Printing device

Abstract

Printing device (1) comprising: a squeegee (51) configured to print a coating material (S) onto a mask (M) on a circuit board (B); a coating material scooping unit (56) configured to scoop the coating material (S) onto the mask (M); a coating material width measuring unit (57) configured to measure a width (W) of the coating material (S) on the mask (M); and a controller (9) configured or programmed to obtain, based on the measured width (W) of the coating material (S), an initial position of a movement of the coating material scooping unit (56) during a coating material scooping process and / or an end position of the movement of the coating material scooping unit (56) during the coating material scooping process and / or an extent of the movement of the coating material scooping unit (56) during the coating material scooping process.

Description

Technical field The present invention relates to a printing device and in particular to a printing device comprising a coating material scooping unit which is configured to scoop a coating material onto a mask. Technical background A printing device comprising a coating material scooping unit, configured to scoop a coating material onto a mask, is conventionally known. Such a printing device is disclosed, for example, in Japanese patent no. 5873928. Japanese Patent No. 5873928 discloses a printer (a printing device) configured to print solder paste onto a printed circuit board by moving the solder paste (the coating material) on a mask with a squeegee. This printer includes a solder loading and unloading device (a coating material scooping unit) configured to scoop the solder paste onto the mask. This solder loading and unloading device arguably moves along the mask from a start position to a finish position and performs a scooping operation to scoop the solder paste onto the mask. State of the art Patent document Patent document 1: Japanese patent no. 5873928 Patent document 2: EP 2 728 980 B1 Brief description of the invention Problems to be solved by the invention In the printer described in Japanese Patent No. 5873928, the solder loading and unloading device may move from the initial assembly position to the final assembly position and perform the dispensing process, thus seemingly failing to account for the actual width of the solder paste. In this case, the solder paste dispensing process could potentially fail due to insufficient movement of the loading and unloading device. Therefore, the printer described in Japanese Patent No. 5873928 has potential for improvement in this respect. Furthermore, the publication EP 2 728 980 B1 describes a method for supplying solder to a mask sheet (100) to be printed onto a printed circuit board (U). The method includes calculating the quantity of solder to be supplied to a plurality of points in an X-direction, which is a longitudinal direction of a doctor blade (50), and changing the quantity of solder supplied at each point in the X-direction based on a result of the calculation. The present invention was proposed to solve the above-mentioned problems, and one object of the present invention is to provide a printing device which is able to significantly reduce or prevent the failure of a coating material scooping process due to an insufficient degree of movement of a coating material scooping unit during the coating material scooping process. Means to solve the problems A printing device according to one aspect of the present invention comprises a squeegee configured to print a coating material on a mask on a circuit board, a coating material scooping unit configured to scoop the coating material on the mask, a coating material width measuring unit configured to measure a width of the coating material on the mask, and a controller configured or programmed to obtain, based on the measured width of the coating material, an initial position of a movement of the coating material scooping unit during a coating material scooping process and / or an end position of the movement of the coating material scooping unit during the coating material scooping process and / or an extent of the movement of the coating material scooping unit during the coating material scooping process. The printing device according to this aspect of the present invention is configured as described above such that the appropriate initial position, the appropriate final position, or the appropriate degree of movement for the actual width of the coating material can be determined taking into account the actual width of the coating material. Accordingly, it is possible to provide a printing device capable of significantly reducing or preventing failure of the coating material feeding process due to an insufficient degree of movement of the coating material feeding unit during the feeding process.Furthermore, if the appropriate degree of movement for the actual width of the coating material is achieved, an unnecessary increase in the degree of movement of the coating material feeding unit during the coating material feeding process can be significantly reduced or prevented. Thus, the time required for the coating material feeding process can be reduced to the necessary minimum. The printing device described above preferably further comprises a mask movement device configured to move the mask, and the controller is preferably configured or programmed to control the mask movement device to move the mask such that the coating material to be scooped is within the operating range of the coating material scooping unit when it is outside the operating range of the coating material scooping unit. Accordingly, the operating range of the coating material scooping unit can be reduced by the amount of mask movement that can be achieved by the mask movement device. Therefore, the device can be made smaller by reducing the operating range of the coating material scooping unit. In this case, the printing device preferably further comprises a mask exchange device, including the mask movement device and a mask storage unit configured to hold the mask. Accordingly, the mask movement device of the mask exchange device can be used as a mask movement unit that moves the mask such that the coating material is located within the operating range of the coating material dispensing unit. Therefore, it is not necessary to provide a separate mask movement device from the mask movement device of the mask exchange device. Thus, no separate mask movement device is provided, and the number of components can be reduced, while the structure can be simplified.Furthermore, the mask can be automatically replaced by the mask replacement device, thus saving the user the effort of replacing the mask. In the aforementioned structure, comprising the mask exchange device, the controller is preferably configured or programmed to control the coating material dispensing unit. This unit dispenses the coating material from the mask to be exchanged before the mask exchange process and discharges the coating material onto a replacement mask after the mask exchange process. Accordingly, the coating material dispensing unit can automatically transfer the coating material from mask to mask, thus saving the user the effort of manually transferring the coating material from mask to mask. The aforementioned printing device, according to this aspect, preferably further comprises a scooping state detector, which is configured to detect the state of coating material scooping by the coating material scooping unit after the coating material scooping process. Accordingly, it can be checked whether the coating material was scooped correctly by the coating material scooping unit or not. Therefore, if the coating material was not scooped correctly by the coating material scooping unit, the device can be prompted to take appropriate action, such as stopping, and it is possible to prevent the occurrence of printing defects. In this case, the scoop state detector preferably includes the coating material width measuring unit. Accordingly, it is not necessary to provide the scoop state detector separately from the coating material width measuring unit. Therefore, the scoop state detector is not provided separately from the coating material width measuring unit, thus reducing the number of components and simplifying the structure. In the aforementioned structure comprising the scoop state detector, the scoop state detector preferably includes an image sensor, a light detector, or a weight detector. Accordingly, the state of a coating material scoop by the coating material scooping unit after the coating material scooping process can be easily detected by the image sensor, the light detector, or the weight detector. In the aforementioned structure, comprising the scoop condition detector, the controller is preferably configured or programmed to perform a control action to notify a user to check the condition of the coating material if the coating material scooping process by the coating material scooping unit is abnormal. Accordingly, the user can quickly take corrective action based on the information provided. Therefore, even if the device is stopped due to the anomaly, the anomaly can be rectified quickly, and the device's downtime can be reduced. In the aforementioned structure, comprising the scoop state detector, the controller is preferably configured or programmed to control the coating material scoop unit to discharge the coating material when the scooping state is abnormal. Accordingly, even if only a portion of the coating material has been scooped by the scoop unit at the time of an anomaly, only the scooped portion can be discharged. Therefore, it is possible to significantly reduce or prevent the next scooping process by the scoop unit when only a portion of the coating material has been scooped.This makes it possible to significantly reduce or prevent the failure of the next coating material scooping process by the coating material scooping unit due to the fact that only a portion of the coating material was scooped by the coating material scooping unit. Effect of the invention According to the present invention, it is possible, as described above, to provide the printing device which is able to significantly reduce or prevent the failure of the coating material scooping process due to an insufficient degree of movement of the coating material scooping unit during the coating material scooping process. Brief description of the drawings [Fig. 1] A top view schematically representing the overall structure of a printing device according to one embodiment. [Fig. 2] A schematic sectional view viewed along line II-II in Fig. 1. [Fig. 3] A schematic side view illustrating the overall structure of the printing device according to the embodiment. [Fig. 4] View (A) is a schematic view illustrating a state in which a mask exchange unit has been raised, and view (B) is a schematic view illustrating a state in which the mask exchange unit has been lowered. [Fig. 5] A block diagram illustrating the control structure of the printing device according to the embodiment. [Fig. 6] Views (A) to (G) are schematic views illustrating a mask exchange process and a plumb line transfer process in the printing device according to the embodiment.[Fig. 7] A schematic view illustrating a solder width measurement in the printing device according to the embodiment. [Fig. 8] A schematic view illustrating the offset of a scoop unit, a front printing end position, and a rear printing end position in the printing device according to the embodiment. [Fig. 9] Views (A) to (D) are schematic views illustrating a process in a case where a coating material is located outside the operating range of the scoop unit in the printing device according to the embodiment. [Fig. 10] A flowchart illustrating a solder loading and unloading detection process carried out by the printing device according to the embodiment. [Fig. 11] A schematic view illustrating a doctor blade unit of a printing device according to a first modified example of the embodiment. [Fig.[Fig. 12] A schematic view illustrating a doctor blade unit of a printing device according to a second modified example of the embodiment. [Fig. 13] A schematic view illustrating a doctor blade unit of a printing device according to a third modified example of the embodiment. Methods and ways of implementing the invention One embodiment which carries out the present invention is described below on the basis of the drawings. The structure of a printing device 1 according to the embodiment of the present invention will now be described with reference to Figures 1, 2, 3, 4, 5, 6, 7, 8 to 9. As shown in Figure 1, the printing device 1 is a device which conveys a circuit board B (see Figure 2) through a pair of conveying devices 12 in an X1 direction and prints a solder S (see Figure 6) onto the circuit board B in a printing position. The circuit board B is a printed circuit board on which components (electronic components) are mounted. The solder S is a bonding material for connecting the components on the circuit board B.In the following description, the direction (X1 direction) of conveying the circuit board B by the pair of conveying devices 12 (conveyor belts) and the opposite direction (X2 direction) are defined as the X direction, and a direction extending in a horizontal direction substantially orthogonal to the X direction is defined as the Y direction. Furthermore, a direction extending substantially orthogonal to both the X and Y directions is defined as the Z direction (upward-downward direction). The solder S is an example of a "coating material" in the claims. The printing device 1 is configured to feed the circuit board B through feeding conveying devices 1a, to perform a printing operation on a surface of the fed circuit board B with a print pattern Pa formed on a mask M, and then to eject the circuit board B, on which the printing operation has taken place, through ejecting conveying devices 1b. The mask M has a rectangular, flat plate shape in a top view (viewed from the Z1 direction side). The mask M comprises a plurality of openings P1, which form the print pattern Pa, and a non-opening P2, which is an area outside the plurality of openings P1. Furthermore, a frame F is attached to the outer circumferential section of the mask M. It should be noted that Figures 1, 2 to 3 show a state in which the mask M has been moved from an operating position A, in which a printing operation with the mask M is taking place, to a mask exchange unit 7 described below. As shown in Fig. 2, the printing device 1 comprises a base 2, a printing table unit 3, a camera unit 4, a mask clamping element 5, a squeegee unit 6, the mask exchange unit 7, detection sensors 8 and a control device 9 (see Fig. 5). The control device 9 is an example of a “controller” in the claims. The printing table unit 3 is provided on base 2 and is configured to hold the circuit board B and align the circuit board B with respect to the mask M. Specifically, the printing table unit 3 has an X-axis movement mechanism (not shown), a Y-axis movement mechanism (not shown), an R-axis movement mechanism (not shown), a Z-axis movement mechanism (not shown), a printing table 11, and the pair of conveyors 12 (see Fig. 1). The X-axis movement mechanism has an X-axis drive 13 (see Fig. 5) as a drive source to move the printing table 11 in the X direction. The Y-axis movement mechanism has a Y-axis drive 14 (see Fig. 5) as a drive source to move the printing table 11 in the Y direction. The R-axis movement mechanism has an R-axis drive 15 (see Fig. 5) as a drive source to rotate the printing table 11 about a rotary axis extending in the Z direction. The Z-axis movement mechanism has a Z-axis drive 16 (see Fig. 5) as a drive source to move the printing table 11 in the Z direction. The printing table 11 comprises a table body 21, a pair of mounting elements 22 provided on the table body 21, a support plate 23 on which a plurality of support bolts 23a are arranged, and a support plate drive 24, which is configured to move the support plate 23 in the Z-direction. The conveying device 12 (see Fig. 1) is provided on each upper section of the pair of mounting elements 22. The support bolts 23a are configured to support the circuit board B by moving the support plate 23 in a Z1 direction (upward direction) from below by the support plate drive 24. As shown in Fig. 1, the pair of conveyors 12 are positioned so that they extend along the X-direction. The pair of conveyors 12 are arranged parallel to each other at a predetermined distance in the Y-direction. Furthermore, the distance between the pair of conveyors 12 in the Y-direction can be adjusted according to the width of the circuit board B to be conveyed. Specifically, a circuit board width axis drive 12a (see Fig. 5) is provided to adjust the distance (the width) between the pair of conveyors 12 in the Y-direction. The camera unit 4 is configured as shown in Figures 2 and 3 to image the mask M and the circuit board B. Specifically, the camera unit 4 comprises a camera X-axis movement mechanism 31, a camera Y-axis movement mechanism 32, and an image sensor 33, comprising a circuit board camera 33a and a mask camera 33b. The camera X-axis movement mechanism 31 has an X-axis motor 31a and a ball screw drive 31b extending in the X direction. The camera Y-axis movement mechanism 32 has a Y-axis motor 32a and a ball screw drive 32b extending in the Y direction. The circuit board camera 33a is configured to image the circuit board B and to detect the relative position of the circuit board B with respect to the printing table 11. The mask camera 33b is set up to image mask M and detect the position of mask M. Thus, in the printing device 1, after the relative position of the circuit board B with respect to the mask M is detected using the circuit board camera 33a and the mask camera 33b, the circuit board B is precisely positioned relative to the mask M (its position and inclination on a horizontal plane) by the X-axis, Y-axis, and R-axis movement mechanisms of the printing table unit 3. Then, in the printing device 1, with the circuit board B precisely positioned relative to the mask M, the circuit board B is raised by the Z-axis movement mechanism of the printing table unit 3 and brought into contact with the lower surface of the mask M. As shown in Fig. 3, the mask clamping element 5 is configured to hold the mask M in the operating position A when the solder S is printed on the circuit board B using the mask M in the print pattern Pa. Specifically, the mask clamping element 5 comprises a first mask holder 41, which is configured to hold one end of the mask M on the X1-direction side, a second mask holder 42, which is configured to hold one end of the mask M on the X2-direction side, and a pressing section (not shown) which is provided on the first mask holder 41 and configured to press the mask M in the X2 direction. As shown in Figs. 2 and 3, the doctor blade unit 6 is configured to move back and forth in the Y-direction to move the plumb line S applied to the upper surface of the mask M and simultaneously wipe the plumb line S off along the upper surface of the mask M. Specifically, the doctor blade unit 6 comprises a doctor blade 51, a doctor blade Y-axis drive 52 which moves the doctor blade 51 in a printing direction (Y-direction), a doctor blade Z-axis drive 53 which moves the doctor blade 51 in the up-down direction (Z-direction), and a doctor blade R-axis drive 54 (see Fig. 5) which rotates the doctor blade 51 about a rotary axis extending in the X-direction. The squeegee 51 extends in the X direction. The squeegee 51 is configured to print the solder S supplied to the mask M and simultaneously apply a predetermined pressure force (load) to the mask M. The squeegee Y-axis drive 52 comprises a Y-axis motor 52a and a ball screw drive 52b, which extends in the Y direction. The squeegee Z-axis drive 53 comprises a Z-axis motor 53a, a belt 53b, and a ball screw drive 53c, which extends in the Z direction. The doctor blade unit 6, as shown in Fig. 2, has a mask displacement device 55 which displaces the mask M in the Y-direction and replaces the mask M. A single mask displacement device 55 is provided in the doctor blade unit 6. The mask displacement device 55 comprises a displacement section 55a, which is movable in the Z-direction (upward-downward direction), and a housing 55b, which receives the displacement section 55a. The mask displacement device 55 has, for example, an air cylinder, the displacement section 55a has a rod of the air cylinder, and the housing 55b has a cylinder of the air cylinder. The mask displacement device 55 is an example of a "mask movement device" in the claims. The mask shifting device 55 is configured to move integrally in the Y-direction by means of a movement of the squeegee 51 in the Y-direction by the squeegee Y-axis drive 52. In the mask shifting device 55, the shifting section 55a moves in a Z2 direction (downward direction) such that it projects from the housing 55b to a position in which the shifting section 55a can contact the frame F of the mask M in the operating position A in the horizontal direction (Y-direction). In the mask shifting device 55, the shifting section 55a moves in the Z1 direction (upward direction) to a position in which the shifting section 55a does not contact the frame F of the mask M in the operating position A in the horizontal direction (Y-direction), so that it is received in the housing 55b. Thus, the squeegee 51 and the mask shifting device 55 are integrally provided in the squeegee unit 6. The squeegee 51 and the mask shifting device 55 are moved integrally in the Y-direction by a movement of the squeegee unit 6. The shifting section 55a of the mask shifting device 55 contacts the frame F of the mask M from the Y1-direction side or the Y2-direction side and moves the mask M in a Y1-direction or a Y2-direction. The doctor blade unit 6 includes a plumb line scoop unit 56, which scoops the plumb line S onto the mask M. The plumb line scoop unit 56 includes a scoop 56a, which is configured to scoop and hold the plumb line S onto the mask M. The scoop 56a is configured to be movable in the Z-direction (up-down direction) between a lowered position for scooping the plumb line S onto the mask M or unloading the scooped plumb line S onto the mask M, and a raised position for not scooping the plumb line S onto the mask M. The plumb line scoop unit 56 is configured to move integrally in the Y-direction by a movement of the doctor blade 51 via the doctor blade Y-axis drive 52. The plumb line scooping unit 56 scoops and holds the plumb line S on the mask M in a state in which the scoop 56a is arranged in the lowered position, by moving in the Y2 direction on the scoop 56a.Furthermore, in a state in which the dispenser 56a is arranged in the lowered position, the soldering unit 56 discharges the drawn solder S from the dispenser 56a onto the mask M by moving it in the Y1 direction. The soldering unit 56 is an example of a "coating material dispensing unit" in the claims. As shown in Figs. 2 and 7, the doctor blade unit 6 includes a plumb line width measuring unit 57, which is configured to measure the width W (see Fig. 7) of the plumb line S (the plumb roll) on the mask M. The width W of the plumb line S refers to the length of the plumb line S in the Y-direction. The plumb line width measuring unit 57 is configured to move integrally in the Y-direction by a movement of the doctor blade 51 in the Y-direction by the doctor blade Y-axis drive 52. The plumb line width measuring unit 57 illuminates the plumb line S on the mask M with a laser beam and simultaneously moves in the Y-direction within a range from one end of the plumb line S in the Y-direction to the other end, receiving the laser beam reflected by the plumb line S on the mask M. Thus, the plumb line width measuring unit 57 obtains the measurement result of the plumb line S. The control device 9 obtains the width W of the plumb line S based on the measurement result of the plumb line S obtained by the plumb line width measuring unit 57.The solder width measuring unit 57 is an example of the “coating material width measuring unit” in the claims. As shown in Figures 4A and 4B, the mask exchange unit 7 is configured to hold a plurality of (two) masks M. Specifically, the mask exchange unit 7 has a first bearing 61, a second bearing 62, and a lifting unit 63. The first bearing 61 and the second bearing 62 are each configured to hold one mask M. The first bearing 61 and the second bearing 62 are aligned in the up-down direction. The first bearing 61 is an upper bearing, located above the second bearing 62. The second bearing 62 is a lower bearing, located below the first bearing 61. The lifting unit 63 is configured to move the first bearing 61 and the second bearing 62 in the up-down direction. In the mask exchange unit 7, the lifting unit 63 is attached to the base 2. In the mask exchange unit 7, the second bearing 62 is attached to the lifting unit 63.In the mask exchange unit 7, the first bearing 61 is attached to the second bearing 62. Thus, the first bearing 61 and the second bearing 62 move integrally up and down to the same extent as the lifting unit 63 moves up and down. The first bearing 61 and the second bearing 62 are configured to be movable in the Z-direction (up-down direction) between a lowered position for loading and unloading the mask M into and from the first bearing 61 and a raised position for loading and unloading the mask M into and from the second bearing 62. The mask exchange unit 7 includes the mask displacement device 55. The mask exchange unit 7 is an example of a "mask exchange device" in the claims. The first bearing 61 and the second bearing 62 are examples of a "mask bearing" in the claims. As shown in Fig. 2, the detection sensors 8 are configured to detect the mask M in a state where the mask clamping element 5 and the mask exchange unit 7 are bridged. A detection sensor 8 is provided at each of the first bearing 61 and the second bearing 62. Specifically, the detection sensor 8 provided at the first bearing 61 is configured to detect the mask M, which is stopped in a state where the mask clamping element 5 and the first bearing 61 are bridged, when the mask M is moved between the operating position A and the first bearing 61. The detection sensor 8 provided at the second bearing 62 is configured to detect the mask M, which is stopped in a state where the mask clamping element 5 and the second bearing 62 are bridged, when the mask M is moved between the operating position A and the second bearing 62.The detection sensors 8 are, for example, transmission sensors and each point to a projector (not shown) which emits light, and a light receiver (not shown) which receives the light emitted by the projector. As shown in Fig. 5, the control device 9 comprises a main controller 9a, a memory 9b, a drive controller 9c, an I / O controller 9d, and a camera controller 9e. The main controller 9a includes a central processing unit (CPU). The memory 9b includes read-only memory (ROM), random access memory (RAM), etc., and stores circuit board data G1, machine data G2, and a printing program. The main controller 9a has a function of controlling each unit of the printing device 1 based on the printing program stored in the memory 9b. The circuit board data G1 includes information regarding the type of circuit board B, information regarding the size of the circuit board B, information regarding the mask M corresponding to the type of circuit board B, information regarding the number of circuit boards on which the solder S is to be printed for each type of circuit board B, etc.The machine data G2 includes information regarding a movement limit position of the squeegee unit 6 in the Y direction, information regarding movement limit positions of the camera unit 4 in the X and Y directions, etc. The main controller 9a is configured or programmed to control the doctor blade unit 6 via the drive controller 9c. Specifically, the drive controller 9c controls a drive of the doctor blade Y-axis drive 52, the doctor blade Z-axis drive 53, and the doctor blade R-axis drive 54 to move the doctor blade 51 in the Y and Z directions and to rotate the doctor blade 51 about the axis of rotation extending in the X direction. The main controller 9a is configured or programmed to control the print table unit 3 via the drive controller 9c. Specifically, the main controller 9a, through the drive controller 9c, drives the X-axis drive 13, the Y-axis drive 14, the R-axis drive 15, and the Z-axis drive 16 to move the circuit board B in the X, Y, and Z directions and to rotate the circuit board B about the axis of rotation extending in the Z direction. Furthermore, the main controller 9a, through the drive controller 9c, drives the support plate drive 24 to move the support plate 23 so that the support bolts 23a move in the Z direction (up and down). The main control 9a drives the circuit board width axis drive 12a via the drive control 9c to adjust the distance (the width) between the pair of conveyor devices 12 in the Y direction.Furthermore, the main control 9a drives a circuit board conveyor axis drive 17 via the drive control 9c to transport the circuit board B in the X direction. The main controller 9a is configured or programmed to control the camera unit 4 via the drive controller 9c. Specifically, the main controller 9a drives the camera X-axis movement mechanism 31 and the camera Y-axis movement mechanism 32 via the drive controller 9c to move the image transmitter 33 (the circuit board camera 33a and the mask camera 33b) in the X and Y directions. The main controller 9a is configured or programmed to control the camera unit 4 via the camera controller 9e. Specifically, the main controller 9a, via the camera controller 9e, controls the process of imaging circuit board B of the circuit board camera 33a. The main controller 9a, via the camera controller 9e, controls the process of imaging the mask M of the mask camera 33b. The main control unit 9a is configured or programmed to control the doctor blade unit 6 via the I / O control unit 9d. Specifically, the main control unit 9a controls the up and down movement of the shifting section 55a of the mask shifting device 55 via the I / O control unit 9d. The main controller 9a is configured or programmed to control the mask exchange unit 7 via the I / O controller 9d. Specifically, the main controller 9a, via the I / O controller 9d, controls the lifting operation of the lifting unit 63 to move the first bearing 61 and the second bearing 62 of the mask exchange unit 7 up and down. Furthermore, the main controller 9a is configured or programmed to receive a detection signal from the detection sensor 8 via the I / O controller 9d when the detection sensor 8 detects the mask M, which is stopped in a state where the mask clamping element 5 and the first bearing 61 are bridged. The main control 9a is set up or programmed to receive a detection signal from the detection sensor 8 via the EA control 9d when the detection sensor 8 detects the mask M stopped in a state of bridging the mask clamping element 5 and the second bearing 62. (Structure of exchanging mask M) As shown in Figures 6A to 6G, the control device 9 is configured or programmed to control the mask shifting device 55 of the mask exchange unit 7 to perform an exchange operation to replace the mask M when the mask M used in the current production of circuit board B is exchanged for the mask M used in the next production of circuit board B. The control device 9 is configured or programmed to control the solder scooping unit 56 to scoop the solder S onto a mask M to be exchanged (the mask M used in the current production of circuit board B) before the mask shifting device 55 of the mask exchange unit 7 performs the exchange operation, and to discharge the solder S onto a replacement mask M (the mask M used in the next production of circuit board B) after the mask shifting device 55 of the mask exchange unit 7 performs the exchange operation.Specifically, as shown in Fig. 6A, the control device 9 first controls the solder scoop 56 to lower the scoop 56a of the solder scoop 56 into the lowered position on the mask M used in the current production of circuit board B, which is arranged in the operating position A. Then, as shown in Fig. 6B, in a state where the scoop 56a is in the lowered position, the control device 9 controls the solder scoop 56 to move in the Y2 direction (a direction in which the solder S is scooped). Thus, the solder S is moved and held on the scoop 56a of the solder scoop 56 on the mask M used in the current production of circuit board B. Then, as shown in Fig. 6C, the control device 9 controls the solder scoop 56 to raise the scoop 56a of the solder scoop 56, which holds the solder S, into the raised position.Then the soldering unit 56 scoops the solder S onto the mask M used in the current production of circuit board B. Then, as shown in Figs. 6C and 6D, the control device 9 controls the mask shifting device 55 of the mask exchange unit 7 to move the mask M used in the current production of circuit board B from operating position A (the mask clamping element 5) to the second bearing 62 of the mask exchange unit 7. Then, when the mask M used in the current production of circuit board B is stored in the second bearing 62, the control device 9 controls the mask exchange unit 7 to lower the first bearing 61 and the second bearing 62 of the mask exchange unit 7 into the lowered position. Then, as shown in Fig. 6E, the control device 9 controls the mask shifting device 55 of the mask exchange unit 7 to move the mask M used in the next production of circuit board B from the first bearing 61 of the mask exchange unit 7 to operating position A (the mask clamping element 5).Thus, the mask M used in the current production of circuit board B is replaced by the mask M used in the next production of circuit board B. Then, when the mask M used in the next production run of circuit board B is arranged in operating position A (the mask clamping element 5), the control device 9 controls the mask exchange unit 7 to raise the first bearing 61 and the second bearing 62 of the mask exchange unit 7 into the raised position. Then, as shown in Fig. 6F, the control device 9 controls the solder feeder unit 56 to lower the feeder 56a of the solder feeder unit 56 into the lowered position on the mask M used in the next production run of circuit board B, which is arranged in operating position A. Then, as shown in Fig. 6G, in a state where the feeder 56a is arranged in the lowered position, the control device 9 controls the solder feeder unit 56 to move in the Y1 direction (a direction in which the solder S is discharged).Thus, the solder S on the creator 56a of the solder creation unit 56 is discharged onto the mask M used in the next production of the circuit board B. (Structure related to the plumbing position) In this embodiment, the control device 9 is set up or programmed to obtain, based on the measured width W of the plumb line S, the initial position of a movement of the plumb line scooping unit 56 in the Y2 direction (the direction in which the plumb line S is scooped) during a process of scooping the plumb line S, the end position of the movement of the plumb line scooping unit 56 in the Y2 direction during the process of scooping the plumb line S, and the extent of movement of the plumb line scooping unit 56 in the Y2 direction during the process of scooping the plumb line S. As shown in Fig. 8, the control device 9 is set up or programmed to obtain, based on the measured width W of the plumb line S, the initial position of a movement of the plumb line scooping unit 56 in the Y2 direction during the process of scooping the plumb line S and the extent of movement of the plumb line scooping unit 56 in the Y2 direction during the process of scooping the plumb line S, for example when the plumb line S is located on the back side (Y1 direction side) of the mask M (when the plumb line scooping unit 56 scoops the plumb line S on the mask M from the side (Y1 direction side) which is opposite the side (Y2 direction side) which is in contact with the squeegee 51). Specifically, the control device 9 achieves the initial position of the movement of the plumb line scooping unit 56 in the Y2 direction during the process of scooping the plumb line S by the following formula (1). Furthermore, the control device 9 achieves the final position of the movement of the plumb line scooping unit 56 in the Y2 direction during the process of scooping the plumb line S by the following formula (2). Additionally, the control device 9 achieves the extent of movement of the plumb line scooping unit 56 in the Y2 direction during the process of scooping the plumb line S by the following formula (3). The rear-side print end position is expressed by the following formula (4). An end distance is the distance by which the squeegee 51 moves beyond the size of the board B when the solder S is printed on the board B. The mask center coordinates, the board size, and the end distance can be obtained based on design information. The offset of the scoop unit is a separation distance between the doctor blade 51 and the scoop unit 56 in the Y-direction. For example, the offset of the scoop unit is a distance in the Y-direction from the center of rotation of the doctor blade 51 to the tip of the scoop 56a of the scoop unit 56. The offset of the scoop unit can be determined based on the design information. Furthermore, the initial position margin and the final position margin are values ​​that define a margin. The initial position margin and the final position margin can be fixed values ​​or values ​​determined according to the measured width W of the perpendicular S. The initial position margin and the final position margin can have different values. The control device 9 is set up or programmed to obtain, based on the measured width W of the plumb line S, the end position of the movement of the plumb line scooping unit 56 in the Y2 direction during the process of scooping the plumb line S and the extent of movement of the plumb line scooping unit 56 in the Y2 direction during the process of scooping the plumb line S, for example when the plumb line S is on the front (Y2 direction side) of the mask M (when the plumb line scooping unit 56 scoops the plumb line S on the mask M from the side (Y1 direction side) which is in contact with the squeegee 51). Specifically, the control device 9 achieves the initial position of the movement of the plumb line scooping unit 56 in the Y2 direction during the process of scooping the plumb line S by the following formula (5). Furthermore, the control device 9 achieves the final position of the movement of the plumb line scooping unit 56 in the Y2 direction during the process of scooping the plumb line S by the following formula (6). Additionally, the control device 9 achieves the extent of movement of the plumb line scooping unit 56 in the Y2 direction during the process of scooping the plumb line S by the following formula (7). (7) The front-side printing end position is expressed by the following formula (8). The initial and final edge values ​​define a boundary. These values ​​can be fixed or determined based on the measured width W of the perpendicular S. The initial and final edge values ​​can also be different. The control device 9 is configured or programmed to control the solder width measuring unit 57 to measure the width W of the solder S during the production of circuit board B, before the solder S is scooped by the solder scooping unit 56. Specifically, the control device 9 is configured or programmed to control the solder width measuring unit 57 to measure the width W of the solder S during the production of circuit board P, after the circuit board B, on which printing has taken place, is ejected and the next circuit board B is inserted, and before the solder S is printed on the inserted next circuit board B. For example, the control device 9 controls the solder width measuring unit 57 to measure the width W of the solder S during the exchange of circuit board B, immediately before the solder S is scooped by the solder scooping unit 56. Thus, the width W of the solder S can be measured in parallel with the exchange of circuit board B.Therefore, it is possible to prevent the occurrence of a time loss in measuring the width W of the perpendicular S. (Structure of the movement of the mask at the time of creating the plumb line) In this embodiment, as shown in Figures 9A to 9D, the control device 9 is configured or programmed to control the mask shifting device 55 of the mask exchange unit 7 in order to move the mask M such that the filler S to be scooped is within the operating range of the filler scooping unit 56 when the filler S to be scooped is outside the operating range of the filler scooping unit 56 (outside a movement limit position). The control device 9 is configured or programmed to determine the extent of movement of the mask M by the mask shifting device 55 of the mask exchange unit 7 based on the initial position of the movement of the filler scooping unit 56 or the end position of the movement of the filler scooping unit 56 and the movement limit position of the filler scooping unit 56 when the filler S to be scooped is outside the operating range of the filler scooping unit 56.The control device 9 is also set up or programmed to control the mask shifting device 55 of the mask exchange unit 7 in order to move the mask M by the achieved degree of movement. For example, the control device 9 achieves the degree of movement of the mask M by the mask shifting device 55 of the mask exchange unit 7 by the following formula (9), if the initial position of the movement of the plumb line scooping unit 56 on the front (Y2-direction side) of the mask M or the final position of the movement of the plumb line scooping unit 56 on the front of the mask M is outside the movement limit position of the plumb line scooping unit 56 on the front of the mask M. Then the control device 9 controls the mask shifting device 55 of the mask exchange unit 7 to move the mask M by the achieved degree of movement such that the plumb line S to be scooped is located within the operating range of the plumb line scooping unit 56. (Structure of detecting the plumb line state) In this embodiment, the plumb line width measuring unit 57 functions as a plumb line state detector, which is configured to detect the plumb line drawing state by the plumb line drawing unit 56 after the plumb line drawing process. After the plumb line drawing process, the control device 9 controls the plumb line width measuring unit 57 to detect whether the plumb line S is present in a position on the mask M where it was located. Specifically, after the plumb line drawing process, the control device 9 controls the plumb line width measuring unit 57 to irradiate the position on the mask M where the plumb line S was located with a laser beam. Based on the measurement result obtained by the plumb line width measuring unit 57 regarding the position where the plumb line S was located, the control device 9 determines whether the plumb line S is present in that position on the mask M. If it is determined that the solder S is not present in the position on the mask M where the solder S was located, the control device 9 determines that the state of the solder S being drawn by the solder drawing unit 56 is normal. If it is determined that the solder S is present in the position on the mask M where the solder S was located, the control device 9 determines that the state of the solder S being drawn by the solder drawing unit 56 is abnormal. The control device 9 is configured or programmed to perform a control action to notify a user to check the state of the solder S when the state of the solder S being drawn by the solder drawing unit 56 is abnormal. At this point, the control device 9 is configured or programmed to perform a control action to stop the printing device 1 by causing a fault.Furthermore, the control device 9 is set up or programmed to control the plumbing unit 56 to discharge the plumb S when the plumbing S supply state by the plumbing unit 56 is abnormal. The solder width measuring unit 57 also functions as a discharge state detector, which is configured to detect the discharge state of the solder S by the solder scoop unit 56 after the discharge process. After the discharge process, the control device 9 controls the solder width measuring unit 57 to detect whether the solder S is present in a position on the mask M where it should be located (a position where the solder S was discharged). Specifically, after the scooping process, the control device 9 controls the solder width measuring unit 57 to illuminate the position on the mask M where the solder S should be located with a laser beam.The control device 9 determines, based on the measurement result obtained by the plumb line width measuring unit 57 of the position in which the plumb line S should be arranged, whether the plumb line S is present in the position on the mask M in which the plumb line S should be arranged or not. If it is determined that the solder S is present in the position on the mask M where it should be located, the control device 9 determines that the state of the solder S unloading by the soldering unit 56 is normal. If it is determined that the solder S is not present in the position on the mask M where it should be located, the control device 9 determines that the state of the solder S unloading by the soldering unit 56 is abnormal. The control device 9 is configured or programmed to perform a control action to notify the user to check the state of the solder S when the state of the solder S unloading by the soldering unit 56 is abnormal. At this point, the control device 9 is configured or programmed to perform a control action to stop the printing device 1 by causing a fault.Furthermore, the control device 9 is set up or programmed to control the soldering unit 56 to discharge the solder S when the state of the discharge of the solder S by the soldering unit 56 is abnormal. (Load loading and unloading detection process) A solder loading and unloading detection process, which is carried out by the printing device 1 according to this embodiment, is now described on the basis of a flowchart with reference to Fig. 10. Each process step of the flowchart is carried out by the control device 9. As shown in Fig. 10, in step S1 the plumbing unit 56 first scoops the plumb S onto the mask M. Then, in step S2, based on the detection result of the plumb line drawing state S by the plumb line width measuring unit 57 as a drawing state detector, it is determined whether a plumb line drawing state S is normal or not. If it is determined that the plumb line drawing state S is normal, the process proceeds to step S3. Then, in step S3, the mask shifting device 55 of the mask exchange unit 7 replaces the mask M. Then, in step S4, the plumb line unit 56 discharges the plumb line S onto the mask M. Then, in step S5, based on the detection result of the solder discharge state S by the solder width measuring unit 57 as a discharge state detector, it is determined whether a solder discharge state S is normal or not. If it is determined that the solder discharge state S is normal, the solder loading and discharging detection process is completed. If in step S2 it is determined that the state of drawing the solder S is abnormal, or if in step S5 it is determined that the state of discharging the solder S is normal, the process proceeds to step S6. Then, in step S6, an error process occurs. In step S6, the printing device 1 is stopped, the user is notified to check the status of the solder S, and the soldering unit 56 discharges the solder S onto the mask M. After this, the solder loading and unloading detection process is complete. (Advantages of this embodiment) According to this embodiment, the following advantageous effects are achieved. According to this embodiment, as described above, the control device 9 is configured or programmed to determine, based on the measured width W of the plumb line S, the initial position of the movement of the plumb line scooping unit 56 during the process of scooping the plumb line S, the final position of the movement of the plumb line scooping unit 56 during the process of scooping the plumb line S, and the extent of movement of the plumb line scooping unit 56 during the process of scooping the plumb line S. Accordingly, the appropriate initial position, the appropriate final position, or the appropriate extent of movement for the actual width W of the plumb line S can be determined taking into account the actual width W of the plumb line S.Accordingly, it is possible to provide the pressure device 1, which is capable of significantly reducing or preventing the failure of the plumb line scooping process S due to an insufficient degree of movement of the plumb line scooping unit 56 during the process. Furthermore, if the degree of movement suitable for the actual width W of the plumb line S is achieved, an unnecessary increase in the degree of movement of the plumb line scooping unit 56 during the process of scooping the plumb line S can be significantly reduced or prevented. Thus, the time required for the plumb line scooping process S can be reduced to the necessary minimum. According to this embodiment, as described above, the control device 9 is configured or programmed to control the mask shifting device 55 to move the mask M such that the filler material S is within the operating range of the filler material scooping unit 56 when it is outside the operating range of the filler material scooping unit 56. Accordingly, the operating range of the filler material scooping unit 56 can be reduced by the amount of movement of the mask M that can be moved by the mask shifting device 55. Therefore, the device can be made smaller by reducing the operating range of the filler material scooping unit 56. According to this embodiment, as described above, the printing device 1 comprises the mask exchange unit 7, which includes the mask displacement device 55, the first bearing 61, and the second bearing 62. Accordingly, the mask displacement device 55 of the mask exchange unit 7 can be used as a mask movement device, which moves the mask M such that the plumb line S is located within the operating range of the plumb line creation unit 56. Therefore, it is not necessary to provide a separate mask movement device from the mask displacement device 55 of the mask exchange unit 7. Thus, no separate mask movement device is provided from the mask displacement device 55 of the mask exchange unit 7, and the number of components can be reduced, while the structure can be simplified.Furthermore, the mask M can be automatically replaced by the mask shifting device 55 as a mask exchange device, thus saving the user the effort of replacing the mask M. According to this embodiment, as described above, the control device 9 is configured or programmed to control the soldering unit 56 to scoop the solder S onto the mask M to be replaced before the mask M is replaced by the mask transfer device 55, and to discharge the solder S onto the replacement mask M after the mask M has been replaced by the mask transfer device 55. Accordingly, the soldering unit 56 can automatically transfer the solder S from mask M to mask M, thus saving the user the effort of manually transferring the solder S from mask M to mask M. According to this embodiment, as described above, the printing device 1 includes the solder width measuring unit 57 as a scooping status detector, which is configured to detect the status of the solder scooping S by the solder scooping unit 56 after the solder scooping process. Accordingly, it can be checked whether the solder S was scooped correctly by the solder scooping unit 56 or not. Therefore, if the solder S was not scooped correctly by the solder scooping unit 56, the device can be prompted to proceed appropriately, such as stopping, and it is possible to prevent the occurrence of printing defects. According to this embodiment, the scoop state detector includes the plumb line width measuring unit 57, as described above. Therefore, it is not necessary to provide the scoop state detector separately from the plumb line width measuring unit 57. Thus, the scoop state detector is not provided separately from the plumb line width measuring unit 57, and therefore the number of components can be reduced and the structure simplified. According to this embodiment, as described above, the control device 9 is configured or programmed to perform a control action to notify the user and check the status of the plumb line S if the plumb line supply unit 56 is in an abnormal state. Accordingly, the user can quickly perform an operation to correct the anomaly based on the information reported to them. Therefore, even if the device is stopped due to the anomaly, the anomaly can be quickly corrected, and the device's downtime can be reduced. According to this embodiment, as described above, the control device 9 is configured or programmed to control the soldering unit 56 to discharge the solder S when the state of the soldering process by the soldering unit 56 is abnormal. Accordingly, even if only a portion of the solder S has been drawn by the soldering unit 56 at the time of an anomaly, only the drawn portion of the solder S can be discharged from the soldering unit 56. Therefore, it is possible to significantly reduce or prevent the next drawing process by the soldering unit 56 in a state where only a portion of the solder S has been drawn. Thus, it is possible to significantly reduce or prevent the next drawing process by the soldering unit 56 from failing due to the fact that only a portion of the solder S has been drawn. (Modified examples) The embodiment disclosed herein is to be regarded in every respect as illustrative and not limiting. The scope of the present invention is not defined by the above description of the embodiment, but by the scope of the patent claims, and all modifications (modified examples) within the meaning and scope according to the patent claims are further included. For example, although the example in which the present invention is applied to a printing device that automatically exchanges a mask with a mask-shifting device (mask exchange device) was illustrated in the embodiment mentioned above, the present invention is not limited thereto. The present invention can be applied to a printing device in which a user manually exchanges a mask. Although the example in which the control device (the controller) is set up to obtain, based on the measured width of the solder (coating material), the initial position of the movement of the soldering unit (coating material supply unit) during the soldering process, the final position of the movement of the soldering unit during the soldering process, and the extent of movement of the soldering unit during the soldering process has been shown in each of the above-mentioned embodiments, the present invention is not limited thereto.In the present invention, the controller can be configured to obtain, based on the measured width of the coating material, the initial position of the movement of the coating material scooping unit during the coating material scooping process and / or the final position of the movement of the coating material scooping unit during the coating material scooping process and / or the extent of movement of the coating material scooping unit during the coating material scooping process. Although the example in which the printing device is configured to move the mask such that the solder to be scooped is within the operating range of the solder scoop unit when the solder (coating material) to be scooped is outside the operating range of the solder scoop unit (coating material scoop unit) was illustrated in the embodiment described above, the present invention is not limited thereto. In the present invention, the printing device may not be configured to move the mask such that the coating material to be scooped is within the operating range of the coating material scoop unit when the coating material to be scooped is outside the operating range of the coating material scoop unit. Although the example in which the printing device includes the mask shifting device as a mask movement device and a mask exchange device was presented in the embodiment described above, the present invention is not limited thereto. In the present invention, a mask movement device and a mask exchange device can be provided independently of one another in the printing device. Although the example in which the filler state detector includes the solder width measuring unit (coating material width measuring unit) was presented in the embodiment described above, the present invention is not limited thereto. In the present invention, as in a first modified example shown in Fig. 11, the filler state detector can include an image sensor 157. The image sensor 157 is provided on the doctor blade unit 6 to image the mask M. In this case, after the filler S process, the control device 9 controls the image sensor 157 to detect whether the solder S is present in the position on the mask M in which the solder S was located. Specifically, after the filler S process, the control device 9 controls the image sensor 157 to image the position on the mask M in which the solder S was located.Based on the imaging result obtained by the image sensor 157 of the position in which the solder S was located, the control device 9 determines whether the solder S is present in the position on the mask M in which it was located. If the control device 9 determines that the solder S is not present in the position on the mask M in which it was located, it determines that the state of the solder S being drawn by the solder drawing unit 56 is normal. Furthermore, if the control device 9 determines that the solder S is present in the position on the mask M in which it was located, it determines that the state of the solder drawing by the solder drawing unit 56 is abnormal. The image sensor 157 can function as a discharge state detector. In the present invention, as in a second modified example shown in Fig. 12, the plumb state detector can include a light detector 257. The light detector 257 is provided in the plumbing unit 56 to illuminate the scoop 56a of the plumbing unit 56 with light and to receive the reflected light. In this case, after the plumb S has been scooped, the control device 9 controls a photodetector 257 to detect whether the plumb S is present on the scoop 56a of the plumbing unit 56 or not. Specifically, after the plumb S has been scooped, the control device 9 controls the photodetector 257 to illuminate a position on the scoop 56a of the plumbing unit 56, where the plumb S should be located, with light and to receive the reflected light.The control device 9 determines, based on the detection result of the position on the scoop 56a of the scooping unit 56 where the solder S should be located, obtained by the photodetector 257, whether the solder S is present in the position on the scoop 56a of the scooping unit 56 where it should be located. If the control device 9 determines that the solder S is present in the position on the scoop 56a of the scooping unit 56 where it should be located, it determines that the state of the soldering process by the solder scooping unit 56 is normal. Furthermore, if the control device 9 determines that the solder S is not present in the position on the scoop 56a of the scooping unit 56 where it should be located, it determines that the state of the soldering process by the solder scooping unit 56 is abnormal. The photodetector 257 can function as a discharge state detector. In the present invention, as in a third modified example shown in Fig. 13, the scoop state detector can include a weight detector 357. The weight detector 357 is provided in the scoop unit 56 to detect the weight of an object to be detected (plumb line S), which is arranged on the scoop 56a of the scoop unit 56. In this case, the control device 9 obtains the weight detection result from the weight detector 357 after the process of scooping the plumb line S. Based on the weight detection result from the weight detector 357, the control device 9 determines whether the plumb line S is present on the scoop 56a of the scoop unit 56 or not. If the control device 9 determines that the plumb line S is present on the scoop 56a of the scoop unit 56, then the state of scooping the plumb line S by the plumb line scoop unit 56 is normal.The control device 9 determines, upon detecting that the plumb line S is not present on the scoop 56a of the scooping unit 56, that the state of plumb line scooping S by the plumb line scooping unit 56 is abnormal. The weight detector 357 can function as a discharge state detector. According to the structure in each of the first to third modified examples, the state of plumb line scooping S by the plumb line scooping unit 56 can be easily detected by the image sensor 157, the light detector 257, or the weight detector 357 after the plumb line scooping process. Although the process operations carried out by the control device are described for the sake of clarity using the flowchart, which is described in the embodiment described above as being controlled by a sequence in which processes occur sequentially along a process flow, the present invention is not limited to this. In the present invention, the process operations carried out by the control device can be event-driven, in which processes are based on an event. In this case, the process operations can be carried out in a completely event-driven manner or in a combination of an event-driven and a sequence-driven manner. Description of the reference symbols 1 Printing device 7 Mask exchange unit (mask exchange device) 9 Control device (controller) 51 Squeegee 55 Mask shifting device (mask movement device) 56 Solder scoop unit (coating material scoop unit) 57 Solder width measuring unit (coating material width measuring unit, scoop state detector) 61 First bearing (mask bearing) 62 Second bearing (mask bearing) 157 Image sensor (scoop state detector) 257 Light detector (scoop state detector) 357 Weight detector (scoop state detector) B Circuit board M Mask S Solder (coating material) W Solder width (width of coating material)

Claims

Printing device (1) comprising: a squeegee (51) configured to print a coating material (S) onto a mask (M) on a circuit board (B); a coating material scooping unit (56) configured to scoop the coating material (S) onto the mask (M); a coating material width measuring unit (57) configured to measure a width (W) of the coating material (S) on the mask (M); and a controller (9) configured or programmed to obtain, based on the measured width (W) of the coating material (S), an initial position of a movement of the coating material scooping unit (56) during a coating material scooping process and / or an end position of the movement of the coating material scooping unit (56) during the coating material scooping process and / or an extent of the movement of the coating material scooping unit (56) during the coating material scooping process. Printing device according to claim 1, further comprising: a mask movement device (55) which is configured to move the mask (M); wherein the controller (9) is configured or programmed to control the mask movement device (55) to move the mask (M) such that the coating material (S) to be scooped is located within an operating range of the coating material scooping unit (56) when the coating material (S) to be scooped is located outside the operating range of the coating material scooping unit (56). Printing device according to claim 2, further comprising: a mask exchange device (7) comprising the mask movement device (55) and a mask storage device (61, 62) which is configured to store the mask (M). Printing device according to claim 3, wherein the controller (9) is set up or programmed to control the coating material scooping unit (56) to scoop the coating material (S) onto the mask to be replaced (M) before a mask exchange operation by the mask exchange device (7) and to discharge the coating material (S) onto a replacement mask after the mask exchange operation by the mask exchange device (7). Printing device according to one of claims 1 to 4, further comprising: a scoop state detector (57, 157, 257, 357) which is configured to detect a state of coating material scooping by the coating material scooping unit (56) after the coating material scooping process. Printing device according to claim 5, wherein the scooping state detector (57, 157, 257, 357) comprises the coating material width measuring unit (57). Printing device according to claim 5, wherein the scoop state detector (57, 157, 257, 357) comprises an image sensor (157), a light detector (257) or a weight detector (357). Printing device according to one of claims 5 to 7, wherein the controller (9) is set up or programmed to perform control to notify a user to check the condition of the coating material (S) when the condition of the coating material scooping by the coating material scooping unit (56) is abnormal. Printing device according to one of claims 5 to 8, wherein the controller (9) is set up or programmed to control the coating material scooping unit (56) to discharge the coating material (S) when the coating material scooping state by the coating material scooping unit (56) is abnormal.

Images