Optoelectronic component and lighting device

Abstract

Optoelectronic component (100) with an optoelectronic semiconductor chip (300) and an optical element (400, 410, 420, 430, 440), wherein the optical element (400, 410, 420, 430, 440) has a prism structure (500) on an upper side (401) facing away from the semiconductor chip (300), which prism structure is designed to split light (330) emitted by the semiconductor chip (300) into two beams (340, 350).

Description

The present invention relates to an optoelectronic component according to patent claim 1 and to a lighting device according to patent claim 15.It is known to use optoelectronic components, for example light-emitting diode components, for lighting purposes. It is known to equip optoelectronic components with optical elements for beam shaping of the light used for illumination.US 2012 0 099 193 A1 describes such a component with lens elements.DE 10 2013 204 476 A1 describes an optical element having a first surface and a second surface. On the first surface, a tooth structure having a plurality of teeth oriented in a second direction is arranged. On the second surface, a relay lens structure having a plurality of relay steps oriented in a first direction is disposed.DE 198 41 863 B4 describes a device for splitting a light beam into two output light beams, comprising a stationary light source for generating an input light beam along an optical axis and a beam splitter element which is acted upon by the input light beam and has a light entry surface for the input light beam lying perpendicular to the optical axis, a first light exit surface for a first output light beam and an opposite second light exit surface for a second output light beam. The light exit surfaces are oriented parallel to the optical axis. The output light beams emerge from the beam splitter element perpendicular to the optical axis and offset with respect to one another.U.S. Pat. No. 7,359,103 B2 describes a light modulator having an inclined optical element for deflecting a light beam. The optical element can be tilted electromechanically.US 2002 / 0 109 918 A1 describes a beam splitter and beam combiner with two birefringent parts.US 2007 / 0 047 254 A1 describes an illumination arrangement with a reflective substrate and one or more light sources.US 2011 / 0 149 018 A1 describes a holographic display device having at least one magneto-optical light modulator.An object of the present invention is to provide an optoelectronic component. This object is achieved by an optoelectronic component having the features of claim 1. Another object of the present invention is to provide a lighting device. This object is achieved by a device having the features of claim 15. Various refinements are specified in the dependent claims.An optoelectronic component comprises an optoelectronic semiconductor chip and an optical element. The optical element has a prism structure on a top side facing away from the semiconductor chip, which prism structure is designed to split light emitted by the semiconductor chip into two beams.The two beams that can be generated by this optoelectronic component can be used to illuminate two separate spatial or surface regions. Since the two beams are generated from the light emitted by only one optoelectronic semiconductor chip, changes in the ratio of the brightnesses of the two beams to one another are advantageously substantially excluded. For example, a temperature change does not cause a change in the ratio of the brightnesses of the two beams. In particular, it can advantageously be achieved that both radiation beams that can be generated by the optoelectronic component always have substantially the same brightness.By distributing the light emitted by the optoelectronic semiconductor chip of the optoelectronic component with the prism structure of the optical element, it can be achieved that the two beams generated by distributing the emitted light have substantially the same emission characteristic as the light emitted by the optoelectronic semiconductor chip before it is divided into the two beams.In one embodiment of the optoelectronic component, the prism structure comprises a plurality of individual prism structures arranged side by side. This makes it possible to form the prism structure of the optical element of the optoelectronic component with a low overall height, which makes it possible to implement the optoelectronic component with compact external dimensions.In one embodiment of the optoelectronic component, the optical element comprises a lens structure. The lens structure can bring about beam shaping of the light emitted by the semiconductor chip of the optoelectronic component and of the beams generated from the emitted light. For example, the lens structure can serve to bundle the light emitted by the optoelectronic semiconductor chip. The beams generated from the radiated light can then also have a narrow-angle characteristic.In one embodiment of the optoelectronic component, the lens structure is formed convexly. For example, the lens structure can be formed as a convex spherical lens. The lens structure can, however, also be formed, for example, as a free-form lens, as an elliptical lens or in another way.In one embodiment of the optoelectronic component, the optical element has a beam deflection structure which is configured to deflect both beams in a common direction. This advantageously makes it possible to deflect the beams generated by the optoelectronic component in the direction of a target region to be illuminated.In one embodiment of the optoelectronic component, the beam deflection structure is configured as tilting a surface of the optical element against a direction perpendicular to a radiation emission direction of the semiconductor chip. Advantageously, the beam deflection structure of the optical element thereby makes it possible to deflect the beams generated by the optoelectronic component in a direction deviating from the radiation emission direction of the semiconductor chip. Advantageously, this makes it possible to arrange the optoelectronic component in such a way that the target regions to be illuminated by the radiation beams are located in a direction tilted counter to the radiation emission direction of the semiconductor chip.In one embodiment of the optoelectronic component, the prism structure is configured to deflect the beams of rays with respect to one another in a first direction. The beam deflection structure is configured to deflect the beams together in a second direction perpendicular to the first direction. Advantageously, this enables a particularly flexible adaptation of the optoelectronic component to a geometry of a target area to be illuminated by the optoelectronic component.In one embodiment of the optoelectronic component, the prism structure and the beam deflection structure are arranged on the top side of the optical element and are superimposed on one another. The beam deflection structure can be formed by tilting the prism structure. The arrangement of the prism structure and the beam deflection structure on a common surface of the optical element advantageously makes it possible to configure an opposite surface of the optical element in a planar manner or to equip it with a further optical function.In one embodiment of the optoelectronic component, each individual prism structure of the prism structure is divided into a plurality of sections in the longitudinal direction. In this case, the individual sections of each prism structure are offset with respect to one another in the radiation emission direction of the semiconductor chip. This makes it possible to configure a tilting of the prism structure forming the beam deflection structure with a low overall height. This is achieved in that each individual section of each individual prism structure of the prism structure is individually tilted. Advantageously, the optical element of the optoelectronic component can thereby have a small height, which makes it possible to form the optoelectronic component with compact external dimensions.In one embodiment of the optoelectronic component, the lens structure and the beam deflection structure are arranged on a common surface of the optical element and are superimposed on one another. In this case, the beam deflection structure can be formed, for example, by tilting the lens structure. The arrangement of the lens structure and the beam deflection structure on a common surface of the optical element advantageously makes it possible to configure an opposite surface of the optical element in a planar manner or to equip it with an additional optical function.In one embodiment of the optoelectronic component, the optical element has a bottom side facing the semiconductor chip. In this case, the underside, the upper side or both the underside and the upper side can be designed as optically functional surfaces of the optical element.In one embodiment of the optoelectronic component, the latter has a housing. The semiconductor chip is arranged on or in the housing. The optical element abuts the housing. The optoelectronic semiconductor chip can be arranged, for example, in a cavity of the housing. This advantageously results in a compact embodiment of the optoelectronic component.In one embodiment of the optoelectronic component, the underside of the optical element has a circumferential edge. The circumferential edge abuts the housing. Advantageously, this enables a simple fastening of the optical element to the housing of the optoelectronic component. In this case, the contact of the circumferential edge with the housing of the optoelectronic component also ensures simultaneously compliance with a desired orientation of the optical element.In one embodiment of the optoelectronic component, the semiconductor chip is configured to emit light having a wavelength from the infrared spectral range. The optoelectronic component is thereby advantageously suitable for illumination purposes in which illumination with visible light is undesirable.The two beams that can be generated by the optoelectronic component advantageously enable two separate spatial or surface regions to be illuminated. In this case, it is advantageously ensured that both spatial or surface regions are always illuminated with the same ratio of brightness, for example with the same brightness.The above-described characteristics, features and advantages of this invention and the manner in which these are achieved become clearer and more clearly comprehensible in conjunction with the following description of the exemplary embodiments, which are explained in more detail in conjunction with the drawings. These are shown in a diagrammatic representation FIG. 1 shows a perspective view of a part of a lighting device comprising an optoelectronic component with a first optical element; FIG. 2 shows a sectional side view of the optoelectronic component; FIG. 3 is a perspective view of a second optical element; FIG. 4 is a perspective view of a third optical element; FIG. 5 shows a perspective view of a fourth optical element; FIG. 6 shows a first perspective view of a fifth optical element; FIG. 7 shows a further perspective view of a fifth optical element; FIG. 8 shows a first sectional view of the fifth optical element; and FIG. 9 shows a further sectional view of the fifth optical element.FIG. 1 shows a schematic perspective illustration of an optoelectronic component 100. FIG. 2 shows a schematic sectional side view of the optoelectronic component 100. The optoelectronic component 100 forms part of a lighting device 110.The optoelectronic component 100 comprises a housing 200 having a top side 201 and a bottom side 202 opposite the top side 201. The housing 200 may be made of a plastic material by a molding method (molding method), for example. However, the housing 200 may also comprise a ceramic material or another material and / or be produced by another method.Electrical contact pads of the optoelectronic component 100 can be arranged on the underside 202 of the housing 200. The optoelectronic component 100 can be provided, for example, as an SMT component for surface mounting, for example for surface mounting by reflow soldering (reflow soldering). The contact areas of the optoelectronic component 100 can, however, also be formed differently and arranged at a different position.On its top side 201, the housing 200 has a cavity 210 which extends into the housing 200 and is open to the top side 201. The opening of the cavity 210 at the top 201 of the housing 200 is bounded by a circumferential edge 220.At the base of the cavity 210 of the housing 200, an optoelectronic semiconductor chip 300 is arranged. The optoelectronic semiconductor chip 300 is configured to emit electromagnetic radiation, for example visible light or light having a wavelength from the infrared spectral range. The optoelectronic semiconductor chip 300 is preferably designed as a light-emitting diode (LED) chip.The optoelectronic semiconductor chip 300 has a radiation emission surface 310. The optoelectronic semiconductor chip 300 is configured to emit light 330 in a radiation emission direction 320 at its radiation emission surface 310. The radiation emission direction 320 is preferably oriented perpendicularly to the radiation emission surface 310 and directed such that the light 330 emitted by the optoelectronic semiconductor chip 300 can emerge from the cavity 210 at the top side 201 of the housing 200. The optoelectronic semiconductor chip 300 can have further radiation emission areas in addition to the radiation emission area 310. In particular, the optoelectronic semiconductor chip 300 can be configured as a volume emitter. A plurality of optoelectronic semiconductor chips may also be present.The light 330 emitted by the optoelectronic semiconductor chip 300 can be emitted as a divergent light cone at the radiation emission surface 310, which is centered about the radiation emission direction 320. The walls of the cavity 210 of the housing 200 can serve as a reflector for the light 330 emitted by the optoelectronic semiconductor chip 300. For this purpose, the walls of the cavity 210 of the housing 200 can have a reflective coating, for example a coating which comprises gold or aluminum, or consist of a reflective material.It is possible to form the housing 200 without a cavity 210. In this case, the optoelectronic semiconductor chip 300 can be arranged, for example, on the upper side 201 of the housing 200. The optoelectronic semiconductor chip 300 can alternatively also be completely or partially embedded in the material of the housing 200.The optoelectronic component 100 comprises a first optical element 400. The first optical element 400 has an upper side 401 and a lower side 402 opposite the upper side 401. The underside 402 is planar. The first optical element 400 comprises an optically transparent material, for example a glass or a silicone, an epoxy resin or another plastic.The first optical element 400 is arranged on the upper side 201 of the housing 200 above the cavity 210. In this case, a circumferential edge 403 of the underside 402 formed on the underside 402 of the first optical element 400 bears against the edge 220 on the upper side 201 of the housing 200.If the housing 200 does not have a cavity 210 and the optoelectronic semiconductor chip 300 is arranged on the top side 201 of the housing 200, the first optical element 400 is preferably arranged between the housing 200 and the first optical element 400.The first optical element 400 has a prism structure 500 on its upper side 401. The prism structure 500 is formed as a roof-shaped beam with a triangular cross section extending along a longitudinal direction and has a first outer surface 501 and a second outer surface 502 on the upper side 401 of the first optical element 400. The first outer surface 501 and the second outer surface 502 are arranged at an angle to each other.The prism structure 500 of the first optical element 400 of the optoelectronic component 100 is provided for splitting the light 330 emitted by the optoelectronic semiconductor chip 300 into a first beam 340 and a second beam 350. The first beam 340 is emitted at the first outer surface 501 of the prism structure 500 of the first optical element 400. The second beam 350 is emitted at the second outer surface 502 of the prism structure 500 of the first optical element 400. In this case, the first beam 340 and the second beam 350 are emitted in different spatial directions. The deflection of the first beam 340 and of the second beam 350 with respect to the radiation emission direction 320 of the optoelectronic semiconductor chip 300 takes place in a splitting direction 360. The splitting direction 360 is arranged in the first optical element 400 of the optoelectronic component 100 in a plane oriented parallel to the radiation emission direction 320 of the optoelectronic semiconductor chip 300.The first beam 340 and the second beam 350 preferably have substantially the same radiation characteristic as the light 330 emitted by the optoelectronic semiconductor chip 300 before splitting it into the first beam 340 and the second beam 350.The beams 340, 350 emitted by the optoelectronic component 100 can each serve to illuminate a surface or spatial region in the illumination device 110. In this case, the angle between the beams 340, 350 emitted by the optoelectronic components 100 can be dimensioned, for example, such that light spots generated by the beams 340, 350 at a distance of, for example, 20 cm to 40 cm from the optoelectronic component 100 have a distance of between 5 cm and 15 cm from one another.With reference to FIGS. 3 to 9, further optical elements are explained below, which can be provided in the optoelectronic component 100 instead of the first optical element 400. These further optical elements have matches with the first optical element 400. Identical components having the same effect are provided with the same reference numerals in FIGS. 3 to 9 as in FIGS. 1 and 2 and will not be described in detail again in each case.FIG. 3 shows a schematic perspective illustration of a second optical element 410. The second optical element 410 has, on its top side 401, a prism structure 500 which is provided for splitting the light 330 emitted by the optoelectronic semiconductor chip 300 of the optoelectronic component 100 in the splitting direction 360 into the first beam 340 and the second beam 350.In the second optical element 410, the prism structure 500 comprises a plurality of individual prism structures 510 arranged side by side. Each single prism structure 510 is formed as a longitudinally oriented roof-shaped beam having a triangular cross section. Each single prism structure 510 has a first outer surface 501 and a second outer surface 502 oriented at an angle to the first outer surface 501. In this case, the first outer surfaces 501 of all individual prism structures 510 are arranged parallel to one another. Correspondingly, the second outer surfaces 502 of all the individual prism structures 510 are also oriented parallel to one another. The individual prism structures 510 are arranged next to one another in the splitting direction 360, transversely to the longitudinal direction of the individual prism structures 510.The individual prism structures 510 of the prism structure 500 of the second optical element 410 each have a lower height in the direction dimensioned parallel to the radiation emission direction 320 than the prism structure 500 of the first optical element 400. As a result, the second optical element 410 overall has a lower height than the first optical element 400.The prism structure 500 of the second optical element 410 comprising the single prism structures 510 is arranged on the upper side 401 of the second optical element 410. The underside 402 of the second optical element 410 is planar and oriented perpendicularly to the radiation emission direction 320 of the optoelectronic semiconductor chip 300 in the arrangement of the second optical element 410 on the housing 200 of the optoelectronic component 100.In a variant of the second optical element 410 that is not shown in the figures, the prism structure 500 comprising the individual prism structures 510 is arranged on the underside 402 of the first optical element 400 and bounded by the encircling edge 403. The upper side 401 of the second optical element 410 can be planar in this variant. In this variant of the second optical element 410 as well, the prism structure 500 of the second optical element 410 serves to split the light 330 emitted by the optoelectronic semiconductor chip 300 of the optoelectronic component 100 into the first beam 340 and the second beam 350.FIG. 4 shows a schematic perspective illustration of a third optical element 420. The third optical element 420 likewise has a prism structure 500 having a plurality of individual prism structures 510. In the case of the third optical element 420, however, the prism structure 500 is arranged on the underside 402 of the third optical element 420 and is bounded laterally by the encircling edge 403. The top side 401 of the third optical element 420 is planar and oriented substantially perpendicular to the radiation emission direction 320 of the optoelectronic semiconductor chip 300 when the third optical element 420 is arranged on the top side 201 of the housing 200 of the optoelectronic component 100.In addition to the prism structure 500, the third optical element 420 has a lens structure 600. The lens structure 600 serves to shape the light 330 emitted by the optoelectronic semiconductor chip 300 of the optoelectronic component 100 and the beams 340, 350 formed from the emitted light 330. For example, the lens structure 600 can serve to bundle the light 330 emitted by the optoelectronic semiconductor chip 300 in order also to bundle the beams 340, 350 generated from the emitted light 330. In this case, the lens structure 600 is designed as a converging lens, for example as a convex converging lens, in particular for example as a convex spherical converging lens. However, the lens structure 600 can also have a different lens shape.The lens structure 600 and the prism structure 500 are both arranged on the underside 402 of the third optical element 420 and are superimposed on one another. As a result, the lens structure 600 deforms the individual prism structures 510 of the prism structure 500 of the third optical element 420. The individual prism structures 510 of the prism structure 500 are not formed in a straight line, but rather are deformed in accordance with the lens structure 600 superimposed on the prism structure 500. As a result, the first outer surfaces 501 and the second outer surfaces 502 of the individual prism structures 510 also do not form continuously planar surfaces. The lens structure 600 of the third optical element 420 has a convex rotationally symmetrical shape, for example a spherical shape, i.e. bulges outwards in the central region of the underside 402 of the third optical element 420. The individual prism structures 510 of the prism structure 500 of the third optical element 420 follow this curvature, i.e. the outer contour of the lens structure 600.FIG. 5 shows a schematic perspective and partially transparent representation of a fourth optical element 430. The fourth optical element 430 is formed on its underside 402 like the third optical element 420, i.e. has a prism structure 500 with individual prism structures 510 and a lens structure 600 superimposed on the prism structure 500. The prism structure 500 of the fourth optical element 430 is in turn configured to split the light 330 emitted by the optoelectronic semiconductor chip 300 of the optoelectronic component 100 in the splitting direction 360 into the first beam 340 and the second beam 350.At its top side 401, the fourth optical element 430 comprises a beam deflection structure 700. The beam deflection structure 700 is configured to both deflect the beams 340, 350 split by the prism structure 500 of the fourth optical element 430 in a common deflection direction 720. The deflection direction 720 is oriented perpendicular to the splitting direction 360 in the fourth optical element 430, but could also include an angle other than a right angle with the splitting direction 360.The beam deflection structure 700 at the top side 401 of the fourth optical element 430 is formed as a tilt 710 of the top side 401 of the fourth optical element 430. The surface of the fourth optical element 430 on the top side 401 of the fourth optical element 430 is not oriented perpendicularly to the radiation emission direction 320 of the optoelectronic semiconductor chip 300 of the optoelectronic component 100 because of the tilt 410, but instead is tilted counter to the radiation emission direction 320.Thus, the fourth optical element 430 has three optical functions. The lens structure 600 of the fourth optical element 430 brings about beam shaping of the light 330 emitted by the optoelectronic semiconductor chip 300 of the optoelectronic component 100 and thereby also of the first beam 340 and of the second beam 350, for example a focusing of the emitted light 330 and of the beams 340, 350. Prism structure 500 including individual prism structures 510 splits light 330 emitted by optoelectronic semiconductor chip 300 into first beam 340 and second beam 350. The beam deflection structure 700 of the fourth optical element 430 deflects the first beam 340 and the second beam 350 together in the deflection direction 720.The prism structure 500 and the lens structure 600 of the fourth optical element 430 are arranged jointly on the underside 402 of the fourth optical element 430 and are superimposed on one another. The beam deflection structure 700 is formed on the top side 401 of the fourth optical element 430. However, it would also be possible, for example, to form the prism structure 500, the lens structure 600 and the beam deflection structure 700 jointly on the upper side 401 or the lower side 402 of the fourth optical element 430 and to superimpose them on one another. It would likewise be possible to combine the beam deflection structure 700 with the prism structure 500 or the lens structure 600 and to arrange the superposition of the beam deflection structure 700 with the prism structure 500 or the lens structure 600 at the top side 401 or the bottom side 402 of the fourth optical element 430.FIG. 6 shows a schematic perspective view of the upper side 401 of a fifth optical element 440. FIG. 7 shows a schematic perspective view of the underside 402 of the fifth optical element 440. FIG. 8 shows a schematic side view of the fifth optical element 440 from a first viewing direction. FIG. 9 shows a schematic side view of the fifth optical element 440 from a second viewing direction perpendicular to the first viewing direction.The fifth optical element 440 has a prism structure 500 on its top side 401, which prism structure is provided to split the light 330 emitted by the optoelectronic semiconductor chip 300 of the optoelectronic component 100 in the splitting direction 360 into the first beam 340 and the second beam 350. The prism structure 500 in turn comprises a plurality of individual prism structures 510, which are arranged next to one another in the splitting direction 360 and extend in a longitudinal direction perpendicular to the splitting direction 360. Each single prism structure 510 has a first outer surface 501 and a second outer surface 502 disposed at an angle against the first outer surface 501.Unlike the prism structure 500 of the second optical element 410, the individual prism structures 510 of the prism structure 500 of the fifth optical element 440 are each divided into a plurality of individual sections 520 along their longitudinal direction. Each section 520 of each individual prism structure 510 of the prism structure 500 has a tilt 710 which forms a beam deflection structure 700 of the fifth optical element 440. The beam deflection structure 700 of the fifth optical element 440 is thus likewise arranged on the upper side 401 of the fifth optical element 440 and is superimposed on the prism structure 500. The beam deflection structure 700 of the fifth optical element 440 is configured to jointly deflect the beams 340, 350 split by the prism structure 500 in the deflection direction 720 oriented perpendicular to the splitting direction 360, and thus parallel to the longitudinal direction of the individual prism structures 510.All individual sections 520 of all individual prism structures 510 of prism structure 500 of fifth optical element 440 have tilt 710. In this case, the individual sections 520 of an individual prism structure 510 are each offset with respect to one another in the radiation emission direction 320 of the optoelectronic semiconductor chip 300 in such a way that the tilted outer surfaces 501, 502 of the individual prism structures 510 have sawtooth-shaped offsets, as can be seen in the side view of FIG. 9. As a result, the height of the superposition of the prism structure 500 and the beam deflection structure 700 in the direction parallel to the radiation emission direction 320 of the optoelectronic semiconductor chip 300 is reduced with respect to a continuous tilt 710 of the individual prism structures 510 without a displacement of the individual sections 520 of the individual prism structures 510.A lens structure 600 is formed on the underside 402 of the fifth optical element 440. Laterally, the lens structure 600 is in turn bounded on the underside 402 by a circumferential edge 403, which, in the arrangement of the fifth optical element 440 on the upper side 201 of the housing 200 of the optoelectronic component 100, bears against the edge 220 of the housing 200.The lens structure 600 of the fifth optical element 440 in turn serves for beam shaping of the light 330 emitted by the optoelectronic semiconductor chip 300 and thus also for beam shaping of the beams 340, 350 obtained from the emitted light 330. The lens structure 600 is designed as a rotationally symmetrical convex lens structure which bulges outwards on the underside 402 of the fifth optical element 440. However, it would also be possible to form the lens structure 600 with a different shape, in particular for example as a free-form lens, as a spherical lens or as an elliptical lens.List of reference characters100 Optoelectronic component 110 Lighting device 200 Housing 201 Top side 202 Underside 210 Cavity 220 Edge 300 Optoelectronic semiconductor chip 310 Radiation emission surface 320 Radiation emission direction 330 Emitted light 340 First beam bundle 350 Second beam bundle 360 Splitting direction 400 First optical element 401 Top side 402 Underside 403 Encircling edge 410 Second optical element 420 Third optical element 430 Fourth optical element 440 Fifth optical element 500 Prism structure 501 First outer surface 502 Second outer surface 510 Single prism structure 520 Section 600 Lens structure 700 Beam deflection structure 710 Tilt 720 Deflection direction

Claims

Optoelectronic component (100) having an optoelectronic semiconductor chip (300) and an optical element (400, 410, 420, 430, 440), wherein the optical element (400, 410, 420, 430, 440) has, on a top side (401) facing away from the semiconductor chip (300), a prism structure (500) which is designed to split light (330) emitted by the semiconductor chip (300) into two beams (340, 350).Optoelectronic component (100) according to claim 1, wherein the prism structure (500) comprises a plurality of individual prism structures (510) arranged side by side.Optoelectronic component (100) according to one of the preceding claims, wherein the optical element (420, 430, 440) comprises a lens structure (600).Optoelectronic component (100) according to Claim 3, wherein the lens structure (600) is formed convexly.Optoelectronic component (100) according to one of the preceding claims, wherein the optical element (430, 440) comprises a beam deflection structure (700) which is configured to deflect both beams (340, 350) in a common direction (720).Optoelectronic component (100) according to Claim 5, wherein the beam deflection structure (700) is formed as a tilt (710) of a surface (401, 402) of the optical element (430, 440) against a plane perpendicular to a radiation emission direction (320) of the semiconductor chip (300).Optoelectronic component (100) according to one of Claims 5 and 6, wherein the prism structure (500) is configured to deflect the beams (340, 350) with respect to one another in a first direction (360), wherein the beam deflection structure (700) is configured to deflect the beams (340, 350) jointly in a second direction (720) perpendicular to the first direction (360).Optoelectronic component (100) according to one of claims 5 to 7, wherein the prism structure (500) and the beam deflection structure (700) are arranged on the top side (401) of the optical element (440) and are superimposed on one another.Optoelectronic component (100) according to claims 6 and 8, wherein each individual prism structure (510) of the prism structure (500) is divided into a plurality of sections (520) in the longitudinal direction, wherein the individual sections (520) of each prism structure (500) are offset with respect to one another in the radiation emission direction (320) of the semiconductor chip (300).Optoelectronic component (100) according to one of Claims 3 to 4 and one of Claims 5 to 9, wherein the lens structure (600) and the beam deflection structure (700) are arranged on a common surface (401, 402) of the optical element and are superimposed on one another.Optoelectronic component (100) according to one of the preceding claims, wherein the optical element (400, 410, 420, 430, 440) has a bottom side (402) facing the semiconductor chip (300).Optoelectronic component (100) according to claim 11, wherein the optoelectronic component (100) comprises a housing (200), wherein the semiconductor chip (300) is arranged on or in the housing (200), wherein the optical element (400, 410, 420, 430, 440) abuts the housing (200).Optoelectronic component (100) according to claim 12, wherein the underside (402) of the optical element (400, 410, 420, 430, 440) has a circumferential edge (403), wherein the circumferential edge (403) abuts the housing (200).Optoelectronic component (100) according to one of the preceding claims, wherein the semiconductor chip (300) is configured to emit light (330) having a wavelength from the infrared spectral range.Lighting device (110) having an optoelectronic component (100) according to one of the preceding claims.

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