Electronic assembly structure and electronic component
DE112014001419B4Active Publication Date: 2026-07-23YAZAKI CORP
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Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- YAZAKI CORP
- Filing Date
- 2014-03-13
- Publication Date
- 2026-07-23
AI Technical Summary
Technical Problem
Conventional relay modules in automobiles experience deformation of lead terminals due to concentrated load when inserted into electrical connection boxes, affecting connection state and holding force.
Method used
An electronic assembly structure with a component main body, lead terminals, and an insulating member that contacts the base ends of the lead terminals to distribute stress, preventing deformation and maintaining a stable connection.
Benefits of technology
The solution effectively prevents deformation of lead terminals, ensures reliable electrical connections, and prevents short circuits while reducing the number of components and module size.
✦ Generated by Eureka AI based on patent content.
Abstract
Electronic assembly structure comprising: an electronic component (21) with a component main body (24) having a cuboid shape, a plurality of conductor terminals (25) projecting from side surfaces of the component main body (24), and an insulating element (26); a housing element (23) into which the component main body (24) is inserted and received by surrounding four side walls of the component main body (24) with wall regions (39) of the housing element (23); and a plurality of terminal pieces (22) held in the housing element (23) and to which the conductor terminals (25) are attached, each of the conductor terminals (25) comprising a base end (34) projecting from at least one side surface of the component main body (24) and a contact region (35) connected to the base end (34) to drop along the side surface.the insulating element (26) is attached to the component main body (24) and the insulating element (26) is contacted or prepared at the base ends (34) of a side of an end surface of the component main body (24) that is furthest away from a bottom wall (38) of the housing element (23) when the electronic component (21) is inserted into the housing element (23), and the component main body (24) and the insulating element (26) are inserted into and received in the housing element (23), the majority of conductor terminals (25) positioned on outside surfaces of the wall areas (39) of the housing element (23) come into contact with the majority of terminals (22) accordingly, and the electronic component (21) is inserted into the housing element (23).
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