Module for electrical components

Abstract

Module (1, 1A) for electrical components, comprising: a substrate (2) with a first surface (2b), a second surface (2c) facing away from the first surface (2b), a first metal foil (2d) provided on the first surface (2b), and a second metal foil (2e) provided on the second surface (2c), wherein a through hole (2f) is provided in the substrate (2) which penetrates from the first surface (2b) to the second surface (2c) and electrically connects the first metal foil (2d) and the second metal foil (2e); a heat-generating component arranged away from the substrate (2) in a plate thickness direction of the substrate (2); a heat transfer resin (4) arranged between the substrate (2) and the heat-generating component and in contact with the substrate (2) and the heat-generating component;a metal element (5) arranged on a side facing away from the heat-generating component with respect to the substrate (2) and at a distance from the substrate (2) in the plate thickness direction of the substrate (2), wherein the substrate (2) is arranged between the metal element (5) and the heat-generating component; a heat-dissipation element (6) arranged between the substrate (2) and the metal element (5) and in contact with the substrate (2) and the metal element (5); and a metallic heat transfer pin (7) inserted into the through-hole (2f), wherein the first metal foil (2d) and the through-hole (2f) are formed at positions that overlap at least the heat-generating component in the plate thickness direction of the substrate (2), and wherein a portion of the heat transfer pin (7) inserted into the through-hole (2f) is in contact with the heat transfer resin (4).

Description

Technical field The present disclosure relates to a module for electrical components that includes a heat generation component. background Typically, heat-generating components, such as a coil or a capacitor, are installed on an electrical component module. Therefore, the electrical component module requires a means to dissipate the heat generated by the heat-generating component. For example, patent literature 1 discloses a module for electrical components in which an electrical component is arranged in a plate thickness direction away from a substrate at one end of the substrate, a metal element is arranged in a plate thickness direction away from the substrate at another end of the substrate, and additionally a heat dissipation element is arranged such that it is located between the substrate and the metal element. The electrical component disclosed in patent literature 1 comprises a coil, which is a heat-generating component, a core in which the coil is housed, and a heat transfer resin arranged between the core and the substrate. According to the technique disclosed in patent literature 1, the heat generated by the coil can be transferred to and dissipated from the heat transfer resin, the substrate, the heat dissipation element, and the metal element in this sequence. As a result, the coil can be cooled. Patent literature 2 discloses an electronic device comprising an electrically conductive heat dissipation path formed in a thickness direction of a substrate to dissipate heat from a heat generating element on the side of one surface of the substrate to the side of another surface of the substrate. Patent literature 3 discloses a manufacturing process for a printed circuit board comprising at least one electrically conductive substrate and one non-electrically conductive substrate to reduce soldering defects of electronic components. Citation list Patent literature Patent literature 1: JP 2020 - 88 127 A; Patent literature 2: DE 11 2013 004 691 T5; andPatent Literature 3: US 2009 / 0 294 165 A1 Overview of the invention Problem to be solved by the invention To improve coil cooling, a higher heat transfer efficiency from the coil to the metal element is desirable. According to the technique disclosed in patent literature 1, the heat generated by the coil is transferred to the substrate or the like only through the heat transfer resin. Therefore, it is possible to increase the efficiency of the heat transfer from the coil to the metal element. The present disclosure was made in view of the above considerations, and one objective of the present disclosure is to provide a module for electrical components that can increase the heat transfer efficiency from a heat-generating component to a metal element compared to the prior art. Means to solve the problem To solve the aforementioned problems and achieve the objective, a module for electrical components with the features of independent claims 1 and 2 is defined according to the invention. Advantageous embodiments are described in the dependent claims. In particular, a module for electrical components according to the present disclosure comprises a substrate having a first surface, a second surface facing away from the first surface, a first metal foil provided on the first surface, and a second metal foil provided on the second surface, wherein a through-hole is provided in the substrate, which penetrates from the first surface to the second surface and electrically connects the first metal foil and the second metal foil. Furthermore, the electrical component module comprises a heat-generating component located away from the substrate in the thickness direction of the substrate, and a heat transfer resin located between the substrate and the heat-generating component and in contact with both. The electrical component module also comprises a metal element located on a side facing away from the heat-generating component and in the thickness direction of the substrate, with the substrate located between the metal element and the heat-generating component, a heat-dissipating element located between the substrate and the metal element and in contact with both, and a metallic heat transfer pin inserted into the through-hole.Part of the heat transfer pin is in contact with the heat transfer resin. Effects of the invention A module for electrical components according to the present disclosure achieves an effect such that it is possible to increase the heat transfer efficiency from a heat generating component to a metal element compared to the prior art. Brief description of the drawings Fig. 1 is a perspective view schematically showing the appearance of an air conditioner according to a first embodiment. Fig. 2 is a perspective view schematically showing an internal structure of the air conditioner according to the first embodiment. Fig. 3 is a cross-sectional view showing a module for electrical components according to the first embodiment. Fig. 4 is a cross-sectional view showing details of the module for electrical components according to the first embodiment. Fig. 5 is a cross-sectional view showing details of a module for electrical components according to a second embodiment. Description of the embodiments A module for electrical components according to embodiments is described in detail below with reference to the drawings. First embodiment. Fig. 1 is a perspective view schematically showing the appearance of an air conditioner 10 according to a first embodiment. Fig. 2 is a perspective view schematically showing an internal structure of the air conditioner 10 according to the first embodiment. As shown in Fig. 1, the air conditioner 10 comprises an indoor unit 11, which is installed indoors, and an outdoor unit 12, which is installed outdoors. The indoor unit 11 blows conditioned air into a room. The indoor unit 11 and the outdoor unit 12 are connected via a refrigerant line 13 through which a refrigerant circulates. The refrigerant line 13 is connected to a valve device, such as a four-way valve that reverses the flow direction of the refrigerant, or an expansion valve that expands the refrigerant to a specific pressure, although this is not specifically shown. As shown in Fig. 2, the outdoor unit 12 comprises a sheet metal housing 12a, an outdoor fan 12b, an outdoor heat exchanger 12c, a compressor 12d, and a drive unit 12e. The arrow Y shown in Fig. 1 and Fig. 2 indicates the direction of airflow generated by the outdoor fan 12b. In the present embodiment, one side of the outdoor unit 12, from which the airflow generated by the outdoor fan 12b is discharged to the outside, is designated as the front, and the side opposite the front is designated as the back. The sheet metal housing 12a is a box-shaped element that serves as the outline of the outdoor unit 12. The sheet metal housing 12a is made of metal. It includes a partition 12f. The partition 12f divides the interior of the sheet metal housing 12a into a fan chamber 12g and a machine chamber 12h. The fan chamber 12g and the machine chamber 12h are arranged side by side in the width direction of the outdoor unit 12. The external fan 12b and the external heat exchanger 12c are arranged in the fan chamber 12g. The external fan 12b is a device that generates an airflow. The external heat exchanger 12c is an element for heat exchange between the refrigerant and the outside air. The outside air introduced into the external fan 12b is passed through the external heat exchanger 12c. As shown in Fig. 1, a wire mesh 12i is provided in a front side wall of the sheet metal housing 12a in a portion facing the fan chamber 12g. An air inlet opening (not shown) is provided in a rear wall of the sheet metal housing 12a in a portion facing the fan chamber 12g. When the external fan 12b shown in Fig. 1 and Fig. 2 is driven, outside air from the outdoor unit 12 flows from the air supply opening into the fan chamber 12g, passes through the external heat exchanger 12c and is then discharged to the outside from the fan chamber 12g via the wire mesh 12i. As shown in Fig. 2, the compressor 12d and the drive device 12e are arranged in the machine chamber 12h. The compressor 12d is a device that compresses the refrigerant using a motor (not shown) as a drive source. The drive device 12e is a device that receives current from an external power supply (not shown) and supplies current to the motor. The drive device 12e is arranged on a surface of the separating device 12f facing the machine chamber 12h. Fig. 3 is a cross-sectional view showing a module 1 for electrical components according to the first embodiment. The module 1 for electrical components shown in Fig. 3 is installed in the drive device 12e. The module 1 for electrical components comprises a substrate 2, a coil 3, a heat transfer resin 4, a metal element 5, a heat dissipation element 6, and a plurality of heat transfer pins 7. When a direction of each component of the module 1 for electrical components is described below, a plate thickness direction of the substrate 2 is defined as a first direction, and a direction intersecting with the first direction is defined as a second direction.Furthermore, in the following description, a direction from an end section of the substrate 2 in the second direction towards a center of the substrate 2 in the second direction is defined as an inner side, and a side opposite the inner side is defined as an outer side. Fig. 4 is a cross-sectional view showing details of module 1 for electrical components according to the first embodiment. The substrate 2 is a flat, plate-shaped element with a conductor section. The substrate 2 comprises a base material 2a, a first metal foil 2d, and a second metal foil 2e. Furthermore, a through-hole 2f is provided in the substrate 2. The cross-sectional shape of the base material 2a is a rectangle that is longer in the second direction than in the first. An insulating resin is used as the material for the base material 2a. The base material 2a comprises a first surface 2b and a second surface 2c, which faces away from the first surface 2b. The first metal foil 2d is provided on the first surface 2b of the base material 2a. The first metal foil 2d is partially bonded to the first surface 2b of the base material 2a. The second metal foil 2e is provided on the second surface 2c of the base material 2a. The second metal foil 2e is partially bonded to the second surface 2c of the base material 2a. In the present embodiment, copper is used as the material for the first metal foil 2d and the second metal foil 2e. However, copper alloys, aluminum, aluminum alloys, nickel, and nickel alloys can also be used, for example. The through-hole 2f penetrates the first surface 2b and the second surface 2c and electrically connects the first metal foil 2d and the second metal foil 2e. The through-hole 2f includes a hole 2g that extends from the first surface 2b of the base material 2a to the second surface 2c in the first direction, and a conductive layer 2h that covers one inner wall of the hole 2g. The conductive layer 2h is tubular in shape. The conductive layer 2h is formed by electroplating. The conductive layer 2h electrically connects the first metal foil 2d and the second metal foil 2e. The conductive part of the substrate 2 consists of the first metal foil 2d, the second metal foil 2e, and the conductive layer 2h of the through-hole 2f. Electrical components (not shown) are mounted on substrate 2. These components include, for example, a noise filter, a smoothing capacitor, sensors that detect current and voltage, a microcomputer, and peripheral circuitry for the microcomputer. The electronic components are connected to the first metal foil 2d, the second metal foil 2e, or the through-hole 2f by soldering. The coil 3 is a heat-generating component located away from the substrate 2 in the first direction. When the drive device 12e is driven, heat is generated by the coil 3. The coil 3 comprises two conductor wires 3a extending towards the substrate 2. The two conductor wires 3a are separated from each other in the second direction. The heat transfer resin 4 is an element arranged between the substrate 2 and the coil 3 and is in contact with both. The heat transfer resin 4 plays a role in transferring the heat generated by the coil 3 to the heat transfer pin 7 and the substrate 2. Preferably, a resin with high thermal conductivity is used as the heat transfer resin 4. The heat transfer resin 4 is arranged between the substrate 2 and the coil 3. The heat transfer resin 4 is thermally bonded to the first metal foil 2d and the coil 3. A portion of the heat transfer resin 4 penetrates the first metal foil 2d in the first direction and is in contact with the first surface 2b. The metal element 5 is located on a side facing away from the coil 3 and in the first direction from the substrate 2, with the base material 2a positioned between the metal element 5 and the coil 3. The metal element 5 is conductive and heat-dissipating. It plays a role in dissipating the heat generated by the coil 3 to the exterior of the drive unit 12e. In the present embodiment, the metal element 5 is a metal sheet. However, the metal element 5 can also be a heat sink, a housing forming the outline of a device on which the drive unit 12e is installed, or the like. In a case where the drive unit 12e is installed on the air conditioner 10, the metal element 5 can be the sheet metal housing 12a of the outdoor unit 12. The heat dissipation element 6 is an element arranged between the substrate 2 and the metal element 5 and is in contact with both. The heat dissipation element 6 plays a role in dissipating the heat generated by the coil 3. A heat-dissipating film, a gel, or a gel with heat dissipation properties is used as the heat dissipation element 6. The heat dissipation element 6 is arranged between the substrate 2 and the metal element 5. The heat dissipation element 6 is thermally connected to the second metal foil 2e and the metal element 5. A portion of the heat dissipation element 6 penetrates the second metal foil 2e in the first direction and is in contact with the second surface 2c. The heat transfer pin 7 is a metal element inserted into the through-hole 2f. Preferably, a metal with high thermal conductivity is used as the heat transfer pin 7. The heat transfer pin 7 projects towards the heat transfer resin 4 via the first surface 2b of the substrate 2 and the first metal foil 2d. A portion of the heat transfer pin 7 is in contact with the heat transfer resin 4. A portion of the heat transfer pin 7 penetrates the heat transfer resin 4. The heat transfer pin 7 projects towards the heat dissipation element 6 via the second surface 2c of the substrate 2 and the second metal foil 2e. A portion of the heat transfer pin 7 is in contact with the heat dissipation element 6. A portion of the heat transfer pin 7 penetrates the heat dissipation element 6. The heat transfer pin 7 exits the heat transfer resin 4 through the through-hole 2f and reaches the heat dissipation element 6. Although the number of heat transfer pins 7 is not particularly limited, in the present embodiment there are four. The four heat transfer pins 7 are arranged at intervals in the second direction. The individual heat transfer pin 7 is inserted into the individual through-hole 2f. The heat transfer pin 7 is arranged in a position that overlaps the coil 3 in the first direction. The heat transfer pin 7 is arranged in a position that is closer to the center of the coil 3 in the second direction. The heat transfer pin 7 is arranged in the second direction between the two conductor wires 3a. The heat transfer pin 7 is arranged on the inner side of each conductor wire 3a. The effects of module 1 on electrical components according to the first embodiment are described below. In the present embodiment, as shown in Fig. 4, the module 1 for electrical components comprises the coil 3, which is arranged away from the substrate 2 in the thickness direction of the substrate 2, and the heat transfer resin 4, which is arranged between the substrate 2 and the coil 3 and is in contact with both the substrate 2 and the coil 3. The module 1 for electrical components further comprises the metal element 5, which is arranged on the side facing away from the coil 3 and away from the substrate 2 in the thickness direction of the substrate 2, with the substrate 2 being arranged between the metal element 5 and the coil 3, and the heat dissipation element 6, which is arranged between the substrate 2 and the metal element 5 and is in contact with both the substrate 2 and the metal element 5.Furthermore, the module 1 for electrical components includes the metallic heat transfer pin 7, which is inserted into the through-hole 2f, and a portion of the heat transfer pin 7 is in contact with the heat transfer resin 4. Additionally, a portion of the heat transfer pin 7 is in contact with the heat dissipation element 6. With these configurations, in the present embodiment, a path is essentially divided into two paths: one in which the heat generated by the coil 3 is transferred to the heat transfer resin 4, the heat transfer pin 7, the heat dissipation element 6, and the metal element 5 in that order; and another in which the heat generated by the coil 3 is transferred to the heat transfer resin 4, the substrate 2, the heat dissipation element 6, and the metal element 5 in that order.The heat transferred from each path to the metal element 5 can then be dissipated from the metal element 5 to the exterior of the drive device 12e. It should be noted that the heat transferred from the heat transfer resin 4 to the substrate 2 is transferred in this order to the first metal foil 2d, the through-hole 2f, and the second metal foil 2e. In the present embodiment, the heat generated by the coil 3 is transferred to the substrate 2 via the heat transfer resin 4, and furthermore, the heat generated by the coil 3 is transferred to the heat dissipation element 6 via the heat transfer pin 7. Therefore, compared to a case where the heat generated by the coil 3 is transferred to the substrate 2 only via the heat transfer resin 4, the heat transfer efficiency from the coil 3 to the metal element 5 can be increased, and the cooling of the coil 3 can be enhanced. In particular, in the present embodiment, by connecting the heat transfer resin 4 and the heat dissipation element 6 with the metallic heat transfer pin 7, the heat transfer efficiency from the heat transfer resin 4 to the heat dissipation element 6 can be increased. Furthermore, by increasing the heat transfer efficiency from the coil 3 to the metal element 5, it is possible to reduce the size of the coil 3, and it is possible to reduce the effect of the heat from the coil 3 on peripheral components and to reduce the area of ​​the substrate 2. In the present embodiment, as shown in Fig. 4, the heat transfer pin 7 projects towards the heat transfer resin 4 beyond the first surface 2b of the substrate 2 and the first metal foil 2d in such a way that the area of ​​the heat transfer pin 7 that absorbs heat from the heat transfer resin 4 is increased. Therefore, it is possible to efficiently transfer the heat from the heat transfer resin 4 to the heat transfer pin 7, and it is possible to further increase the heat transfer efficiency from the coil 3 to the metal element 5. In the present embodiment, as shown in Fig. 4, the heat transfer pin 7 projects from the second surface 2c of the substrate 2 and the second metal foil 2e towards the heat dissipation element 6 in such a way that the area of ​​the heat transfer pin 7 that transfers heat to the heat dissipation element 6 increases. Therefore, it is possible to efficiently transfer heat from the heat transfer pin 7 to the heat dissipation element 6, and it is possible to further increase the heat transfer efficiency from the coil 3 to the metal element 5. Since the heat transfer resin 4 shown in Fig. 4 is a resin, it can be easily deformed in the present embodiment. Therefore, the coil 3, which has irregularities, can be brought into close contact with the heat transfer resin 4, making it possible to efficiently transfer heat from the coil 3 to the heat transfer resin 4 and to further increase the heat transfer efficiency from the coil 3 to the metal element 5. It should be noted that in the present embodiment, the heat transfer pin 7 is inserted into the through-hole 2f and attached to the heat transfer resin 4 and the heat dissipation element 6. However, the heat transfer pin 7 can also be connected to the substrate 2 by soldering. Since the volume of a metal part of the heat transfer pin 7 can be increased in this way, it is possible to further increase the heat transfer efficiency from the coil 3 to the metal element 5. Second embodiment. Next, a module 1A for electrical components according to a second embodiment is described with reference to Fig. 5. Fig. 5 is a cross-sectional view showing details of the module 1A for electrical components according to the second embodiment. The present embodiment differs from the first embodiment in that a liquid metal 6a is used as a heat dissipation element 6, and a housing section 5a, in which the liquid metal 6a is housed, is provided in the metal element 5. It should be noted that in the second embodiment, the parts that overlap with those of the first embodiment are provided with the same reference numerals, and their description is omitted. The annular housing section 5a, which projects towards the substrate 2, is formed in a section of the metal element 5 facing the substrate 2. A front end of a wall of the housing section 5a is in contact with the second metal foil 2e of the substrate 2. A recess 5b is formed in the housing section 5a, opening towards the substrate 2. The liquid metal 6a is contained in the recess 5b. The liquid metal 6a is in contact with the second metal foil 2e, the heat transfer pin 7, and the conducting wire 3a of the coil 3. A portion of the heat transfer pin 7 and a portion of the conducting wire 3a penetrate the liquid metal 6a. In the present embodiment, the heat dissipation element 6 is the liquid metal, and the metal element 5 comprises the housing section 5a in which the liquid metal 6a is contained such that the heat transferred from the heat transfer pin 7 to the liquid metal 6a causes a convection phenomenon within the liquid metal 6a. That is, the heated liquid metal 6a transfers heat to the metal element 5 while causing the convection phenomenon. By utilizing the properties of the liquid metal 6a, which, as a liquid, causes the convection phenomenon, and the properties of the liquid metal 6a, which, as a metal, exhibits high thermal conductivity, it is therefore possible to efficiently transfer heat from the heat dissipation element 6 to the metal element 5, and it is possible to further increase the heat transfer efficiency from the coil 3 to the metal element 5. In the present embodiment, a configuration has been described in which the housing section 5a is formed by a portion of the section of the metal element 5 facing the substrate 2 projecting towards the substrate 2. However, the present embodiment is not limited to this configuration. For example, the housing section 5a can be formed by omitting a portion of the section of the metal element 5 facing the substrate 2, such that it is located away from the substrate 2 in the first direction. The configurations shown in the embodiments described above are examples and can be combined with other known techniques. Furthermore, the embodiments can be combined with one another, and some configurations can be partially omitted or modified without departing from the scope of the present invention. In each embodiment described above, a case is described in which the number of heat transfer pins 7 is four. However, the number of heat transfer pins 7 can be suitably increased or decreased. Although the heat transfer pins 7 shown in Figures 3, 4 to 5 are arranged in a horizontal direction of the paper, they can also be arranged in a depth direction of the paper, or both horizontally and in a depth direction. While the heat transfer pin 7 shown in Figures 3, 4 to 5 is arranged on the inside of the conductor wire 3a, it can also be arranged on the outside of the conductor wire 3a.In such a configuration, it is sufficient that the through-hole 2f is provided in a section of the substrate 2 located on the outside of the conductor wire 3a, and that the heat transfer pin 7 is inserted into the through-hole 2f. In each of the embodiments described above, the heat transfer pin 7 projects beyond the first metal foil 2d towards the heat transfer resin 4. However, the heat transfer pin 7 can also be in contact with the heat transfer resin 4 without projecting beyond the first metal foil 2d towards the heat transfer resin 4. That is, an end face of the heat transfer pin 7 facing the heat transfer resin 4 and an end face of the first metal foil 2d facing the heat transfer resin 4 can form the same surface. Furthermore, in each of the embodiments described above, the heat transfer pin 7 projects beyond the second metal foil 2e towards the heat dissipation element 6. However, the heat transfer pin 7 can also be in contact with the heat dissipation element 6 without projecting beyond the second metal foil 2e towards it. That is, an end face of the heat transfer pin 7 facing the heat dissipation element 6 and an end face of the second metal foil 2e facing the heat transfer resin 4 can form the same surface. Furthermore, in each of the embodiments described above, a portion of the heat transfer pin 7 is in contact with the heat dissipation element 6. However, a portion of the heat transfer pin 7 can be separated from the heat dissipation element 6 without the heat transfer pin 7 coming into contact with the heat dissipation element 6. In this way, the path is divided into the path in which the heat generated by the coil 3 is transferred to the heat transfer resin 4, the heat transfer pin 7, the substrate 2, the heat dissipation element 6, and the metal element 5 in that order, and the path in which the heat generated by the coil 3 is transferred to the heat transfer resin 4, the substrate 2, the heat dissipation element 6, and the metal element 5 in that order.This means that the heat generated by the coil 3 is transferred to the substrate 2 via the heat transfer resin 4, and additionally, the heat generated by the coil 3 is transferred to the substrate 2 via the heat transfer pin 7. Therefore, it is possible to increase the heat transfer efficiency from the coil 3 to the metal element 5 compared to the prior art, and it is possible to improve the cooling of the coil 3. The heat-generating component to be cooled is not limited to coil 3, as long as the heat-generating component is an electronic device that generates heat. The heat-generating component could, for example, be a capacitor. Reference symbol list 1, 1A Module for electrical components; 2 Substrate; 2a Base material; 2b First surface; 2c Second surface; 2d First metal foil; 2e Second metal foil; 2f Through hole; 2g Hole; 2h Conductor layer; 3 Coil; 3a Conductor wire; 4 Heat transfer resin; 5 Metal element; 5a Housing section; 5b Recess; 6 Heat dissipation element; 6a Liquid metal; 7 Heat transfer pin; 10 Air conditioner; 11 Indoor unit; 12 Outdoor unit; 12a Sheet metal housing; 12b Outdoor fan; 12c Outdoor heat exchanger; 12d Compressor; 12e Drive device; 12f Separator; 12g Fan chamber; 12h Machine chamber; 12i Wire mesh; 13 Refrigerant line

Claims

Module (1, 1A) for electrical components, comprising: a substrate (2) with a first surface (2b), a second surface (2c) facing away from the first surface (2b), a first metal foil (2d) provided on the first surface (2b), and a second metal foil (2e) provided on the second surface (2c), wherein a through hole (2f) is provided in the substrate (2) which penetrates from the first surface (2b) to the second surface (2c) and electrically connects the first metal foil (2d) and the second metal foil (2e); a heat-generating component arranged away from the substrate (2) in a plate thickness direction of the substrate (2); a heat transfer resin (4) arranged between the substrate (2) and the heat-generating component and in contact with the substrate (2) and the heat-generating component;a metal element (5) arranged on a side facing away from the heat-generating component with respect to the substrate (2) and at a distance from the substrate (2) in the plate thickness direction of the substrate (2), wherein the substrate (2) is arranged between the metal element (5) and the heat-generating component; a heat-dissipation element (6) arranged between the substrate (2) and the metal element (5) and in contact with the substrate (2) and the metal element (5); and a metallic heat transfer pin (7) inserted into the through-hole (2f), wherein the first metal foil (2d) and the through-hole (2f) are formed at positions that overlap at least the heat-generating component in the plate thickness direction of the substrate (2), and wherein a portion of the heat transfer pin (7) inserted into the through-hole (2f) is in contact with the heat transfer resin (4). Module (1, 1A) for electrical components, comprising: a substrate (2) with a first surface (2b), a second surface (2c) facing away from the first surface (2b), a first metal foil (2d) provided on the first surface (2b), and a second metal foil (2e) provided on the second surface (2c), wherein a through hole (2f) is provided in the substrate (2) which penetrates from the first surface (2b) to the second surface (2c) and electrically connects the first metal foil (2d) and the second metal foil (2e); a heat-generating component arranged away from the substrate (2) in a plate thickness direction of the substrate (2); a heat transfer resin (4) arranged between the substrate (2) and the heat-generating component and in contact with the substrate (2) and the heat-generating component;a metal element (5) arranged on a side facing away from the heat-generating component with respect to the substrate (2) and away from the substrate (2) in the thickness direction of the substrate (2), wherein the substrate (2) is arranged between the metal element (5) and the heat-generating component; a heat-dissipation element (6) arranged between the substrate (2) and the metal element (5) and in contact with the substrate (2) and the metal element (5); and a metallic heat transfer pin (7) inserted into the through-hole (2f), wherein a portion of the heat transfer pin (7) projects towards the heat transfer resin (4) beyond the first surface (2b) of the substrate (2) and the first metal foil (2d) and is in contact with the heat transfer resin (4). Module (1, 1A) for electrical components according to claim 1 or 2, wherein the heat dissipation element (6) is a liquid metal, and wherein the metal element (5) comprises a housing section (5a) in which the liquid metal is housed. Module (1, 1A) for electrical components according to one of claims 1 to 3, wherein a part of the heat transfer pin (7) is in contact with the heat dissipation element. Module (1, 1A) for electrical components according to one of claims 1 to 4, wherein the heat transfer pin (7) is soldered to the substrate.

Images