Power conversion device
DE112023007046T5Undetermined Publication Date: 2026-08-06MITSUBISHI ELECTRIC CORP
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- MITSUBISHI ELECTRIC CORP
- Filing Date
- 2023-10-19
- Publication Date
- 2026-08-06
Smart Images
Figure 00000000_0000_ABST
Abstract
One objective is to provide a technique capable of uniformly establishing thermal conductivity within a plane of a heat-radiating film. A power conversion device comprises a semiconductor device, a heat sink, a heat-radiating film positioned between the semiconductor device and the heat sink, and a housing that covers the top and side portions of the semiconductor device. The semiconductor device includes a semiconductor element, an insulating layer, a first circuit structure, and a second circuit structure arranged on the top and bottom surfaces of the insulating layer, respectively, and a sealing element. The housing is fixed to the heat sink while pressing the top portion of the semiconductor device toward one side of the heat sink.
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Semiconductor device, optical semiconductor device and heat dissipation member
JP2013149952A
JP002013149952A