, 222 rotating shaft.

Claims

[1] A component mounting method in a component mounting apparatus (1, 8) comprising: a board holding device (2, 9) with a holding element (21, 91) which, for mounting a component on a board (11, 12, 13) with a non-planar component mounting surface (11a, 12a, 13a), holds the board (11, 12, 13) at a holding position (211X, 211Y) on a board holding surface (21a, 91a) and rotates the board (11, 12, 13); a board transfer device (3) which loads and unloads the board (11, 12, 13) with respect to the board holding surface (21a, 91a) of the holding element (21, 91); a component feeding device (4) which feeds the component to be mounted on the board (11, 12, 13); and a component loading device (6) which receives the component from the component feeder (4) and moves the component in two orthogonal directions within a horizontal plane and in a vertical direction to mount the component on a mounting portion (11d, 12c) on the board (11, 12, 13) held at the holding position (211X, 211Y) on the board holding surface (21a, 91a); wherein the component assembly process comprises: a board information input step of inputting board information relating to the position of a positioned portion for positioning the board (11, 12, 13) on the board holding surface (21a, 91a) and the position of the mounting portion (11d, 12c); a board loading and holding step of loading the board (11, 12, 13) into the holding position (211X, 211Y) on the board holding surface (21a, 91a) by the board transfer device (3) and holding the loaded board (11, 12, 13) at the holding position (211X, 211Y) on the board holding surface (21a, 91a) by holding means (211, 212; 931a, 931b) provided in the board holding device (2, 9); a board rotation step of rotating the holding member (21, 91) of the board holding device (2, 9) so that a normal to the mounting portion (11d, 12c) on the non-planar component mounting surface (11a, 12a, 13a) is directed in the vertical direction, based on pre-stored board holding device information relating to the position of a rotary shaft (222) for the holding member (21, 91) in the board holding device (2, 9), a positional relationship between the rotary shaft (222) and the board holding surface (21a, 91a), and the position of the holding position (211X, 211Y) on the board holding surface (21a, 91a), and the input board information; a compensated mounting position calculation step of calculating compensation amounts in the two orthogonal directions within the horizontal plane and in the vertical direction for the position of the mounting portion (11d, 12c) whose normal is directed in the vertical direction in the board rotation step, based on a rotation amount of the holding member (21, 91) in the board rotation step, the board holding device information, and the board information, and calculating a compensated mounting position from the compensation amounts in the two orthogonal directions within the horizontal plane and in the vertical direction and the board information; and a component mounting step of mounting the component to the mounting portion (11d, 12c) on the circuit board (11, 12, 13) based on the compensated mounting position. [2] The component mounting method in claim 1, wherein: the board holding device (2, 9) is designed to be movable in the vertical direction; and the component mounting step comprises compensatingly moving the board holding device (2, 9) in the vertical direction with respect to the compensation amount in the vertical direction calculated in the compensated mounting position calculation step. [3] The component mounting method in claim 1 or 2, comprising: a board position detection step of capturing an image of the board (11, 12, 13) held at the holding position (211X, 211Y) on the board holding surface (21a, 91a) by an image capturing device (55) and detecting, by means of the image, positional deviation amounts of the board (11, 12, 13) relative to the holding position (211X, 211Y); wherein the compensated mounting position calculation step comprises calculating the compensation amounts in the two orthogonal directions within the horizontal plane and in the vertical direction for the position of the mounting portion (11d, 12c) whose normal is directed in the vertical direction in the board rotating step, based on the positional deviation amounts, the rotation amount of the holding member (21, 91) in the board rotating step, the board holding device information, and the board information. [4] The component mounting method in any one of claims 1 to 3, comprising: a post-rotation mounting position detection step of capturing an image of the mounting portion (11d, 12c) by the image capturing means (55) after the holding member (21, 91) has been rotated to align the normal in the board rotation step with the position of the mounting portion (11d, 12c) in the vertical direction, and detecting, by means of the image, the position of the mounting portion (11d, 12c) after the rotation; and a recompensated position calculation step of the board (11, 12, 13) of recompensating the compensated mounting position by a difference between the position of the mounting portion (11d, 12c) after the rotation detected by the image and the compensated mounting position calculated in the compensated mounting position calculation step, and wherein the component mounting step comprises mounting the component to the mounting portion (11d, 12c) on the circuit board (11, 12, 13) based on the compensated mounting position which has been compensated again. [5] A component mounting device (1, 8) comprising: a board holding device (2, 9) with a holding element (21, 91) which, for mounting a component on a board (11, 12, 13) with a non-planar component mounting surface (11a, 12a, 13a), holds the board (11, 12, 13) at a holding position (211X, 211Y) on a board holding surface (21a, 91a) and rotates the board (11, 12, 13); a board transfer device (3) which loads and unloads the board (11, 12, 13) with respect to the board holding surface (21a, 91a) of the holding element (21, 91); a component feeding device (4) which feeds the component to be mounted on the circuit board (11, 12, 13); a component loading device (6) which receives the component from the component feeder (4) and moves the component in two orthogonal directions within a horizontal plane and in a vertical direction to mount the component on a mounting portion (11d, 12c) on the board (11, 12, 13) held at the holding position (211X, 211Y) on the board holding surface (21a, 91a); and a control device (7) which controls an operation of the board holding device (2, 9), the board transfer device (3), the component feeding device (4) and the component loading device (6); wherein the control device (7) comprises: Input means for inputting board information relating to the position of a positioned portion for positioning the board (11, 12, 13) on the board holding surface (21a, 91a) and the position of the mounting portion (11d, 12c), and board holding device information relating to the position of a rotary shaft (222) for the holding member (21, 91) in the board holding device (2, 9), a positional relationship between the rotary shaft (222) and the board holding surface (21a, 91a), and the position of the holding position (211X, 211Y) on the board holding surface (21a, 91a); Storage means for storing the input board information and board holder information; Board loading and holding means (211, 212; 931a, 931b) for loading the board (11, 12, 13) into the holding position (211X, 211Y) on the board holding surface (21a, 91a) by the board transfer device (3) and for holding the loaded board (11, 12, 13) at the holding position (211X, 211Y) on the board holding surface (21a, 91a) by holding means (211, 212; 931a, 931b) provided in the board holding device (2, 9); Board rotating means (22, 92) for rotating the holding element (21, 91) of the board holding device (2, 9) so that a normal to the mounting portion (11d, 12c) on the non-planar component mounting surface (11a, 12a, 13a) is directed in the vertical direction based on the board information and the board holding device information; Compensated mounting position calculation means for calculating compensation amounts in the two orthogonal directions within the horizontal plane and in the vertical direction for the position of the mounting portion (11d, 12c) whose normal is directed in the vertical direction by the board rotating means (22, 92), based on a rotation amount of the holding member (21, 91) by the board rotating means (22, 92), the board holding device information, and the board information, and for calculating the compensated mounting position from the compensation amounts in the two orthogonal directions within the horizontal plane and in the vertical direction and the board information; and Component mounting means for mounting the component to the mounting portion (11d, 12c) on the circuit board (11, 12, 13) based on the compensated mounting position. [6] The component mounting device (1, 8) in claim 5, wherein: the board holding device (2, 9) is designed to be movable in the vertical direction; and the component mounting means compensatingly moves the board holding device (2, 9) in the vertical direction with respect to the compensation amount in the vertical direction calculated by the compensated mounting position calculating means. [7] The component mounting device (1, 8) in claim 5 or 6, comprising: an image capture device (55) capable of capturing an image of the circuit board (11, 12, 13); wherein the control device (7) is provided with: Board position detection means for capturing the image of the board (11, 12, 13) held at the holding position (211X, 211Y) on the board holding surface (21a, 91a) by the image capturing device (55) and for detecting, by means of the image, positional deviation amounts of the board (11, 12, 13) relative to the holding position (211X, 211Y); and wherein the compensated mounting position calculating means calculates compensation amounts in the two orthogonal directions within the horizontal plane and in the vertical direction for the position of the mounting portion (11d, 12c) whose normal is directed in the vertical direction by the board rotating means (22, 92), based on the positional deviation amounts, the rotation amount of the holding member (21, 91) by the board rotating means (22, 92), the board holding device information, and the board information. [8] The component mounting device (1, 8) in any one of claims 5 to 7, wherein: the holding element (21, 91) is composed of a first holding element (221) having a first rotary shaft (222) capable of rotating about a horizontal axis, and a second holding element (91) having a second rotary shaft (911) rotatable about an axis orthogonal to the first rotary shaft (222) on the first holding element (221); and the board rotating means (22, 92) individually rotates the first holding member (221) and the second holding member (91) in the board holding device (2, 9) so that a normal to the mounting portion (12c) on the non-planar component mounting surface (12a) is directed in the vertical direction based on the board information and the board holding device information.

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