Electronic component package and system with an electronic component package

Abstract

An electronic component package (100, 200) comprising: a redistribution layer; a bridge die (140) above the redistribution layer, the bridge die having a top, a bottom, a first side between the top and the bottom, and a second side between the top and the bottom, the second side being opposite the first side, the bridge die comprising a plurality of silicon vias (146), the plurality of silicon vias being coupled to the redistribution layer; an encapsulation layer (160) being laterally adjacent to and in contact with the first and second sides of the bridge die; a core (130) on the redistribution layer, the core being laterally adjacent to and in contact with the encapsulation layer;a first conductive via (132) laterally adjacent to the first side of the bridge die, wherein the first conductive via is in and in contact with a first section of the core; a second conductive via (132) laterally adjacent to the second side of the bridge die, wherein the second conductive via is in and in contact with a second section of the core; a first die (150a) coupled to the bridge die; and a second die (150b) coupled to the bridge die, wherein the second die is electrically coupled to the first die via electrical conductors (148) in the bridge die.

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