TAKING DEVICE, TAKING METHOD AND METHOD FOR PRODUCING A SINGLE-CRYSTALLINE SILICON BLOCK

DE112024004385T5Undetermined Publication Date: 2026-08-06SUMCO CORP
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
SUMCO CORP
Filing Date
2024-05-29
Publication Date
2026-08-06
Patent Text Reader

Abstract

A chamfering device, a chamfering method, and a method for producing a single-crystal silicon block are provided, enabling the easy chamfering of an outer circumferential edge of an end face of a cylindrical block. The chamfering device comprises a drive rotary body, which is a rotating body that rotates a cylindrical block by transmitting a circumferential torque to an outer circumferential face of the block, a machining tool that machines the block, and a motion device that moves the machining tool in an axial direction relative to the block according to an axial position of the block. As the drive rotary body rotates the block, an outer circumferential edge of an end face of the block is chamfered using the machining tool and the motion device.
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Citation Information

Patent Citations

  • Grinding / polishing machine for silicon block, and method of working silicon wafer

    JP2009233794A