LAMINATE

DE112024003646T5Undetermined Publication Date: 2026-07-30ASAHI KASEI KOGYO KABUSHIKI KAISHA
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
ASAHI KASEI KOGYO KABUSHIKI KAISHA
Filing Date
2024-10-29
Publication Date
2026-07-30
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Abstract

One purpose of the present invention is to provide a laminate in one embodiment that exhibits both good conductivity and good adhesion (in particular, inhibition of peeling and / or cohesive failure within a layer of the laminate). Another purpose of the present invention is to provide, in one embodiment, a laminate production method for producing such a laminate. In one embodiment, a laminate is provided comprising a metal layer, a metal-containing polymer layer, and a polymer layer in the specified order. The metal layer and the metal-containing polymer layer contain the same type of metal, the thickness of the metal layer is 0.1–1010 µm, and the thickness of the metal-containing polymer layer is 0.04–10 µm.
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Citation Information

Patent Citations

  • Forming method of conductive film, wiring board, electronic device, and electronic equipment

    JP2006128228A