Substrate processing machine

Abstract

A plate processing machine comprises: a work execution section configured to perform a predetermined plate processing operation on each of several plates based on a set work condition; a change time detection section configured to detect a change time at which the work condition changes or varies; and a verification execution section configured to verify the execution result of the plate processing on the plates after the change time and to stop the plate processing machine at the next plate if the execution result is determined to be faulty.

Description

Technical field The present description refers to a plate processing machine that performs a predetermined plate processing operation on a plate. State of the art A technique for the mass production of board-based products by performing board processing operations on a board bearing a circuit pattern is widely used. Typical examples of board processing machines that perform the processing include a solder paste printer, which prints the solder paste, and a component assembler, which performs the component assembly. Furthermore, several types of board processing machines are usually arranged to form a board processing line. For example, a common board processing line includes a solder paste printer, a print verification machine, several component assemblers, a board visual inspector, and a reflow machine. In such a board processing line, downtime can occur due to a change in the operating conditions of the solder paste printer or the component assembler.As a countermeasure, a technical example was proposed in patent literature 1 to 3 in which the testing procedure of a pressure testing machine or a plate visual inspector is modified on the downstream side so that it is suitable for a change in the operating conditions. Patent literature 1 describes a method for managing plate inspection, comprising a step for acquiring information about changes in the fixture configuration of a component assembler, a step for determining a test object of a test fixture based on the acquired information, and a step for performing an inspection of a plate by the test fixture based on the determined test object. Accordingly, it is possible to perform the required inspection within a specified time without introducing an expensive plate visual inspector. Patent literature 2 discloses a testing device for work results from plate production, which defines a workflow for a testing operation on a plate based on work information about the work performed on the plate. When the work information is embodied in plate processing, it includes process information from work devices such as a suction nozzle, an assembly head, and a component feeder, and further corresponds to error information such as the assembly position deviation error rate of the suction nozzle, the number of assembly errors of the assembly head, and a pick-up error rate for each feeder group of the component feeder. In this way, it is possible to modify a workflow by selecting a test target, defining a test sequence, or the like, thereby achieving efficient and flexible testing. Furthermore, patent literature 3 describes a plate visual inspector that checks the appearance of a plate according to an inspection criterion that is updated based on a variation factor when the variation factor, which can cause an optical defect in the plate, occurs in an upstream device. Specific examples of the variation factor described include refilling solder paste and cleaning a screen mask in a solder printing machine, as well as changing a component supplier and modifying production data in a component assembler. Accordingly, it should be possible to provide a plate visual inspector capable of updating an inspection criterion according to the actual assembly state of a component. Citation list Patent literature Patent Literature 1: JP-A-2012-064831Patent Literature 2: JP-A-2003-124699Patent Literature 3: JP-A-2013-168538 Summary of the invention Technical task Incidentally, in the technical examples in patent literature 1 to 3, it is advantageous that the inspection method of the panel visual inspector can be modified according to changes in the component assembler's working conditions. However, the modification of the inspection method does not always correspond to the change in working conditions, and in some cases, the modification of the working conditions itself is not implemented satisfactorily. In these cases, a work error may occur during the assembly work performed by the component assembler, and the panel visual inspector will evaluate the result as defective, thus producing a defective panel. Particularly if the panel processing line includes several component assemblers, a large number of defective panels can result.It should be noted that a change in the operating conditions of the solder paste printing machine may lead to a work error in the printing process, and the print testing machine may detect a fault and produce a defective plate. Therefore, one objective of the present description is to provide a plate processing machine that is able to suppress the number of defective plates, even if a work error occurs after a change in the operating conditions of the plate processing machine. Solution to the problem The present description discloses a plate processing machine comprising: a work execution section configured to perform a predetermined plate processing operation on each of several plates based on a set working condition; a change time detection section configured to detect a change time at which the working condition is changed or varies; and a test execution section configured to test the execution result of the plate processing on the plates after the change time and to stop the plate processing machine at the next plate if the execution result is determined to be faulty. Furthermore, the present description discloses a plate processing machine comprising: a work execution section configured to perform predetermined plate processing operations on each of several plates based on a set working condition; a change time detection section configured to detect a change time at which the working condition changes or varies; and a verification execution section configured to verify the execution result of the plate processing on each of a limited number of plates after the change time. The present description also discloses a technical idea wherein "The plate processing machine according to claim 1 or 2" in claim 4 of the originally filed application is amended to "The plate processing machine according to any one of claims 1 to 3", a technical idea wherein "The plate processing machine according to claim 1 or 2" in claim 5 of the originally filed application is amended to "The plate processing machine according to any one of claims 1 to 4", a technical idea wherein "The plate processing machine according to claim 1 or 2" in claim 6 of the originally filed application is amended to "The plate processing machine according to any one of claims 1 to 5", a technical idea wherein "The plate processing machine according to claim 1 or 2" in claim 7 of the original application is amended to "The plate processing machine according to any one of claims 1 to 6", and a technical ideain claim 8 of the original application, the "The plate processing machine according to claim 1 or 2" is amended to "The plate processing machine according to one of claims 1 to 7". Furthermore, the present description also discloses a technical idea in which "The plate processing machine according to claim 1 or 2" in claim 9 of the original application is amended to "The plate processing machine according to any one of claims 1 to 8", a technical idea in which "The plate processing machine according to claim 9" in claim 11 of the original application is amended to "The plate processing machine according to claim 9 or 10", a technical idea in which "The plate processing machine according to claim 9" in claim 12 of the original application is amended to "The plate processing machine according to any one of claims 9 to 11", a technical idea in which "The plate processing machine according to claim 9" in claim 13 in the originally filed version is amended to "The plate processing machine according to any one of claims 9 to 12", and a technical ideain claim 14, where "The plate processing machine according to claim 1 or 2" is amended to "The plate processing machine according to one of claims 1 to 8" in the originally filed version. Advantageous effects of the invention According to the disclosed plate processing machine, since the plate processing result is checked within the machine itself after the change in processing conditions, a processing error can be detected earlier than in a configuration where the check is performed by another machine downstream. Therefore, even if a processing error occurs after the plate processing machine's operating conditions have changed, it is possible to detect the error early in order to prevent the subsequent occurrence of defective plates and to reduce the number of defective plates. Brief description of the characters Fig. 1 is a front view schematically showing a panel processing line including a component assembler corresponding to a panel processing machine according to a specific embodiment. Fig. 2 is a side view schematically showing a configuration of a solder printing machine corresponding to the panel processing machine of the specific embodiment. Fig. 3 is a perspective view schematically showing a configuration of a component assembler corresponding to the panel processing machine of the specific embodiment and an automatic conveying device. Fig. 4 is a top view schematically showing a configuration of the component assembler. Fig. 5 is a block diagram showing a configuration related to the control of the panel processing line and the panel processing machine. Fig. 6 is a list diagram illustrating the operating conditions of five elements.Figure 7 is a flowchart of a workflow illustrating the operation of a component assembler. Figure 8 is a flowchart of a workflow for defects, where the diagram represents a subsequent operation if the inspection result in the workflow of Figure 7 is a defect. Description of the execution forms 1. Configuration of the plate processing line 9 First, with reference to Figures 1 and 5, the board processing line 9 is described, which comprises a solder paste printing machine 1 and a component assembler 4, corresponding to a board processing machine of the specified form. The board processing line 9 includes a solder paste printing machine 1, a print testing machine 2, a component assembly line 3, a board visual inspector 6, and a reflow machine 7. As indicated by the arrow in the upper left of Figure 1, the conveying direction of the boards for component assembly in the component assembly line 3 is the X-axis direction, a direction orthogonal to the X-axis direction in a horizontal plane is the Y-axis direction, and the vertical direction is the Z-axis direction. In the component assembly line 3, five component assemblers 4 and one component assembler 5 of a different model than the component assemblers 4 are arranged in the X-direction.The component assembly line 3 is further equipped with a common feeder storage device 31 and an automatic exchange device 32. The solder paste printing machine 1 performs printing operations to apply solder paste to a plate in a predetermined pattern. The detailed configuration of the solder paste printing machine 1 is described later. The print testing machine 2 receives the plate from the solder paste printing machine 1 and performs a test operation to check the solder paste printing condition on the plate. The print testing machine 2 is located near the upstream end of the component assembly line 3. The print testing machine 2 and the upstream component assembler 4 of the component assembly line 3 are connected by a plate conveyor (not shown). The plate conveyor conveys the plate whose printing condition has been deemed satisfactory by the print testing machine 2 to the component assembly line 3. The five component assemblers 4 that make up the component assembly line 3 have the same configuration. The component assembler 4 performs the assembly operation of attaching a component to a plate using a belt feeder 41. As shown in Fig. 1, the component assembler 4 comprises a component feeder 42 located at a substantially mid-height on the front face in the Y-axis direction and an internal feeder storage device 43 located below the component feeder 42. The component feeder 42 has several slots (not shown) extending in the Y-axis direction. The belt feeder 41 is functionally arranged in each of the several slots. The internal feeder storage device 43 has the same configuration as the component feeder 42, and the belt feeder 41 is arranged in each of the several slots. The belt feeder 41, arranged in the component feeding device 42, feeds components. The machine's internal feeder storage device 43 temporarily stores belt feeders 41 to be used later and previously used belt feeders 41. In Fig. 1, the belt feeder 41 is inserted into the machine's internal feeder storage device 43 of the first to fourth component assemblers 4, counting from the upstream side, and the machine's internal feeder storage device 43 of the fifth component assembler 4 is empty. A detailed configuration of the component assembler 4 is described later. Five component assemblers of different models are arranged side-by-side on the downstream side of five component assemblers 4. Component assembler 5 performs assembly work to attach a component to a plate using a tray-like component feeder, the reference number of which is omitted. While component assembler 4 primarily performs assembly work for small and medium-sized components, component assembler 5 primarily performs assembly work for large and deformed components. The common feeder storage device 31 is arranged side-by-side on the upstream side of five component assemblers 4. The common feeder storage device 31 has the same configuration as the component feeder 42, and a belt feeder 41 is mounted in each of its multiple slots. However, the common feeder storage device 31 has more slots than the component feeder 42 and can accommodate a large number of belt feeders 41. Each of the multiple belt feeders 41 stored in the common feeder storage device 31 is compatible enough to be used by any of the five component assemblers 4. The automatic exchange device 32 moves in the X-direction along guide rails located on the front faces of the five component assemblers 4 and the common feeder storage device 31 in the Y-direction. The automatic exchange device 32 is powered by a contactless power supply mechanism (not shown). The automatic exchange device 32 moves between the component feeder 42 of each of the five component assemblers 4 and the common feeder storage device 31 to automatically exchange the belt feeder 41. For each of the five component assemblers 4, the automatic exchange device 32 automatically exchanges the belt feeder 41 between the component feeder 42 and the machine's internal feeder storage device 43. The configuration of the automatic exchange device 32 will be described in more detail later.Part of the replacement process for the belt feeder 41 can be carried out by one worker. The plate visual inspector 6 is located downstream and separately from the component assembler 5. The plate visual inspector 6 receives the plate on which the component assembly work has been completed from the component assembler 5 via the conveyor 61. The plate visual inspector 6 performs an inspection of the assembly work result by processing image data obtained by capturing an image of the plate. In other words, the plate visual inspector 6 checks the quality of the component's assembly condition. A repair station for repairing a plate found to be defective can be located upstream or downstream of the plate visual inspector 6. The repaired plate is conveyed back into the plate visual inspector 6, and the inspection process is repeated. The reflow machine 7 is located downstream of the plate inspector 6 and positioned at a distance from it. The reflow machine 7 receives the plate, which has been deemed satisfactory by the plate inspector 6, via the plate conveyor 71. The reflow machine 7 heats and cools the solder paste to ensure the soldering condition of the component. It should be noted that the line configuration of the plate processing line 9 can differ from the configuration described above and can be modified into various configurations. 2. Device configuration of the solder paste printing machine 1 The device configuration of the solder paste printing machine 1 of embodiment is described next with reference to Fig. 2. The solder paste printing machine 1 is configured by assembling a plate conveyor 11, a screen holding device 12, a doctor blade movement device 13, a camera 14, a control device 19, and the like on a base 10. The base 10 comprises a bottom, a front (left side in Fig. 2), and a back (right side in Fig. 2). The plate conveyor 11 is arranged on the bottom of the base 10. The plate conveyor 11 comprises a conveyor belt (not shown) and a plate holding section 111. The conveyor belt transports the plate K to the plate holding section 111 by rotating it. The plate holding section 111 is arranged in a working position substantially in the center of the base 10 to be movable up and down.The plate-holding section 111 holds the conveyed plate K, presses the plate K upwards to a predetermined height, and brings the plate K into close contact with an underside of the screen 122 described later. When the printing work on the plate K is complete, the plate-holding section 111 lowers the plate K. The conveyor belt then rotates again to convey the plate K to the outside of the machine. The screen holding device 12 is arranged slightly above the plate conveyor device 11. The screen holding device 12 comprises a pair of support tables 121, which are arranged on the front and rear surfaces of the base 10. The pair of support tables 121 supports the screen 122 so that it does not loosen in a horizontal position. The screen 122 is supported on the pair of support tables 121, for example, by a frame element arranged on the outer circumferential edge. Fig. 2 shows a cross-section of the screen 122, where the thickness of the screen 122 is actually less than the thickness of the plate K. The screen 122 is provided with several pressure holes 123 that extend through it in a top-bottom direction. The several pressure holes 123 are arranged in a predetermined pattern that corresponds to the contact surfaces (exposed electrodes) on the wiring pattern of the plate K. The doctor blade movement device 13 is arranged above the screen holding device 12. The doctor blade movement device 13 comprises a head drive device 131, a doctor blade head 132, a pair of lifting and lowering drive sections 133, a pair of doctor blades 134, and the like. The head drive device 131 is bridged over the upper part of the base 10 and extends in the Y-axis direction (front-to-back direction). The head drive device 131 moves the doctor blade head 132 in the Y-direction by means of a linear motion mechanism, for example, a feed screw mechanism. The doctor blade head 132 holds a pair of lifting and lowering drive sections 133 arranged at the front and rear in the Y-direction. Each of the two lifting and lowering drive sections 133 holds a squeegee 134 at its underside. The two lifting and lowering drive sections 133 operate independently of each other and raise and lower the squeegee 134 by means of an actuator, for example, an air cylinder. The two squeegees 134 are designed in the form of a horizontally elongated plate extending in the X-axis direction and are arranged opposite each other. Each pair of squeegees 134 slides on the top surface of the screen 122 in the Y-direction to move the solder paste CS placed on the top surface of the screen 122. Accordingly, the solder paste CS is printed onto the plate K via the printing holes 123 of the screen 122. Here, a pair of squeegees 134 are alternately moved downwards to perform the printing process. Specifically, the squeegee 134 on the front (left side in Fig. 2) performs the printing process, moving the solder paste CS from the front to the back. Next, the squeegee 134 on the back (right side in Fig. 2) performs the printing process, moving the solder paste CS from the back to the front. Fig. 2 shows a state in which the front squeegee 134 is raised and the rear squeegee 134 is lowered to perform the printing process. Each pair of squeegees 134 is held by a lift-and-lower drive section 133 while tilted so that the front side facing the moving surface is inclined downwards. The tilt angle of the squeegee 134 is adjusted by an adjustment mechanism, the reference number of which has been omitted, located in a lower part of the lift-and-lower drive section 133.In addition, the sieve 122 and the squeegee 134 are regularly cleaned to remove solder residues. The camera 14 is a digital imaging device with an imaging element. The camera 14 is located on the upper part of the rear surface of the base 10, and its optical axis is directed obliquely downwards. The camera 14 captures an image of an area within the imaging field based on a control signal from a control device 19 connected for communication and acquires image data. In particular, the camera 14 captures images of an object such as the screen 122 and the squeegee 134, the solder paste CS applied to the top of the screen 122, and the like. The camera 14 transmits the image data acquired by the image acquisition to the control device 19. The control device 19 performs image processing of the image data to check the condition, position, and the like of the object and the solder paste CS. The camera 14 may include an image processing section and transmit an image processing result to the control device 19. The control device 19 is configured using a computer device comprising a CPU, various memory components, an input / output area, and the like. The control device 19 is connected via a network (not shown) to the line management device 99 (see Fig. 5). The control device 19 controls the print execution area based on the print job data received from the line management device 99 in order to proceed with the printing process. The print job execution section operates based on the set operating conditions and corresponds in particular to the plate feeder 11, the screen holding device 12, the doctor blade movement device 13, and the camera 14. The print job data is created for each plate type K and updated or modified as needed. At least part of the creation, updating, and modification of the print job data is performed by the operator. The print job data includes plate data relating to the shape and other characteristics of the plate K, as well as data relating to the type of solder paste CS. The print job data includes data on the screen 122 and the squeegee 134 to be used. Furthermore, the print job data includes data relating to a detailed workflow of the print job, such as the feed rate of the plate K, the movement speed, the number of movements, and the stroke speed of the squeegee 134 in the Y-axis direction, the imaging conditions of the camera 14, an image processing procedure, a procedure for feeding and managing the solder paste CS, and the like. 3. Device configuration of the component assembler 4 and the automatic exchange device 32 Next, the device configuration of the component assembler 4 of the embodiment is described with reference to Fig. 3 and Fig. 4. The component assembler 4 is configured by assembling a component feeder 42, an internal feeder storage device 43, two sets of plate conveyors 44, a head drive device 45, a component imaging camera 46, a plate imaging camera 47, a height sensor 48, a control device (not shown), and the like on a base 40. As described above, in the component feeding device 42, belt feeders 41 are arranged in each of the several slots. The housing 411 of the belt feeder 41 is designed as a vertically elongated, rectangular, thin box. The housing 411 releasably holds the belt spool 413, onto which the carrier belt 412 is wound. The carrier belt 412 stores components in each of the several cavities that are formed at regular intervals in the longitudinal direction of the belt. When the belt feeder 41 is inserted into the slot of the component feeder 42, power is supplied via the connector from the main side of the component assembler 4. The belt feeder 41 can also communicate with the control device. Based on a control command from the control device, the belt feeder 41 controls a feeding operation of the carrier belt 412. Accordingly, the belt feeder 41 feeds the carrier belt 412 in a predetermined conveying direction and delivers the carrier belt 412 so that the component can be picked up at a predetermined receiving position. The two sets of plate conveyors 44 are arranged side by side in the Y-axis direction on the base 40 and extend in the X-axis direction. The plate conveyor 44 comprises a belt conveyor, a positioning device, and the like, the reference numerals of which are omitted. The belt conveyor then conveys the plate K in the conveying direction. The positioning device positions the plate K at a predetermined working position. After completion of the component assembly, the plate conveyor 44 conveys the plate K out of the machine. The plate conveyor 44 can have a single-track configuration with only one set. The head drive device 45 transfers the component fed by the component feeder 42 to a predetermined mounting position on the plate K, which is positioned by the plate conveyor 44. The head drive device 45 moves a movable platform 451 in two horizontal directions (X-axis direction and Y-axis direction) by means of two sets of linear motion mechanisms (not shown). The mounting head 452 is interchangeably attached to the movable platform 451 by a clamping element (not shown). The mounting head 452, together with the movable platform 451, is driven in two horizontal directions by the head drive device 45. The mounting head 452 adjusts the position in the vertical direction and the rotation angle in the horizontal plane of the component being picked up, and lowers and mounts the component onto the plate K. In particular, a holding element for a component is attached to the mounting head 452. A suction nozzle 453 is used as the holding element, which picks up a component by applying a vacuum. Alternatively, a chuck can be used instead of the suction nozzle 453 to grip and hold a component. The suction nozzle 453 held by the mounting head 452 is exchanged according to the size of the component to be mounted on the plate K. Specifically, a nozzle station 454 is arranged on the top of the base 40, which can interchangeably hold several suction nozzles 453. The component assembler 4 causes the mounting head 452 to hold the suction nozzle 453 held in the nozzle station 454 when the suction nozzle 453 used for the assembly work is not held by the mounting head 452. On some models of the component assembler 4, the operator changes the suction nozzle 453 manually. The component imaging camera 46 and the plate imaging camera 47 are digital imaging devices with imaging elements such as CMOS. The component imaging camera 46 and the plate imaging camera 47 perform imaging based on a control signal from the control device and transmit the image data acquired during imaging to the control device. The component imaging camera 46 captures an image of the component held by the suction nozzle 453 of the assembly head 452 from below. The image processing section of the control device processes the acquired image data and checks the holding status of the component. The plate imaging camera 47 captures an image of a position marker attached to the plate K from above and transmits the acquired image data to the control device.The image processing section of the control device performs image processing of the image data, checks the actual working position of the plate K and reflects this in the position control of the assembly head 452. The height sensor 48 is arranged on the movable platform 451. The height sensor 48 measures the height from a target object to the assembly head 452 by measuring the distance to the target object located vertically below it. For example, an optical sensor that uses laser light is used as the height sensor 48. Target objects include the plate K positioned by the plate conveyor 44, a component fed by the component feeder 42, a component mounted on the plate K, and the like. The control device is mounted on base 40, and its position is not restricted. The control device is configured using a computer device comprising a CPU, various memory components, an input / output section, and the like. The control device can be configured to have multiple CPUs distributed and arranged within it, interconnected. The control device is connected to the line management device 99 via a network (not shown). Based on the assembly data received from the line management device 99, the control device directs the assembly execution section to proceed with the assembly of the component.The assembly execution section operates on the basis of the set working conditions and corresponds in particular to the component feeding device 42, two sets of plate conveyor devices 44, the head drive device 45, the component imaging camera 46, the plate imaging camera 47 and the height sensor 48. The assembly work data is created for each type of plate K and updated or modified as needed. At least part of the creation, updating, and modification of the assembly work data is performed by the worker. The assembly work data includes plate data relating to the shape and other characteristics of plate K, and component data relating to the shape and other characteristics of the component to be assembled. There are several component data points, which vary depending on the type and size of the component. The assembly work data includes data relating to the type and arrangement position of the belt feeder 41, the suction nozzle 453, and other components to be used. Furthermore, the assembly work data includes coordinate data for the pickup position of the belt feeder 41 and coordinate data for the assembly position on plate K on which the component is mounted.Furthermore, the assembly work data includes data on a detailed workflow of the assembly work, such as a conveying speed of the plate K, a movement speed and a movement path of the assembly head 452, imaging conditions of the component imaging camera 46 and the plate imaging camera 47, an image processing procedure and the like. The automatic exchange device 32 will now be described with reference to Fig. 3. The automatic exchange device 32 comprises a device body 321, a holding section 322, and several movement mechanisms (not shown). The device body 321 is in the form of a vertically elongated box, the rear of which is open in the Y-axis direction towards the component assembler 4. The holding section 322 is in the form of a small box, the rear of which is open in the Y-axis direction, and is arranged inside the device body 321. The holding section 322 is driven by a lifting and lowering mechanism (not shown) to move up and down between a raised position and a lowered position, as indicated by arrow A1. The holding section 322 has an interior space for holding several belt feeders 41, which are arranged in the X-axis direction.The multiple motion mechanisms are arranged side by side in the X-axis direction within the holding section 322. As indicated by arrows A2 and A3, each of the multiple motion mechanisms moves the belt feeder 41 in the Y-axis direction in the raised position and the lowered position. As shown in Fig. 3, when the holding section 322 is in the raised position, it can move the belt feeder 41 between the holding section 322 and the component feeder 42. Similarly, when the holding section 322 is in the raised position, it can move the belt feeder 41 between the holding section 322 and the common feeder storage device 31. When the holding section 322 is in the lowered position, it can also move the belt feeder 41 between the holding section 322 and the machine's internal feeder storage device 43. 4. Details of changes or variations in working conditions and an example of an error factor In the solder paste printing machine 1 and the component assembler 4 of the implementation, a work stoppage can occur due to a change or deviation in the operating conditions. That is, a plate K classified as defective by the pressure testing machine 2 can be produced due to a change or variation in the operating conditions in the solder paste printing machine 1. Furthermore, a plate K classified as defective by the plate visual inspector 6 can be produced due to a change or variation in the operating conditions in the component assembler 4. Additionally, a plate K classified as defective by the plate visual inspector 6 can be produced due to a change or variation in the operating conditions in the solder paste printing machine 1, even if the plate K was not classified as defective by the pressure testing machine 2. These types of working conditions are defined by the 5Ms of quality control. That is, there are five working conditions: Man, Machine, Method, Material, and Measurement. Here, the working conditions in the soldering press 1 and the component assembler 4 are described, along with details of changes or variations to the working conditions and an example of a defect factor for each point, with reference to Fig. 6. (1) Details of the execution of the installation work by the worker (Man) The setup work performed by the worker includes creating and installing work data (printing work data and assembly work data) as well as assembling and adjusting component sections (various objects) of the plate processing machine. The details of this setup work constitute working conditions. Setup work to update or change at least part of the work data corresponds to a change in working conditions. Furthermore, assembling a component section means changing the component section that performs the plate processing, and adjusting the component section includes the ability to vary the operational quality. Therefore, assembling and adjusting component sections also correspond to a change in working conditions. A work error is defined as a case in which a change in working conditions becomes a factor contributing to the error.For example, if the updated or modified work data is faulty, this can be an error factor. In the case of the solder paste printing machine 1, an error set by the operator in the position of the squeegee 134 or an error in the condition of the screen 122 installed by the operator can be an error factor. In the case of the component assembler 4, a positional error and an error in the position of the belt feeder 41 set by the operator can be error factors. (2) Component section of the work execution section or maintenance status of the component section (machine) The component sections of the workpiece processing machine's machining section are, of course, a working condition. Furthermore, the quality of work can vary depending on the maintenance condition of the component sections, and the maintenance condition itself is a working condition. Replacing component sections corresponds to a change in the working condition. A variation element (adjustment, cleaning, maintenance, or the like) related to the maintenance condition of a component section corresponds to a variation point of the working condition. A defect factor can be the influence of individual differences within a component section and a resulting deterioration in performance. Even if, for example, the performance of the replaced and installed component section is within the normal range, a defect can occur if the compatibility of the combination with another component is poor.Furthermore, an error can occur if the vacuum supplied to the suction nozzle 453 of the component assembler 4 decreases (a variation element where the vacuum level decreases) or if the maintenance condition of the head drive device 45 is poor and the position control accuracy of the assembly head 452 decreases. Additionally, an image processing error can occur due to a deterioration in the performance of the camera 14 of the solder paste printing machine 1 and the component imaging camera 46 and the plate imaging camera 47 of the component assembler 4. Furthermore, in the component section where regular maintenance is recommended, the execution of the maintenance corresponds to the maintenance condition. The arrival of the maintenance deadline can be considered a variation element of the working condition. From another perspective, using the component section after the maintenance date carries the possibility of a defect occurring. Moreover, performing maintenance on the component sections is a form of variation in the maintenance condition and corresponds to a variation element of the working condition. The screen 122 and the squeegee 134 of the soldering machine 1, as well as the belt feeder 41 and the assembly head 452 of the component assembler 4, can be cited as component sections for which regular maintenance is recommended, but the component sections for which regular maintenance is recommended are not limited to these. (3) Method specified for the processing of plates The execution method for plate processing includes operating conditions such as operating speed and operating sequence. These changes correspond to modifications of the operating conditions. As a case of a failure factor, the execution method may become unsuitable after the modification. For example, the quality of the printing work may deteriorate after the movement speed of the squeegee 134 of the soldering printing machine 1 is changed. Furthermore, the quality of the assembly work may deteriorate after the lifting control or air pressure control method of the suction nozzle 453 of the component assembler 4, or the horizontal movement speed of the assembly head 452, is changed. (4) Elements (material) used for plate processing The components and materials used for plate processing have characteristics such as batch and supplier, and the components themselves can be considered operating conditions. Refilling components, changing batches, and similar actions correspond to a change in operating conditions. An example of a failure factor is a mismatch due to a change in a component. For instance, the physical properties such as viscosity and composition of the solder paste CS supplied by solder paste printing machine 1 differ slightly from those of the original solder paste CS, resulting in an incompatibility that can affect the quality of the printing.Furthermore, a batch change or a change of supplier of a component in connection with the replacement of the carrier strip 412 and the spool 413 used in the component assembler 4 may lead to a discrepancy with the component data in the assembly data. Additionally, if the batch of plate K is changed, the deformation state of plate K may change. (5) Measurement in connection with plate processing and details of the execution of the processing based on the measurement result (Measurement) The details of the measurement procedure associated with plate processing and the processing based on the measurement result constitute a working condition that can affect operational quality. Changes in the details of the measurement and processing procedures correspond to changes in the working condition. An error factor occurs when there is an anomaly in the details of the measurement and processing procedures. For example, if an anomaly occurs in the thermal correction processing related to the position control of the assembly head 452 of the component assembler 4, the assembly accuracy of the component decreases, and an error occurs. Additionally, the position control accuracy of the assembly head 452 decreases if the component sections of the head drive device 45 expand thermally over time.As a countermeasure, thermal correction processing is regularly performed to thermally correct the scale of the XY coordinate system used for position control, and the details of the correction are updated sequentially. The possibility of an anomaly occurring during thermal correction processing is not zero. Furthermore, if an anomaly occurs during resolution correction processing related to the image processing of camera 14 of the soldering machine 1 or the component imaging camera 46 and the plate imaging camera 47 of the component assembler 4, an image processing error may occur, preventing proper image processing. 5. Line Management Device 99 The control device of the component assembler 4 and the control device 19 of the solder paste printing machine 1 incorporate several functional sections to suppress the number of defective plates K even if a work error occurs after a change in operating conditions. Before describing the functional sections, a configuration relating to the overall control of the plate processing line 9 is described with reference to Fig. 5. As shown in the figures, each of the several plate processing machines comprising the plate processing line 9 is connected to the line management device 99. Furthermore, the line management device 99 is connected to the common feeder storage device 31 and is wirelessly connected to the automatic exchange device 32. The line management device 99 is configured using a computer device. The line management device 99 includes an input section that receives a command, selection operation, or the like from an operator, and a display section that shows various types of information to the operator. The line management device 99 instructs each plate processing machine to perform plate processing by transmitting operational data. In addition, the line management device 99 receives log data from each of the plate processing machines in essentially real time, recording a detailed history of the operational execution status, and manages the progress status of the plate processing. Furthermore, the line management device 99 manages the inventory of the belt feeders 41 in the common feeder storage device 31.Furthermore, the line management device 99 transmits an exchange command from the tape feeder 41 to the automatic exchange device 32 using wireless communication, receives information about the progress status of the exchange process and manages the progress. 6. Control configuration in relation to the working conditions of the component assembler 4 Next, with reference to Fig. 5, a control configuration is described that mainly relates to the operating conditions of the component assembler 4. The component assembler 4 comprises seven functional sections, which are mainly implemented by software within the control device. That is, the component assembler 4 comprises an assembly work control section 81, a change time detection section 82, a test execution section 83, a conveying control section 84, an automatic recovery section 85, a handling section 86, and a notification section 87, which are shown in Fig. 5. The assembly work control section 81 controls the assembly execution section described above (component feeding device 42, machine-internal feeder storage device 43, plate conveyor 44, head drive device 45, component imaging camera 46, plate imaging camera 47, and height sensor 48). Part of the operation of the plate conveyor 44 is controlled by the conveyor control section 84. In the normal state, the conveyor control section 84 operates the plate conveyor 44 to convey several plates K into the machine and to position each of the several plates K at a predetermined working position so that the assembly of the components can be carried out. Change Time Recording Section 82 records a change time at which working conditions change or vary. Change Time Recording Section 82 can capture information about a large number of change times when the log data is generated. Change Time Recording Section 82 can capture information about part of the change time from Line Management Device 99 or another external device. For example, Change Time Recording Section 82 can capture the change time when the worker performs an input operation of the details of the setup work performed. In addition, Change Time Recording Section 82 can capture the change time and the maintenance date of the component section from the operating information of various maintenance devices and the input information of the worker performing the maintenance. Furthermore, the change-time detection section 82 receives a signal indicating the time of change at which the working conditions in the soldering machine 1 change or vary. This signal is transmitted directly from the soldering machine 1 to the component assembler 4 or via the line management device 99. The change-time detection section 82 handles the change in working conditions in its own machine (component assembler 4) in a similar way to the change in working conditions in the soldering machine 1. In this way, it is possible to handle a case in which the change in working conditions in the soldering machine 1 affects the assembly work of the component assembler 4 and represents an error factor. After the change-time detection section 82 has detected the change time, the inspection execution section 83 checks the result of the component's assembly work on plate K. In other words, inspection execution section 83 checks the assembly status of the component assembled after the change time. Inspection execution section 83 preferably checks the result of the assembly work on each of the plates K after the change time. The limit number only needs to be set to a minimum value sufficient to determine whether the change in working conditions affects the quality of the assembly work; for example, three or ten plates K can be set. Instead of the number of plates K, the limit number can also be defined based on the number of components assembled. The inspection procedure section 83 captures an image of the assembled component using the plate imaging camera 47 and checks the assembly status by processing the captured image data. It is preferable that the inspection procedure section 83 uses the same image processing method as the plate visual inspector 6, or an image processing method that is more refined than that of the plate visual inspector 6, and uses a quality determination criterion that is equal to or stricter than that of the plate visual inspector 6. Accordingly, the inspection procedure section 83 can detect plates that were previously classified as defective by the plate visual inspector 6. That is, plate K, which was classified as good by the inspection procedure section 83, will not be classified as defective by the plate visual inspector 6. If the image field of the plate imaging camera 47 is narrower than that of the inspection camera of the plate visual inspector 6, the plate imaging camera 47 can capture more images than the inspection camera. Accordingly, the inspection execution section 83 and the plate visual inspector 6 can align the target regions. The image processing performed by the inspection execution section 83 can be image data with a narrow image field or data obtained by combining multiple image data sets. Since the existing plate imaging camera 47 is used as described above, it is not necessary to provide a new inspection camera, thus avoiding an increase in the manufacturing costs of the component assembler 4. It is preferable that test procedure section 83 checks the assembly status of the component only with respect to the component that could be affected by the change or variation in the working conditions. For example, if, in an example of a change in working conditions, the belt feeder 41 or the belt spool 413 is replaced, test procedure section 83 can only specify as the test target the component fed by the carrier belt 412 after the replacement. If the suction nozzle 453 is replaced, test procedure section 83 can only specify as the test target the component assembled with the replaced suction nozzle 453. Furthermore, if several types of components may be affected by a change or deviation in the working conditions, Inspection Procedure Section 83 may perform a sampling inspection of the assembly status with respect to some of the several types of components. For example, if maintenance work is carried out on the head drive device 45 as an example of a change in the working conditions, several types of components may be affected by the maintenance work. Therefore, Inspection Procedure Section 83 performs a sampling inspection of the assembly status of the component. For example, Inspection Procedure Section 83 performs a sampling inspection of four components located near the four corners on plate K.By extracting several components at a large distance from each other in this way, test procedure section 83 can accurately and efficiently check with a small number of components whether the maintenance work has an effect or not. Furthermore, inspection procedure section 83 can perform the sampling inspection of plate K after the change time. For example, in an example of a change in working conditions after the maintenance date of the component section, inspection procedure section 83 can perform the sampling inspection of plate K at a constant rate, such as one per 10 sheets or one per 100 sheets. At this point, the inspection can be stopped at the limit number described above, or the inspection can be continued at a constant rate. When inspection section 83 performs the assembly status check, the throughput rate of component assembler 4 decreases, and consequently, the overall throughput rate of panel processing line 9 also decreases. In other words, the production efficiency of panel K (panel product) decreases. However, since the number of inspection items is limited to a certain threshold, the decrease in production efficiency is only temporary, or the number of inspections is reduced through sampling. Therefore, the time-averaged production efficiency does not decrease significantly. Furthermore, compared to the configuration where only the panel visual inspector 6 on the downstream side checks the assembly status, a notable benefit is achieved: errors in the assembly work can be detected early. If the assembly result is found to be defective, the inspection execution section 83 stops the assembly work on the next panel K. If the inspection execution section 83 determines that the assembly result is defective, the conveying control section 84 controls the unloading of panel K from the machine. This prevents further work on the panel K classified as defective. Furthermore, it prevents the occurrence of repeated defects. For example, if the change in working conditions in most upstream component assemblers 4 is not carried out satisfactorily and becomes a defect factor, there is a risk that seven defective panels K will be produced in component assembly line 3 before the defect is detected by the panel visual inspector 6. However, if the inspection execution section 83 performs the inspection, the number of defective panels K is limited to one. If the inspection procedure section 83 determines that a defect exists, it is easy to assume that the change in working conditions that triggered the inspection is a contributing factor. Therefore, notification section 87 provides the worker with attribution information that links the defect finding to the changed or varied working conditions. Accordingly, the worker can quickly recognize the occurrence of the defect and take timely action. Furthermore, since the working conditions considered to be contributing factors are communicated, no skills or knowledge for investigating and identifying the contributing factor are required. Here, it is preferable for the fault to be handled automatically on the device side, rather than requiring worker intervention, as this can contribute to labor savings. However, depending on the specifics of the modified working conditions, the means of automatic handling may vary, and in some cases, automatic handling is not possible. There are three specific means of automatic handling: the automatic recovery section 85, the automatic handling section 86, and the automatic exchange device 32. If the execution result is determined to be faulty, the automatic recovery section 85 automatically reverts the modified working condition to the working condition before the change. For example, if a fault occurs after the suction nozzle 453 is replaced in the nozzle station 454, the suction nozzle 453 currently held in the assembly head 452 is considered a fault factor. In this case, the automatic recovery section 85 performs a control action so that the suction nozzle 453 currently held by the assembly head 452 is returned to the nozzle station 454, and the previously used suction nozzle 453 is again held by the assembly head 452. Furthermore, if a fault is assumed to occur after the movement speed (speed of component conveying) of the assembly head 452 has been changed, the current movement speed of the assembly head 452 is considered a fault factor.In this case, the automatic recovery section 85 performs a control to trace the log data and return to the previous movement speed. If the execution result is determined to be faulty, the automatic handling section 86 automatically replaces the modified working condition with another equivalent working condition. For example, it is assumed that an error occurs after the suction nozzle 453 is replaced. In this case, the automatic handling section 86 can perform a control action to replace the suction nozzle 453 currently held by the assembly head 452 with a different suction nozzle 453 on the nozzle station 454, instead of replacing the suction nozzle 453 with the previously used suction nozzle 453. In its implemented form, the automatic exchange device 32 handles the automatic exchange of the tape feeder 41. The automatic exchange device 32 cannot automatically resolve the defect itself, but rather processes it automatically in cooperation with the notification section 87. That is, if a defect occurs after the replacement of the tape feeder 41 or the tape reel 413, the notification section 87 communicates the allocation information to the automatic exchange device 32 via the line management device 99. This information links the result of the defect detection with the replaced tape feeder 41. Accordingly, the automatic exchange device 32 can automatically replace the tape feeder 41.Information about the individual belt feeder 41 to be automatically replaced and its storage position can be transmitted from the line management device 99 to the automatic exchange device 32. Due to the automatic handling described above by the automatic recovery section 85, the automatic handling section 86, and the automatic exchange device 32, the component assembler 4 returns to a state in which the assembly work can be carried out satisfactorily as before. A component assembler 5 of a different model may also include an assembly work control section 81, a change time detection section 82, a test execution section 83, a feed control section 84, an automatic recovery section 85, an automatic handling section 86, and a notification section 87. Furthermore, the above description of the working conditions and the like relating to the belt feeder 41 may be replaced by the description relating to the tray-type component feeding device. 7. Operation of the component assembler 4 The operation of the component assembler 4 is described next with reference to Figures 7 and 8. The following description assumes that the test execution section 83 performs the test for each plate, the number of plates tested K is specified by the test counter N, and the limit number is specified by NE. In Figure 7, in step S1, the test execution section 83 clears the test counter N as the initial condition immediately after the component assembler 4 starts. In the next step S2, the assembly work control section 81 causes the assembly work to be carried out on the inserted plate K as the work objective. In the next step S3, the change time detection section 82 determines whether the change time of the work condition was detected before the start of the assembly work or during the execution of the assembly work.As long as the change time is not recorded, steps S2 and S3 are repeated, and the unloading of plate K after the assembly work and the loading of the next plate K are repeated. Once the change time has been recorded, the process continues with step S4. In step S4, test execution section 83 checks the assembly status of the component immediately after completion of the assembly work. In the next step S5, test execution section 83 branches the process based on the test result. In step S6, if the test result is good, test execution section 83 increments the test counter N. In the next step S7, test execution section 83 determines whether the test counter N is less than a limit number NE and branches the process accordingly. If, in step S8, the test counter N is less than the limit NE, plate K is processed and the next plate K is inserted, and the assembly work control section 81 continues the assembly work. The workflow then returns to step S4, and the repetition loop, which includes steps S4 to S8, is repeated. If no error occurs in the test result and the test counter N reaches the limit NE, the workflow returns from step S7 to step S1. This means that the change in working conditions has no effect on the assembly work and no error occurs. Steps S2 and S3 are then repeated as long as the change time is not detected, and the test execution section 83 is not executed. In step S5, if the test result is faulty, the workflow proceeds to the fault workflow in Fig. 8. In step S11 of Fig. 8, the test execution section 83 stops the assembly work on the next plate K. In the next step S12, the feed control section 84 controls the unloading of the plate K identified as faulty from the machine. In the next step S13, the notification section 87 notifies the operator of assignment information that links the fault detection result and the changed work condition. In the next step S14, it is determined whether the device can automatically correct the fault. If automatic correction is not possible, the fault workflow ends. In step S15, if automatic treatment is possible, a treatment method is selected based on the details of the changed work condition. The workflow then proceeds to one of steps S16, S17, or S18, depending on the selected treatment method. In step S16, the automatic restore section 85 automatically restores the changed work condition (the work condition corresponding to the change time captured in step S3) to the work condition before the change. In step S17, the automatic handling section 86 automatically replaces the changed work condition with another equivalent work condition. In step S18, notification section 87 notifies the automatic exchange device 32 via the line management device 99 of the assignment information. In the next step, S19, the automatic exchange device 32 performs an automatic exchange of the belt feeder 41. The fault operation sequence is terminated by executing one of steps S16, S17, and S19. Afterward, the component assembler 4 resumes the assembly work according to the status check and the operator's restart command. If automatic handling is performed on the device side, the component assembler 4 can record the plate K identified as defective in the log data, remove the plate K from the machine, and automatically restart the assembly work. This minimizes the decrease in production efficiency. According to the component assembler 4 of the implementation, the result of the assembly work is checked after the time the working conditions within the machine itself (component assembler 4) have changed. This makes it possible to detect work malfunctions at an early stage compared to a configuration where the check is performed by a panel visual inspector 6 on the downstream side. Therefore, even if a work error occurs after the working conditions of the machine itself or the solder paste printing machine 1 have been changed, it is possible to detect the work error early in order to prevent the subsequent occurrence of defective panels and to reduce the number of defective panels. 8. Control configuration regarding the operating conditions of the solder paste printing machine 1 The soldering printing machine 1 comprises seven functional sections, similar to those of the component assembler 4 within the control device 19. Specifically, the soldering printing machine 1 includes a pressure control section 8A, a change-time detection section 8B, a pressure test execution section 8C, a feed control section 8D, an automatic recovery section 8E, an automatic handling section 8F, and a notification section 8G. The following section primarily describes the differences from the functional sections of the component assembler 4, while omitting a description of the commonalities and similarities. The pressure control section 8A controls the printing section (plate feeder 11, screen holder 12, doctor blade movement device 13, and camera 14). The change-time detection section 8B detects the time of change at which the operating conditions in the machine itself (soldering press 1) change or vary. Unlike the change-time detection section 82, the change-time detection section 8B does not receive any information about the change time of any other device on the upstream side. The pressure testing section 8C operates after the change time to check the printing condition (execution result of the printing work) of the solder paste CS printed on the plate K. The pressure testing section 8C captures an image of the printed plate K with a different inspection camera (not shown) than camera 14 and checks the printing condition by processing the captured image data. Additionally, an inspection position is arranged between the working position and the output position of the plate conveyor 11, and the inspection camera captures an image of the plate K positioned at the inspection position. It is advantageous if the pressure testing section 8C uses the same image processing method as that of the pressure testing machine 2, or an image processing method that is more refined than that of the pressure testing machine 2, and uses a quality determination criterion that is equal to or stricter than that of the pressure testing machine 2.By checking the pressure condition through the pressure test section 8C, the number of defective plates K produced can be limited to one. For example, if a defect occurs after a change in the movement speed or tilt angle of the squeegee 134, the automatic recovery section 8E restores the movement speed or tilt angle to its previous value. The soldering press 1 does not have a component section that is automatically replaced by the automatic exchange device 32. According to the soldering press 1 configuration, it is possible to detect a work error earlier than in a configuration where the printing condition is only checked by the downstream pressure testing machine 2, and it is possible to reduce the number of defective plates K produced. 9. Applications and modifications of the execution form The work conditions described in the detailed design can be selected and used accordingly. For example, the change time capture section (82, 8B) does not have to capture the arrival of the maintenance time as a variation element of the work condition, but can capture the performance of the maintenance as a change to the work condition. Furthermore, the change time capture section (82, 8B) can have a function that automatically determines whether the change time should be captured according to the change details of the work condition. For example, the capture section for change time 82 does not have to capture the change time information if the carrier belt 412 and the belt reel 413 of the same batch are exchanged, but can capture the change time information if the batch is changed and if the supplier is changed.As described above, omitting the operating conditions where the probability of failure is relatively low reduces the number of operations in test execution section 83 and suppresses the decline in the throughput rate in component assembler 4. Furthermore, the execution form can be applied or modified in various ways. List of reference symbols 1: Solder printing machine, 11: Plate feeder, 12: Screen holding device, 122: Screen, 13: Doctor blade movement device, 134: Doctor blade, 14: Camera, 2: Pressure testing machine, 3: Component assembly line, 31: Common feeder storage device, 32: Automatic exchange device, 4: Component assembler, 41: Belt feeder, 42: Component feeding device, 43: Machine-internal feeder storage device, 44: Plate conveyor, 45: Head drive device, 452: Assembly head, 453: Suction nozzle, 46: Component imaging camera, 47: Plate imaging camera, 5: Component assembler, 6: Plate visual inspector, 81: Assembly work control section, 82: Change time detection section, 83: Test execution section, 84: Feeder control section, 85: Automatic recovery section 86: Handling section, 87: Notification section, 8A: Pressure control section, 8B: Change time recording section, 8C: Pressure test execution section, 8D: Conveyance control section,8E: Automatic recovery section, 8F: Handling section, 8G: Notification section, 9: Board processing line, 99: Line management device, K: Board, CS: Solder paste, QUOTES INCLUDED IN THE DESCRIPTION This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature JP-A-2012-064831

[0005] JP-A-2003-124699

[0005] JP-A-2013-168538

[0005]

Claims

A plate processing machine comprising: a work execution section configured to perform predetermined plate processing operations on each of several plates based on a set work condition; a change time detection section configured to detect a change time at which the work condition changes or varies; and a verification execution section configured to verify the execution result of the plate processing on the plates after the change time and to stop plate processing on the next plate if the execution result is determined to be faulty. A plate processing machine comprising: a work execution section configured to perform predetermined plate processing operations on each of several plates based on a set working condition; a change time detection section configured to detect a change time at which the working conditions change or vary; and a verification execution section configured to verify the execution result of the plate processing on each of a limited number of plates after the change time. The plate processing machine according to claim 1 or 2, further comprising: a conveying control section configured to convey each of the multiple plates into the plate processing machine and to position the plates at a predetermined working position, to define as a control target a conveying device for plates configured to enable the work execution section to perform the plate processing at the working position, to convey the plates for which the execution result was rated as good out of the plate processing machine, and to restrict the conveyance of the plates whose execution result was determined to be defective out of the plate processing machine. The plate processing machine according to claim 1 or 2, wherein the working condition comprises at least one of the following elements: (1) details for the execution of setup work by a worker, (2) a component section of the work execution section or a maintenance state of the component section, (3) an execution method specified in the plate processing, (4) an element used for plate processing, and (5) a measurement associated with the work on the plates and details for the execution of the processing based on a measurement result. The plate processing machine according to claim 1 or 2, further comprising: an automatic recovery section configured to automatically restore the modified working state to a state prior to the modification if the execution result is determined to be faulty. The plate processing machine according to claim 1 or 2, further comprising: an automatic handling section configured to automatically replace the changed working condition with another equivalent working condition if the execution result is determined to be faulty. The plate processing machine according to claim 1 or 2, further comprising: a notification section configured to communicate assignment information to a worker or an automatic exchange device, in which a determination result indicating that the execution result has been determined to be faulty and the changed or varying working conditions are linked together. The plate processing machine according to claim 7, wherein the automatic exchange device is configured to automatically exchange the changed working condition for another equivalent working condition when the assignment information is received. The plate processing machine according to claim 1 or 2, wherein the work execution section is an assembly work execution section configured to mount a component onto the plates, and the inspection execution section is an assembly inspection execution section configured to inspect an assembly state of the assembled component. The plate processing machine according to claim 9, wherein the test execution section is configured to check the assembly state only with respect to the component that may be affected by a change or deviation in the operating conditions. The plate processing machine according to claim 9, wherein the test execution section is configured to perform a sample inspection of the assembly condition with respect to some of the multiple types of components when the multiple types of components may be affected by a change or deviation in the operating conditions. The plate processing machine according to claim 9, wherein the test execution section is configured to check the assembly state by taking an image of the assembled component with a plate image camera configured to take an image of a position marker attached to the plate, and by performing image processing of the captured image data. The plate processing machine according to claim 9, wherein the change time detection section is configured to receive a signal indicating the change time at which the working conditions in an upstream solder paste printing machine are changed or vary, and the assembly test execution section is configured to check the assembly status of the assembled component after the change time of the working condition in the solder printing machine. The plate processing machine according to claim 1 or 2, wherein the work execution section is a printing work execution section configured to print solder paste onto the plates, and the test execution section is a pressure test execution section configured to test a print condition of the printed solder paste.

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