TAKING DEVICE, TAKING METHOD AND METHOD FOR PRODUCING A SINGLE-CRYSTALLINE SILICON BLOCK
DE112024004385T5Undetermined Publication Date: 2026-08-06SUMCO CORP
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- SUMCO CORP
- Filing Date
- 2024-05-29
- Publication Date
- 2026-08-06
Abstract
A chamfering device, a chamfering method, and a method for producing a single-crystal silicon block are provided, enabling the easy chamfering of an outer circumferential edge of an end face of a cylindrical block. The chamfering device comprises a drive rotary body, which is a rotating body that rotates a cylindrical block by transmitting a circumferential torque to an outer circumferential face of the block, a machining tool that machines the block, and a motion device that moves the machining tool in an axial direction relative to the block according to an axial position of the block. As the drive rotary body rotates the block, an outer circumferential edge of an end face of the block is chamfered using the machining tool and the motion device.
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Grinding / polishing machine for silicon block, and method of working silicon wafer
JP2009233794A