Semiconductor module
The introduction of a sealing gel expansion suppression plate in semiconductor modules mitigates the effects of gel expansion, ensuring reliability by preventing excessive stress and separation, thus improving performance at elevated temperatures.
DE112015006064B4Active Publication Date: 2026-07-09MITSUBISHI ELECTRIC CORP
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- MITSUBISHI ELECTRIC CORP
- Filing Date
- 2015-01-27
- Publication Date
- 2026-07-09
AI Technical Summary
Technical Problem
Semiconductor modules for electrical power applications experience damage and degradation due to moisture absorption and temperature-induced expansion of the sealing gel, leading to broken wires and separation from the insulating substrate.
Method used
Incorporation of a sealing gel expansion suppression plate positioned inclined towards the upper surface of the sealing gel to prevent excessive pressure and separation, with additional configurations such as grid-shaped frames, inverted V-shapes, and buffer materials to manage expansion.
Benefits of technology
The solution effectively reduces stress on sealed objects, preventing damage and separation, thereby enhancing the reliability of semiconductor modules at high temperatures.
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Smart Images
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Abstract
Semiconductor module (600, 700) comprising: a semiconductor element (6a, 6b) connected to a metal pattern (5) on an insulating substrate (3) contained in a housing (1); a sealing gel (2) sealing the insulating substrate (3) and the semiconductor element (6a, 6b) within the housing (1); and a sealing gel expansion suppression plate (8) arranged to contact an upper surface of the sealing gel, the upper surface of the sealing gel (2) having a plurality of holes (2c), and the housing (1) having a cover (1a) closing an opening of the housing (1) and a space between the cover (1a) and the upper surface of the sealing gel (2).
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