METHOD FOR PRODUCING A SEMICONDUCER MODULE AND SEMICONDUCER MODULE

Abstract

A method for manufacturing a semiconductor module comprising a first printed circuit board to which a plurality of semiconductor elements are bonded, a second printed circuit board arranged adjacent to the first printed circuit board such that side surfaces of the first printed circuit board and the second printed circuit board face each other, and a sealing element that forms a seal between the semiconductor elements, the first printed circuit board, and the second printed circuit board, comprises forming a plate-like element with a convex section formed along an arrangement direction in which the first printed circuit board and the second printed circuit board are arranged side by side, separately forming the first printed circuit board and the second printed circuit board by cutting the plate-like element, and bonding the plurality of semiconductor elements to a surface of the first printed circuit board on a side opposite the convex section.sealing with the sealing element so that part of the convex section in the first printed circuit board is exposed, or applying a thermally conductive layer element to part of the convex section in the first printed circuit board which is exposed after sealing with the sealing element, and deforming the second printed circuit board such that a surface of the convex section formed on the second printed circuit board is closer to an inner surface of the sealing element than a surface of the convex section formed on the first printed circuit board.

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