Hybrid power converters, lateral devices, vertical devices, multi-copper clips, replica devices

Abstract

Disclosed embodiments may include systems, devices, processes, and methods for fabricating and packaging power converters on an integrated circuit. In some embodiments, a power converter device may be processed and packaged using a hybrid (co-packaging) approach. The power converter comprises a first die with an integrated circuit having a plurality of first switches and a plurality of second switches. The power converter further comprises a second die with an integrated circuit, which includes a controller circuit that is electrically coupled to control the switching of the plurality of first switches and the plurality of second switches. The power converter may include additional dies with integrated circuits that are coupled to the controller circuit.The plurality of first switches and the plurality of second switches can each comprise vertically double-diffused metal-oxide-semiconductor field-effect transistors. The plurality of first switches and the plurality of second switches can each comprise laterally double-diffused metal-oxide-semiconductor field-effect transistors.