POWER CONVERSION DEVICE, ELECTRIC VEHICLE DRIVE DEVICE AND POWER CONVERSION DEVICE MANUFACTURING METHOD

Abstract

A power conversion device (1) comprises: one or more power modules (10); a control device (11); at least one electrical component, including a smoothing capacitor (12), an inductor, a boost converter unit, a buck converter unit, and a transmission control unit; a busbar assembly (13) with a busbar; and a cooler (14) with a first cooling surface (14b), a second cooling surface (14c), and a coolant flow path (14a) formed in the cooler (14). Each power module (10), the smoothing capacitor (12), the inductor, the boost converter unit, the buck converter unit, the transmission control unit, and the busbar assembly (13) are heat-generating components. The first cooling surface (14b) and the second cooling surface (14c) are provided parallel to each other on both sides of the coolant flow path (14a).At least one of the heat-generating components is thermally connected to the first cooling surface (14b). At least one of the heat-generating components is thermally connected to the second cooling surface (14c).

Description

TECHNICAL AREA

[0001] The present disclosure relates to a power conversion device, an electric vehicle drive device and a power conversion device manufacturing method. STATE OF THE ART

[0002] In recent years, electric or hybrid vehicles have been equipped with motors as power sources. Therefore, these vehicles generally include power conversion devices such as inverters to control the power supplied to the motors. Configurations of such vehicle-mounted power conversion devices have been disclosed (see, for example, Patent Document 1). A power conversion device in Patent Document 1 has a main part consisting of: a power module with an integrated semiconductor element such as an IGBT; a drive circuit that drives the power module; a control circuit that controls these components; a smoothing capacitor that smooths an input voltage to the power module; and a heat sink with a coolant flow path formed therein.

[0003] However, the power conversion device disclosed in patent document 1 cannot function as a product without its main components being installed in a housing. Therefore, it is difficult to verify the function and performance of the power conversion device before installation in a housing. This difficulty thus leads to a disadvantage with regard to improving the productivity of the power conversion device and also poses a problem with regard to ensuring its quality.

[0004] Configurations that allow the function and performance of a power conversion device to be verified before installation in a housing have been disclosed (see, for example, patent document 2). A power conversion device disclosed in patent document 2 is a self-contained high-voltage unit that can incorporate the main functions required for the power conversion device, namely a cooling function and an inverter function, and allows the verification of both functions before installation in a housing. QUOTE LIST PATENT DOCUMENT Patent document 1: Japanese published patent application no. 2019-170158 Patent document 2: Japanese published patent application no. 2017-135919 SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION

[0005] Patent document 2 above shows the functions of the power conversion device before it is installed in a housing, thus allowing its functionality to be tested prior to installation. However, in the configuration of the disclosed power conversion device, a water-cooling jacket has a surface on which a power module is arranged, and a busbar and a smoothing capacitor are placed on an upper section of the power module. Therefore, a heat-generating component other than the power module (e.g., the smoothing capacitor) cannot be thermally connected to the water-cooling jacket in a state where sufficient area for heat dissipation is ensured. This results in a reduction in the cooling capacity of the power conversion device.

[0006] In view of this, it is the subject of the present disclosure to provide a power conversion device which has excellent cooling performance, thereby improving the productivity of the power conversion device. MEANS TO SOLVE THE PROBLEM

[0007] A power conversion device according to the present disclosure comprises: one or more power modules, each of which has one or more semiconductor elements and is connected to a power supply connection terminal for connection to a DC power supply; a control board that controls switching operations of the semiconductor elements; at least one electrical component, which is a smoothing capacitor that smooths an input voltage to be fed into the power module from the DC power supply; and electrical components, which are an inductor, a boost converter unit, a buck converter unit, and a transmission control unit, which are electrically connected to the power module.a busbar arrangement with a busbar that establishes an electrical connection in at least one interval between an interval between the power supply connection terminal and the power module, an interval between the power supply connection terminal and the at least one electrical component, and an interval between the power module and the at least one electrical component;and a cooler comprising a first cooling surface, a second cooling surface on the opposite side from the first cooling surface, and a coolant flow path formed within the cooler. The power module, smoothing capacitor, inductor, boost converter unit, buck converter unit, transmission control unit, and busbar are heat-generating components. The first and second cooling surfaces are provided parallel to each other on both sides of the coolant flow path. At least one of the heat-generating components is thermally connected to the first cooling surface. At least one of the heat-generating components is thermally connected to the second cooling surface. IMPACT OF THE INVENTION

[0008] The power conversion device according to the present disclosure comprises: one or more power modules; a control board; at least one electrical component, including a smoothing capacitor, an inductor, a boost converter unit, a buck converter unit, and a transmission control unit; a busbar assembly with a busbar; and a cooler with a first cooling surface, a second cooling surface, and a coolant flow path formed in the cooler. Each power module, the smoothing capacitor, the inductor, the boost converter unit, the buck converter unit, the transmission control unit, and the busbar assembly are heat-generating components. The first cooling surface and the second cooling surface are provided parallel to each other on both sides of the coolant flow path.At least one of the heat-generating components is thermally connected to the first cooling surface. At least one of the heat-generating components is thermally connected to the second cooling surface. This makes it possible to thermally connect a second heat-generating component to the cooler without increasing the cooler's size. Because both heat-generating components are thermally connected to the cooler, their heat dissipation properties are improved, resulting in a power conversion device with excellent cooling performance. Furthermore, the power conversion device is a complete, integrated unit that performs the main functions (e.g.,(an inverter function and cooling) required for the power conversion device, and which allows verification of the main functions without being enclosed in a housing or the like. Consequently, the productivity of the power conversion device 1 can be improved. BRIEF DESCRIPTION OF THE DRAWINGS [ Fig. 1] Fig. Figure 1 is a side view schematically showing a power conversion device according to embodiment 1. [ Fig. 2] Fig. Figure 2 is a side view schematically showing the power conversion device according to embodiment 1. [ Fig. 3] Fig. Figure 3 shows an example of the circuit configuration of a power converter according to embodiment 1. [ Fig. 4] Fig. Figure 4 is a side view schematically showing another power conversion device according to embodiment 1. [ Fig. 5] Fig. Figure 5 is a side view schematically showing another power conversion device according to embodiment 1. [ Fig. 6] Fig. Figure 6 shows a manufacturing process for the power conversion device according to embodiment 1. [ Fig. 7] Fig. Figure 7 is a side view schematically showing a power conversion device according to embodiment 2. [ Fig. 8] Fig. Figure 8 is a side view schematically showing the power conversion device according to embodiment 2. [ Fig. 9] Fig. Figure 9 is a side view schematically showing another power conversion device according to embodiment 2. [ Fig. 10] Fig. Figure 10 is a side view schematically showing the other power conversion device according to embodiment 2. [ Fig. 11] Fig. Figure 11 shows a manufacturing process for the power conversion device according to embodiment 2. [ Fig. 12] Fig. Figure 12 is a side view schematically showing a power conversion device according to embodiment 3. [ Fig. 13] Fig. Figure 13 is a side view schematically showing the power conversion device according to embodiment 3. [ Fig. 14] Fig. Figure 14 is a side view schematically showing another power conversion device according to embodiment 3. [ Fig. 15] Fig. Figure 15 is a side view schematically showing the other power conversion device according to embodiment 3. [ Fig. 16] Fig. Figure 16 is a side view schematically showing a power conversion device according to embodiment 4. [ Fig. 17] Fig. Figure 17 is a side view schematically showing the power conversion device according to embodiment 4. [ Fig. 18] Fig. Figure 18 is a side view schematically showing another power conversion device according to embodiment 4. [ Fig. 19] Fig. Figure 19 is a side view schematically showing the other power conversion device according to embodiment 4. [ Fig. 20] Fig. Figure 20 is a side view schematically showing another power conversion device according to embodiment 4. [ Fig. 21] Fig. Figure 21 is a side view schematically showing a power conversion device according to embodiment 5. [ Fig. 22] Fig. Figure 22 is a side view schematically showing the power conversion device according to embodiment 5. [ Fig. 23] Fig. Figure 23 is a side view schematically showing another power conversion device according to embodiment 5. [ Fig. 24] Fig. Figure 24 is a side view schematically showing the other power conversion device according to embodiment 5. [ Fig. 25] Fig. Figure 25 is a side view schematically showing a power conversion device according to embodiment 6. [ Fig. 26] Fig. Figure 26 is a side view schematically showing the power conversion device according to embodiment 6. [ Fig. 27] Fig. Figure 27 is a side view schematically showing another power conversion device according to embodiment 6. [ Fig. 28] Fig. Figure 28 is a side view schematically showing the other power conversion device according to embodiment 6. [ Fig. 29] Fig. Figure 29 is a side view schematically showing a power conversion device according to embodiment 7. [ Fig. 30] Fig. Figure 30 is a side view schematically showing the power conversion device according to embodiment 7. [ Fig. 31] Fig. Figure 31 is a side view schematically showing another power conversion device according to embodiment 7. [ Fig. 32] Fig. Figure 32 is a side view schematically showing the other power conversion device according to embodiment 7. [ Fig. 33] Fig. Figure 33 is a diagram that schematically shows an electric vehicle drive device according to embodiment 8. DESCRIPTION OF THE EXECUTION FORMS

[0009] Power conversion devices, an electric vehicle drive device, and a power conversion device manufacturing method according to the present embodiments of the disclosure are described below with reference to the drawings. The description is given while the same or corresponding elements and sections in the drawings are identified by the same reference numerals. Design 1

[0010] Fig. Figure 1 is a side view schematically showing a power conversion device 1 according to embodiment 1, wherein a side wall of a cooler 14 is partially removed. Fig. Figure 2 is a side view schematically showing the power conversion device 1, with one side wall of a housing 200 partially removed. Fig. Figure 3 shows an example of the circuit configuration of the power conversion device 1. Fig. Figure 4 is a side view schematically showing another power conversion device 1 according to embodiment 1, wherein the side wall of the cooler 14 is partially removed. Fig. Figure 5 is a side view schematically showing the other power conversion device 1, with the side wall of the housing 200 partially removed. Fig. Figure 6 shows a manufacturing process for the power conversion device 1. The power conversion device 1 is a device for converting an input current from DC to AC or from AC to DC, or for converting an input voltage to a different voltage. In the present disclosure, the power conversion device 1 is described as a converter for converting DC power to AC power and for supplying the AC power to a drive motor of a hybrid or electric car. However, according to the present disclosure, the power conversion device 1 is not limited to such an inverter. <Schaltungskonfiguration der Leistungskonvertierungsvorrichtung 1>

[0011] A schematic diagram of the circuit configuration of the power conversion device 1 is shown with reference to Fig. 3 described. The power conversion device 1 comprises a power module 10 and a smoothing capacitor 12, which smooths an input voltage supplied to the power module 10 by a DC power supply 21. The power conversion device 1 is connected to the DC power supply 21, which is provided outside the device. The power conversion device 1 comprises busbars 13a, through which DC power flows, and busbars 13b, through which AC power flows. The smoothing capacitor 12 is electrically connected to the busbars 13a. The power module 10 is electrically connected to the busbars 13a and the busbars 13b. The power module 10 has one or a plurality of semiconductor elements 10a and is connected to power supply connection terminals 22, which are provided by the DC power supply 21. Although the power module 10 in Fig. While the device has six semiconductor elements 10a, the number of semiconductor elements 10a is not limited to this. The semiconductor elements 10a perform power conversion between DC / DC power and AC power. The AC power is output from the busbars 13b to a drive motor 300 to operate a rotating electric machine that includes the drive motor 300. The power conversion device 1 can be configured to convert the AC power output from a generator into DC power to charge the DC power supply 21.

[0012] Each of the semiconductor elements 10a uses a semiconductor element for power control, such as a metal-oxide-semiconductor field-effect transistor (MOSFET), an insulated-gate bipolar transistor (IGBT), a flyback diode, or similar. The semiconductor element 10a is not limited to these and can also be a different semiconductor element, such as a bipolar transistor. Alternatively, the semiconductor element 10a can be a reverse-conducting IGBT (RC-IGBT) in which a switching element and a flyback diode are integrated.

[0013] The semiconductor element 10a is formed on a semiconductor substrate made of a material such as silicon, silicon carbide, or gallium nitride. A wide-bandgap semiconductor element, which has a larger bandgap than silicon, can be used for semiconductor element 10a. For example, if a MOSFET made of silicon carbide, a wide-bandgap semiconductor element, is used, this MOSFET can exhibit a greater rate of change (di / dt) of the switching current than a MOSFET made of silicon. Additionally, such a wide-bandgap semiconductor element has a low on-resistance, low losses, and generates little heat, allowing the chip area to be reduced. Because the chip area is reduced, the module 10 can be miniaturized for lower power requirements. <Konfiguration der Leistungskonvertierungsvorrichtung 1>

[0014] A configuration of the power conversion device 1 is described with reference to Fig. The power conversion device 1 comprises one or a plurality of power modules 10, a control board 11, at least one electrical component, a busbar assembly 13, and the heat sink 14. Each of the power modules 10 has one or a plurality of semiconductor elements 10a and is connected to the power supply connection terminals 22 to be supplied to the DC power supply 21. Although the power conversion device 1 comprises three such power modules 10 in the present embodiment, the number of power modules 10 is not limited thereto. The number of semiconductor elements 10a in each of the power modules 10 is, for example, two. The control board 11 controls the switching operations of the semiconductor elements 10a.

[0015] In the present embodiment, the power conversion device 1 comprises, as at least one electrical component, the smoothing capacitor 12, which smooths an input voltage supplied by the DC power supply 21 to the power module 10. The at least one electrical component is not limited to the smoothing capacitor 12. Other examples of the at least one electrical component are an inductor, a boost converter unit, a buck converter unit, and a transmission control unit, which are electrically connected to the power module 10. These other examples of the at least one electrical component are described later.

[0016] The busbar arrangement 13 comprises busbars 13a that establish an electrical connection in at least one interval between the power supply connection terminals 22 and the power module 10, between the power supply connection terminals 22 and the at least one electrical component, and between the power module 10 and the at least one electrical component. In the present embodiment, the busbar arrangement 13 comprises busbars 13a that establish an electrical connection in the interval between the power supply connection terminals 22 and the power module 10, the interval between the power supply connection terminals 22 and the smoothing capacitor 12, and the interval between the power module 10 and the smoothing capacitor 12. Fig. 1 shows the busbar arrangement 13 the two in Fig. 3 busbars 13a and 13b are shown. In Fig. 1 and Fig. 2. Busbars 13a and 13b are schematically shown together as busbars 23 by a dashed line, and busbars 13a and 13b are in Fig. 1 or Fig. 2 not shown individually.

[0017] The cooler 14 has a first cooling surface 14b, a second cooling surface 14c on the opposite side of the first cooling surface 14b, and a coolant flow path 14a formed within the cooler 14. The power module 10, the smoothing capacitor 12, the inductor, the boost converter unit, the buck converter unit, the transmission control unit, and the busbar assembly 13 are heat-generating components. The first cooling surface 14b and the second cooling surface 14c are arranged parallel to each other on both sides of the coolant flow path 14a. At least one of the heat-generating components is thermally connected to the first cooling surface 14b. At least one of the heat-generating components is thermally connected to the second cooling surface 14c.In the present embodiment, the smoothing capacitor 12 is thermally connected to the first cooling surface 14b as a heat-generating component, and the power module 10 is thermally connected to the second cooling surface 14c as a heat-generating component.

[0018] This configuration allows, in addition to the power module 10 as one of the heat-generating components, another heat-generating component to be thermally connected to the cooler 14 without increasing the size of the cooler 14. Since both heat-generating components are thermally connected to the cooler 14, their heat dissipation properties are improved, resulting in a power conversion device 1 with excellent cooling. Furthermore, because the heat dissipation properties of both heat-generating components are improved, their size can be reduced. Consequently, the power conversion device 1 can also be made smaller.

[0019] The power conversion device 1 is enclosed in a housing or the like and mounted in a hybrid or electric vehicle. The power conversion device 1 has a power conversion function and a cooling function and allows for the verification of the power conversion function and the cooling function. The in Fig. The power conversion device 1 shown is a complete, integrated unit that incorporates the main functions required for the power conversion device 1 (e.g., inverter function and cooling) and allows for verification of these main functions without requiring installation in a housing or similar enclosure. Consequently, the productivity of the power conversion device 1 can be improved. Furthermore, if the power conversion device 1 is mounted on a drive motor or an e-axis, the overall size of the equipment for the power conversion device 1 can be avoided. Additionally, a test probe can be easily connected, thereby improving the accuracy of the inspection of the power conversion device 1. Since the accuracy of the inspection of the power conversion device 1 is improved, the quality of the power conversion device 1 can be ensured. <Gehäuse 200>

[0020] A configuration where the in Fig. The power conversion device 1 shown in the housing 200 is described with reference to Fig. 2 described. The in Fig. The power conversion device shown in 1 is in Fig. 2 is designated as “subassembly 100”. The power conversion device 1 comprises the housing 200. The heat-generating components, the control board 11, and the heat sink 14 are housed in the housing 200. In the present embodiment, the heat-generating components are the power modules 10, the smoothing capacitor 12, and the busbar assembly 13, as described above. The first cooling surface 14b and the second cooling surface 14c are orthogonal to a direction of a normal surface of the housing 200 that faces the first cooling surface 14b or the second cooling surface 14c, respectively. In the present embodiment, the housing 200 is formed in the form of a tube with a bottom, and the opposite surface of the housing 200 is an inner surface of a bottom wall 200a of the housing 200. The shape of the housing 200 is not limited to the shape of a tube with a bottom.However, if the housing 200 has the form of a tube with a base, the housing 200 can be easily manufactured. The direction of the normal to the inner surface of the base wall 200a is that indicated by the arrow A in . Fig. 2 specified direction. In the present embodiment, the smoothing capacitor 12 is arranged on one side in a mounting direction of the subassembly 100 on the housing 200 (in a direction opposite to the normal).

[0021] This configuration ensures that the mounting direction of subassembly 100 on housing 200 is orthogonal to the first cooling surface 14b and the second cooling surface 14c, thus facilitating easy mounting of subassembly 100 on housing 200. Because subassembly 100 can be easily mounted on housing 200, the productivity of power conversion device 1 can be improved. <Bestandteile der Leistungskonvertierungsvorrichtung 1>

[0022] The components of the power conversion device 1 are described in detail. For example, the housing 200 is made of aluminum or an aluminum alloy. By using aluminum or an aluminum alloy and employing a die-casting process to manufacture the housing 200, its production can be simplified. Additionally, the weight of the housing 200 can be reduced. The housing 200 can be integrated with an external device, such as a drive motor or an e-axle.

[0023] The cooler 14 is made, for example, of aluminum or an aluminum alloy. Using aluminum or an aluminum alloy and employing a die-casting process to manufacture the cooler 14, its production is simplified. Additionally, the weight of the cooler 14 can be reduced. The flow through the coolant flow path 14a is facilitated by a coolant (not shown). This coolant is, for example, a long-life coolant (LLC). The cooler 14 in the present embodiment is a water-cooling type cooler.

[0024] The coolant flow path 14a is formed, for example, parallel to the first cooling surface 14b and the second cooling surface 14c. By causing the coolant flow to run parallel to the first cooling surface 14b and the second cooling surface 14c, the first cooling surface 14b and the second cooling surface 14c can be cooled efficiently. The cooler 14 has an inlet and an outlet (not shown) for the coolant. Through the coolant inlet or outlet, the coolant flows from outside the housing 200 into the cooler 14 or flows from the cooler 14 to the outside of the housing 200. The subassembly 100 is attached to the housing 200 using, for example, a connection lug (not shown) provided on the cooler 14.

[0025] Each of the semiconductor elements 10a of the power module 10 is, for example, an IGBT, as described above. The power module 10 has a multitude of high-voltage main circuit connections and a multitude of signal connections (not shown). The high-voltage main circuit connections are connected to the busbars 23 of the busbar assembly 13. The multitude of signal connections is connected to the control board 11. The power module 10 generates heat as a result of the rapid actuation of the switches of the semiconductor elements 10a. The heat generated in the power module 10 is transferred via the heat sink 14 to the coolant flowing through the coolant flow path 14a.

[0026] Although the power module 10 is directly thermally connected to the cooler 14 in the present embodiment, no restriction is imposed in this regard. The power module 10 can be thermally connected to the cooler 14 with a heat conductor arranged between them. The heat conductor is made of a material that has excellent thermal conductivity, and the material is, for example, a grease, a solder, a gap filler, or a compound. Furthermore, the power module 10 can be efficiently cooled by the thermal connection of the power module 10 to the cooler 14 and the heat conductor located between them.

[0027] The busbar assembly 13 comprises a plurality of busbars 23 and a retaining element 24. The busbars 23 are made, for example, of copper, which has excellent electrical conductivity. The retaining element 24 is made of a resin that has insulating properties. The busbars 23 and the retaining element 24 are connected to each other by injection molding. The integrated mold holds the busbars 23 in place with the retaining element 24. Additionally, the retaining element 24 provides insulation at each interval between the plurality of busbars 23.

[0028] The busbars 23 are electrically connected to the high-voltage main circuit connections originating from the power module 10. The connection between the busbars 23 and the high-voltage main circuit connections is achieved, for example, by fastening with screws or by TIG welding. Additionally, the busbars 13a are electrically connected as DC lines beneath the busbars 23 to the smoothing capacitor 12, and the busbars 13b are electrically connected as AC lines beneath the busbars 23 to the drive motor 300 (in Fig. 1 not shown).

[0029] In the present embodiment, the busbar assembly 13 is arranged on the side of the power module 10 opposite the cooler 14. Although the busbar assembly 13 in the present embodiment comprises both busbars 13a and 13b, no restriction is imposed in this regard. A busbar assembly with busbars 13a and a busbar assembly with busbars 13b can be provided separately. Even though the busbar assembly 13 in the present embodiment is formed by overmolding, no restriction is imposed in this respect. The busbar assembly 13 can be formed from the busbars 23 and an insulating element provided around the busbars 23 without any molding. The insulating element is formed, for example, from insulating paper or a resin.The busbars 13a can be formed directly on the power module 10 using parallel flat plates.

[0030] The control board 11 comprises a drive circuit and a control circuit. The drive circuit operates the power module 10. The control circuit controls the drive circuit. In the present embodiment, the control board 11 is located on the side of the busbar assembly 13 opposite the power module 10. By arranging the control board 11 in such a location, the influence of the heating of the power module 10 on the control board 11 can be suppressed. However, the location of the control board 11 is not limited to this. For example, the control board 11 can be located between the busbar assembly 13 and the power module 10, or at the same level as the busbar assembly 13.

[0031] Although the control board 11 in the present embodiment is formed from a circuit board, as in Fig. As shown in Figure 1, no restrictions are imposed. The control board 11 can be subdivided into a multitude of boards to accommodate functionality, ease of arrangement, productivity, and similar considerations. For example, the control board 11 can be subdivided into control circuits for the drive circuit and the control circuit. In the present embodiment, the control board 11 is attached to a board mounting projection (not shown) provided on the busbar assembly 13. The component to which the control board 11 is attached is not limited to the busbar assembly 13 and can, for example, be the heat sink 14 or the smoothing capacitor 12.

[0032] The smoothing capacitor 12 smooths an input voltage of the power module 10. The smoothing capacitor 12 has a housing 12a, a plurality of capacitor elements 12b, and a plurality of capacitor busbars (not shown). The plurality of capacitor elements 12b are enclosed in the housing 12a. The housing 12a is made, for example, of a synthetic resin.

[0033] The smoothing capacitor 12, as a heat-generating component, is thermally connected to the first cooling surface 14b or the second cooling surface 14c. In the present embodiment, the smoothing capacitor 12 is thermally connected to the first cooling surface 14b. This configuration allows the smoothing capacitor 12, which contributes significantly to heat generation, to be thermally connected to the cooler 14. Because the smoothing capacitor 12 is thermally connected to the cooler 14, its heat dissipation properties are improved, resulting in a power conversion device 1 with excellent cooling performance. Furthermore, because the heat dissipation properties of the smoothing capacitor 12 are improved, the capacitor elements 12b of the smoothing capacitor 12 can be reduced in size.Since the capacitor elements 12b are reduced in size, the smoothing capacitor 12 is reduced in size, which allows the power conversion device 1 to be reduced in size.

[0034] Each of the capacitor elements 12b, for example, is a wound film capacitor. The wound film capacitor is flattened into an oval shape. The capacitor element 12b is sealed in the housing 12a by filling the housing 12a with an epoxy resin.

[0035] Each capacitor busbar has one end connected to the capacitor element 12b. The other end of the capacitor busbar projects outside the housing 12a and is connected to the busbars 13a in the busbar assembly 13. The connection between the other end of the capacitor busbar and the busbars 13a is achieved, for example, by fastening with screws or by TIG welding. Alternatively, the other end of the capacitor busbar can be electrically connected to the high-voltage main circuit terminals of the power module 10, for example, by fastening with screws or by TIG welding.

[0036] The smoothing capacitor 12 generates heat through Joule heating via its own equivalent series resistance (ESR) and heat absorption from the power module 10. The heat generated in the smoothing capacitor 12 is transferred via the cooler 14 to the coolant flowing through the coolant flow path 14a.

[0037] Although the smoothing capacitor 12 is directly thermally connected to the cooler 14 in the present embodiment, no restriction is imposed in this regard. The smoothing capacitor 12 can be thermally connected to the cooler 14 with a heat conductor arranged between them. The heat conductor is made of a material that has excellent thermal conductivity, and the material is, for example, a grease, a solder, a gap filler, or a compound. Furthermore, the thermal connection of the smoothing capacitor 12 to the cooler 14 and the heat conductor located between them allows the smoothing capacitor 12 to be cooled efficiently. <Flacher Oberflächenabschnitt der wärmeerzeugenden Komponente>

[0038] The at least one heat-generating component, which is thermally connected to the first cooling surface 14b, has a flat surface section that is formed parallel to the first cooling surface 14b on a side opposite it. In the present embodiment, the at least one heat-generating component that is thermally connected to the first cooling surface 14b is the smoothing capacitor 12, and the smoothing capacitor 12 has a flat surface section 15a that is formed parallel to the first cooling surface 14b. In the present embodiment, the flat surface section 15a is formed parallel to the coolant flow path 14a.Neither the other heat-generating components, with the exception of the smoothing capacitor 12 (and the at least one heat-generating component thermally connected to the first cooling surface 14b), nor the control board 11 are provided on the side of the flat surface section 15a opposite the first cooling surface 14b. If the power conversion device 1 has the housing 200, the flat surface section 15a is a surface on one side in the mounting direction of the subassembly 100. If the at least one heat-generating component thermally connected to the first cooling surface 14b is a heat-generating component other than the smoothing capacitor 12, the flat connection section can be provided for the heat-generating component that is thermally connected to the first cooling surface 14b and is not the smoothing capacitor 12, e.g., the busbar assembly 13.

[0039] This configuration allows the in Fig. The power conversion device 1 shown in Figure 1 can stand on its own by means of the flat surface section 15a, which is a base surface. Since the power conversion device 1 stands on its own, its stability is improved during transport by a conveyor, for example, when transporting the power conversion device 1. This allows the work for mounting it on the housing 200 to be carried out easily during transport. Because the work for mounting it on the housing 200 can be carried out easily, the productivity of the power conversion device 1 can be improved. In addition, the quality of the power conversion device 1 can be advantageously ensured during assembly by the simple mounting on the housing 200.

[0040] Additionally, the in Fig. The form of a reversible box shown in Figure 1 and the packaging effort for the power conversion device 1 can be simplified, thereby improving the productivity of the power conversion device 1. If the heat-generating components are placed on surfaces on both sides of the cooler 14, it could be difficult to stabilize the orientation of the product during transport due to the differences in the dimensions and shapes of the components, if the power conversion device 1 is in the Fig. The state is as shown in Figure 1. Therefore, providing the flat surface section 15a on the surface on the side in the mounting direction of the housing 200, as in the present disclosure, directly leads to an improvement in the productivity of the power conversion device 1. <modifikationen>

[0041] Modifications to the power conversion device 1 are described with reference to Fig. 4 and Fig. 5 described. Fig. 4 shows a modification of the in Fig. 1 shown power conversion device 1, and Fig. 5 shows a modification of the in Fig. 2. Power conversion device 1. The cooler 14 has an opening provided in the first cooling surface or the second cooling surface and connected to the coolant flow path 14a, as well as a heat dissipation plate 25 covering the opening. In the present embodiment, an opening 14d is provided in the second cooling surface 14c. The heat dissipation plate 25 has a plurality of heat dissipation fins 25a on one of its surfaces on the side of the coolant flow path 14a, projecting towards the side of the coolant flow path 14a. The heat dissipation plate 25 is, for example, made of aluminum, which has excellent thermal conductivity.

[0042] The first cooling surface or the second cooling surface is formed on a surface of the heat dissipation plate 25 on a side opposite the coolant flow path 14a. The power module 10 is thermally connected to the first cooling surface or the second cooling surface on the heat dissipation plate 25. In the present embodiment, the second cooling surface 14c is formed on the surface of the heat dissipation plate 25 on the side opposite the coolant flow path 14a, and the power module 10 is thermally connected to the second cooling surface 14c on the heat dissipation plate 25. Sealing means between the heat dissipation plate 25 and the cooler 14 include, for example, packing, friction stir welding (FSW), or electron beam welding.

[0043] This configuration allows for an increase in the heat dissipation area in the coolant flow path 14a. Because the heat dissipation area is increased, the heat dissipation characteristics of the power module 10 can be improved. Since the heat dissipation characteristics of the power module 10 are improved, a power conversion device 1 with excellent cooling performance can be obtained. Additionally, the power conversion device 1 can be made smaller because the heat dissipation characteristics of the power module 10 have been improved. <Herstellungsverfahren für die Leistungskonvertierungsvorrichtung 1>

[0044] A manufacturing process for the power conversion device 1 is described with reference to Fig. Section 6 describes the manufacturing process for the power conversion device 1. This process comprises an element preparation step (S11), a subassembly assembly step (S12), and a housing assembly step (S13). A manufacturing process that includes a testing step (S12-1) is described at the end. Each of the steps is described below.

[0045] The element preparation step is a step of preparing: the one or more power modules 10, each of which comprises the one or more semiconductor elements 10a and is connected to the connection terminals 22 of the power supply for connection to the DC power supply; the control board 11, which controls the switching operations of the semiconductor elements 10a; the smoothing capacitor 12, which smooths an input voltage to be fed into the power module 10 from the DC power supply; the busbar assembly 13 with the busbars 13a, which establish an electrical connection in at least two of the intervals between the connection terminals 22 of the power supply, the power module 10 and the smoothing capacitor 12;of the cooler 14 with the first cooling surface 14b, the second cooling surface 14c on the side opposite the first cooling surface 14b and the coolant flow path 14a formed in the cooler 14; and of the housing 200, which is formed in the form of a tube with a bottom.

[0046] The subassembly step is a step of thermally connecting at least one of the power module 10, the smoothing capacitor 12, and the busbar assembly 13 to the first cooling surface 14b and thermally connecting at least one of the power module 10, the smoothing capacitor 12, and the busbar assembly 13 to the second cooling surface 14c to form a subassembly of the power conversion device 1 consisting of the power module 10, the control device 11, the smoothing capacitor 12, the busbar assembly 13, and the cooler 14. The subassembly of the power conversion device 1 formed in this step has, for example, the configuration of the power conversion device 1 described in Fig. 1 is shown. Fig. The smoothing capacitor 12 is thermally connected to the first cooling surface 14b, and the power module 10 is thermally connected to the second cooling surface 14c. The busbar assembly 13 is located on the side of the power module 10 opposite the cooling surface 14. The control board 11 is located on the side of the busbar assembly 13 opposite the power module 10.

[0047] The housing assembly step is a step to incorporate the sub-assembly into the housing 200. The power conversion device 1 formed in this step, for example, has the configuration of the in Fig. The power conversion device 1 shown in Figure 2 is mounted on the subassembly 100. The subassembly 100 is attached to the housing 200 using, for example, the connection provided on the cooler 14 (not shown). The first cooling surface 14b and the second cooling surface 14c are provided parallel to each other on both sides of the coolant flow path 14a. The first cooling surface 14b and the second cooling surface 14c are orthogonal to the direction of the normal on the inner surface of the bottom wall 200a of the housing 200. The mounting direction of the subassembly 100 on the housing 200 is orthogonal to the direction of the first cooling surface 14b and the second cooling surface 14c.

[0048] By manufacturing the power conversion device 1, the mounting direction of the subassembly 100 on the housing 200 is orthogonal to the first cooling surface 14b and the second cooling surface 14c, thus facilitating the easy mounting of the subassembly 100 on the housing 200. Since the subassembly 100 can be easily mounted on the housing 200, the productivity of the power conversion device 1 can be improved. The subassembly 100 can have a power conversion function and a cooling function, and the manufacturing process for the power conversion device 1 can include an inspection step for inspecting both the power conversion and cooling functions, with the inspection step preceding the housing assembly step.By inspecting the power conversion function and the cooling function before the step of assembling the housing, the productivity of the power conversion device 1 can be improved.

[0049] As described above, the power conversion device 1 according to embodiment 1 comprises: one or more power modules 10; the control board 11; the smoothing capacitor 12 as the at least one electrical component; the busbar assembly 13 with the busbars 23; and the cooler 14 with the first cooling surface 14b, the second cooling surface 14c, and the coolant flow path 14a formed in the cooler 14. Each power module 10, the smoothing capacitor 12, and the busbar assembly 13 are heat-generating components. The first cooling surface 14b and the second cooling surface 14c are provided parallel to each other on both sides of the coolant flow path 14a. The power module 10, as one of the heat-generating components, is thermally connected to the first cooling surface 14b. The smoothing capacitor 12, as one of the heat-generating components, is thermally connected to the second cooling surface 14c.Thus, in addition to the power module 10 as one of the heat-generating components, it is possible to thermally connect the smoothing capacitor 12 as another heat-generating component to the cooler 14 without increasing the size of the cooler 14. Since the two heat-generating components are thermally connected to the cooler 14, the heat dissipation properties of both heat-generating components are improved, resulting in a power conversion device 1 with excellent cooling performance. Additionally, the [description of the component] exhibits... Fig. The power conversion device 1 shown incorporates a power conversion function and a cooling function, and allows for the verification of both functions. Thus, the power conversion device 1 is a complete, integrated unit that can perform the main functions required for the device (e.g., the conversion function and cooling) and allows for verification of these functions without being enclosed in a housing or similar structure. Consequently, the productivity of the power conversion device 1 can be improved.

[0050] A case is assumed in which: the power conversion device 1 comprises the housing 200; the heat-generating components, the control board 11 and the cooler 14, which form the subassembly 100, are housed in the housing 200; and the first cooling surface 14b and the second cooling surface 14c are perpendicular to the direction perpendicular to the surface of the housing 200 opposite the first cooling surface 14b or the second cooling surface 14c, respectively. In this case, the mounting direction of the subassembly 100 on the housing 200 will be perpendicular to the direction of the first cooling surface 14b and the second cooling surface 14c, thus facilitating easy mounting of the subassembly 100 on the housing 200. Because the subassembly 100 can be easily mounted on the housing 200, the productivity of the power conversion device 1 can be improved.If the housing 200 is formed in the shape of a tube with a bottom, the housing 200 can be easily manufactured.

[0051] A case is assumed in which: the smoothing capacitor 12, as the at least one heat-generating component thermally connected to the first cooling surface 14b, has the flat surface section 15a formed parallel to the first cooling surface 14b on the side opposite it; and neither the other heat-generating components, with the exception of the smoothing capacitor 12 as the at least one heat-generating component thermally connected to the first cooling surface 14b, nor the control board 11 are provided on the side of the flat surface section 15a opposite the first cooling surface 14b. In this case, it is the one in Fig. The power conversion device 1 shown in Figure 1 is designed to stand on its own due to the flat section 15a, which forms a base. Because the power conversion device 1 stands independently, its stability is improved during transport by a conveyor, for example, during transport of the power conversion device 1. This allows for easy assembly work on the housing 200 during transport. Since assembly work on the housing 200 can be carried out easily, the productivity of the power conversion device 1 can be improved. In addition, the ease of assembly on the housing 200 advantageously ensures the quality of the power conversion device 1 during assembly.

[0052] If the smoothing capacitor 12, as a heat-generating component, is thermally connected to the first cooling surface 14b or the second cooling surface 14c, the smoothing capacitor 12, which has a large amount of heat generation, can be thermally connected to the cooler 14. Since the smoothing capacitor 12 is thermally connected to the cooler 14, its heat dissipation properties are improved, resulting in a power conversion device 1 with excellent cooling performance. Furthermore, because the heat dissipation properties of the smoothing capacitor 12 are improved, the capacitor elements 12b of the smoothing capacitor 12 can be reduced in size. Because the capacitor elements 12b are reduced in size, the smoothing capacitor 12 is reduced in size, which in turn allows the power conversion device 1 to be reduced in size.

[0053] A case is assumed in which: the cooler 14 has an opening provided in the first cooling surface or the second cooling surface and connected to the coolant flow path 14a, and a heat dissipation plate 25 covering the opening; the heat dissipation plate 25 has a plurality of heat dissipation fins 25a on its surface on the side of the coolant flow path 14a, projecting onto the side of the coolant flow path 14a; the first cooling surface or the second cooling surface is formed on the surface of the heat dissipation plate 25 on the side opposite the coolant flow path 14a; and the power module 10 is thermally connected to the first cooling surface or the second cooling surface on the heat dissipation plate 25. In this case, the area of ​​heat dissipation in the coolant flow path 14a can be increased, thereby improving the heat dissipation properties of the power module 10.Since the heat dissipation properties of the power module 10 are improved, a power conversion device 1 can be obtained which has excellent cooling performance.

[0054] The manufacturing process for the power conversion device 1 comprises: the element preparation step of preparing the power module 10, the control board 11, the smoothing capacitor 12, the busbar assembly 13, the cooler 14 and the housing 200; the subassembly formation step of thermally connecting at least one of the power module 10, the smoothing capacitor 12 and the busbar assembly 13 with the first cooling surface 14b and thermally connecting at least one of the power module 10, the smoothing capacitor 12 and the busbar assembly 13 with the second cooling surface 14c, in order to form a subassembly of the power conversion device 1 from the power module 10, the control device 11, the smoothing capacitor 12, the busbar assembly 13 and the cooler 14; and the housing assembly step of inserting the sub-assembly into the housing 200.The first cooling surface 14b and the second cooling surface 14c are provided parallel to each other on both sides of the coolant flow path 14a. The first cooling surface 14b and the second cooling surface 14c are orthogonal to the direction of the normal to the inner surface of the bottom wall 200a of the housing 200. The mounting direction of the subassembly on the housing 200 is orthogonal to the first cooling surface 14b and the second cooling surface 14c. Consequently, the subassembly can be easily mounted on the housing 200. Because the subassembly can be easily mounted on the housing 200, the productivity of the power conversion device 1 can be improved.If the subassembly 100 has a power conversion function and a cooling function, and the manufacturing process includes a test step to verify the power conversion function and the cooling function, wherein the test step precedes the housing assembly step, the power conversion function and the cooling function can be verified prior to the housing assembly step, thereby improving the productivity of the power conversion device 1. Design 2

[0055] A power conversion device 1 according to embodiment 2 is described. Fig. Figure 7 is a side view schematically showing the power conversion device 1 according to embodiment 2, with the side wall of the cooler 14 partially removed. Fig. Figure 8 is a side view schematically showing the power conversion device 1, with the side wall of the housing 200 partially removed. Fig. Figure 9 is a side view schematically showing another power conversion device 1 according to embodiment 2, wherein the side wall of the cooler 14 is partially removed. Fig. Figure 10 is a side view schematically showing the other power conversion device 1, with the side wall of the housing 200 partially removed. Fig. Figure 11 shows a manufacturing process for the power conversion device 1. The power conversion device 1 according to embodiment 2 comprises, in addition to the components of embodiment 1, a plurality of support columns 16a.

[0056] As in Fig. As shown in Figure 7, the power conversion device 1 comprises a plurality of support columns 16a arranged on the side of the first cooling surface 14b and projecting in a direction away from the first cooling surface 14b. In the present embodiment, the plurality of support columns 16a is arranged within an external environment of the first cooling surface 14b and attached to the first cooling surface 14b. Also in the present embodiment, the first cooling surface 14b is rectangular, and thus the support columns 16a, of which there are four, are arranged at the corresponding four corners of the first cooling surface 14b. The arrangement, the locations of attachment, and the number of the plurality of support columns 16a are not limited. The support columns 16a are, for example, made of iron, an aluminum alloy, or a resin material.The support columns 16a are attached, for example, by screwing, snapping, gluing, or welding. The support columns 16a and the cooler 14 can be connected to each other.

[0057] Each of the multiple support columns 16a has a flat support column surface section 15b, which is formed at an end section on one of the sides opposite the first cooling surface 14b and parallel to the first cooling surface 14b. The flat support column surface sections 15b are provided on the same plane parallel to the first cooling surface 14b, and neither the heat-generating components nor the control board 11 are provided on the side of each of the flat support column surface sections 15b opposite the first cooling surface 14b.

[0058] This configuration allows the in Fig. The power conversion device 1 shown in Figure 7 is designed to stand independently due to the flat support column surface section 15b, which forms the base surfaces. Because the power conversion device 1 stands independently, its stability is improved, for example, during transport by a conveyor. This facilitates assembly work on the housing 200 during transport. The ease of assembly also improves the productivity of the power conversion device 1. Furthermore, the ease of assembly on the housing 200 helps ensure the quality of the power conversion device 1 during assembly. Additionally, this configuration avoids the formation of flat surface sections on the electrical components.Thus, the electrical components have no sections that need to be used for transport, thereby preventing damage to the electrical components during transport.

[0059] A configuration where the in Fig. The power conversion device 1 shown in section 7 is incorporated into the housing 200, with reference to Fig. 8 described. The in Fig. The power conversion device 1 shown in Figure 7 is used in Fig. 8 is designated as “subassembly 100”. The power conversion device 1 comprises the housing 200. The heat-generating components, the control board 11, the cooler 14, and the support columns 16a are housed in the housing 200. In the present embodiment, the heat-generating components are the power modules 10, the smoothing capacitor 12, and the busbar assembly 13, respectively. The first cooling surface 14b and the second cooling surface 14c are orthogonal to the direction of the normal surface of the housing 200, which faces the first cooling surface 14b and the second cooling surface 14c, respectively. In the present embodiment, the housing 200 is formed in the form of a tube with a bottom, and the opposite surface of the housing 200 is the inner surface of the bottom wall 200a of the housing 200. The shape of the housing 200 is not limited to the shape of a tube with a bottom.If the housing 200 has the form of a tube with a base, the housing 200 can be easily manufactured. The direction of the normal to the inner surface of the base wall 200a is that indicated by the arrow A in . Fig. 8 specified direction. The flat support column surface section 15b is in contact with the inner surface of the bottom wall 200a of the housing 200. The subassembly 100 is attached to the housing 200 by the flat support column surface section 15b.

[0060] This configuration ensures that the mounting direction of subassembly 100 on housing 200 is orthogonal to the first cooling surface 14b and the second cooling surface 14c, thus facilitating easy mounting of subassembly 100 on housing 200. Because subassembly 100 can be easily mounted on housing 200, the productivity of the power conversion device 1 can be improved. Furthermore, since subassembly 100 can be secured to housing 200 by the flat support column surface section 15b, it can be easily attached to housing 200 without the need for additional fasteners.

[0061] In the present embodiment, the plurality of support columns 16a are provided in a detachable manner. This configuration allows the support columns 16a to be removed from the subassembly 100 when the subassembly 100 is mounted on the housing 200. Removing the support columns 16a enables a reduction in the weight of the power conversion device 1 without compromising the stability of the subassembly 100 during transport by a conveyor.

[0062] A manufacturing process for removable support columns 16a is described. If the support columns 16a are designed to be detachable using screws, the worm gear holes are machined on the housing sections of the support columns 16a, which are obtained by extrusion or die casting. The worm gear holes provided in the body sections of the support columns 16a are used to fasten the support columns 16a, for example, to the cooler 14 or the busbar assembly 13. If the support columns 16a are made of a resin, nuts are cast into the resin-formed support columns 16a, thus producing removable support columns 16a.

[0063] The heights and shapes of the flat support column surface sections 15b, which are the base sections, vary depending on the shape of the product or the mode of transport. Therefore, no special dimensional restrictions are imposed on the support columns 16a, except that: the flat support column surface sections 15b are provided on the same plane parallel to the first cooling surface 14b; and neither the heat-generating components nor the control board 11 are provided on the side of each of the flat support column surface sections 15b opposite the first cooling surface 14b. <modifikationen>

[0064] Modifications to the power conversion device 1 are described with reference to Fig. 9 and Fig. 10 described. Fig. 9 shows a modification of the in Fig. 7 shown power conversion device 1, and Fig. 10 shows a modification of the in Fig. 8. Power conversion device 1. The cooler 14 has an opening provided in the first or second cooling surface, which communicates with the coolant flow path 14a and the heat dissipation plate 25, which covers the opening. In the present embodiment, the opening 14d is provided in the second cooling surface 14c. The heat dissipation plate 25 has on its surface, on the side of the coolant flow path 14a, a plurality of heat dissipation fins 25a, which project into the coolant flow path 14a. The heat dissipation plate 25 is, for example, made of aluminum, which has excellent heat dissipation properties.

[0065] The first cooling surface or the second cooling surface is formed on the surface of the heat dissipation plate 25 on the side opposite the coolant flow path 14a. The power module 10 is thermally connected to the first cooling surface or the second cooling surface on the heat dissipation plate 25. In the present embodiment, the second cooling surface 14c is formed on the surface of the heat dissipation plate 25 on the side opposite the coolant flow path 14a, and the power module 10 is thermally connected to the second cooling surface 14c on the heat dissipation plate 25.

[0066] This configuration allows for an increase in the heat dissipation area in the coolant flow path 14a. Since the heat dissipation area is increased, the heat dissipation properties of the power module 10 can be improved. Because the heat dissipation properties of the power module 10 are improved, a power conversion device 1 with excellent cooling performance is obtained. Furthermore, because the heat dissipation properties of the power module 10 have been improved, the power conversion device 1 can be made smaller. <Herstellungsverfahren für die Leistungskonvertierungsvorrichtung 1>

[0067] A manufacturing process for the power conversion device 1 is described with reference to Fig. The manufacturing process for the power conversion device 1 comprises an element preparation step (S11), a subassembly assembly step (S12), a transport step (S13), a support column release step (S14), and a housing assembly step (S15). Each of these steps is described below.

[0068] The element preparation step is a step of preparing: the one or more power modules 10, each of which comprises the one or more semiconductor elements 10a and is connected to the connection terminals 22 of the power supply for connection to the DC power supply; the control board 11, which controls switching operations of the semiconductor elements 10a; the smoothing capacitor 12, which smooths an input voltage to be supplied from the DC power supply to the power module 10; the busbar assembly 13 with the busbars 13a, which establish an electrical connection in at least two of the intervals between the connection terminals 22 of the power supply, the power module 10 and the smoothing capacitor 12;of the cooler 14 with the first cooling surface 14b, the second cooling surface 14c on the side opposite the first cooling surface 14b and the coolant flow path 14a formed in the cooler 14; the plurality of detachably formed support columns 16a; and the housing 200, which is formed in the form of a tube with a bottom.

[0069] The subassembly step is a step of thermally connecting at least one of the power module 10, the smoothing capacitor 12, and the busbar assembly 13 to the first cooling surface 14b, thermally connecting at least one of the power module 10, the smoothing capacitor 12, and the busbar assembly 13 to the second cooling surface 14c, and attaching the plurality of support columns 16a to the first cooling surface 14b, wherein the support columns 16a project in a direction away from the first cooling surface 14b, to form a subassembly of the power conversion device 1 from the power module 10, the control device 11, the smoothing capacitor 12, the busbar assembly 13, the cooler 14, and the plurality of support columns 16a. The subassembly of the power conversion device 1 formed in this step has, for example, the configuration shown in Fig. The configuration of the power conversion device 1 shown in Figure 7 is shown. Fig. The smoothing capacitor 12 is thermally connected to the first cooling surface 14b, and the power module 10 is thermally connected to the second cooling surface 14c. The busbar assembly 13 is located on the side of the power module 10 opposite the cooler 14. The control board 11 is located on the side of the busbar assembly 13 opposite the power module 10. The plurality of support columns 16a are attached to the first cooling surface 14b using, for example, screws.

[0070] The transport step is a step in transporting the subassembly to a staging location of the housing 200 in a state in which the flat support column surface section 15b, which is provided at an end section on one side of each of the plurality of support columns 16a opposite the side of the first cooling surface 14b, has been brought into contact with a support surface, so that the subassembly has been brought to a standstill. If the subassembly is transported by a conveyor, the support surface is provided to the conveyor.

[0071] The support column removal step is a step to detach each of the plurality of support columns 16a from the subassembly. If the support columns 16a are fastened to the first cooling surface 14b using screws, the support column removal step includes loosening the screws. The housing assembly step is a step to receive the subassembly, from which the plurality of support columns 16a have been removed, into the housing 200. The power conversion device 1 formed in this step, for example, has the following features: Fig. 2 shown configuration of the power conversion device 1.

[0072] After the subassembly formation step has been carried out, the flat support column surface sections 15b are positioned in the subassembly on the same plane, parallel to the first cooling surface 14b. After the subassembly formation step has been completed, none of the power modules 10, the smoothing capacitor 12, the busbar assembly 13, and the control board 11 are positioned on the side of each of the flat support column surface sections 15b opposite the first cooling surface 14b in the subassembly. Therefore, the power conversion device 1 is allowed to stand on its own, supported by the flat support column surface sections 15b, which are the base sections. Because the power conversion device 1 stands on its own, its stability is improved during transport by a conveyor, for example, when transporting the power conversion device 1.This allows work to be carried out on the housing 200 during transport.

[0073] The subassembly is attached to the housing 200 using, for example, the connection provided on the cooler 14 (not shown). The first cooling surface 14b and the second cooling surface 14c are provided parallel to each other on both sides of the coolant flow path 14a. The first cooling surface 14b and the second cooling surface 14c are orthogonal to the direction of the normal to the inner surface of the bottom wall 200a of the housing 200. The mounting direction of the subassembly on the housing 200 is orthogonal to the direction of the first cooling surface 14b and the second cooling surface 14c.

[0074] During the manufacture of the power conversion device 1, detaching the support columns 16a from the subassembly at the time of mounting the subassembly on the housing 200 allows for a reduction in the weight of the power conversion device 1 without compromising the stability of the subassembly during transport by a conveyor. Since the mounting direction of the subassembly on the housing 200 is orthogonal to the first cooling surface 14b and the second cooling surface 14c, the subassembly can be easily mounted on the housing 200. Because the subassembly can be easily mounted on the housing 200, the productivity of the power conversion device 1 can be improved. embodiment 3

[0075] A power conversion device 1 according to embodiment 3 is described. Fig. Figure 12 is a side view schematically showing the power conversion device 1 according to embodiment 3, with the side wall of the cooler 14 partially removed. Fig. Figure 13 is a side view schematically showing the power conversion device 1, with the side wall of the housing 200 partially removed. Fig. Figure 14 is a side view schematically showing another power conversion device 1 according to embodiment 3, wherein the side wall of the cooler 14 is partially removed. Fig. Figure 15 is a side view schematically showing the other power conversion device 1, with the side wall of the housing 200 partially removed. The power conversion device 1 according to embodiment 3 has a configuration in which the arrangement of the heat-generating components and the control board 11 differs from the arrangement in embodiment 1.

[0076] As in Fig. As shown in Figure 12, in the present embodiment each of the power modules 10 is thermally connected to the first cooling surface 14b as a heat-generating component, and the smoothing capacitor 12, also as a heat-generating component, is thermally connected to the second cooling surface 14c. Even though the arrangement of the heat-generating components is thus the reverse of the arrangement in embodiment 1, both heat-generating components are thermally connected to the cooler 14 without the need to increase the size of the cooler 14. Consequently, the heat dissipation properties of the two heat-generating components are improved, resulting in a power conversion device 1 with excellent cooling performance. Furthermore, since the heat dissipation properties of the two heat-generating components are improved, their size can be reduced.Since both heat-generating components are reduced in size, the power conversion device 1 can be reduced in size.

[0077] In the present embodiment, the busbar assembly 13 is arranged on the side of the power module 10 opposite the cooler 14. The control board 11 is arranged on the side of the busbar assembly 13 opposite the power module 10. As shown in Fig. As shown in Figure 13, in the present embodiment the power module 10, the busbar assembly 13, and the control board 11 are arranged on the side facing the housing 200 in the mounting direction. The arrangement of the heat-generating components and the control board 11 in the subassembly 100 described in the present embodiment is the reverse of the arrangement in subassembly 100 described in embodiment 1.

[0078] As in Fig. As shown in Figure 12, the power conversion device 1 comprises a plurality of support columns 16b arranged on the side of the first cooling surface 14b and projecting in a direction away from the first cooling surface 14b. In the present embodiment, the plurality of support columns 16b are arranged within the external environment of the first cooling surface 14b and attached to the busbar assembly 13. The arrangement and the locations of attachment of the plurality of support columns 16b are not limited thereto.

[0079] Each of the plurality of support columns 16b has a flat support column surface section 15b formed at an end section on the side opposite the first cooling surface 14b, parallel to the first cooling surface 14b. The flat support column surface sections 15b are provided on the same plane parallel to the first cooling surface 14b, and neither the heat-generating components nor the control board 11 are provided on the side opposite the first cooling surface 14b of each of the flat support column surface sections 15b. Therefore, it is the in Fig. The power conversion device 1 shown in Figure 12 is designed to stand on its own by means of the flat support column surface sections 15b, which are the base surfaces. Since the power conversion device 1 stands on its own, its stability is improved during transport by a conveyor, for example, during transport of the power conversion device 1. This allows assembly work on the housing 200 to be carried out easily during transport. Because assembly work on the housing 200 can be carried out easily, the productivity of the power conversion device 1 can be improved.

[0080] The support columns 16b are made, for example, of iron, an aluminum alloy, or a resin material. The support columns 16b are attached to the busbar assembly 13, for example, by fastening with screws, fitting, gluing, or welding. A configuration can be used in which the support columns 16b and the busbar assembly 13 are integrated together. Alternatively, the support columns 16b can also be attached to the first cooling surface 14b.

[0081] The multiple support columns 16b can be provided in a detachable configuration. This allows the support columns 16b to be detached from the subassembly 100 when the subassembly 100 is mounted on the housing 200. Detaching the support columns 16b reduces the weight of the power conversion device 1 without compromising the stability of the subassembly 100 during transport by a conveyor.

[0082] The heights and shapes of the flat support column surface sections 15b, which are the base sections, vary depending on the shape of the product or the mode of transport. Therefore, no special dimensional restrictions are imposed on the support columns 16b, except that: the flat support column surface sections 15b are provided on the same plane parallel to the first cooling surface 14b; and neither the heat-generating components nor the control board 11 are provided on the side of each of the flat support column surface sections 15b opposite the first cooling surface 14b. <modifikationen>

[0083] Modifications to the power conversion device 1 are described with reference to Fig. 14 and Fig. 15 described. Fig. 14 shows a modification of the in Fig. 12 shown power conversion device 1, and Fig. 15 shows a modification of the in Fig. The power conversion device 13 shown in Figure 1. The cooler 14 has an opening provided in the first or second cooling surface, which communicates with the coolant flow path 14a and the heat dissipation plate 25 that covers the opening. In the present embodiment, the opening 14d is provided in the first cooling surface 14b. The heat dissipation plate 25 has on its surface, on the side of the coolant flow path 14a, a plurality of heat dissipation fins 25a that project into the coolant flow path 14a. The heat dissipation plate 25 is, for example, made of aluminum, which has excellent heat dissipation properties.

[0084] The first cooling surface or the second cooling surface is formed on the surface of the heat dissipation plate 25 on the side opposite the coolant flow path 14a. The power module 10 is thermally connected to the first cooling surface or the second cooling surface on the heat dissipation plate 25. In the present embodiment, the first cooling surface 14b is formed on the surface of the heat dissipation plate 25 on the side opposite the coolant flow path 14a, and the power module 10 is thermally connected to the first cooling surface 14b on the heat dissipation plate 25.

[0085] This configuration allows for an increase in the heat dissipation area in the coolant flow path 14a. Since the heat dissipation area is increased, the heat dissipation properties of the power module 10 can be improved. Because the heat dissipation properties of the power module 10 are improved, a power conversion device 1 with excellent cooling performance is obtained. Furthermore, since the heat dissipation properties of the power module 10 have been improved, the power conversion device 1 can be made smaller. Design 4

[0086] A power conversion device 1 according to embodiment 4 is described. Fig. Figure 16 is a side view schematically showing the power conversion device 1 according to embodiment 4, with the side wall of the cooler 14 partially removed. Fig. Figure 17 is a side view schematically showing the power conversion device 1, with the side wall of the housing 200 partially removed. Fig. Figure 18 is a side view schematically showing another power conversion device 1 according to embodiment 4, wherein the side wall of the cooler 14 is partially removed. Fig. Figure 19 is a side view schematically showing the other power conversion device 1, with the side wall of the housing 200 partially removed. Fig. Figure 20 is a side view schematically showing another power conversion device 1 according to embodiment 4, with the side wall of the cooler 14 partially removed. The power conversion device 1 according to embodiment 4 has a configuration in which a heat-generating component has been added to the components in embodiment 1.

[0087] As in Fig. As shown in Figure 16, the power conversion device 1 in the present embodiment comprises an inductor 17 (or reactor 17), which is an electrical component and a heat-generating component. The inductor 17 forms part of a circuit for increasing the input voltage for each of the power modules 10. The inductor 17 is an electromagnetic component for converting electrical energy into magnetic energy and for storing and releasing the energy. A high current of up to several hundred A flows through the inductor 17, so the inductor 17 is a heat-generating component that contributes significantly to heat production.

[0088] The choke 17 is connected to the busbars 13a in the busbar assembly 13. The connection between the choke 17 and the busbars 13a is achieved, for example, by fastening with screws or by TIG welding. The choke 17 is electrically connected to the power module 10 and the smoothing capacitor 12 via the busbars 13a.

[0089] The throttle 17, as the heat-generating component, is thermally connected to the first cooling surface 14b. The smoothing capacitor 12 and the throttle 17 are arranged side by side on the first cooling surface 14b. The heat generated in the throttle 17 is transferred via the cooler 14 to the coolant flowing through the coolant flow path 14a. Although the throttle 17 is provided on the first cooling surface 14b in the present embodiment, this is not restricted, and the throttle 17 can also be thermally connected to the second cooling surface 14c.

[0090] By thermally connecting a multitude of heat-generating components to one or both of the first cooling surface 14b and the second cooling surface 14c, the heat dissipation properties of the multitude of heat-generating components are further improved, resulting in a power conversion device 1 with excellent cooling performance. Furthermore, since a multitude of heat-generating components are provided side by side on one of the cooling surfaces, the height of the power conversion device 1 can be reduced. The number of heat-generating components that can be thermally connected to the cooling surface(s) is not limited, and a larger number of heat-generating components can be thermally connected to the cooling surface(s).

[0091] As in Fig. As shown in Figure 17, in the present embodiment the smoothing capacitor 12 and the choke 17 are arranged laterally to the housing 200 in the mounting direction. The heights of the smoothing capacitor 12 and the choke 17 differ from each other in the mounting direction. Therefore, it is difficult for the subassembly 100 to stand stably upright due to the flat surface section 15a of the smoothing capacitor 12. However, in the present embodiment, since the support columns 16 are provided in this configuration, the subassembly 100 can be transported to the housing 200 in a state in which it stands alone on the support columns 16a. <Modifikation 1>

[0092] Modifications to the power conversion device 1 are described with reference to Fig. 18 and Fig. 19 described.

[0093] Fig. 18 shows a modification of the in Fig. 16 shown power conversion device 1, and Fig. 19 shows a modification of the in Fig. 17. Power conversion device 1. The cooler 14 has an opening provided in the first or second cooling surface, which communicates with the coolant flow path 14a and the heat dissipation plate 25, which covers the opening. In the present embodiment, the opening 14d is provided in the second cooling surface 14c. The heat dissipation plate 25 has on its surface, on the side of the coolant flow path 14a, a plurality of heat dissipation fins 25a, which project into the coolant flow path 14a. The heat dissipation plate 25 is, for example, made of aluminum, which has excellent heat dissipation properties.

[0094] The first cooling surface or the second cooling surface is formed on the surface of the heat dissipation plate 25 on the side opposite the coolant flow path 14a. The power module 10 is thermally connected to the first cooling surface or the second cooling surface on the heat dissipation plate 25. In the present embodiment, the second cooling surface 14c is formed on the surface of the heat dissipation plate 25 on the side opposite the coolant flow path 14a, and the power module 10 is thermally connected to the second cooling surface 14c on the heat dissipation plate 25.

[0095] This configuration allows for an increase in the heat dissipation area in the coolant flow path 14a. Since the heat dissipation area is increased, the heat dissipation properties of the power module 10 can be improved. Because the heat dissipation properties of the power module 10 are improved, a power conversion device 1 with excellent cooling performance is obtained. Furthermore, because the heat dissipation properties of the power module 10 are improved, the power conversion device 1 can be made smaller. <Modifikation 2>

[0096] A further modification of the power conversion device 1 is described with reference to Fig. 20 described. In modification 2, the power conversion device 1 comprises a boost converter unit 26 and a buck converter unit 27, which are electrical components that also generate heat. In modification 2, the boost converter unit 26 and the buck converter unit 27 are thermally connected to the first cooling surface 14b, and the power module 10 is thermally connected to the second cooling surface 14c. The boost converter unit 26 boosts an input voltage from the DC power supply 21, which includes the inductor 17. The buck converter unit 27 steps down the input voltage from the DC power supply 21. The smoothing capacitor 12 is located on the side of the control board 11 opposite the busbar assembly 13.The smoothing capacitor 12 is attached to the busbar assembly 13 or the cooler 14 by, for example, providing a mounting projection or a section of the mounting leg on the smoothing capacitor 12.

[0097] The heat-generating components to be thermally connected to the cooling surfaces are not limited thereto, and a transfer control unit (TCU) 28 can be provided instead of the boost converter unit 26 or the step-down converter unit 27. The transfer control unit 28 controls a transfer actuator. By thermally connecting a plurality of heat-generating components to one of the cooling surfaces, the heat dissipation properties of the plurality of heat-generating components are further improved, thereby enabling a power conversion device 1 with further excellent cooling performance. Design 5

[0098] A power conversion device 1 according to embodiment 5 is described. Fig. Figure 21 is a side view schematically showing the power conversion device 1 according to embodiment 5, with the side wall of the cooler 14 partially removed. Fig. Figure 22 is a side view schematically showing the power conversion device 1, with the side wall of the housing 200 partially removed. Fig. Figure 23 is a side view schematically showing another power conversion device 1 according to embodiment 5, wherein the side wall of the cooler 14 is partially removed. Fig. Figure 24 is a side view schematically showing the other power conversion device 1, with the side wall of the housing 200 partially removed. The power conversion device 1 according to embodiment 5 has a configuration in which a second cover 18b has been added to the components in embodiment 1.

[0099] The power conversion device 1 comprises one or both of the following components: a first cover 18a provided at the first cooling surface 14b and covering all elements arranged on the side of the first cooling surface 14b; and a second cover 18b provided at the second cooling surface 14c and covering all elements arranged on the side of the second cooling surface 14c. In the present embodiment, the power conversion device 1 comprises the second cover 18b as shown in Fig. Figure 21 shows the second cover 18b, which is attached to the cooler 14, for example by screws. The second cover 18b is made of, for example, iron, an aluminum alloy, or a resin material. The second cover 18b has a through-hole (not shown) through which a wire to be supplied with the DC power supply passes.

[0100] This configuration allows precision components (not shown) mounted on each of the power modules 10 and the control board 11, which are covered by the second cover 18b, to be protected from dust, powder dust, and the like in a factory environment. A seal (not shown) can be provided between the contact surfaces of the second cover 18b and the cooler 14 to seal against any gap that might form between the second cover 18b and the cooler 14. By providing the seal, the elements covered by the second cover 18b can be reliably protected from dust, powder dust, and the like in a factory environment.

[0101] As in Fig. As shown in Figure 22, in the present embodiment the second cover 18b is arranged within an external environment of the second cooling surface 14c. This configuration allows for easy assembly work on the housing 200, even though the second cover 18b is already in place. Because assembly work on the housing 200 is simplified, the productivity of the power conversion device 1 can be improved. <modifikationen>

[0102] Modifications to the power conversion device 1 are made with reference to Fig. 23 and Fig. 24 described. Fig. 23 shows a modification of the in Fig. 21 shown power conversion device 1, and Fig. 24 shows a modification of the in Fig. 22. The power conversion device 1. The cooler 14 has an opening provided in the first cooling surface or the second cooling surface, which communicates with the coolant flow path 14a and the heat dissipation plate 25, which covers the opening. In the present embodiment, the opening 14d is provided in the second cooling surface 14c. The heat dissipation plate 25 has on its surface, on the side of the coolant flow path 14a, a plurality of heat dissipation fins 25a, which project into the coolant flow path 14a. The heat dissipation plate 25 is, for example, made of aluminum, which has excellent heat dissipation properties.

[0103] The first cooling surface or the second cooling surface is formed on the surface of the heat dissipation plate 25 on the side opposite the coolant flow path 14a. The power module 10 is thermally connected to the first cooling surface or the second cooling surface on the heat dissipation plate 25. In the present embodiment, the second cooling surface 14c is formed on the surface of the heat dissipation plate 25 on the side opposite the coolant flow path 14a, and the power module 10 is thermally connected to the second cooling surface 14c on the heat dissipation plate 25. The second cover 18b is attached to the second cooling surface 14c of the cooler 14, which surrounds the opening 14d.

[0104] This configuration allows for an increase in the area of ​​heat heating in the coolant flow path 14a. Since the heat dissipation area is increased, the heat dissipation properties of the power module 10 can be improved. Because the heat dissipation properties of the power module 10 are improved, a power conversion device 1 with excellent cooling performance is obtained. Furthermore, because the heat dissipation properties of the power module 10 are improved, the power conversion device 1 can be made smaller. Design 6

[0105] A power conversion device 1 according to embodiment 6 is described. Fig. Figure 25 is a side view schematically showing the power conversion device 1 according to embodiment 6, with the side wall of the cooler 14 partially removed. Fig. Figure 26 is a side view schematically showing the power conversion device 1, with the side wall of the housing 200 partially removed. Fig. Figure 27 is a side view schematically showing another power conversion device 1 according to embodiment 6, wherein the side wall of the cooler 14 is partially removed. Fig. Figure 28 is a side view schematically showing the other power conversion device 1, with the side wall of the housing 200 partially removed. The power conversion device 1 according to embodiment 6 has a configuration in which the first cover 18a and the second cover 18b have been added to the components of embodiment 1.

[0106] In the present embodiment, the power conversion device 1 comprises both the first cover 18a and the second cover 18b, as shown in Fig. Figure 25 shows the first cover 18a being attached to the cooler 14, for example by means of screws. The first cover 18a is made, for example, of iron, an aluminum alloy, or a resin material.

[0107] The first cover 18a has a flat cover surface section 15c, which at one end section is formed parallel to the first cooling surface 14b on a side opposite the first cooling surface 14b. This configuration allows the Fig. The power conversion device 1 shown in Figure 25 is self-supporting due to the flat cover surface section 15c, which forms a base. Because the power conversion device 1 stands on its own feet, its stability is improved during transport by a conveyor, for example, during transport of the power conversion device 1. This allows for easy assembly work on the housing 200 during transport. Since assembly work on the housing 200 can be carried out easily, the productivity of the power conversion device 1 can be improved. In addition, the ease of assembly on the housing 200 advantageously ensures the quality of the power conversion device 1 during assembly.

[0108] A configuration where the in Fig. The power conversion device 1 shown in section 25 is incorporated into the housing 200, with reference to Fig. 26 described. The in Fig. The power conversion device 1 shown in Figure 25 is used in Fig. 26 is designated as “subassembly 100”. The power conversion device 1 comprises the housing 200. The first cover 18a, the second cover 18b, and the cooler 14 are accommodated in the housing 200. The first cooling surface 14b and the second cooling surface 14c are orthogonal to the direction of the normal surface of the housing 200 opposite the first cooling surface 14b or the second cooling surface 14c, respectively. In the present embodiment, the housing 200 is formed in the form of a tube with a bottom, and the opposite surface of the housing 200 is the inner surface of the bottom wall 200a of the housing 200. The shape of the housing 200 is not limited to the shape of a tube with a bottom. However, if the housing 200 has the shape of a tube with a bottom, the housing 200 can be easily manufactured. The direction of the normal to the inner surface of the bottom wall 200a is that indicated by arrow A in Fig. 26. The flat cover surface section 15c is in contact with the inner surface of the bottom wall 200a of the housing 200. The subassembly 100 is attached to the housing 200 by the flat cover surface section 15c.

[0109] This configuration ensures that the mounting direction of subassembly 100 on housing 200 is orthogonal to the first cooling surface 14b and the second cooling surface 14c, thus facilitating easy mounting of subassembly 100 to housing 200. Because subassembly 100 can be easily mounted to housing 200, the productivity of the power conversion device 1 can be improved. Furthermore, since subassembly 100 can be secured to housing 200 by the flat cover surface section 15c, it can be easily attached to housing 200 without the need for additional fasteners. <modifikationen>

[0110] Modifications to the power conversion device 1 are made with reference to Fig. 27 and Fig. 28 described. Fig. 27 shows a modification of the in Fig. 25 shown power conversion device 1, and Fig. 28 shows a modification of the in Fig. 26. Power conversion device 1. The cooler 14 has an opening provided in the first or second cooling surface, which communicates with the coolant flow path 14a and the heat dissipation plate 25, which covers the opening. In the present embodiment, the opening 14d is provided in the second cooling surface 14c. The heat dissipation plate 25 has on its surface, on the side of the coolant flow path 14a, a plurality of heat dissipation fins 25a, which project into the coolant flow path 14a. The heat dissipation plate 25 is, for example, made of aluminum, which has excellent heat dissipation properties.

[0111] The first cooling surface or the second cooling surface is formed on the surface of the heat dissipation plate 25 on the side opposite the coolant flow path 14a. The power module 10 is thermally connected to the first cooling surface or the second cooling surface on the heat dissipation plate 25. In the present embodiment, the second cooling surface 14c is formed on the surface of the heat dissipation plate 25 on the side opposite the coolant flow path 14a, and the power module 10 is thermally connected to the second cooling surface 14c on the heat dissipation plate 25. The second cover 18b is attached to the second cooling surface 14c of the cooler 14, which surrounds the opening 14d.

[0112] This configuration allows for an increase in the area of ​​heat heating in the coolant flow path 14a. Since the heat dissipation area is increased, the heat dissipation properties of the power module 10 can be improved. Because the heat dissipation properties of the power module 10 are improved, a power conversion device 1 with excellent cooling performance is obtained. Furthermore, because the heat dissipation properties of the power module 10 have been improved, the power conversion device 1 can be made smaller. Design 7

[0113] A device for power conversion 1 according to embodiment 7 is described. Fig. Figure 29 is a side view schematically showing the power conversion device 1 according to embodiment 7, with the side wall of the cooler 14 partially removed. Fig. Figure 30 is a side view schematically showing the power conversion device 1, with the side wall of the housing 200 partially removed. Fig. Figure 31 is a side view schematically showing another power conversion device 1 according to embodiment 7, wherein the side wall of the cooler 14 is partially removed. Fig. Figure 32 is a side view schematically showing the other power conversion device 1, with the side wall of the housing 200 partially removed. The power conversion device 1 according to embodiment 7 has a configuration in which transport projections 19 have been added to the components in embodiment 1.

[0114] As in Fig. As shown in Figure 29, the second cooling surface 14c has a plurality of transport projections 19 located within the outer environment of the second cooling surface 14c and projecting in a direction away from the second cooling surface 14c. Each of the transport projections 19 has a projection end section 19a on its end section on the side opposite the second cooling surface 14c, projecting in a direction parallel to the second cooling surface 14c. As shown in Fig. As shown in Figure 30, the transport projections 19 sections are sections which, as a result of the gripping of their projection end sections 19a by a transport device 20, serve as a means of transport for the transport of the sub-assembly 100 into the housing 200.

[0115] This configuration, because the transport projections 19 are located within the outermost vicinity of the subassembly 100, ensures an operating range for the transport device 20 and also reduces the distance between the housing 200 and the subassembly 100. Additionally, it facilitates the assembly of the subassembly 100 to the housing 200, thereby improving the productivity of the power conversion device 1. Furthermore, by simplifying the assembly work on the housing 200, the quality of the power conversion device 1 can be advantageously ensured during assembly.

[0116] The transport projections 19 are made, for example, of iron, an aluminum alloy, or a resin material. The transport projections 19 are attached to the cooler 14, for example, by screws, joining, gluing, or welding. The transport projections 19 and the cooler 14 can be connected to each other.

[0117] The shape of the section of each transport projection 19 that is gripped by the transport device 20 is not limited to the shape of the projection end section 19a. The shape of the section of the transport projection 19 that is to be gripped by the transport device 20 can be in the form of a recess provided at an end section of the transport device 20. <modifikationen>

[0118] Modifications to the power conversion device 1 are made with reference to Fig. 31 and Fig. 32 described. Fig. 31 shows a modification of the in Fig. 29 shown power conversion device 1, and Fig. 32 shows a modification of the in Fig. 30. Power conversion device 1. The cooler 14 has an opening provided in the first or second cooling surface, which communicates with the coolant flow path 14a and the heat dissipation plate 25, which covers the opening. In the present embodiment, the opening 14d is provided in the second cooling surface 14c. The heat dissipation plate 25 has on its surface, on the side of the coolant flow path 14a, a plurality of heat dissipation fins 25a, which project into the coolant flow path 14a. The heat dissipation plate 25 is, for example, made of aluminum, which has excellent heat dissipation properties.

[0119] The first cooling surface or the second cooling surface is formed on the surface of the heat dissipation plate 25 on the side opposite the coolant flow path 14a. The power module 10 is thermally connected to the first cooling surface or the second cooling surface on the heat dissipation plate 25. In the present embodiment, the second cooling surface 14c is formed on the surface of the heat dissipation plate 25 on the side opposite the coolant flow path 14a, and the power module 10 is thermally connected to the second cooling surface 14c on the heat dissipation plate 25. The transport projections 19 are attached to the second cooling surface 14c on the cooler 14, which surrounds the opening 14d.

[0120] This configuration allows for an increase in the area of ​​heat heating in the coolant flow path 14a. Since the heat dissipation area is increased, the heat dissipation properties of the power module 10 can be improved. Because the heat dissipation properties of the power module 10 are improved, a power conversion device 1 with excellent cooling performance is obtained. Furthermore, because the heat dissipation properties of the power module 10 are improved, the power conversion device 1 can be made smaller. Design 8

[0121] An electric vehicle drive device 600 according to embodiment 8 is described. Fig. Figure 33 is a schematic representation of the electric vehicle drive device 600 according to embodiment 8, wherein one side wall is partially removed. The electric vehicle drive device 600 according to embodiment 8 comprises the power conversion device 1, which has the housing 200.

[0122] The electric vehicle drive device 600 comprises: the power conversion device 1 with the housing 200; an electric motor 400, which is electrically connected to the power conversion device 1 and has a rotating shaft whose rotation is controlled; and a gearbox 500, which is coupled to the rotating shaft and which converts the rotational speed of the rotating shaft and transmits the result of the conversion to a drive wheel. The housing 200 is integrated with an electric motor housing 400a, which accommodates the electric motor 400, and a gearbox housing 500a, which accommodates the transmission 500, or with both. The electric motor 400 includes the drive motor 300.The electric vehicle drive device 600, mounted in an electric vehicle, is a device for transmitting the rotation of the drive motor 300, which is controlled by the power conversion device 1 connected to the external DC power supply, via the gearbox 500 to an axle of the electric vehicle. In the present embodiment, the electric motor housing 400a and the gearbox housing 500a are integrated together, and the housing 200 is integrated with both the electric motor housing 400a and the gearbox housing 500a.

[0123] The power conversion device 1 performs a DC / AC conversion between the DC power supply (not shown) and the drive motor 300. The gearbox 500 converts the rotation of the drive motor 300 and transmits the result of the conversion to the shaft. The housing 200, the electric motor housing 400a, and the gearbox housing 500a are manufactured, for example, by aluminum die casting.

[0124] This configuration allows for improved vibration resistance of the power conversion device 1 compared to a case where the power conversion device 1, the electric motor 400, and the gearbox 500 are housed in corresponding enclosures, and these enclosures are integrally joined to one another. Additionally, the number of enclosure components can be reduced. Because the number of such components is reduced, the cost of the electric vehicle drive device 600 can be lowered.

[0125] Although the disclosure above is described in relation to various exemplary embodiments and implementations, it should be understood that the various features, aspects and functions described in one or more of the individual embodiments are not limited in their applicability to the specific embodiment with which they are described, but can instead be applied alone or in various combinations to one or more of the embodiments of the disclosure.

[0126] It is therefore understood that numerous modifications, not illustrated by way of example, can be developed without departing from the scope of the specification of this disclosure. For example, at least one of the components can be modified, added, or eliminated. At least one of the components mentioned in at least one of the preferred embodiments can be selected and combined with the components mentioned in another preferred embodiment. DESCRIPTION OF REFERENCE MARKS 1 Power conversion device 10 Power module 10a Semiconductor element 11 Control board 12 Smoothing capacitor 12a Housing 12b Capacitor element 13 Busbar arrangement 13a, 13b busbar 14 coolers 14a Coolant flow path 14b first cooling surface 14c second cooling surface 14d opening 15a Flat surface section 15b Flat support column surface section 15c Flat Cover Surface Section 16a, 16b Support column 17 Throttle 18a first cover 18b second cover 19 Transport advantage 19a End of the lead section 20 Transport device 21 DC power supply 22 Power supply connection 23 Busbar 24 retaining element 25 Heat dissipation plate 25a Heat dissipation fin 26 Upconverter unit 27 Step-down converter unit 28 Transmission control unit 100 sub-assemblies 200 cases 200a floor wall 300 drive motor 400 electric motor 400a electric motor housing 500 gearbox 500a gearbox housing 600 electric vehicle drive device< / modifikationen> < / modifikationen> < / modifikationen> < / modifikationen> < / modifikationen> < / modifikationen>

Claims

[1] Power conversion device comprising: one or a plurality of power modules, each of which comprises one or a plurality of semiconductor elements and is connected to a power supply connection terminal for connection to a DC power supply; a control board that controls the switching operations of the semiconductor elements; at least one electrical component, which is a smoothing capacitor that smooths an input voltage to be fed into the power module from the DC power supply, and electrical components, which are an inductor, a boost converter unit, a buck converter unit and a transmission control unit, which are electrically connected to the power module; a busbar arrangement comprising a busbar that establishes an electrical connection in at least one interval below an interval between the power supply connection terminal and the power module, an interval between the power supply connection terminal and the at least one electrical component, and an interval between the power module and the at least one electrical component; and a cooler with a first cooling surface, a second cooling surface on a side opposite the first cooling surface and a coolant flow path formed in the cooler, wherein The power module, the smoothing capacitor, the choke, the boost converter unit, the buck converter unit, the transmission control unit, and the busbar assembly are heat-generating components. the first cooling surface and the second cooling surface are provided parallel to each other on both sides of the coolant flow path, at least one of the heat-generating components is thermally connected to the first cooling surface, and at least one of the heat-generating components is thermally connected to the second cooling surface. [2] Power conversion device according to claim 1, wherein the power conversion device has a power conversion function and a cooling function and enables verification of the power conversion function and the cooling function. [3] Power conversion device according to claim 1 or 2, comprising a housing, wherein the heat-generating components, the control board and the cooler are housed in the casing, and the first cooling surface and the second cooling surface are orthogonal to a direction of a normal to a surface of the housing opposite the first cooling surface or the second cooling surface. [4] Power conversion device according to claim 3, wherein the housing is formed in the shape of a tube with a bottom, and the opposite surface is an inner surface of a bottom wall of the housing. [5] Power conversion device according to any one of claims 1 to 4, wherein the at least one heat-generating component, which is thermally connected to the first cooling surface, has a flat surface section formed on a side opposite the first cooling surface parallel to the first cooling surface, and Neither the other heat-generating components, with the exception of the at least one heat-generating component that is thermally connected to the first cooling surface, nor the control board are provided on the opposite side of the side of the first cooling surfaces of the flat section. [6] Power conversion device according to any one of claims 1 to 5, comprising a multitude of support columns arranged on the side of the first cooling surface and projecting in a direction away from the first cooling surface, wherein Each of the multiple support columns has a flat support column surface section formed at an end section thereof on a side opposite the side of the first cooling surface parallel to the first cooling surface, the flat support column surface sections are provided on the same plane parallel to the first cooling surface, and Neither the heat-generating components nor the control board are provided on the opposite side of the side of the first cooling surfaces of each of the flat support column surface sections. [7] Power conversion device according to claim 6, wherein the plurality of support columns is provided in a detachable manner. [8] Power conversion device according to any one of claims 1 to 7, comprising one or both of: a first cover provided at the first cooling surface and covering all elements arranged on the side of the first cooling surface; and a second cover provided on the second cooling surface, covering all elements located on the side of the second cooling surface. [9] Power conversion device according to claim 8, comprising the first cover, wherein the first cover has a flat cover surface section formed at an end section thereof on a side opposite the side of the first cooling surface parallel to the first cooling surface. [10] Power conversion device according to any one of claims 1 to 7, wherein the second cooling surface has a plurality of transport projections arranged within an outer environment of the second cooling surface and projecting in a direction away from the second cooling surface. [11] Power conversion device according to any one of claims 1 to 10, wherein the smoothing capacitor is thermally connected to the first cooling surface or the second cooling surface. [12] Power conversion device according to any one of claims 1 to 10, wherein the cooler has an opening provided in the first cooling surface or the second cooling surface and connected to the coolant flow path, and a heat dissipation plate covering the opening, The heat dissipation plate has a multitude of heat dissipation fins on one of its surfaces on the side of the coolant flow path, projecting towards the side of the coolant flow path. the first cooling surface or the second cooling surface is formed on a surface of the heat dissipation plate on a side opposite to the side of the coolant flow path, and The power module is thermally connected to the first cooling surface or the second cooling surface on the heat dissipation plate. [13] Power conversion device according to claim 6, comprising a housing, wherein the heat-generating components, the control board, the cooler and the support columns are included in the housing, the first cooling surface and the second cooling surface are orthogonal to a direction of a normal to an opposite surface of the housing that faces the first cooling surface or the second cooling surface, and the flat support column surface sections are in contact with the opposite surface. [14] Power conversion device according to claim 13, wherein the housing is formed in the shape of a tube with a bottom, and the opposite surface is an inner surface of a bottom wall of the housing. [15] Power conversion device according to claim 9, comprising a housing and the second cover, wherein the first cover, the second cover and the cooler are included in the housing, the first cooling surface and the second cooling surface are orthogonal to a direction of a normal to an opposite surface of the housing that faces the first cooling surface or the second cooling surface, and the flat covering surface section is in contact with the opposite surface. [16] Power conversion device according to claim 15, wherein the housing is formed in the shape of a tube with a bottom, and the opposite surface is an inner surface of a bottom wall of the housing. [17] Electric vehicle drive device comprising: the power conversion device according to claim 3 or 4 or according to one of claims 13 to 16; an electric motor electrically connected to the power conversion device and having a rotating shaft whose rotation is controlled; and a gearbox coupled to the rotary shaft that converts a rotational speed of the rotary shaft and transmits a result of the conversion to a drive wheel, wherein the housing is integrated with one or both of an electric motor housing that accommodates the electric motor and a gearbox housing that accommodates the gearbox. [18] Power conversion device manufacturing process, comprising: an element preparation step for preparation one or a plurality of power modules, each of the power modules comprising one or a plurality of semiconductor elements and connected to a power supply connection terminal for connection to a DC power supply, a control board that controls the switching operations of the semiconductor elements, a smoothing capacitor that smooths an input voltage to be fed from the DC power supply to the power module, a busbar arrangement with a busbar that establishes an electrical connection in at least two of the intervals between the power supply connection terminal, the power module and the smoothing capacitor, a cooler with a first cooling surface, a second cooling surface on a side opposite the first cooling surface, and a coolant flow path formed in the cooler, and a housing formed in the shape of a tube with a bottom; a subassembly formation step of the thermal connection of at least one of the power module, the smoothing capacitor and the busbar assembly with the first cooling surface and of the thermal connection of at least one of the power module, the smoothing capacitor and the busbar assembly with the second cooling surface, in order to to form a subassembly of a power conversion device consisting of the power module, the control board, the smoothing capacitor, the busbar assembly, and the cooler; and a housing assembly step of receiving the sub-assembly in the housing, wherein the first cooling surface and the second cooling surface are provided parallel to each other on both sides of the coolant flow path, the first cooling surface and the second cooling surface are orthogonal to a direction of a normal to an inner surface of a bottom wall of the housing, and The mounting direction of the sub-assembly on the housing is a direction orthogonal to the first cooling surface and the second cooling surface. [19] Power conversion device according to claim 18, wherein the subassembly has a power conversion function and a cooling function, and The power conversion device manufacturing process includes a test step to test the power conversion function and the cooling function, wherein the test step precedes the housing assembly step. [20] Power conversion device manufacturing process, comprising: an element preparation step for preparation one or a plurality of power modules, each of which comprises one or a plurality of semiconductor elements and is connected to a power supply connection terminal for connection to a DC power supply, a control board that controls the switching operations of the semiconductor elements, a smoothing capacitor that smooths an input voltage to be fed from the DC power supply to the power module, a busbar arrangement with a busbar that establishes an electrical connection in at least two of the intervals between the power supply connection terminal, the power module and the smoothing capacitor, a cooler with a first cooling surface, a second cooling surface on a side opposite the first cooling surface and a coolant flow path formed in the cooler, a multitude of detachably formed support columns, and a housing formed in the shape of a tube with a bottom; a subassembly formation step of the thermal connection of at least one of the power module, the smoothing capacitor and the busbar assembly with the first cooling surface, of the thermal connection of at least one of the power module, the smoothing capacitor and the busbar assembly with the second cooling surface, and of attaching the plurality of support columns to the first cooling surface, wherein the support columns project in a direction away from the first cooling surface in order to to form a sub-assembly of a power conversion device consisting of the power module, the control board, the smoothing capacitor, the busbar assembly, the cooler and the plurality of support columns; a transport step of transporting the subassembly to a provisioning location of the housing in a state in which a flat support column surface section, provided at an end section, has been brought into contact with a support surface on a side opposite to the side of the first cooling surface of each of the plurality of support columns, so that the subassembly has been brought to a standstill; a support column release step to detach each of the multiple support columns from the subassembly; and a housing assembly step for receiving, in the housing, the sub-assembly from which the multitude of support columns were removed, wherein After the subassembly formation step has been carried out, the flat support column surface sections in the subassembly are provided on the same plane parallel to the first cooling surface, and After the subassembly step has been performed, none of the power module, smoothing capacitor, busbar assembly and control board is provided on the opposite side of the first cooling surface of each of the flat support column surface sections in the subassembly.

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