Semiconductor chip and component

Abstract

Semiconductor chip (LD) with a structured backside (RS) configured for electrical and thermal connection of the semiconductor chip (LD), wherein: - the semiconductor chip (LD) has emitter regions (E) configured for generating electromagnetic radiation (L); - the structured backside (RS) has connection pads (AP) configured for electrical connection of the emitter regions (E); - the connection pads (AP) are p-contacts or n-contacts, and all connection pads (AP) configured as either p-contacts or n-contacts overlap at least two of the emitter regions (E) of the semiconductor chip (LD) in plan view, and each pad is configured for electrical connection to only one of the emitter regions (E); and - the semiconductor chip (LD) has additional connection pads (WA) besides the connection pads (AP), wherein the connection pads (AP) and the additional connection pads (WA) form p-contacts and n-contacts of the semiconductor chip (LD).where the p-contacts and n-contacts of the semiconductor chip (LD) are located on the same contact plane.