SEMICONDUCTOR COMPONENT

Abstract

A semiconductor device is provided that achieves improved reliability when a semiconductor element is operated at a high temperature. A semiconductor device (1) is provided in which the maximum operating temperature of a semiconductor element (50) is 150°C or higher. The semiconductor device comprises: a conductor pattern (20); a semiconductor element (50) arranged on the conductor pattern (20) via a connecting element (40); and a sealing element (30) that is in contact with the conductor pattern (20), the connecting element (40), and the semiconductor element (50), thereby sealing these components, and to which an ion trap (32) is added for capturing ions of a metal (metal ions (42)), the metal being contained in the connecting element (40).