DC / DC converter device

Abstract

DC-DC converter device comprising: a transformer (250); a high-voltage-side printed circuit board assembly (210A) connected to a primary side of the transformer (250) and forming a high-voltage-side circuit (210); a low-voltage-side printed circuit board assembly (220A) connected to a secondary side of the transformer (250) and forming a low-voltage-side circuit (220); a control circuit board assembly (240A) forming a control circuit (240) for controlling the high-voltage-side circuit (210) and the low-voltage-side circuit (220); a housing (101) containing the transformer (250), the high-voltage-side printed circuit board assembly (210A), the low-voltage-side printed circuit board assembly (220A), and the control circuit board assembly (240A); a metal frame (300) placed in the housing (101) and between the transformer (250) and the Control circuit card assembly (240A) is arranged;and an elastic element inserted between the metal frame (300) and the transformer (250), wherein the transformer (250) is pressed against and attached to a bottom section side of the housing (101) by the metal frame (300) over the elastic element inserted between the metal frame (300) and the transformer (250).

Description

Technical field

[0001] The present invention relates to a DC-DC converter device and in particular to a DC-DC converter device comprising a transformer for converting an alternating high voltage into an alternating low voltage. State of the art

[0002] An electric vehicle and a plug-in hybrid vehicle include an inverter for powering a motor using a high-voltage storage battery for propulsion and a low-voltage storage battery for powering auxiliary equipment such as vehicle lights and a radio. Such a vehicle includes a DC-DC converter for converting energy from a high-voltage storage battery to a low-voltage storage battery, or vice versa.

[0003] The DC-DC converter device comprises a high-voltage circuit for converting a high-voltage DC voltage into an AC voltage, a transformer for converting a high-voltage AC voltage into a low-voltage AC voltage, a low-voltage rectifier circuit for converting a low-voltage AC voltage into a DC voltage, and a control circuit for controlling the high-voltage circuit and the low-voltage rectifier circuit.

[0004] In a DC-DC converter device, heat is generated by the semiconductor elements, transformer, and other components forming the high-voltage circuit and the low-voltage rectifier circuit. As the temperature rises due to this heat generation, the losses increase. Therefore, the enclosure housing the electronic components, including the transformer and circuitry, has a heat-dissipating design.

[0005] The following setup is known as a DC-DC converter device.

[0006] A printed circuit board (PCB) is mounted on a metal base plate. An opening is provided in a portion of the PCB, and a transformer is positioned in this opening and mounted to the base plate. A metal cover is integrated with the base plate, housing the PCB and the transformer. An inwardly projecting section is provided in an upper portion of the cover. This protruding section of the cover is press-fitted to the transformer, which is sandwiched between the base plate and the cover (see, for example, patent literature 1). List of literature Patent literature

[0007] Patent Literature 1: JP-A-2007-6635 Summary of the invention: Technical problems

[0008] In a setup described in patent literature 1, a transformer and a printed circuit board are hermetically provided in a space that has no separation, so that the setup functions poorly or one of its properties is reduced due to electromagnetic noise generated by a high-voltage-side circuit, a low-voltage-side rectifier circuit, the transformer and the like.

[0009] The design is such that a protruding section of a cover is brought into press contact with the transformer, and the transformer is sandwiched between a base plate and the cover, so that the transformer can be damaged by shock, vibration, or the like. Problem solving

[0010] A DC-DC converter device of the invention comprises: a transformer; a high-voltage-side printed circuit board assembly connected to a primary side of the transformer and forming a high-voltage-side circuit; a low-voltage-side printed circuit board assembly connected to a secondary side of the transformer and forming a low-voltage-side circuit; a control circuit board assembly controlling a control circuit for controlling the high-voltage-side circuit and the low-voltage-side circuit; a housing containing the transformer, the high-voltage-side printed circuit board assembly, the low-voltage-side printed circuit board assembly, and the control circuit board assembly; a metal frame arranged in the housing and placed between the transformer and the control circuit board assembly;and an elastic element inserted between the metal frame and the transformer, wherein the transformer is pressed against and secured to a bottom section side of the enclosure by the elastic element inserted between the metal frame and the transformer. Advantageous effects of the invention

[0011] According to the invention, electromagnetic noise from a transformer is shielded by a metal frame arranged between a control circuit board assembly and the transformer. Furthermore, the metal frame presses the transformer against a bottom section of an enclosure via an elastic element, securing it to the enclosure. This reduces the likelihood of damage to the transformer from shock or vibration. Brief description of the drawings

[0012] Fig. Figure 1 is a perspective view from the outside, illustrating an embodiment of a DC-DC converter device of the invention.

[0013] Fig. Figure 2 illustrates an embodiment of a circuit design of the in Fig. 1 illustrated DC-DC converter device.

[0014] Fig. Figure 3 is a perspective exploded view of the in Fig. 1 illustrated DC-DC converter device.

[0015] Fig. 4 is an enlarged perspective view of a Fig. 3 illustrated transformers.

[0016] Fig. Figure 5 is a perspective exploded view of the in Fig. 4 illustrated transformers.

[0017] Fig. Figure 6 is a perspective view of a control circuit map and a metal frame, as shown in Fig. 2 illustrated.

[0018] Fig. 7 is a perspective view of the in Fig. 6 illustrated metal frame seen from the back.

[0019] Fig. Figure 8 is a top view of a state in which a high-voltage printed circuit board assembly and the metal frame are housed in a casing.

[0020] Fig. Figure 9 is a top view illustrating the arrangement of the internal components, with the metal frame in Fig. 8 is transparent.

[0021] Fig. Figure 10 is a top view illustrating a state in which the control circuit board is attached to the high-voltage-side printed circuit board assembly and the metal frame, as shown in Fig. 8 illustrates.

[0022] Fig. Figure 11 is a cross-sectional view along line XI-XI of the Fig. 10.

[0023] Fig. 12 is a cross-sectional view along line XII-XII of the Fig. 10.

[0024] Fig. Figure 13 is a top view of a cooling channel provided in a bottom section of the housing.

[0025] Fig. Figure 14 is a top view to describe a relationship between the arrangement of the internal components and the cooling channel, wherein the bottom section of the housing is transparent. Description of the embodiment [Exterior of the DC-DC converter device]

[0026] An embodiment of a DC-DC converter device of the invention is described below with reference to the drawings.

[0027] Fig. Figure 1 is a perspective view of the exterior of a DC-DC converter device. 100 of the invention.

[0028] The DC-DC converter device 100It is used for electric vehicles, plug-in hybrid vehicles, and the like. The vehicle includes a low-voltage storage battery to power auxiliary devices such as lights and a radio. The DC-DC converter device 100 performs an energy conversion from a high-voltage storage battery to a low-voltage storage battery, or performs an energy conversion from the low-voltage storage battery to the high-voltage storage battery.

[0029] A circuit for performing the energy conversion is housed in a casing. 101 accommodated.

[0030] A top cover 102 is on one of the upper sides of the case 101 attached by fasteners, such as screws. A floor section 101a (see Fig. 11) is integrally mounted on one lower side of the housing 101 provided, and a bottom cover 103is on the case 101 attached by fastening elements, such as screws, in such a way that a predetermined space is created from the floor section 101a is available.

[0031] Although details are described below, a cooling channel 351 (see Fig. 13), through which a cooling medium, such as cooling water or cooling gas, flows, in the space between the floor section 101a of the case 101 and the bottom cover 103 A sealing element, such as an O-ring (not shown), is provided. It is positioned between the housing and the housing. 101 and the bottom cover 103 inserted and is designed in such a way that the cooling medium is enclosed.

[0032] The case 101 , the top cover 102 and the bottom cover 103 are formed individually, for example by means of aluminum die casting.

[0033] An inlet pipe104 , which serves as a guide to ensure that the cooling medium enters the cooling channel 351 flows, and an outlet pipe 105 , which serves as a guide to ensure that the cooling medium flows out of the cooling channel 351 The outflow is located on a side surface of the housing. 101 appropriate.

[0034] Into one side surface of the housing 101 will be an input jack 106 , which is to be connected via wiring, to supply high-voltage energy from the high-voltage storage battery to an energy conversion circuit located in the housing 101 is intended to be inserted through an opening (not shown) located in the housing. 101 is planned.

[0035] An output jack 107 , with which a wiring for outputting a DC low voltage from the one in the housing 101 The intended energy conversion circuit is connected to one side of the housing. 101A signal socket is also provided. 108 , with which a signal wiring for transmitting / receiving a low-energy signal to / from the housing 101 is connected to the intended energy conversion circuit, in which one side surface of the housing 101 planned.

[0036] The input jack 106 , the output jack 107 and the signal socket 108 can be placed individually on different side surfaces of the housing 101 be planned. [Circuit layout of the DC-DC converter device]

[0037] A circuit diagram of the DC-DC converter device is shown. 100 described.

[0038] Fig. Figure 2 shows a circuit diagram of the DC-DC converter device of the invention. The DC-DC converter device 100 has a high-voltage circuit (high-voltage circuit) 210to convert a high-voltage direct current into an alternating current, a transformer 250 for converting an alternating high voltage into an alternating low voltage and a low-voltage rectifier circuit (low-voltage circuit) 220 for converting a low-voltage alternating current into a direct current.

[0039] The DC-DC converter device 100 The embodiment has an active clamping circuit 230 to suppress a signal connected to the MOSFETs (field-effect transistors) S1 and S2 of the low-voltage rectifier circuit 220 applied impulse voltage. The active clamping circuit 230 It has active clamping MOSFETs S3 and S4 and an active clamping capacitor. 209 (C c The DC-DC converter device 100 The active clamping circuit is not necessarily required. 230 exhibit.

[0040] A resonant choke coil 230 (Lr ) is between the high-voltage side circuit 201 and the transformer 250 coupled. The switching of MOSFETs at zero voltage, which connects the high-voltage side of the circuit. 210 forming, can be achieved using a combined inductance of a resonant choke coil 203 and a stray inductance of the transformer 250 be performed.

[0041] A filter coil 207 (L1) and a filter capacitor 205 (C1) are on an output side of the low-voltage rectifier circuit 220 designed to eliminate noise superimposed on an output voltage.

[0042] It should be noted that the resonant choke coil 203 , the filter coil 207 and the filter capacitor 205They are not necessarily needed and, although the efficiency may be reduced and noise may be amplified, the DC-DC converter device can still be used for energy conversion with a circuit design that does not include these components.

[0043] The switching control of the high-voltage side circuit 210 , the low-voltage side rectifier circuit 220 and the active clamping circuit 230 is achieved by means of a control circuit 240 carried out. (Circuit diagram of the high-voltage side circuit)

[0044] The high-voltage side circuit 210 It comprises four MOSFETs H1 to H4 connected as an H-bridge, and a smoothing input capacitor. 202 (C in A snubber capacitor is provided in parallel in each of the MOSFETs H1 to H4.

[0045] By subordinating the four MOSFETs H1 to H4 of the high-voltage side circuit210 In a phase-shift PWM control, an alternating voltage is applied to a primary side of the transformer. 250 generated. (Circuit diagram of the low-voltage rectifier circuit)

[0046] The low-voltage side rectifier voltage 220 It has two rectification phases formed by the MOSFETs S1 and S2, and a smoothing circuit formed by an inductor. 206 (L out ) and a smoothing capacitor 208 (C out ). The sides with high potential of the respective rectification phases (i.e., the drain-side wiring of MOSFETs S1 and S2) are connected to a secondary side of the transformer. 250 connected. A secondary side center branch terminal of the transformer. 250 is connected to the throttle coil 206 (L out ) connected, and the smoothing capacitor 208 (C out) is connected to an output side of the choke coil 206 (L out ) tied together. [Complete setup of the DC-DC converter device]

[0047] Fig. Figure 3 is a perspective exploded view of the in Fig. 1 illustrated DC-DC converter device.

[0048] The case 101 It is made from an aluminum-based metal, such as aluminum or an aluminum alloy. The casing 101 It is designed to have a box shape, which is a largely rectangular parallelepiped shape with one side surface 101b surrounding it. A high-voltage printed circuit board assembly. 210A , the transformer 250 , the resonant choke coil 203 , the choke coil 206 , the filter coil 207 , a low-voltage printed circuit board assembly 220A , a metal frame 300and a control circuit card assembly 240A are in the case 101 accommodated.

[0049] The high-voltage side circuit board assembly 210A It is designed such that the MOSFETs H1 to H4, which control the high-voltage side circuit 210 form, a smoothing input capacitor 212 and electronic components (not shown), such as a gate resistor, on a high-voltage printed circuit board 211 are mounted. The MOSFETs H1 to H4, which are located on the high-voltage side of the circuit board. 211 are mounted on the floor section 101a of the case 101 An insulating film (not shown) is attached by fasteners (not shown). The insulating film (not shown) is attached in such a way that one side of its surface is pressed against the bottom section. 101a of the case 101is in contact and is cooled by the cooling medium, which is located on the side of the bottom section. 101a of the case 101 intended cooling channel 351 flows.

[0050] The low-voltage side printed circuit board assembly 220A is designed such that the MOSFETs S1 and S2, which control the low-voltage rectifier circuit 220 form, the smoothing capacitor 208 (C out ) and the active clamping MOSFETs S3 and S4, which form the active clamping circuit 230 form, the active clamping capacitor 209 (C c ) and electronic components (not shown), such as a gate resistor, on a low-voltage side circuit board 221 are mounted.

[0051] Although not shown, the low-voltage side circuit board 221A structure in which, for example, an insulating film is provided on an area of ​​a metal substrate, and a wiring pattern is provided on the insulating film. Each of the MOSFETs S1 to S4 has a package structure in which a circuit section is sealed by a resin, and a drain terminal, connected to a drain electrode, is provided on an area of ​​the resin. The drain terminal of each of the MOSFETs S1 to S4 is connected to a drain pattern of the metal substrate by soldering. An opposite surface of a mounting area of ​​the low-voltage side circuit board. 221 is on the ground section 101a of the case 101 directly or via a heat conduction element, and heat generated by each of the MOSFETs S1 to S4 is transferred via the metal substrate to the bottom section. 101a of the case 101 transferred. The heat that reaches the floor section 101a of the case 101The material being transferred is cooled by the cooling medium, which flows through the cooling channel. 351 flows, which is on the side of the bottom section 101a of the case 101 is planned.

[0052] The transformer 250 , the choke coil 206 and the filter coil 207 are on the ground section 101a of the case 101 They are positioned and secured by fasteners (not shown). The metal frame 300 is attached to the transformer 250 , the choke coil 206 and the filter coil 207 to cover those in the case 101 are housed.

[0053] Although details are described below, the transformer 250 , the choke coil 206 and the filter coil 207 secured in a state in which the transformer 250 , the choke coil 206 and the filter coil 207through the metal frame 300 to the floor section 101a of the case 101 be pressed.

[0054] In the section of soil 101a of the case 101 , which is on the upper side of the high-voltage side of the printed circuit board assembly 210A This corresponds to a recess (not shown) and the resonant choke coil. 203 housed in the recess. The high-voltage side circuit board assembly. 210A is on one upper side of the resonant choke coil 203 placed.

[0055] The control circuit map assembly 240A It is built by assembling electronic components that complete the control circuit. 240 on a control circuit map 241 form, and is mounted on the metal frame 300 Attached by fasteners (not shown). In the control circuit board assembly 240A will the top cover 102 on the case101 attached by the fastening elements. [Transformer structure]

[0056] Fig. Figure 4 is an enlarged perspective view of the scene in Fig. 3 illustrated transformers. Fig. Figure 5 is a perspective exploded view of the in Fig. 4 illustrated transformers.

[0057] As in Fig. As illustrated in section 5, the transformer 250 a setup in which a coil 255 , in order to create a primary winding 254 is wound, and a pair of upper and lower secondary windings 252 through a pair of nuclei 251 are sandwiched around the E-type.

[0058] A pair of clamps 254a are in the primary winding 254 provided and a passageway 254b , which can be inserted through a fastening element, such as a screw, is in each clamp 254aprovided. Each of the secondary windings 252 It is formed by subjecting a copper plate to a press mold to create a secondary winding section and a busbar in one piece. Each secondary winding 252 has a clamp 252a and a center branch terminal 252b in their end sections. The clamp 252a and the center branch terminal 252b They each have through openings. 252c , through which a fastening element, such as a screw, can be inserted. The center branch terminals 252b the upper and lower secondary windings 252 are stacked.

[0059] The heat transfer plates 253 , which are made of an elastic material, wherein the material is made of silicone or the like, are between the upper core 251 and the secondary windings 252 or between the lower core 251and the secondary windings 252 planned.

[0060] As in Fig. As illustrated in section 4, the kernels are 251 designed so that they have a smaller width than the heat transfer plates 253 exhibit, and each of the heat transfer plates 253 is formed by side sections of the cores 251 exposed. The clamps 254a the primary winding 254 and the clamps 252a and the center branch terminals 252b the secondary windings 252 are to the sides of the heat transfer plates 253 extended.

[0061] One of the clamps 254a the primary winding 254 of the transformer 250 is with the resonant choke coil 203 connected by the fastening element that passes through the corresponding through-opening 254b is inserted. The other clamp 254a the primary winding 254 of the transformer250 is connected directly or via a busbar to the high-voltage side circuit board assembly 210A electrically connected by the mounting element, which passes through the corresponding opening 254b is introduced. The terminals 252a and the center branch terminals 252b the secondary windings 252 of the transformer 250 are connected directly or via a busbar to the low-voltage side circuit board assembly 220A electrically connected by the fastening elements that pass through the respective openings 252c be introduced. [Arrangement within the housing]

[0062] Fig. Figure 6 is a perspective view of the control circuit map and the metal frame, as shown in Fig. 2 is illustrated. Fig. 7 is a perspective view of the in Fig. 6 illustrated metal frame, as seen from the back. Fig. Figure 8 is a top view of a state in which the high-voltage printed circuit board assembly and the metal frame are housed in the enclosure. Fig. Figure 9 is a top view illustrating the arrangement of the internal components, where the metal frame is in Fig. 8 is transparent.

[0063] As in Fig. As illustrated in 9, the high-voltage side printed circuit board assembly is shown. 210A in a lower left corner of the case 101 arranged. The transformer 250 is located above the high-voltage side of the circuit board assembly 210A placed. An upper left corner of the transformer. 250 is in close contact with an upper left corner of the case 101 .

[0064] As described above, the resonant choke coil 203 near the top side of the high-voltage printed circuit board assembly 210A placed. It should be noted that Fig. 8 and Fig. 9 Illustrate a state in which the top side of the high-voltage printed circuit board assembly 210A removed and the resonant choke coil 203 has been exposed.

[0065] The low-voltage side printed circuit board assembly 220A is on the right side of the transformer 250 arranged. An upper right corner of the low-voltage side circuit board assembly 220A is in close contact with an upper right corner of the case 101 The choke coil 206 and the filter coil 207 are arranged in the right and left directions to be in close contact with a lower side of the low-voltage printed circuit board assembly 220A to be, so that the choke coil 206 in the middle of the case 101 is arranged and the filter coil 207 coming into close contact with the right side of the case 101 is located.

[0066] The metal frame 300 has a large rectangular area section 300a , which is the low-voltage side printed circuit board assembly 220A , the choke coil 206 and the filter coil 207 covered, and a small rectangular area section 300b , which differs from the large area section 300a extends to the transformer 250 to cover. As in Fig. As illustrated in section 8, the small area section 300b such an area, which only contains the transformer 250 covered. The metal frame 300 has an area that covers the entire area within the housing 101 covered, with the exception of one region where the high-voltage side printed circuit board assembly 210A is arranged.

[0067] As in Fig. Figure 6 illustrates a plurality of rounded lead sections. 301 , which belong to the control circuit card assembly 240Aare designed to be in the metal frame 300 planned. The control circuit carton assembly 240A is secured to the round protruding sections by the fastening elements (not shown), such as screws. 301 the metal frame 300 attached and fixed.

[0068] As in Fig. As illustrated in figure 7, there are three flat springs. 311 until 313 by fastening elements, such as screws, on an opposite surface (back surface) of the metal frame 300 attached, with the opposite surface facing a side on which the control circuit card assembly is located. 240A is intended. The flat springs 311 until 313 are made of stainless steel. The flat spring 311 is on one rear surface of the small area section 300b installed in a position that allows the transformer 250corresponds. The flat springs 312 and 313 are located on one rear surface of the large area section 300a in positions that are adjacent to the choke coil 206 or the filter coil 207 correspond to electronic components with a comparatively larger weight.

[0069] A separation section 302 , which leads to the floor section 101a of the case 101 It is bent towards one side of the metal frame. 300 on the side of the high-voltage circuit board assembly 210A planned. The separation section 302 is part of an entire region of the small area section 300b extended, and the small section of the area 300b is closer to the ground section 101a of the case 101 as the large area section 300a namely by one stage of the separation section 302 .

[0070] A plurality of through openings 303 is in the metal frame 300 provided and by means of fastening elements (not shown), such as screws, which pass through the through-holes 303 to be introduced at rounded lead sections 101c (see Fig. 3) attached, which are in the floor section 101a of the case 101 are deployed.

[0071] The control circuit map assembly 240A is attached to the metal frame 300 and the high-voltage side circuit board assembly 210A appropriate. Fig. 10 is a top view illustrating a state in which the control circuit card assembly 240A on the high-voltage side circuit board assembly 210A and the in Fig. 8 illustrated metal frames 300 appropriate.

[0072] As described above, the control circuit card assembly 240Aat the rounded lead sections 301 the metal frame 300 attached by fasteners, such as screws.

[0073] The assembly includes the control circuit card assembly. 240A through the metal frame 300 from the transformer 250 , the low-voltage side printed circuit board assembly 220A , the choke coil 206 and the filter coil 207 separated. Therefore, the control circuit card assembly is 240A shielded from electromagnetic noise emanating from the transformer 250 , the low-voltage side printed circuit board assembly 220A , the choke coil 206 and the filter coil 207 is generated. [Transformer mounting structure]

[0074] An embodiment of a mounting structure for the transformer is described. 250 described.

[0075] Fig. Figure 11 is a cross-sectional view along line XI-XI of the Fig. 10, and Fig. 12 is a cross-sectional view along line XII-XII of the Fig. 10.

[0076] A leading section 304 is planned in an area that is the core 251 of the transformer 250 in the metal frame 300 This corresponds to a rounded lead section. 301a , which is directed outwards, being an upper side of the Fig. 11 is in the lead section 304 provided. The flat spring 311 is inside the protrusion section 304 attached. The flat spring 311 is attached to the metal frame 300 by means of a fastening element 361 , such as a screw, attached to the round protruding section 301a The intended internal thread section is screwed in.

[0077] The flat spring 311presses the kernels 251 of the transformer to the ground section 101a of the case 101 in a state where the metal frame 300 on the case 101 is attached. This secures the transformer. 250 between the flat spring 311 and the floor section 101a of the case 101 attached.

[0078] In this state, a heat-radiating contact section is formed. 305 , which covers the lead section 304 the metal frame 300 surrounds, with the upper heat transfer plate 253 brought into contact. A round lead section. 101c 1, which is in the soil section 101a of the case 101 As provided, it will be used with the lower heat transfer plate. 253 brought into contact.

[0079] Therefore, the secondary windings 252 of the transformer 250 heat generated via the cores 251and the flat spring 311 on the metal frame 300 The heat is transferred and then radiated away. Furthermore, the heat generated by the secondary windings is... 252 of the transformer 250 is generated via the heat transfer plates. 253 on the metal frame 300 It is transmitted and then broadcast.

[0080] The heat transfer plates 257 , which are made of an elastic material, such as silicone, are mounted on the busbars, which are the upper and lower secondary windings. 252 of the transformer 250 This concerns the upper heat transfer plate. 257 is equipped with a heat-radiating system section 306 the metal frame 300 brought into contact, and the lower heat transfer plate 257 will be with a round lead section 101c 2 brought into contact, which is in the soil section 101aof the case 101 is planned.

[0081] The cooling channel 351 , through which the cooling medium is circulated, is located between the bottom section 101a of the case 101 and the lid 103 provided for the lower surface.

[0082] Therefore, the heat generated by the transformer 250 is generated via the heat transfer plates. 253 and 257 on the floor section 101a of the case 101 transferred and cooled by the cooling medium which passes through the cooling channel 351 flows.

[0083] As described above, the flat springs correspond to 312 and 313 , which are attached to the metal frame 300 are attached to an upper section of the choke coil 206 or an upper section of the filter coil 207 .

[0084] The choke coil 206 and the filter coil 207 as well as the transformer250 are caused by the flat springs 312 or 313 in a state at the bottom section 101a of the case 101 pressed and attached to it, in which the metal frame 300 on the case 101 is appropriate. Therefore, heat from the choke coil is 206 and the filter coil 207 is produced, also on the metal frame 300 or the case 101 transferred and is cooled by the cooling medium which flows through the cooling channel 351 flows. [Construction of the cooling channel]

[0085] The cooling capacity for cooling heat generated by electronic power supply components, such as the transformer 250 , the resonant choke coil 203 , the choke coil 206 , the filter coil 207 , the high-voltage side circuit board assembly 210A and the low-voltage side circuit board assembly 220AThe efficiency of the generated heat can be improved by constructing the cooling channel using the cooling medium.

[0086] The following describes an embodiment of the cooling channel design that can improve cooling efficiency.

[0087] Fig. Figure 13 is a top view of the cooling channel provided in the bottom section of the housing, and Fig. Figure 14 is a top view showing the relationship between the arrangement of the internal components and the cooling channel, where the bottom section of the housing is transparent. It should be noted that in Fig. 13 and Fig. 14 of the bottom covers 103 is removed.

[0088] As in Fig. As illustrated in 13, there are multiple guide walls. 352 , which serve as guides for the flow direction of the cooling medium passing through the cooling channel 351 flows, integrated with the housing 101in the soil section 101a of the case 101 trained.

[0089] The cooling channel 351 It has a region I and a region II, each of which allows the cooling medium to be recirculated. In particular, the cooling medium flows out of the outlet pipe. 105 out, after the cooling medium, which comes from an inlet pipe 204 flows away, in area I in an up-and-down direction of the Fig. 13 and Fig. 14 flows upwards and downwards and also flows upwards and downwards in the up and down direction in area II, i.e. after the cooling medium is returned to each of the areas.

[0090] As in Fig. As illustrated in 14, the high-voltage side printed circuit board assembly 210A , the resonant choke coil 203 and the transformer 250 in area I of the cooling channel 351 positioned so that the high-voltage side circuit board assembly 210Aon the side of the inlet pipe 104 is planned.

[0091] The choke coil 206 , the filter coil 207 and the low-voltage side printed circuit board assembly 220A will be in area II of the cooling channel 351 placed. The choke coil 206 and the filter coil 207 are located on the side of the outlet pipe 105 arranged in a right- and left-hand direction, and the low-voltage side printed circuit board assembly 220A is above the choke coil 206 and the filter coil 207 arranged.

[0092] The cooling medium that enters the inlet pipe 104 in area I of the cooling channel 351 The flow cools the high-voltage side of the circuit board assembly. 210A , the resonant choke coil 203 and the transformer 250 Then the cooling medium flows from a position where the cooling medium flows to the side of the inlet pipe. 104is returned to area II and flows to the side of the low-voltage printed circuit board assembly. 220A . The cooling medium then flows into area II in the right and left directions to successively cool the low-voltage side circuit board assembly. 220A , the choke coil 206 and the filter coil 207 to cool and thereby the outlet pipe 105 to reach.

[0093] The cooling medium that enters from the inlet pipe 104 The air flowing in has not yet absorbed any heat from the electronic power supply components located in the housing. 101 It is housed within a low temperature range. This makes it possible to operate the high-voltage printed circuit board assembly. 210A , the resonant choke coil 203 and the transformer 250 , which has a large heat generation capacity, to cool effectively.

[0094] As described above, the cooling medium cools the electronic power supply components, which have a large heat generation amount, and then the cooling medium flows into area II to cool the low-voltage side printed circuit board assembly. 220A , the choke coil 206 and the filter coil 207 to cool them one after the other.

[0095] The cooling capacity also depends on the depth of the cooling channel. 351 In a shallow cooling channel 351a The flow rate of the cooling medium increases, and its flow rate increases, thus increasing the cooling capacity. It is therefore preferred to improve the overall cooling capacity, i.e., to improve the cooling efficiency in such a way that the depth of the cooling channel is increased. 351in an area of ​​a component to which the cooling capacity should mainly be applied, is designed such that the depth is less than in a surrounding area in order to reduce the flow rate of the cooling medium. [Effects of the embodiment]

[0096] According to the embodiment, the following effects can be obtained. (1) A substrate assembly comprising an energy conversion circuit section of the DC-DC converter device 100 The resulting circuit is integrated into the high-voltage side circuit board assembly. 210A , the low-voltage side printed circuit board assembly 220A and the control circuit map assembly 240A subdivided. The control circuit map assembly 240A is through the metal frame 300 from the transformer 250 , the low-voltage side printed circuit board assembly 220A , the choke coil 206 and the filter coil 207separate. Therefore, the control circuit map assembly can be 240A be shielded from electromagnetic noise emanating from the transformer 250 , the low-voltage side printed circuit board assembly 220A , the choke coil 206 and the filter coil 207 is generated. (2) The transformer 250 , the choke coil 206 and the filter coil 207 , which have a high weight, are supported by the flat springs 311 , 312 or 313 to the floor section 101a of the case 101 pressed, which is attached to the metal frame 300 are attached and are placed between the respective flat springs. 311 until 313 and the floor section 101a attached.

[0097] Since the flat springs 311 until 313 exhibiting elasticity, it is possible to assess the possibility of damage to the transformer. 250 , the choke coil206 and the filter coil 207 even in a case where the DC-DC converter device 100 is subjected to a shock or vibration. (3) The flat springs 311 until 313 are formed by a metal element with thermal conductivity, such as stainless steel. Therefore, the heat generated by the transformer can be dissipated. 250 , the choke coil 206 and the filter coil 207 is produced on the metal frame 300 It can be transmitted and then broadcast. (4) The transformer 250 It has a design in which the heat transfer plates 253 immediately below the pair of upper and lower nuclei 251 are included, and has a structure in which the heat-radiating system section 306 the metal frame 300 with the upper heat transfer plate 253is brought into contact. This dissipates heat from the secondary windings. 252 of the transformer 250 is transmitted via the core 251 on the metal frame 300 transferred and is also directly applied to the heat-radiating section of the system. 306 the metal frame 300 The heat is transferred and then radiated. This improves the heat dissipation properties of the transformer. 250 to the metal frame 300 . Since the heat transfer plates continue 253 integrated with the transformer 250 If planned, it is possible to effectively carry out repairs, disassembly and reassembly during maintenance. (5) The heat transfer plate 257 is between the upper secondary winding 252 of the transformer 250 and the heat-radiating section of the system 306 the metal frame 300inserted. This makes it possible to dissipate the heat generated by the secondary windings. 252 of the transformer 250 is generated, also via the heat-radiating section of the system. 306 on the metal frame 300 to transfer. In this way, the heat transfer property is improved. (6) The rounded lead section 101c 1, which is in the soil section 101a of the case 101 As provided, it will be used with the lower heat transfer plate. 253 of the transformer 250 brought into contact. This makes it possible to dissipate the heat generated by the transformer. 250 is generated via the heat transfer plate 253 on the floor section 101a of the case 101 to transfer. Therefore, the heat-radiating property of the transformer is 250 improved. (7) The heat transfer plate 257 is between the lower secondary winding 252of the transformer 250 and the rounded lead section 101c 2 inserted, which is in the floor section 101a of the case 101 This is planned. This will make it possible to dissipate the heat generated by the transformer. 250 is generated via the heat transfer plate 257 on the metal frame 300 to transfer. In this way, the heat-radiating property of the transformer is enhanced. 250 improved. (8) The cooling channel 351 , through which the cooling medium flows, is located between the bottom section 101a of the case 101 and the bottom cover 103 provided for. Therefore, heat that is in the transformer can 250 , the resonant choke coil 203 , the choke coil 206 and the filter coil 207 is generated and which goes to the housing 101 to be transferred through the cooling channel 351 The flowing cooling medium is used for cooling. (9) The insulating film (not shown) of the high-voltage side printed circuit board assembly 210A and the metal substrate of the low-voltage side circuit board 221 in the low-voltage side printed circuit board assembly 220A are with the floor section 101a of the case 101 brought into contact. Therefore, heat generated by the MOSFETs H1 to H4 of the high-voltage side circuit board assembly can be dissipated. 210A , the MOSFETs S1 to S4 of the low-voltage side printed circuit board assembly 220A and similar things are produced, to the floor section 101a of the case 101 be transferred and can be transferred through the cooling medium that passes through the cooling channel 351 The fluid flows and can be effectively cooled. A silicone rubber film or a ceramic plate made of silicone nitride or a similar material with high thermal conductivity can be used as an insulating film.

[0098] It should be noted that the embodiment includes rectifying elements in the low-voltage-side rectifier circuit. 220 The rectification phase is illustrated using MOSFETs S1 and S2. However, the rectifying elements can be replaced by diodes. Furthermore, each rectification phase is illustrated as a circuit implemented using a single rectifying element. However, each rectification phase can also be implemented as a circuit in which multiple rectifying elements are connected in parallel.

[0099] The embodiment illustrates a setup in which the transformer 250 , the choke coil 206 and the filter coil 207 through the flat springs 111 until 113 at the bottom section 101a of the case 101 They can be attached. However, damping elements made of an insulating resin can be used instead of the flat springs. 111 until 113can be used. This means that any element can be used as long as the element possesses elasticity.

[0100] As elements for pressing the throttle coil 206 and the filter coil 207 to the floor section 101a of the case 101 The elastic elements are not necessarily needed, and the choke coil 206 and the filter coil 207 can from the metal frame 300 They themselves must be pressed down. This means that at least the transformer 250 from the elastic element to the floor section 101a of the case 101 It must be pressed down and attached.

[0101] The embodiment illustrates a setup in which the transformer 250 , the control circuit map assembly 240A , the high-voltage side circuit board assembly 210A and the low-voltage side printed circuit board assembly 220Aalternating sides of the metal frame 300 must be shielded. However, at least the control circuit board assembly must be shielded. 240A from electromagnetic noise from the transformer 250 through the metal frame 300 be shielded.

[0102] The embodiment illustrates the housing 101 with a setup in which the cooling channel 351 between the floor section 101a and the bottom cover 103 is intended. However, the DC-DC converter device can 100 , which do not use the cooling channel 351 encompasses being formed by the fact that the floor section 101a of the case 101 is attached using a cooling jacket that is located in another device, such as an inverter device, with which the DC-DC converter device 100 is connected, is provided for.

[0103] The embodiment illustrates the flat spring. 311 as a structure attached to the metal frame 300 It is attached. However, a damping element or the like can be used instead of the flat spring. 311 can be used, and the damping element can be designed so that it can be attached to the transformer by gluing or the like. 250 is attached.

[0104] The embodiment illustrates a setup in which the transformer 250 and the like directly on the ground section 101a of the case 101 It is attached. However, a thermally conductive element can be placed between the transformer and the transformer. 250 and the like, and the floor section 101a of the case 101 to be installed, and the transformer 250 and the like can be pressed against the thermally conductive element. This means that the transformer 250and the like only need to be constructed in such a way that they are attached to the side of the floor section 101a of the case 101 are pressed through and attached to the elastic elements located between the metal frame 300 and the transformer 250 and the like.

[0105] As described above, the DC-DC converter device can 100 , which is the resonant choke coil 203 and the filter coil 207 not included, be trained. On the other hand, the DC-DC converter device can 100 to be trained, which includes other electronic components, such as the filter capacitor. 205 , will be added.

[0106] Furthermore, the invention can be modified and applied in various ways within its scope. This means that the invention only needs to have one setup in which a metal frame is placed between a transformer located in a housing and a control circuit board assembly, an elastic element is inserted between the metal frame and the transformer, and the transformer is pressed against and secured to a bottom section of the housing by the elastic element inserted between the metal frame and the transformer. Reference symbol list 100 DC-DC converter device 101 cases 101a Soil section 101c round lead section 101c1, 101c2 rounded lead section 104 Inlet pipe 105 Outlet pipe 203 Resonant choke coil 206 Throttle coil 207 Filter coil 210 High-voltage side circuit 210A High-voltage side printed circuit board assembly 220 Low-voltage side rectifier circuit 220A Low-voltage side printed circuit board assembly 240 Control circuit 240A Control Circuit Board Assembly 250 transformer 251 core 252 Secondary winding 253, 257 Heat transfer plate 254 Primary winding 300 metal frames 301 round lead section 302 Separation section 305 heat-radiating contact section 306 heat-radiating system section 311 to 313 Flat spring 351 Cooling channel S1 a to S1 d , S2 a to S2 d MOSFET (field-effect transistor)

Claims

[1] DC-DC converter device comprising: a transformer; a high-voltage-side printed circuit board assembly that is connected to a primary side of the transformer and forms a high-voltage-side circuit; a low-voltage printed circuit board assembly connected to a secondary side of the transformer, forming a low-voltage circuit; a control circuit board assembly that forms a control circuit for controlling the high-voltage side circuitry and the low-voltage side circuitry; a housing that contains the transformer, the high-voltage printed circuit board assembly, the low-voltage printed circuit board assembly, and the control circuit board assembly; a metal frame placed inside the enclosure and positioned between the transformer and the control circuit board assembly; and an elastic element inserted between the metal frame and the transformer, wherein The transformer is pressed against and attached to a bottom section side of the housing by the elastic element inserted between the metal frame and the transformer. [2] DC-DC converter device according to claim 1, wherein the elastic element is a spring element. [3] DC-DC converter device according to claim 1, wherein the elastic element is made of a resin. [4] DC-DC converter device according to claim 1, wherein the housing includes a cooling channel for cooling the transformer on the bottom section side. [5] DC-DC converter device according to claim 1, wherein the transformer has a heat transfer plate and the metal frame has a heat-radiating contact section which is brought into contact with the heat transfer plate. [6] DC-DC converter device according to claim 1, wherein the metal frame has a heat-radiating system section which is brought into contact with a busbar which is connected to the secondary winding of the transformer. [7] DC-DC converter device according to claim 1, further comprising an inductor, wherein the inductor is pressed against and attached to the bottom section side of the housing by the metal frame via an elastic element inserted between the metal frame and the inductor. [8] DC-DC converter device according to claim 1, further comprising a filter coil, wherein the filter coil is pressed against and attached to the bottom section side of the housing by an elastic element inserted between the metal frame and the filter coil. [9] DC-DC converter device according to claim 1, wherein the housing has a plurality of round protruding sections extending towards the control circuit board assembly, and the metal frame is attached to the plurality of round protruding sections. [10] DC-DC converter device according to claim 1, wherein the metal frame is shaped such that the high-voltage side printed circuit board assembly is exposed.

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